CN205407980U - Pick -up module - Google Patents
Pick -up module Download PDFInfo
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- CN205407980U CN205407980U CN201620171408.XU CN201620171408U CN205407980U CN 205407980 U CN205407980 U CN 205407980U CN 201620171408 U CN201620171408 U CN 201620171408U CN 205407980 U CN205407980 U CN 205407980U
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- sensitive chip
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Abstract
The utility model discloses a pick -up module, it includes an optical lens, a sensitization chip and a support. The sensitization chip has an aluminium pad, the support has one and leads to an unthreaded hole and a brazing dish, wherein lead to the unthreaded hole intercommunication two sides of support, the brazing dish is predetermine the surface of support, wherein the sensitization chip is in by dress the support, so that the sensitization chip the aluminium pad with the support the brazing dish is switched on, wherein optical lens set up in the sensitization route of sensitization chip, so that from optical lens gets into the light of pick -up module's inside is passing quilt behind the logical unthreaded hole the sensitization chip is received.
Description
Technical field
This utility model relates to optical imaging field, particularly to a camera module.
Background technology
In recent years, had become as the standard configuration of electronic equipment as the camera module helping user to obtain image or image data, along with the lightening development trend that electronic equipment presents day by day, the size of camera module it is also proposed harsher requirement.Additionally, user is also more and more higher to the requirement of the image quality of camera module, and this makes camera module must flow through the quantity of the various electronic devices and components such as the area of photosensitive region increasing sensitive chip and resistance, electric capacity, driver and improve the packaging technology of camera module and realize.
In the packaging technology of the camera module of prior art, encapsulation CSP (ClipScalePackage particularly with regard to sensitive chip and wiring board, wafer-level package) time, the pad of sensitive chip and the pad of wiring board are typically via tying up gold thread (W/B) technique or tin cream welding procedure sight line.Both technique all also exists significant limitation.
For tying up gold thread technique, when using the pad of the gold thread conducting pad of sensitive chip and wiring board, the pad needing the pad to sensitive chip and wiring board all plants the techniques such as ball wiring, this not only needs to expend more material, but also need to spend more man-hour, to such an extent as to the production efficiency that directly results in the increase of the production cost of camera module and camera module is low.For tin cream welding procedure, LGA (LandGridArray is carried out firstly the need of to sensitive chip, grid array package) technique, this technique can increase the height of sensitive chip, additionally, when adopting the pad of the tin cream welding pad of sensitive chip and wiring board, need to arrange the tin paste layer of 50um left and right thickness between the pad and the pad of wiring board of sensitive chip, which in turns increases the height of the camera module being made into, thus causing that adopting the height dimension that tin cream welding procedure manufactures camera module to be far longer than adopts the height dimension tying up the camera module that gold thread technique manufactures, and then cause that situation about running in the opposite direction occur in the development trend of camera module and the development trend of the electronic equipment of application camera module.
Utility model content
A purpose of the present utility model is in that to provide a camera module, wherein said camera module includes a support and a sensitive chip, the such as various electronic devices and components such as resistance, electric capacity and driver of described camera module it have been integrated in the inside of described support, wherein said sensitive chip is used upside-down method of hull-section construction directly against the downside being loaded on described support, by such mode, the size of described camera module can be effectively reduced, so that described camera module is particularly suitable for being applied to pursuing lightening electronic equipment.
A purpose of the present utility model is in that to provide a camera module, wherein said sensitive chip has an aluminum pad, described support has a copper pad, when described sensitive chip is mounted on described support, the described aluminum pad of described sensitive chip and the described copper pad of described support are simultaneously turned on, that is, described camera module by being used for mounting described sensitive chip and the step of described support and can be used for being connected described sensitive chip and the step of described support unites two into one, with by reduce the packaging process of described camera module reduce described camera module manufacturing cost and improve described camera module production efficiency.
A purpose of the present utility model is in that to provide a camera module, wherein said camera module adopts copper material and aluminium to be respectively prepared the described copper pad of described support and the described aluminum pad of described sensitive chip, the pad that golden material to substitute the camera module of prior art is made, to reduce the material cost of described camera module.
A purpose of the present utility model is in that to provide a camera module, wherein said camera module can adopt ultrasonic welding process to be welded together by the described copper pad of the described aluminum pad of described sensitive chip Yu described support, the described copper pad of described aluminum pad and described support to turn on described sensitive chip.
A purpose of the present utility model is in that to provide a camera module, wherein said camera module can adopt conductive adhesive film the described aluminum pad of described sensitive chip and the described copper pad of described support to be linked together, the described copper pad of described aluminum pad and described support to turn on described sensitive chip.
A purpose of the present utility model is in that to provide a camera module, after the described aluminum pad of wherein said sensitive chip and the described copper pad of described support are welded together, the link position of both does not have the defects such as the pore of no power or macroscopic view, and without problems such as the splashes of the motlten metal easily occurred when generating the intermetallic compound of fragility and occur like in electric resistance welding between the described aluminum pad and the described copper pad of described support of described sensitive chip such that it is able to ensure reliability and the image quality of described camera module.
A purpose of the present utility model is in that to provide a camera module, wherein when the described copper pad of the described aluminum pad of the employing ultrasonic welding process described sensitive chip of connection and described support, the problem using the welding region that cannot touch during manual welding of prior art can be solved, by the dither that ultrasound wave produces, without the described aluminum pad of described sensitive chip and the described copper pad of described support are added any external condition and intermediate medium, thus advantageously reducing the manufacturing cost of described camera module and improving the production efficiency of described camera module.
A purpose of the present utility model is in that to provide a camera module, and the described support of wherein said camera module and described sensitive chip are all without special customization, and versatility is relatively good.
In order to achieve the above object, this utility model provides a camera module, comprising:
One optical lens；
One sensitive chip, described sensitive chip has an aluminum pad；And
The support of one integrated circuit, described support has a light hole and a copper pad, wherein said light hole connects two sides of described support, described copper pad is preset in the surface of described support, wherein said sensitive chip is mounted on described support, so that the described copper pad of the described aluminum pad of described sensitive chip and described support is switched on, wherein said optical lens is arranged at the photosensitive path of described sensitive chip, so that the light entering the inside of described camera module from described optical lens is being received by described sensitive chip after described light hole.
According to a preferred embodiment of the present utility model, the described aluminum pad of described sensitive chip and the photosensitive region of described sensitive chip are positioned at the same side of described sensitive chip, the described copper pad of described aluminum pad switched on is predetermined in the downside of described support, so that described sensitive chip is mounted on the downside of described support.
According to a preferred embodiment of the present utility model, described camera module farther includes a flexible circuit board, wherein said flexible circuit board has a circuit pads, when described flexible circuit board is mounted on described support, described circuit pads is automatically turned on the described copper pad of described support.
According to a preferred embodiment of the present utility model, the described aluminum pad of described circuit pads switched on is predetermined in the upper side of described support, so that described wiring board is mounted on the upper side of described support.
According to a preferred embodiment of the present utility model, the described copper pad of described circuit pads switched on is predetermined in the downside of described support, so that described wiring board is mounted on the downside of described support.
According to a preferred embodiment of the present utility model, described support extends to form an attachment platform to described light hole, one first attachment groove is formed in the downside of described attachment platform, wherein the described copper pad for being switched on the described aluminum pad of described sensitive chip is located at described attachment platform and is positioned at described first attachment groove, so that the described sensitive chip being mounted on described attachment platform is positioned at described first attachment groove, wherein said sensitive chip and described wiring board are not directly contacted with.
According to a preferred embodiment of the present utility model, described camera module farther includes a voice coil motor, wherein said voice coil motor has a motor pad, when described voice coil motor is mounted on the upper side of described support, described motor pad is automatically turned on the described copper pad of described support, and wherein said optical lens is driveably arranged at described voice coil motor.
According to a preferred embodiment of the present utility model, described camera module farther includes a filter element, and wherein said filter element is mounted on described support, so that described filter element is maintained between described optical lens and described sensitive chip.
According to a preferred embodiment of the present utility model, the upper side at described attachment platform forms one second attachment groove, and the described filter element being mounted on described attachment platform is positioned at described second attachment groove.
It is switched on by the mode of ultrasonic bonding according to a preferred embodiment of the present utility model, the described aluminum pad of described sensitive chip and the described copper pad of described support.
According to a preferred embodiment of the present utility model, described camera module includes a conductive adhesive layer, described conductive adhesive layer is formed between the described aluminum pad of described sensitive chip and the described copper pad of described support, the described copper pad of described aluminum pad and described support to turn on described sensitive chip.
According to a preferred embodiment of the present utility model, described conductive adhesive layer is anisotropic conductive film.
Accompanying drawing explanation
Fig. 1 is the structural representation after the camera module according to a preferred embodiment of the present utility model is cut open along centre position.
Fig. 2 is the process schematic that the sensitive chip of the camera module according to above preferred embodiment of the present utility model is mounted on an embodiment of support.
Fig. 3 is the sensitive chip positionality schematic diagram with support of the camera module according to above preferred embodiment of the present utility model.
Fig. 4 is the schematic diagram that the sensitive chip of the camera module according to above preferred embodiment of the present utility model is mounted on another embodiment of support.
Detailed description of the invention
It is described below for disclosing this utility model so that those skilled in the art are capable of this utility model.Preferred embodiment in being described below is only used as citing, it may occur to persons skilled in the art that other apparent modification.The ultimate principle of the present utility model defined in the following description can apply to other embodiments, deformation program, improvement project, equivalent and the other technologies scheme without departing from spirit and scope of the present utility model.
Shown in Fig. 1 to Fig. 4 according to Figure of description of the present utility model, being elucidated with according to the camera module of a preferred embodiment of the present utility model, wherein said camera module includes the support 30 of sensitive chip 10, optical lens 20 and an integrated circuit.
Described sensitive chip 10 has an aluminum pad 11.Described support 30 has light hole 31 and a copper pad 32, and described light hole 31 connects two sides of described support 30, and described copper pad 32 is predetermined in the surface of described support 30.Described sensitive chip 10 is mounted on described support 30, so that described copper pad 32 mutual conduction of the described aluminum pad 11 of described sensitive chip 10 and described support 30, described optical lens 20 is arranged at the photosensitive path of described sensitive chip 10, so that the light being reflected by the object enters the inside of described camera module from described optical lens 20, and received by described sensitive chip 10 after the described light hole 31 of traverse and carry out photoelectric conversion follow-up.
It is worth mentioning that, described camera module of the present utility model adopts upside-down method of hull-section construction by described sensitive chip 10 directly against being loaded on described support 30, the inside of wherein said support 30 has been integrated the such as resistance of described camera module, the various electronic devices and components 100 such as electric capacity and driver, wherein it is predetermined the described copper pad 32 in the surface of described support 30 and is connected to described electronic devices and components 100, by such mode, when the described copper pad 32 of described aluminum pad 11 and described support 30 that described sensitive chip 10 is mounted on described support 30 and described sensitive chip 10 is switched on, described sensitive chip 10 is connected to the described electronic devices and components 100 of the inside being integrated in described support 30.
Preferably, while described sensitive chip 10 is mounted on described support 30, the described aluminum pad 11 of described sensitive chip 10 and the described copper pad 32 of described support 30 are automatically turned on.That is, described camera module of the present utility model is in packed process, described sensitive chip 10 it is mounted on the step of described support 30 and the step of the described aluminum pad 11 of described sensitive chip 10 and described copper pad 32 mutual conduction of described support 30 is united two into one, the manufacturing cost of described camera module can be effectively reduced thereby through the packaging process reducing described camera module and improve the production efficiency of described camera module.
Additionally, the described support 30 of described camera module of the present utility model adopts the golden material that copper material substitutes prior art to make the described copper pad 32 of the described aluminum pad 11 for turning on described sensitive chip 10, by such mode, it is possible to be effectively reduced the material cost of described camera module.
Referring to figs. 2 and 3, it is shown that, the attachment of described sensitive chip 10 and described support 30 can be realized by a ultrasound wave workbench 200, wherein said ultrasound wave workbench 200 includes workbench main body 210 and a pressure head 220.Described ultrasound wave workbench 200 mounts described sensitive chip 10 and includes step in the process of described support 30:
Step one, described workbench main body 210 provides a stopper slot 211 and at least one first sorption channel 212, described first sorption channel 212 is communicated in described stopper slot 211, wherein said support 30 is placed in the described stopper slot 211 of described workbench main body 210, placing described support 30 with the inwall for forming described stopper slot 211 by described workbench main body 210 and the cheap of horizontal level occur, described workbench main body 210 provides absorption affinity so that described support 30 is maintained in described stopper slot 211 by each described first sorption channel 212.
Step 2, described pressure head 220 provides at least one second sorption channel 221, and wherein said pressure head 220 adsorbs described sensitive chip 10 by each described second sorption channel 221, so that described sensitive chip 10 is attached at described pressure head 220.
Step 3, described sensitive chip 10 is overlapped the to each other and is arranged at described support 30 by described pressure head 220, so that the described aluminum pad 11 of described sensitive chip 10 is mutually corresponding with the described copper pad 32 of described support 30 and contacts.
Step 4, described pressure head 220 provides the temperature and pressure being suitable in the described sensitive chip 10 being mutually overlapped and described support 30, the temperature range that wherein said pressure head 220 provides is: 150 DEG C-250 DEG C, and the pressure limit that described pressure head 220 provides is: 25N-50N.
Step 5, described workbench main body 210 inspires dither, the described aluminum pad 11 of the described sensitive chip 10 contacted with each other and the described copper pad 32 of described support 30 is made to occur high frequency friction that molecule aggregation occurs, thus realizing the conducting of the described copper pad 32 of the attachment of described sensitive chip 10 and described support 30 and the described aluminum pad 11 of described sensitive chip 10 and described support 30, the frequency range of the dither that wherein said ultrasound wave workbench inspires is: 17KHZ-27KHZ.
What it will be appreciated by those skilled in the art that is, described step 2 and described step 3 adopt described pressure head 220 that described sensitive chip 10 is arranged at described support 30 overlappingly, can not need so that the described aluminum pad 11 of described sensitive chip 10 corresponds to, with the described copper pad 32 of described support 30, the step contacted mutually, but directly provide by the support 30 described in described sensitive chip 10 that is set together overlappingly in advance in described step one.
With reference to shown in Fig. 4, in another preferred embodiment of described camera module of the present utility model, the connection of the described aluminum pad 11 of described sensitive chip 10 and the described copper pad 32 of described support 30 can also carry out not over the technique of ultrasonic bonding, but realized by glued mode.
Specifically, described camera module also includes a conductive adhesive layer 40, wherein said conductive adhesive layer 40 is formed between described aluminum pad 11 and the described copper pad 32 of described support 30 of described sensitive chip 10, for connecting and turning on the described aluminum pad 11 of described sensitive chip 10 and the described copper pad 32 of described support 30.Described conductive adhesive layer 40 can be anisotropic conductive film.Realize in the composition of attachment of described sensitive chip 10 and described support 30 using glued mode, first one layer of anisotropic conductive film it is coated with in the position of the described aluminum pad 11 of described sensitive chip 10 and/or the described copper pad 32 of described support 30, then described sensitive chip 10 and described support 30 are put together, and make the described aluminum pad 11 of described sensitive chip 10 mutually corresponding with the described copper pad 32 of described support 30, to be formed at the described conductive adhesive layer 40 between described aluminum pad 11 and the described copper pad 32 of described support 30 of described sensitive chip 10 by anisotropic conductive film, turn on the described aluminum pad 11 of described sensitive chip 10 and the described copper pad 32 of described support 30.Preferably, it is also possible to providing hot pressing to overlapped described sensitive chip 10 and described support 30, its temperature is suitable between 150 DEG C-200 DEG C.
With reference to Fig. 1, described camera module includes a wiring board 50, is connected to, for by described camera module, the electronic equipment that described camera module is employed.Described wiring board 50 has a circuit pads 51, and while described wiring board 50 is mounted on described support 30, described circuit pads 51 is automatically turned on the described copper pad 32 of described support 30.It is noted that described wiring board 50 can be mounted on the upper side of described support 30, it is also possible to be mounted on the downside of described support 30, it needs to be designed according to the use of described camera module.In this preferred embodiment of described camera module of the present utility model illustrated in fig. 1, described wiring board 50 is mounted on the downside of described support 30.
Additionally, the described aluminum pad 11 of described sensitive chip 10 and the photosensitive region of described sensitive chip be positioned at described photosensitive New School you 10 same side, the described copper pad 32 of described aluminum pad 11 switched on is predetermined in the downside of described support 30, thus described sensitive chip 10 is mounted on the downside of described support 30 by upside-down method of hull-section construction.
nullDescribed support 30 extends to form an attachment platform 33 to described light hole 31 direction，One first attachment groove 34 is formed in the downside of described attachment platform 33，Wherein the described copper pad 32 for being switched on the described aluminum pad 11 of described sensitive chip 10 is located at described attachment platform 33 and is positioned at described first attachment groove 34，So that the described sensitive chip 10 being mounted on described attachment platform 33 is positioned at described first attachment groove 34，Wherein said sensitive chip 10 and described wiring board 50 are not directly contacted with，By such mode，The flatness of described sensitive chip 10 is not by the impact of the flatness of described wiring board 10，And when described camera module is used，Even if the heat that described sensitive chip 10 produces causes described wiring board 50 to be deformed without the flatness affecting described sensitive chip 10，Thus advantageously ensuring that the image quality of described camera module.
Described camera module farther includes a filter element 60, wherein said filter element 60 is mounted on described support 30, so that described filter element 60 is held between described sensitive chip 10 and described optical lens 20, thus the light being reflected by the object enters the inside of described camera module from described optical lens 20, and received by described sensitive chip 10 after being filtered by described filter element 60, to improve the image quality of described camera module.It is worth mentioning that, the type of described filter element 60 is unrestricted in described camera module of the present utility model, such as described filter element 60 may be implemented as cutoff filter, enters the infrared part in the light within described camera module with what be reflected by the object by the filtration of described filter element 60 from described optical lens 20.
Preferably, upper side at described attachment platform 33 forms one second attachment groove 35, the described filter element 60 being mounted on described attachment platform 33 is positioned at described second attachment groove 35, by such mode, the height dimension of described camera module can be reduced further, so that described camera module is particularly suitable for being applied to pursuing lightening electronic equipment.
Described camera module farther includes a voice coil motor 70, wherein said voice coil motor 70 has a motor pad 71, when described voice coil motor 70 is mounted on the upper side of described support 30, described motor pad 71 is automatically turned on the described copper pad 32 of described support 30, and wherein said optical lens 20 is driveably arranged at described voice coil motor 70.The focal length of described camera module can be adjusted by described voice coil motor 70.Specifically, described voice coil motor 70 can drive described optical lens 20 to move along the short transverse of described camera module, to pass through the focal length changing described optical lens 20 with the distance described camera module of adjustment of described sensitive chip 10.
It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as citing and is not limiting as this utility model.The purpose of this utility model is completely and be effectively realized.Function of the present utility model and structural principle are shown in an embodiment and illustrate, without departing under described principle, embodiment of the present utility model can have any deformation or amendment.
Claims (12)
1. a camera module, it is characterised in that including:
One optical lens；
One sensitive chip, described sensitive chip has an aluminum pad；And
The support of one integrated circuit, described support has a light hole and a copper pad, wherein said light hole connects two sides of described support, described copper pad is preset in the surface of described support, wherein said sensitive chip is mounted on described support, so that the described copper pad of the described aluminum pad of described sensitive chip and described support is switched on, wherein said optical lens is arranged at the photosensitive path of described sensitive chip, so that the light entering the inside of described camera module from described optical lens is being received by described sensitive chip after described light hole.
2. camera module according to claim 1, the described aluminum pad of wherein said sensitive chip and the photosensitive region of described sensitive chip are positioned at the same side of described sensitive chip, the described copper pad of described aluminum pad switched on is predetermined in the downside of described support, so that described sensitive chip is mounted on the downside of described support.
3. camera module according to claim 2, farther include a flexible circuit board, wherein said flexible circuit board has a circuit pads, and when described wiring board is mounted on described support, described circuit pads is automatically turned on the described copper pad of described support.
4. camera module according to claim 3, wherein the described aluminum pad of described circuit pads switched on is predetermined in the upper side of described support, so that described wiring board is mounted on the upper side of described support.
5. camera module according to claim 3, wherein the described copper pad of described circuit pads switched on is predetermined in the downside of described support, so that described wiring board is mounted on the downside of described support.
6. camera module according to claim 5, wherein said support extends to form an attachment platform to described light hole, one first attachment groove is formed in the downside of described attachment platform, wherein the described copper pad for being switched on the described aluminum pad of described sensitive chip is located at described attachment platform and is positioned at described first attachment groove, so that the described sensitive chip being mounted on described attachment platform is positioned at described first attachment groove, wherein said sensitive chip and described wiring board are not directly contacted with.
7. camera module according to claim 6, farther include a voice coil motor, wherein said voice coil motor has a motor pad, when described voice coil motor is mounted on the upper side of described support, described motor pad is automatically turned on the described copper pad of described support, and wherein said optical lens is driveably arranged at described voice coil motor.
8. camera module according to claim 7, farther includes a filter element, and wherein said filter element is mounted on described support, so that described filter element is maintained between described optical lens and described sensitive chip.
9. camera module according to claim 8, wherein forms one second attachment groove at the upper side of described attachment platform, and the described filter element being mounted on described attachment platform is positioned at described second attachment groove.
10., according to described camera module arbitrary in claim 1-9, the described aluminum pad of wherein said sensitive chip and the described copper pad of described support are switched on by the mode of ultrasonic bonding.
11. according to described camera module arbitrary in claim 1-9, wherein said camera module includes a conductive adhesive layer, described conductive adhesive layer is formed between the described aluminum pad of described sensitive chip and the described copper pad of described support, the described copper pad of described aluminum pad and described support to turn on described sensitive chip.
12. camera module according to claim 11, wherein said conductive adhesive layer is anisotropic conductive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620171408.XU CN205407980U (en) | 2016-03-07 | 2016-03-07 | Pick -up module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620171408.XU CN205407980U (en) | 2016-03-07 | 2016-03-07 | Pick -up module |
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| Publication Number | Publication Date |
|---|---|
| CN205407980U true CN205407980U (en) | 2016-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620171408.XU Active CN205407980U (en) | 2016-03-07 | 2016-03-07 | Pick -up module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018224031A1 (en) * | 2017-06-08 | 2018-12-13 | 宁波舜宇光电信息有限公司 | Welding structure for optical module and application thereof |
-
2016
- 2016-03-07 CN CN201620171408.XU patent/CN205407980U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018224031A1 (en) * | 2017-06-08 | 2018-12-13 | 宁波舜宇光电信息有限公司 | Welding structure for optical module and application thereof |
| CN109031572A (en) * | 2017-06-08 | 2018-12-18 | 宁波舜宇光电信息有限公司 | Welding structure and its application for optics module |
| CN110692231A (en) * | 2017-06-08 | 2020-01-14 | 宁波舜宇光电信息有限公司 | Welding structure for optical module and application thereof |
| CN109031572B (en) * | 2017-06-08 | 2023-07-14 | 宁波舜宇光电信息有限公司 | Welding structure for optical module and application thereof |
| US11714250B2 (en) * | 2017-06-08 | 2023-08-01 | Ningbo Sunny Opotech Co., Ltd. | Welding structure for optical module and application thereof |
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