CN104661424B

CN104661424B - The asymmetric structure-improved of six sandwich circuit boards

Info

Publication number: CN104661424B
Application number: CN201310587141.3A
Authority: CN
Inventors: 倪蕴之; 朱永乐; 陈蓁
Original assignee: JIANGSU SUHANG ELECTRONIC CO Ltd
Current assignee: JIANGSU SUHANG ELECTRONIC CO Ltd
Priority date: 2013-11-20
Filing date: 2013-11-20
Publication date: 2018-04-27
Anticipated expiration: 2033-11-20
Also published as: CN104661424A

Abstract

The invention discloses a kind of asymmetric structure-improved of six sandwich circuit boards, including the first line layer stacked gradually, first PP dielectric layers, first without copper core plate dielectric layer, 2nd PP dielectric layers, second without copper core plate dielectric layer, 3rd PP dielectric layers, second line layer, 3rd without copper core plate dielectric layer, tertiary circuit layer, 4th PP dielectric layers, 4th line layer, 4th without copper core plate dielectric layer, 5th line layer, 5th PP dielectric layers and the 6th line layer, first, five PP thickness of dielectric layers are identical, first, 4th is identical without copper core plate thickness of dielectric layers, second, four PP thickness of dielectric layers are identical, second, three is identical without copper core plate thickness of dielectric layers.The asymmetric structure-improved of six sandwich circuit boards between PP dielectric layers by increasing without copper core flaggy, form full symmetric medium Rotating fields, so as to the management and control beneficial to laminating technology, reduce difficulty of processing, reduce the internal stress produced in lamination process between plate, the problems such as preventing plate caused by dissymmetrical structure from sticking up, lift product yield.

Description

The asymmetric structure-improved of six sandwich circuit boards

Technical field

The present invention relates to a kind of wiring board, more particularly to a kind of asymmetric structure-improved of six sandwich circuit boards.

Background technology

The conventional design of wiring board is structure symmetrical above and below, and the wiring board of this type can meet IPC plates when making Stick up≤0.75% requirement.But some wiring boards are when design structure because the particular/special requirement of signal occur in some levels The design of dissymmetrical structure, requirement that such wiring board sticks up plate are usually≤1.5%.But the circuit of such unsymmetric structure Plate is acted in lamination by internal stress due to asymmetry, easily occurs that plate is curved, plate is stuck up, to the processing of wiring board when plate sticks up serious, The great puzzlement that the processing of particularly slab and thick copper coin is brought, while also downstream plant such as patch assembling etc. to wiring board Inconvenience is brought, is the difficulty that modernization industry development has to solve so solving the problems, such as that the plate of structure asymmetry plate is stuck up Topic.

The content of the invention

, can will be non-right the present invention provides a kind of asymmetric structure-improved of six sandwich circuit boards in order to overcome drawbacks described above Structural adjustment is referred to as symmetrical structure, while does not influence the particular/special requirement to signal.

The present invention in order to solve its technical problem used by technical solution be：A kind of asymmetric improvement knot of six sandwich circuit boards Structure, including stack gradually first line layer, the first PP dielectric layers, first without copper core plate dielectric layer, the 2nd PP dielectric layers, second No copper core plate dielectric layer, the 3rd PP dielectric layers, the second line layer, the 3rd are situated between without copper core plate dielectric layer, tertiary circuit layer, the 4th PP Matter layer, the 4th line layer, the 4th are without copper core plate dielectric layer, the 5th line layer, the 5th PP dielectric layers and the 6th line layer, and described One PP dielectric layers are identical with the 5th PP thickness of dielectric layers, described first without copper core plate dielectric layer and the 4th without copper core plate medium thickness Spend identical, the 2nd PP dielectric layers and the 4th PP thickness of dielectric layers are identical, and described second without copper core plate dielectric layer and the 3rd nothing Copper core plate thickness of dielectric layers is identical.

As a further improvement on the present invention, the first PP dielectric layers, the 2nd PP dielectric layers, the 3rd PP dielectric layers, Four PP dielectric layers and the 5th PP dielectric layers are that the epoxy resin fiberglass cloth piece of insulation is made.

As a further improvement on the present invention, described first without copper core plate dielectric layer, second without copper core plate dielectric layer, the 3rd No copper core plate dielectric layer and the 4th is made without the epoxy glass fiber cloth plate that copper core plate dielectric layer is insulation.

The beneficial effects of the invention are as follows：By increasing by first and second between first, second and third PP dielectric layers without copper core flaggy, And their thickness is consistent with corresponding dielectric layer or without copper core flaggy, form full symmetric dielectric layer Structure, so that beneficial to the management and control of laminating technology, reduces difficulty of processing, reduces the internal stress produced in lamination process between plate, prevent Only the curved the problems such as being stuck up with plate of plate caused by dissymmetrical structure, product yield is lifted, and make plate bent plate stick up from original 1.5% to reduce To less than 0.5%.

Brief description of the drawings

Fig. 1 is schematic structural view of the invention.

With reference to attached drawing, make the following instructions：

1 --- first line layer 2 --- second line layer

3 --- tertiary circuit layer 4 --- the 4th line layers

5 --- the 5th line layer 6 --- the 6th line layers

11 --- the first PP dielectric layers 12 --- the 2nd PP dielectric layers

13 --- the 3rd PP dielectric layers 14 --- the 4th PP dielectric layers

15 --- the 5th PP dielectric layers

21 --- first without copper core plate dielectric layer

22 --- second without copper core plate dielectric layer

23 --- the 3rd without copper core plate dielectric layer

24 --- the 4th without copper core plate dielectric layer

Embodiment

Elaborate below to the present invention, but protection scope of the present invention is not limited to following embodiments, i.e., in every case with this The simple equivalent changes and modifications that patent application the scope of the claims and description are made, all still belongs to patent of the present invention and covers model Within enclosing.

As shown in Figure 1, a kind of asymmetric structure-improved of six sandwich circuit boards, including the first line layer 1, first stacked gradually PP dielectric layers 11, first are situated between without copper core plate dielectric layer 21, the 2nd PP dielectric layers 12, second without copper core plate dielectric layer 22, the 3rd PP Matter layer 13, the second line layer the 2, the 3rd are without copper core plate dielectric layer 23, tertiary circuit layer 3, the 4th PP dielectric layers 14, the 4th line layer 4th, the 4th without copper core plate dielectric layer 24, the 5th line layer 5, the 5th PP dielectric layers 15 and the 6th line layer 6, the first PP media Layer 11 is identical with 15 thickness of the 5th PP dielectric layers, and described first is thick without copper core plate dielectric layer 24 without copper core plate dielectric layer 21 and the 4th Spend identical, the 2nd PP dielectric layers 12 are identical with 14 thickness of the 4th PP dielectric layers, and described second without 22 He of copper core plate dielectric layer 3rd is identical without copper core plate 23 thickness of dielectric layer.In this way, by increasing by first and second between first, second and third PP dielectric layers without copper Core layer, and their thickness is consistent with corresponding dielectric layer or without copper core flaggy, form full symmetric Medium Rotating fields so that beneficial to the management and control of laminating technology, reduce the internal stress produced in lamination process between plate, it is not right to prevent Claim the problems such as plate is curved and plate is stuck up caused by structure.

Preferably, the first PP dielectric layers, the 2nd PP dielectric layers, the 3rd PP dielectric layers, the 4th PP dielectric layers and the 5th PP dielectric layers are that the epoxy resin fiberglass cloth piece of insulation is made.

Preferably, described first without copper core plate dielectric layer, second without copper core plate dielectric layer, the 3rd without copper core plate dielectric layer and 4th is made without the epoxy glass fiber cloth plate that copper core plate dielectric layer is insulation.

Claims

A kind of 1. asymmetric structure-improved of six sandwich circuit boards, it is characterised in that：Including the first line layer stacked gradually（1）, One PP dielectric layers（11）, first without copper core plate dielectric layer（21）, the 2nd PP dielectric layers（12）, second without copper core plate dielectric layer （22）, the 3rd PP dielectric layers（13）, the second line layer（2）, the 3rd without copper core plate dielectric layer（23）, tertiary circuit layer（3）, the 4th PP dielectric layers（14）, the 4th line layer（4）, the 4th without copper core plate dielectric layer（24）, the 5th line layer（5）, the 5th PP dielectric layers （15）With the 6th line layer（6）, the first PP dielectric layers（11）With the 5th PP dielectric layers（15）Thickness is identical, first nothing Copper core plate dielectric layer（21）With the 4th without copper core plate dielectric layer（24）Thickness is identical, the 2nd PP dielectric layers（12）With the 4th PP Dielectric layer（14）Thickness is identical, and described second without copper core plate dielectric layer（22）With the 3rd without copper core plate dielectric layer（23）Thickness phase Together.
2. the asymmetric structure-improved of six sandwich circuit boards according to claim 1, it is characterised in that：The first PP media Layer, the 2nd PP dielectric layers, the 3rd PP dielectric layers, the 4th PP dielectric layers and the 5th PP dielectric layers are the glass epoxy of insulation Fiber pieces of cloth are made.
3. the asymmetric structure-improved of six sandwich circuit boards according to claim 2, it is characterised in that：Described first without copper core plate Dielectric layer, second are without copper core plate dielectric layer, the 3rd without copper core plate dielectric layer and the 4th without the ring that copper core plate dielectric layer is insulation Oxygen glass fibre fabric swatch is made.