CN116981237A - Auxiliary heat extraction device for exchange of information engineering - Google Patents
Auxiliary heat extraction device for exchange of information engineering Download PDFInfo
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- CN116981237A CN116981237A CN202311098170.3A CN202311098170A CN116981237A CN 116981237 A CN116981237 A CN 116981237A CN 202311098170 A CN202311098170 A CN 202311098170A CN 116981237 A CN116981237 A CN 116981237A
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- heat
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- 238000000605 extraction Methods 0.000 title claims description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 70
- 238000001816 cooling Methods 0.000 claims abstract description 58
- 239000004065 semiconductor Substances 0.000 claims abstract description 28
- 239000000110 cooling liquid Substances 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 230000000694 effects Effects 0.000 abstract description 10
- 239000000428 dust Substances 0.000 description 7
- 230000000191 radiation effect Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000003325 tomography Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20181—Filters; Louvers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Abstract
The invention relates to the technical field of heat dissipation of a host machine, and discloses an auxiliary heat removal device of a switch for information engineering, which comprises a heat dissipation box, a cooling box, a first air port, a second air port, heat conduction fins and a mounting frame, wherein the first air port and the second air port are respectively arranged on two side surfaces of the heat dissipation box, the first air port and the second air port are communicated with the inside of the heat dissipation box, the first air port and the second air port are the same in size, the cooling box is fixed on the lower side surface of the heat dissipation box, cooling liquid is filled in the cooling box, and a semiconductor refrigerating sheet is mounted on the lower side surface of the cooling box in a fitting manner. According to the invention, the air outlet or the air inlet of the exchanger is communicated with the air outlet or the air inlet of the exchanger by utilizing the air outlet at one side of the heat dissipation box, so that the air exhaust amount or the air inlet of the exchanger is independently increased, the heat dissipation effect is improved, the heat conduction fin is cooled after the cooling liquid is cooled by utilizing the semiconductor refrigerating sheet, the air entering the main machine of the exchanger can be cooled to a low-temperature state, and the heat dissipation effect on the exchanger can be further improved.
Description
Technical Field
The invention relates to the technical field of heat dissipation of a host, in particular to an auxiliary heat removal device of an exchanger for information engineering.
Background
Information engineering mainly researches basic knowledge and skills in the aspects of information acquisition, transmission, processing, utilization, analysis, design and the like of a control system, and performs design debugging of a communication network and a network security foundation, information acquisition and processing and the like, for example: the design of face and fingerprint information collecting system, the design of medical CT tomography scanner, etc. compared with communication engineering, the information engineering is more biased to the information collecting part and the communication engineering is more biased to the information transmitting part.
The network exchanger is an equipment for expanding network, can provide more connection ports for sub-network so as to connect more computers, and can make one of the main components in information engineering.
In order to achieve a good heat dissipation effect on the switch, the switch generally performs ventilation and heat dissipation through a fan inside the switch, but under the condition of large information transmission, the switch occasionally has a high-load running condition, and the heat dissipation requirement is difficult to meet by virtue of the fan of the switch, so that the data exchange efficiency is affected. We therefore propose a heat extraction device for use in the auxiliary heat exchange of information engineering.
Disclosure of Invention
The invention aims to provide an auxiliary heat extraction device of a switch for information engineering, which independently increases the air exhaust amount or the air intake amount of the switch by utilizing the communication between an air inlet at one side of a heat radiation box and an air outlet or an air inlet of the switch, increases the heat radiation effect of the switch, and cools a cooling liquid by utilizing a semiconductor refrigerating sheet and then cools a heat conduction fin, so that air entering a main machine of the switch is cooled to a low temperature state, the heat radiation effect of the switch can be further increased, and the problems in the background art are solved.
In order to achieve the above purpose, the present invention provides the following technical solutions: an auxiliary heat removal device of a switch for information engineering comprises a heat radiation box, a cooling box, a first air port, a second air port, heat conduction fins and a mounting frame; the first air port and the second air port are respectively arranged on the surfaces of two sides of the heat dissipation box, the first air port and the second air port are communicated with the inside of the heat dissipation box, and the first air port and the second air port are the same in size; the cooling box is fixed on the lower surface of the side edge of the heat dissipation box, the cooling box is filled with cooling liquid, the lower surface of the cooling box is attached with a semiconductor refrigerating sheet, the cold end of the semiconductor refrigerating sheet is attached to the surface of the cooling box, the hot end surface of the semiconductor refrigerating sheet is vertically fixed with a plurality of first fins, the first fins are mutually parallel, the cold end surface of the semiconductor refrigerating sheet is vertically fixed with a plurality of second fins which are mutually parallel, the second fins penetrate into the surface of the cooling box above the semiconductor refrigerating sheet in the cooling box, fans are transversely arranged on the surfaces of the cooling box, and two sides of each fan are respectively provided with a through hole communicated with the inside of each fan; the heat conduction fins are vertically and uniformly fixed in the heat dissipation box, copper pipes penetrate through the heat conduction fins, the copper pipes penetrate through the heat conduction fins in an S shape, two ends of each copper pipe penetrate through the heat dissipation box, the tail end of the upper part of each copper pipe is communicated with the inside of the cooling box through a water return pipe, a water pump is arranged above the side edge of the cooling box, an inlet of the water pump is communicated with the inside of the cooling box through a water suction pipe, and an outlet of the water pump is communicated with the lower part of the copper pipes through a water outlet pipe; the heat dissipation box is characterized in that the mounting frame is vertically fixed inside the heat dissipation box on the side edge of the heat conduction fins, two sides of the mounting frame are mutually communicated, a plurality of fans are uniformly mounted on one side surface of the mounting frame, and an air outlet of each fan faces to the direction of the first air outlet.
Through adopting above-mentioned technical scheme, make the first wind gap of heat dissipation case align and with the air intake intercommunication of switch host computer, or make the second wind gap alignment of heat dissipation to and with the air outlet intercommunication of switch host computer, when independently starting the fan of heat dissipation incasement portion, can increase the intake in the switch host computer or to outside volume of airing exhaust, can increase the radiating effect to the switch host computer, in increasing the intake in the switch host computer, can also start semiconductor refrigeration piece, fan and water pump, reduce the coolant liquid in the cooling tank into, and cool down for heat conduction fin, the air that finally makes entering child switch host computer also by lower to lower state, can ensure to have better cooling radiating effect to the switch host computer.
As a preferred embodiment of the invention, two electric struts are supported and mounted on two sides of the bottom of the heat dissipation box, and two electric struts are arranged.
Through adopting above-mentioned technical scheme, utilize electronic branch to realize the support to the heat dissipation case to can guarantee the high adjustment to the heat dissipation case, make its switch host computer that adapts to the difference in height.
In a preferred embodiment of the invention, dust-proof nets are embedded and fixed in the through holes above and below the fan, and the dust-proof nets are filled in the through holes of the fan.
Through adopting above-mentioned technical scheme, through the setting of dust screen, can avoid the dust to get into the inside of fan.
As a preferred embodiment of the invention, the first filter screen is vertically embedded and fixed in the first air port, and the first filter screen is provided with two layers and is arranged in the first air port in parallel.
Through adopting above-mentioned technical scheme, through the setting of first filter screen, can avoid outside dust to get into the inside of heat dissipation case from first wind gap.
As a preferred embodiment of the invention, the second filter screen is vertically embedded and fixed in the second air port, and the second filter screen is provided with two layers and is arranged in the second air port in parallel.
Through adopting above-mentioned technical scheme, through the setting of second filter screen, can avoid outside dust to get into the inside of cooling box from the second wind gap.
As a preferable implementation mode of the invention, the surface of the heat dissipation box of the first air port outer ring is fixed with a first rubber ring, and the first rubber ring is tightly adhered to the surface of the heat dissipation box in a surrounding manner.
Through adopting above-mentioned technical scheme, first rubber circle encircles the air intake outer lane at first wind gap and switch host computer, can keep the sealed intercommunication state between the two.
As a preferable implementation mode of the invention, the surface of the heat dissipation box of the second air port outer ring is fixed with a second rubber ring, and the second rubber ring is tightly adhered to the surface of the heat dissipation box in a surrounding manner.
Through adopting above-mentioned technical scheme, the second rubber circle encircles the air outlet outer lane at second wind gap and switch host computer, can keep the sealed intercommunication state between the two.
As a preferred embodiment of the invention, the bottom end of the electric supporting rod is fixedly provided with a supporting plate, and the vertically arranged supporting rod of the electric supporting rod is arranged above the supporting plate.
Through adopting above-mentioned technical scheme, the extension board is arranged in the bottom of electronic branch, can increase the area of support of its bottom, makes it by stable support.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the auxiliary heat removal device for the exchange machine for the information engineering, the cooling box is arranged below the side edge of the heat radiation box to be fixed, the air inlets are formed in the two sides of the heat radiation box, one side of the air inlet is communicated with the air outlet or the air inlet of the exchange machine, the air exhaust amount or the air inlet of the exchange machine is independently increased, the heat radiation effect is improved, the semiconductor refrigerating sheet is used for cooling the cooling liquid and then cooling the heat conducting fins, so that air entering the exchange machine host machine is cooled to a low-temperature state, and the heat radiation effect on the exchange machine can be further improved.
2. According to the auxiliary heat extraction device of the exchanger for the information engineering, provided by the invention, the plurality of fans are arranged on the side edge of the cooling box, and the fans blow towards the first fins, so that the heat radiation effect on the first fins can be increased, and the heat end of the semiconductor refrigerating sheet has a good heat radiation effect.
3. The auxiliary heat extraction device of the exchanger for information engineering has the advantages that the cold end of the semiconductor refrigerating sheet is provided with the plurality of second fins and is arranged in the cooling box, and the plurality of second fins can have larger contact area with cooling liquid and have better cooling effect.
4. According to the auxiliary heat removal device for the exchange machine for the information engineering, the first rubber ring and the second rubber ring are arranged to encircle the outer ring of the first air port or the second air port, the auxiliary heat removal device is tightly attached to the outer ring of the air inlet or the air outlet of the exchange machine host, and the sealing communication state between the first air port and the air inlet or the second air port of the exchange machine host and the air outlet of the exchange machine host is increased.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading of the detailed description of non-limiting embodiments, given with reference to the accompanying drawings in which:
fig. 1 is a schematic view showing the overall structure of an auxiliary heat removal device for a switch for information engineering according to the present invention;
FIG. 2 is a schematic diagram of the structure of a cooling tank of the auxiliary heat removal device for an exchange for information engineering according to the present invention;
fig. 3 is a schematic view showing the internal structure of a cooling tank of the auxiliary heat removal device for a switch for information engineering according to the present invention;
fig. 4 is a schematic cross-sectional view of a radiator tank of the auxiliary heat removal apparatus for a switch for information engineering according to the present invention;
fig. 5 is a schematic diagram of the connection structure of the heat conduction fin and copper pipe of the auxiliary heat removal device for the exchange machine for information engineering.
In the figure: 1. a heat radiation box; 2. a cooling box; 21. a water pump; 211. a water pumping pipe; 212. a water outlet pipe; 22. a semiconductor refrigeration sheet; 221. a first fin; 222. a second fin; 23. a fan; 231. a through port; 232. a dust screen; 24. a water return pipe; 3. a first tuyere; 31. a first filter screen; 32. a first rubber ring; 4. an electric strut; 41. a support plate; 5. a heat conducting fin; 51. copper pipe; 6. a mounting frame; 61. a blower; 7. a second tuyere; 71. a second filter screen; 72. and a second rubber ring.
Detailed Description
Referring to fig. 1-5, the present invention provides a technical solution: an auxiliary heat extraction device of a switch for information engineering comprises a heat extraction box 1, a cooling box 2, a first air port 3, a second air port 7, heat conduction fins 5 and a mounting frame 6; the bottom both sides of the heat dissipation case 1 are all supported and installed electronic branch 4, electronic branch 4 is provided with two, electronic branch 4 is perpendicular to and is arranged in the bottom both sides of the heat dissipation case 1, and the bottom end of electronic branch 4 is fixed with extension board 41 in both sides each other, the top of extension board 41 is arranged in the support that electronic branch 4 was perpendicular to, utilize the extension board 41 of electronic branch 4 bottom, can make its stable support at ground, control electronic branch 4 rise or descend the height, can adjust the height of heat dissipation case 1, make its adaptation air intake and the high different switch host computer of air outlet use.
The right side and the left side surface at the heat dissipation case 1 are offered to first wind gap 3 and second wind gap 7, and the inside intercommunication of heat dissipation case 1 is all passed through to first wind gap 3 and second wind gap 7, and the size of first wind gap 3 and second wind gap 7 is the same, the inside vertical embedding of first wind gap 3 and second wind gap 7 is fixed with first filter screen 31 and second filter screen 71, first filter screen 31 and second filter screen 71 all are provided with two, the inside of embedding to first wind gap 3 of two first filter screens 31 mutually parallel, and the inside of embedding to second wind gap 7 mutually parallel of two second filter screens 71, through the setting of first filter screen 31 and second filter screen 71, can avoid outside dust to get into the inside of heat dissipation case 1 from first wind gap 3 or second wind gap 7.
The heat dissipation case 1 surface fixation of the outer lane of first wind gap 3 has first rubber circle 32, first rubber circle 32 encircles and pastes tightly at the surface of heat dissipation case 1, when first wind gap 3 is close to the air intake of switch host computer, first rubber circle 32 encircles and pastes tightly at the air intake outer lane surface of switch host computer, can keep the purpose of heat dissipation case 1 right side and switch host computer air intake sealing connection, the heat dissipation case 1 surface fixation of the outer lane of second wind gap 7 has second rubber circle 72, second rubber circle 72 encircles and pastes tightly at the surface of heat dissipation case 1, when second wind gap 7 is close to the air outlet of switch host computer, second rubber circle 72 encircles and pastes tightly at the air outlet outer lane surface of switch host computer, can keep the purpose of heat dissipation case 1 left side and switch host computer air outlet sealing connection.
The inside right side at the heat dissipation case 1 is fixed to the vertical of mounting bracket 6, and the mounting bracket 6 is parallel to the right side surface of heat dissipation case 1, the both sides of mounting bracket 6 link up each other, and the even a plurality of fans 61 of installing of right side surface of mounting bracket 6, every fan 61's air outlet all is towards the direction of first wind gap 3, when fan 61 is started the during operation, can make the inside flow air current that forms from left to right of heat dissipation case 1, and then can take out the inside steam of switch host computer from the air outlet through second wind gap 7 and discharge to outside from first wind gap 3, perhaps inhale outside air from second wind gap 7 after, get into the inside of heat dissipation case 1 through the air intake from first air inlet, increase the radiating effect to the switch host computer.
The cooling box 2 is fixed on the lower surface of the side edge of the heat dissipation box 1, the cooling box 2 is internally filled with cooling liquid, the semiconductor refrigerating sheet 22 is attached to the lower surface of the cooling box 2, the cold end of the semiconductor refrigerating sheet 22 is attached to the surface of the cooling box 2, the cold end surface of the semiconductor refrigerating sheet 22 is uniformly provided with a plurality of mutually parallel second fins 222, the second fins 222 penetrate into the cooling box 2, when the semiconductor refrigerating sheet 22 works, the cooling liquid can be cooled to a low temperature state through the second fins 222, the hot end surface of the front end of the semiconductor refrigerating sheet 22 is vertically fixed with a plurality of first fins 221, the first fins 221 are mutually parallel, a fan 23 is transversely arranged on the surface of the cooling box 2 above the semiconductor refrigerating sheet 22, two sides of the fan 23 are respectively provided with a through hole 231 communicated with the inner part of the cooling box, a dustproof net 232 is embedded and fixed in the through hole 231, the dustproof purpose of the fan 23 can be realized, dust can be prevented from entering the inner part of the fan 23, the air outlet of the fan 23 faces downwards, when the fan 23 works, the semiconductor refrigerating sheet 22 can cool well, and the semiconductor refrigerating sheet 22 can cool.
The heat conduction fins 5 are arranged in a plurality of heat conduction fins 5, the heat conduction fins 5 are vertically and uniformly fixed in the heat dissipation box 1, the heat conduction fins 5 are mutually parallel and are arranged on the left side of the mounting frame 6, copper pipes 51 penetrate through the heat conduction fins 5, the copper pipes 51 penetrate through the heat conduction fins 5 in an S shape, two ends of each copper pipe 51 penetrate to the outside of the heat dissipation box 1, the tail end above each copper pipe 51 is communicated with the inside of the cooling box 2 through a water return pipe 24, a water pump 21 is arranged above the side edge of the cooling box 2, an inlet of the water pump 21 is communicated with the inside of the cooling box 2 through a water suction pipe 211, an outlet of the water pump 21 is communicated with the lower side of the copper pipes 51 through a water outlet pipe 212, when the water pump 21 works, cooling liquid in the cooling box 2 can be pumped out through the water suction pipe 211 and then enters the copper pipes 51, good heat dissipation is carried out for the heat conduction fins 5, then flows back into the cooling box 2, when the fan 61 is started to work, external air enters the heat dissipation box 1 from the second air inlet 7, passes through the space between the heat conduction fins 5, the air can be cooled, then the air can be supplied to the heat exchanger through the first air inlet 3, and the good heat dissipation effect is provided for a heat exchanger.
When the heat dissipation box is used, the height of the heat dissipation box 1 is adjusted according to the height of the heat dissipation air outlet or the air inlet of the switch host, so that the electric supporting rod 4 drives the heat dissipation box 1 to rise or fall to the height, the height of the heat dissipation box 1 is suitable for the height of the switch host, and the heights of the first air outlet 3 and the second air outlet 7 are suitable for the heights of the air outlet and the air inlet of the switch host. When the heat dissipation requirement of the exchange host is not high, the heat dissipation box 1 can be made
One side of the second air opening 7 is close to the air outlet of the switch host, or one side of the first air opening 3 of the heat dissipation box 1 is close to the air inlet of the switch host, and the second rubber ring 72 surrounds the outer ring of the air outlet of the switch host to keep close, or the first rubber ring 32 surrounds the outer ring of the air inlet of the switch host to keep close, so that the purposes that the air outlet of the switch host is communicated with the second air opening 7 or the air inlet of the switch host is communicated with the first air opening 3 can be realized, the fan 61 can be independently started to work to blow air towards the first air opening 3, hot air in the switch host is pumped out into the heat dissipation box 1 through the air outlet of the fan, and then is discharged to the outside from the first air opening 3, or the air inlet quantity of the switch host is increased, and the air outlet speed of the switch host can be increased to improve the heat dissipation effect of the switch host can be further increased; when the heat dissipation requirement of the exchanger host is higher, one side of the first air opening 3 of the heat dissipation box 1 can be close to the air inlet of the exchanger host, the first rubber ring 32 surrounds the outer ring of the air inlet of the exchanger host and is tightly attached to the air inlet, the purpose that the air inlet of the exchanger host is communicated with the first air opening 3 can be achieved, the fan 61, the fan 23, the water pump 21 and the semiconductor refrigerating fin 22 can be started at the same time, the cold energy of the cold end of the semiconductor refrigerating fin 22 is transferred to the second fin 222 during operation, the cooling liquid in the cooling box 2 is cooled to a lower temperature, the water pump 21 pumps the cooled cooling liquid from the water pumping pipe 211 and enters the copper pipe 51 through the water outlet pipe 212, then the cooling liquid flows back into the cooling box 2 from the water return pipe 24, when the cooling liquid of the rotating ring passes through the copper pipe 51, the heat conducting fin 5 in the cooling box 2 can be cooled to a lower temperature, the heat of the heat conducting fin 22 at the heat end is transferred to the first fin 221, the fan 23 is acted on the first fin 221 downwards during operation, the cooling liquid can be acted on the second fin 221, the cooling liquid can be better acted on the first fin 221, the cooling liquid can enter the air inlet 3 through the heat exchange body through the heat exchange tube 1, and the cooling liquid can enter the cooling box 3 from the air inlet through the heat exchange body, and the heat exchange body 3, and the cooling effect can be cooled down to the heat inside through the heat exchange body, and the cooling fin 3.
Claims (8)
1. The auxiliary heat extraction device for the exchanger for the information engineering is characterized by comprising a heat extraction box (1), a cooling box (2), a first air port (3), a second air port (7), heat conduction fins (5) and a mounting frame (6); the first air port (3) and the second air port (7) are respectively arranged on the two side surfaces of the radiating box (1), the first air port (3) and the second air port (7) are communicated with the inside of the radiating box (1), and the first air port (3) and the second air port (7) are the same in size;
the cooling box (2) is fixed on the lower side surface of the side edge of the cooling box (1), cooling liquid is filled in the cooling box (2), a semiconductor refrigerating sheet (22) is mounted on the lower side surface of the cooling box (2) in a fitting mode, the cold end of the semiconductor refrigerating sheet (22) is tightly attached to the surface of the cooling box (2), a plurality of first fins (221) are vertically fixed on the hot end surface of the semiconductor refrigerating sheet (22), the first fins (221) are mutually parallel, a plurality of second fins (222) which are mutually parallel are vertically fixed on the cold end surface of the semiconductor refrigerating sheet (22), the second fins (222) penetrate into the cooling box (2) above the inner semiconductor refrigerating sheet (22) of the cooling box (2), fans (23) are transversely mounted on the surface of the cooling box (2), and through holes (231) which are communicated with the inner parts of the fans are formed in two sides of the fans (23);
the heat conduction fins (5) are arranged in a plurality, the heat conduction fins (5) are vertically and uniformly fixed in the heat dissipation box (1), the heat conduction fins (5) are mutually parallel, copper pipes (51) penetrate through the heat conduction fins (5), the copper pipes (51) penetrate through the heat dissipation box (1) in an S shape, two ends of each copper pipe (51) penetrate through the heat dissipation box (1), the tail end above each copper pipe (51) is communicated with the inside of the cooling box (2) through a water return pipe (24), a water pump (21) is arranged above the side edge of the cooling box (2), the inlet of the water pump (21) is communicated with the inside of the cooling box (2) through a water suction pipe (211), and the outlet of the water pump (21) is communicated with the lower part of the copper pipes (51) through a water outlet pipe (212);
the heat dissipation box is characterized in that the mounting frame (6) is vertically fixed inside the heat dissipation box (1) at the side edge of the heat conduction fin (5), two sides of the mounting frame (6) are mutually communicated, a plurality of fans (61) are uniformly arranged on one side surface of the mounting frame (6), and air outlets of the fans (61) face the direction of the first air opening (3).
2. A heat extraction device for use in connection with an information engineering switch as defined in claim 1, wherein: electric supporting rods (4) are supported and installed on two sides of the bottom of the heat dissipation box (1), and the electric supporting rods (4) are two.
3. A heat extraction device for use in connection with an information engineering switch as defined in claim 1, wherein: dust-proof nets (232) are embedded and fixed in the through holes (231) above and below the fan (23), and the through holes (231) of the fan (23) are filled with the dust-proof nets (232).
4. A heat extraction device for use in connection with an information engineering switch as defined in claim 1, wherein: the inside vertical embedding of first wind gap (3) is fixed with first filter screen (31), and first filter screen (31) are provided with two-layer and arrange in first wind gap (3) that are parallel to each other.
5. A heat extraction device for use in connection with an information engineering switch as defined in claim 1, wherein: the second filter screen (71) is vertically embedded and fixed in the second air opening (7), and the second filter screen (71) is provided with two layers and is arranged in the second air opening (7) in parallel.
6. A heat extraction device for use in connection with an information engineering switch as defined in claim 1, wherein: the surface of the radiating box (1) of the outer ring of the first air port (3) is fixedly provided with a first rubber ring (32), and the first rubber ring (32) is tightly adhered to the surface of the radiating box (1) in a surrounding mode.
7. A heat extraction device for use in connection with an information engineering switch as defined in claim 1, wherein: the surface of the radiating box (1) of the outer ring of the second air port (7) is fixedly provided with a second rubber ring (72), and the second rubber ring (72) is tightly adhered to the surface of the radiating box (1) in a surrounding mode.
8. A heat extraction device for use in connection with an information engineering switch as defined in claim 2, wherein: the bottom end of the electric supporting rod (4) is fixed with a supporting plate (41), and a vertically arranged support of the electric supporting rod (4) is arranged above the supporting plate (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311098170.3A CN116981237A (en) | 2023-08-29 | 2023-08-29 | Auxiliary heat extraction device for exchange of information engineering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311098170.3A CN116981237A (en) | 2023-08-29 | 2023-08-29 | Auxiliary heat extraction device for exchange of information engineering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116981237A true CN116981237A (en) | 2023-10-31 |
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| CN202311098170.3A Pending CN116981237A (en) | 2023-08-29 | 2023-08-29 | Auxiliary heat extraction device for exchange of information engineering |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117595563A (en) * | 2024-01-18 | 2024-02-23 | 湖南创一智能科技有限公司 | Motor air-air cooler |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117595563A (en) * | 2024-01-18 | 2024-02-23 | 湖南创一智能科技有限公司 | Motor air-air cooler |
| CN117595563B (en) * | 2024-01-18 | 2024-04-02 | 湖南创一智能科技有限公司 | Motor air-air cooler |
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