CN205581761U - A heat conduction structure for computer CPU - Google Patents
A heat conduction structure for computer CPU Download PDFInfo
- Publication number
- CN205581761U CN205581761U CN201620003152.1U CN201620003152U CN205581761U CN 205581761 U CN205581761 U CN 205581761U CN 201620003152 U CN201620003152 U CN 201620003152U CN 205581761 U CN205581761 U CN 205581761U
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- China
- Prior art keywords
- sole plate
- fin
- cpu
- nacelle
- fan
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Abstract
The utility model provides a heat conduction structure for computer CPU, including first heat conduction bottom plate, set up the heat pipe of connecting first heat conduction bottom plate, second heat conduction bottom plate respectively in second heat conduction bottom plate and both ends on the CPU upper surface, still including setting up the cabin body in quick -witted bottom of the case portion, install the fin on first heat conduction bottom plate lower surface and fixing the fan on the fin side, the cabin body is upper end open -ended cavity structure, first heat conduction bottom plate links to each other with cabin body upper end opening and forms a pressurized cabin, and fin and fan setting are in the pressurized cabin. The utility model discloses in, fan and fin setting have guaranteed that the fan can only have been avoided water, dust, impurity etc. To get into the internal circuit board and damaged CPU at the pressurized cabin inner loop from the cabin body inspiratory cold air in bottom and exhaust hot -air effectively in exothermal process in the pressurized cabin.
Description
Technical field
This utility model relates to a kind of conductive structure, particularly relates to a kind of conductive structure being applied to computer CPU.
Background technology
Computer CPU the most often produces bigger heat, and the radiating effect of the radiator matched with CPU will directly influence work quality and the service life of CPU.Computer volume and inner space are less, and the CPU heat dissipation problem that heater element produces because of integrated distribution is more prominent.In existing CPU radiation processes, the conduction of heat between heat conduction original paper and CPU module is relatively slow, and heat of high temperature is easily accumulated in conducting-heat elements, is difficult to fin conductive, causes radiating efficiency extremely low.Furthermore, existing solution CPU heat dissipation problem is usually and uses temperature-controlled fan to dispel the heat, and i.e. installs fin and fan on CPU.In this kind of radiator structure, fin, CPU, fan all with extraneous contact being in unified atmospheric environment, when cpu temperature is too high, fan absorbs cold air from the external world easily to be caused the water in the external world, dust, sandy soil etc. to enter internal circuit board damaging CPU.
Utility model content
In order to solve, the radiating effect of existing cpu heat is the best and fin, CPU, fan are all easily caused the defect that internal circuit damages with extraneous contact, and this utility model spy provides a kind of conductive structure for computer CPU.
The technical solution of the utility model is as follows:
A kind of conductive structure for computer CPU, the second conductive sole plate and the two ends that including the first conductive sole plate, are arranged on CPU upper surface connect the first conductive sole plate, the heat pipe of the second conductive sole plate respectively；Also include the nacelle being arranged on bottom cabinet, the fin being arranged on the first conductive sole plate lower surface and be fixed on the fan on fin side；Nacelle is the cavity structure of upper end open, and described first conductive sole plate and nacelle upper end open are connected to form a sealed compartment, and fin and fan are arranged in sealed compartment.In this programme, the CPU heat absorbed is delivered to the first conductive sole plate by heat pipe by the second conductive sole plate being arranged on CPU upper surface, first conductive sole plate transfers heat on fin again, in this programme, some fin are uniformly arranged in the first conductive sole plate so that area of dissipation is bigger.Furthermore, air inlet and air outlet is offered relative to the position of fan and the sidewall of nacelle respectively relative to the position of fin bottom nacelle, gap between fin forms vent passages, when CPU runs overheated, fan will absorb the cold air outside cabinet bottom nacelle and delivers to fin, after cold air passes through fin, hot-air will be discharged from air outlet.Traditional CPU heat radiation is dispelled the heat generally by installing fin and fan on CPU, in this kind of radiator structure, fin, CPU, fan all with extraneous contact being in unified atmospheric environment, when cpu temperature is too high, fan absorbs cold air and easily causes the water in the external world, dust, sandy soil etc. to enter internal circuit board damage CPU from the external world.For solving this defect, inventor is by being arranged on fan and fin in sealed compartment, by completely isolated to CPU, internal circuit board and fan, fin, the hot-air making fan sucks bottom nacelle in radiation processes cold air and discharge can only circulate in sealed compartment, efficiently avoid water, dust, impurity etc. and enters internal circuit board and damage CPU.
For the technical program is better achieved, described heat pipe is hollow structure inside, and the inwall of heat pipe is evenly arranged with heat-conducting medium.Heat pipe is that metal material is made, it is preferable that the heat pipe in this programme uses copper pipe.The heat-conducting medium being uniformly arranged on heat pipe inwall makes heat pipe can quickly absorb the heat that CPU module sends, and heat is the most quickly conducted to fin through the first conductive sole plate, make heat be difficult to accumulation, be effectively improved heat transfer efficiency, improve the radiating effect of CPU module.
Further, described heat-conducting medium is powdery metal particles.Metal heat-conducting energy force rate nonmetallic heat conductive ability is strong, and the powdery metal particles being uniformly arranged on heat pipe inwall further increases heat-conducting area, it is ensured that the heat on CPU is absorbed in time and transmits.
Further, described nacelle upper surface offering seal groove, seal washer is arranged in seal groove, and the first conductive sole plate is connected with nacelle by seal washer.The setting of seal washer ensure that formation sealed compartment between the first conductive sole plate and nacelle, it is to avoid inadequate because sealing dynamics, and fan exits into internal circuit board from the outside cold air sucked of cabinet from the junction of the first conductive sole plate Yu nacelle and damages CPU.
Further, also including that the position being fixed on the hangers on the first conductive sole plate side and corresponding hangers is arranged on the screwed hole on nacelle sidewall, the first conductive sole plate runs through hangers with nacelle by bolt is simultaneously attached with screwed hole.In this programme, the first conductive sole plate is bolted with nacelle so that readily accessible between the first conductive sole plate and nacelle, when heat radiation goes wrong, it is simple to overhaul the fan in sealed compartment with fin.
In sum, Advantageous Effects of the present utility model is as follows:
1, fan and fin are arranged in sealed compartment, ensure that the hot-air of fan sucks bottom nacelle in radiation processes cold air and discharge can only circulate in sealed compartment, efficiently avoid water, dust, impurity etc. and enter internal circuit board and damage CPU.
2, heat pipe is that the heat-conducting medium being uniformly arranged on the inwall of hollow structure inside and heat pipe makes the heat on CPU be difficult to accumulation, is effectively improved heat transfer efficiency, enhances radiating effect.
3, the heat conductivility of powdery metal particles is relatively strong, and heat-conducting medium uses powdery metal particles to further enhancing the heat transfer efficiency of heat pipe.
4, the first conductive sole plate is sealed by seal washer with nacelle, it is to avoid inadequate because sealing dynamics, and the outside cold air sucked of cabinet exits into internal circuit board and damages CPU from the junction of the first conductive sole plate Yu nacelle.
5, the first conductive sole plate is bolted with nacelle so that readily accessible between the first conductive sole plate and nacelle, when heat radiation goes wrong, it is simple to overhaul the fan in sealed compartment with fin.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of conductive structure for computer CPU；
Fig. 2 is the structural representation of nacelle；
Fig. 3 is the partial schematic diagram in Fig. 2 at A；
Wherein the parts title corresponding to reference is as follows:
1-the first conductive sole plate, 2-the second conductive sole plate, 3-heat pipe, 4-nacelle, 5-fin, 6-fan, 7-heat-conducting medium, 8-seal groove, 9-hangers, 10-screwed hole.
Detailed description of the invention
Below in conjunction with the accompanying drawings and this utility model is described in more detail by specific embodiment, but embodiment of the present utility model is not limited to this.
Embodiment 1
As shown in Figure 1, Figure 2, Figure 3 shows, a kind of conductive structure for computer CPU, the second conductive sole plate 2 including the first conductive sole plate 1, being arranged on CPU upper surface and two ends connect the heat pipe 3 of first conductive sole plate the 1, second conductive sole plate 2 respectively；Also include the nacelle 4 being arranged on bottom cabinet, the fin 5 being arranged on the first conductive sole plate 1 lower surface and be fixed on the fan 6 on fin 5 side；Nacelle 4 is the cavity structure of upper end open, and described first conductive sole plate 1 is connected to form a sealed compartment with nacelle 4 upper end open, and fin 5 and fan 6 are arranged in sealed compartment.
The heat conduction principle of the present embodiment is as follows: the CPU heat absorbed is delivered to the first conductive sole plate 1 by heat pipe 3 by the second conductive sole plate 2 being arranged on CPU upper surface, first conductive sole plate 1 transfers heat on fin 5 again, air inlet and air outlet is offered relative to the position of fan 6 and the sidewall of nacelle 4 respectively relative to the position of fin 5 bottom nacelle 4, gap between fin 5 forms vent passages, when CPU runs overheated, fan 6 will absorb the cold air outside cabinet bottom nacelle 4 and delivers to fin 5, after cold air passes through fin 5, hot-air will be discharged from air outlet.The present embodiment enters internal circuit board damage CPU by fan 6 and fin 5 are arranged in sealed compartment cold air, the dust etc. avoiding sucking bottom nacelle 4 in radiation processes.
Embodiment 2
The present embodiment is on the basis of embodiment 1, and described heat pipe 3 is hollow structure inside, and the inwall of heat pipe 3 is evenly arranged with heat-conducting medium 7.Described heat-conducting medium 7 is powdery metal particles.
Metal heat-conducting energy force rate nonmetallic heat conductive ability is strong, and the powdery metal particles being uniformly arranged on heat pipe 3 inwall is effectively improved heat transfer efficiency, enhances radiating effect, it is ensured that the heat on CPU is absorbed in time and transmits.
Embodiment 3
The present embodiment, on the basis of embodiment 1 or embodiment 2, described nacelle 4 upper surface offers seal groove 8, and seal washer is arranged in seal groove 8, and the first conductive sole plate 1 is connected with nacelle 4 by seal washer.
The setting of seal washer ensure that formation sealed compartment between the first conductive sole plate 1 and nacelle 4, it is to avoid causes because of sealing dynamics fan 6 to exit into internal circuit board from the outside cold air sucked of cabinet from the junction of the first conductive sole plate 1 with nacelle 4 not and damages CPU.
Embodiment 4
The present embodiment is on the basis of embodiment 1 or embodiment 2 or embodiment 3, also including that the position being fixed on the hangers 9 on the first conductive sole plate 1 side and corresponding hangers 9 is arranged on the screwed hole 10 on nacelle 4 sidewall, the first conductive sole plate 1 runs through hangers 9 with nacelle 4 by bolt is simultaneously connected with screwed hole 10.
First conductive sole plate 1 is bolted with nacelle 4 so that readily accessible between the first conductive sole plate 1 and nacelle 4, when heat radiation goes wrong, it is simple to overhaul the fan 6 in sealed compartment with fin 5.
As it has been described above, this utility model can preferably be realized.
Claims (5)
1. the conductive structure for computer CPU, it is characterised in that:
The second conductive sole plate (2) including the first conductive sole plate (1), being arranged on CPU upper surface and two ends connect the heat pipe (3) of the first conductive sole plate (1), the second conductive sole plate (2) respectively；The fin (5) also include the nacelle (4) being arranged on bottom cabinet, being arranged on the first conductive sole plate (1) lower surface and the fan (6) being fixed on fin (5) side；Nacelle (4) is the cavity structure of upper end open, and described first conductive sole plate (1) and nacelle (4) upper end open are connected to form a sealed compartment, and fin (5) and fan (6) are arranged in sealed compartment.
A kind of conductive structure for computer CPU the most according to claim 1, it is characterised in that:
Described heat pipe (3) is hollow structure inside, and the inwall of heat pipe (3) is evenly arranged with heat-conducting medium (7).
A kind of conductive structure for computer CPU the most according to claim 2, it is characterised in that:
Described heat-conducting medium (7) is powdery metal particles.
A kind of conductive structure for computer CPU the most according to claim 1, it is characterised in that:
Offering seal groove (8) on described nacelle (4) upper surface, seal washer is arranged in seal groove (8), and the first conductive sole plate (1) is connected with nacelle (4) by seal washer.
A kind of conductive structure for computer CPU the most according to claim 1, it is characterised in that:
Also including the screwed hole (10) that the position of the hangers (9) being fixed on the first conductive sole plate (1) side and corresponding hangers (9) is arranged on nacelle (4) sidewall, the first conductive sole plate (1) runs through hangers (9) with nacelle (4) by bolt is simultaneously attached with screwed hole (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620003152.1U CN205581761U (en) | 2016-01-05 | 2016-01-05 | A heat conduction structure for computer CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620003152.1U CN205581761U (en) | 2016-01-05 | 2016-01-05 | A heat conduction structure for computer CPU |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205581761U true CN205581761U (en) | 2016-09-14 |
Family
ID=56883050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620003152.1U Expired - Fee Related CN205581761U (en) | 2016-01-05 | 2016-01-05 | A heat conduction structure for computer CPU |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205581761U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107624022A (en) * | 2017-09-18 | 2018-01-23 | 安徽工程大学 | A kind of multistage cold wind heat abstractor of electronic device |
-
2016
- 2016-01-05 CN CN201620003152.1U patent/CN205581761U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107624022A (en) * | 2017-09-18 | 2018-01-23 | 安徽工程大学 | A kind of multistage cold wind heat abstractor of electronic device |
| CN107624022B (en) * | 2017-09-18 | 2019-06-14 | 安徽工程大学 | A kind of multistage cold wind radiator of electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160914 Termination date: 20170105 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |