CN203618216U

CN203618216U - Six-layer circuit board asymmetry improvement structure

Info

Publication number: CN203618216U
Application number: CN201320739778.5U
Authority: CN
Inventors: 倪蕴之; 朱永乐; 陈蓁
Original assignee: JIANGSU SUHANG ELECTRONIC CO Ltd
Current assignee: JIANGSU SUHANG ELECTRONIC CO Ltd
Priority date: 2013-11-20
Filing date: 2013-11-20
Publication date: 2014-05-28
Anticipated expiration: 2023-11-20

Abstract

The utility model discloses a six-layer circuit board asymmetry improvement structure. The six-layer circuit board asymmetry improvement structure comprises a first circuit layer, a first PP dielectric layer, a first copper-core-board-free dielectric layer, a second PP dielectric layer, a second copper-core-board-free dielectric layer, a third PP dielectric layer, a second circuit layer, a third copper-core-board-free dielectric layer, a third circuit layer, a fourth PP dielectric layer, a fourth circuit layer, a fourth copper-core-board-free dielectric layer, a fifth circuit layer, a fifth PP dielectric layer and a sixth circuit layer, the first PP dielectric layer and the fifth PP dielectric layer are the same in thickness, the first copper-core-board-free dielectric layer and the fourth copper-core-board-free dielectric layer are the same in thickness, the second PP dielectric layer and the fourth PP dielectric layer are the same in thickness, and the second copper-core-board-free dielectric layer and the third copper-core-board-free dielectric layer are the same in thickness. The six-layer circuit board asymmetry improvement structure adds copper-core-board-free layers among the PP dielectric layers, a fully symmetrical dielectric layer structure is formed, thereby facilitating control of lamination technology, lowering machining difficulty, reducing internal stress generated among boards in a lamination process, preventing problems caused by an asymmetric structure such as a board twist, and improving the product yield.

Description

The asymmetric structure-improved of six sandwich circuit boards

Technical field

The utility model relates to a kind of wiring board, relates in particular to the asymmetric structure-improved of a kind of six sandwich circuit board.

Background technology

The conventional design of wiring board is upper and lower symmetrical structure, and the wiring board of this type can meet IPC plate and stick up in the time making≤0.75% requirement.But because the specific (special) requirements of some level to signal, there is the design of dissymmetrical structure in some wiring boards in project organization, the requirement that this type of wiring board sticks up plate is generally≤1.5%.But the wiring board of this type of unsymmetric structure is due to asymmetric, in the time of lamination, be subject to internal stress effect, easily occur that plate is curved, plate sticks up, plate sticks up the processing to wiring board when serious, the great puzzlement that particularly processing of slab and thick copper coin brings, also give the downstream factory of wiring board as paster assembling etc. brings inconvenience, so solve the problem that the plate of the asymmetric plate of structure sticks up, be the difficult problem that modernization industry development must solve simultaneously.

Summary of the invention

In order to overcome above-mentioned defect, the utility model provides a kind of six sandwich circuit board asymmetric structure-improved, unsymmetric structure can be adjusted into symmetrical structure, does not affect the specific (special) requirements to signal simultaneously.

The utility model for the technical scheme that solves its technical problem and adopt is: the asymmetric structure-improved of a kind of six sandwich circuit board, comprise the first line layer stacking gradually, the one PP dielectric layer, first without copper central layer dielectric layer, the 2nd PP dielectric layer, second without copper central layer dielectric layer, the 3rd PP dielectric layer, the second line layer, the 3rd without copper central layer dielectric layer, tertiary circuit layer, the 4th PP dielectric layer, the 4th line layer, the 4th without copper central layer dielectric layer, the 5th line layer, the 5th PP dielectric layer and the 6th line layer, a described PP dielectric layer is identical with the 5th PP thickness of dielectric layers, described first is identical without copper central layer thickness of dielectric layers with the 4th without copper central layer dielectric layer, described the 2nd PP dielectric layer is identical with the 4th PP thickness of dielectric layers, described second is identical without copper central layer thickness of dielectric layers with the 3rd without copper central layer dielectric layer.

As further improvement of the utility model, a described PP dielectric layer, the 2nd PP dielectric layer, the 3rd PP dielectric layer, the 4th PP dielectric layer and the 5th PP dielectric layer are the epoxy resin fiberglass cloth sheet of insulation and make.

As further improvement of the utility model, described first makes without copper central layer dielectric layer and the 4th epoxy glass fiber cloth plate that is insulation without copper central layer dielectric layer without copper central layer dielectric layer, the 3rd without copper central layer dielectric layer, second.

The beneficial effects of the utility model are: by increase first and second without copper core layer between first, second and third PP dielectric layer, and their thickness is consistent with corresponding with it dielectric layer or without copper core layer, form the dielectric layer structure of full symmetric, thereby be beneficial to the management and control of laminating technology, reduce difficulty of processing, reduce the internal stress producing between plate in lamination process, prevent the problems such as the curved and plate of plate that asymmetrical junction is configured to sticks up, improving product yield, and plate bent plate is stuck up from original 1.5% be reduced to below 0.5%.

Accompanying drawing explanation

Fig. 1 is the utility model structural representation.

By reference to the accompanying drawings, make the following instructions:

Embodiment

Below the utility model is elaborated; but protection range of the present utility model is not limited to following embodiment; the simple equivalence of in every case being done with the utility model claim and description changes and modifies, within all still belonging to the utility model patent covering scope.

As shown in Figure 1, the asymmetric structure-improved of a kind of six sandwich circuit board, comprise the first line layer 1 stacking gradually, the one PP dielectric layer 11, first without copper central layer dielectric layer 21, the 2nd PP dielectric layer 12, second without copper central layer dielectric layer 22, the 3rd PP dielectric layer 13, the second line layer 2, the 3rd without copper central layer dielectric layer 23, tertiary circuit layer 3, the 4th PP dielectric layer 14, the 4th line layer 4, the 4th without copper central layer dielectric layer 24, the 5th line layer 5, the 5th PP dielectric layer 15 and the 6th line layer 6, a described PP dielectric layer 11 is identical with the 5th PP dielectric layer 15 thickness, described first is identical without copper central layer dielectric layer 24 thickness with the 4th without copper central layer dielectric layer 21, described the 2nd PP dielectric layer 12 is identical with the 4th PP dielectric layer 14 thickness, described second is identical without copper central layer dielectric layer 23 thickness with the 3rd without copper central layer dielectric layer 22.Like this, by increase first and second without copper core layer between first, second and third PP dielectric layer, and their thickness is consistent with corresponding with it dielectric layer or without copper core layer, form the dielectric layer structure of full symmetric, thereby be beneficial to the management and control of laminating technology, reduce the internal stress producing between plate in lamination process, prevent the problems such as the curved and plate of plate that asymmetrical junction is configured to sticks up.

Preferably, the epoxy resin fiberglass cloth sheet that a described PP dielectric layer, the 2nd PP dielectric layer, the 3rd PP dielectric layer, the 4th PP dielectric layer and the 5th PP dielectric layer are insulation is made.

Preferably, described first make without copper central layer dielectric layer and the 4th epoxy glass fiber cloth plate that is insulation without copper central layer dielectric layer without copper central layer dielectric layer, the 3rd without copper central layer dielectric layer, second.

Claims

1. the asymmetric structure-improved of sandwich circuit board, it is characterized in that: comprise the first line layer (1) stacking gradually, the one PP dielectric layer (11), first without copper central layer dielectric layer (21), the 2nd PP dielectric layer (12), second without copper central layer dielectric layer (22), the 3rd PP dielectric layer (13), the second line layer (2), the 3rd without copper central layer dielectric layer (23), tertiary circuit layer (3), the 4th PP dielectric layer (14), the 4th line layer (4), the 4th without copper central layer dielectric layer (24), the 5th line layer (5), the 5th PP dielectric layer (15) and the 6th line layer (6), a described PP dielectric layer (11) is identical with the 5th PP dielectric layer (15) thickness, described first is identical without copper central layer dielectric layer (24) thickness with the 4th without copper central layer dielectric layer (21), described the 2nd PP dielectric layer (12) is identical with the 4th PP dielectric layer (14) thickness, described second is identical without copper central layer dielectric layer (23) thickness with the 3rd without copper central layer dielectric layer (22).

2. the asymmetric structure-improved of six sandwich circuit board according to claim 1, is characterized in that: a described PP dielectric layer, the 2nd PP dielectric layer, the 3rd PP dielectric layer, the 4th PP dielectric layer and the 5th PP dielectric layer are the epoxy resin fiberglass cloth sheet of insulation and make.

3. the asymmetric structure-improved of six sandwich circuit board according to claim 2, is characterized in that: described first makes without copper central layer dielectric layer and the 4th epoxy glass fiber cloth plate that is insulation without copper central layer dielectric layer without copper central layer dielectric layer, the 3rd without copper central layer dielectric layer, second.