CN205407983U - Pick -up module - Google Patents
Pick -up module Download PDFInfo
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- CN205407983U CN205407983U CN201620172667.4U CN201620172667U CN205407983U CN 205407983 U CN205407983 U CN 205407983U CN 201620172667 U CN201620172667 U CN 201620172667U CN 205407983 U CN205407983 U CN 205407983U
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- support
- camera module
- sensitive chip
- buffer part
- solder joint
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Abstract
The utility model discloses a pick -up module, it includes an optical lens, a sensitization chip, a support and one or more buffering portion. The sensitization chip has a core assembly piece solder joint, the support has one and leads to unthreaded hole and a set of support solder joint, wherein lead to the unthreaded hole intercommunication two sides of support, the support solder joint predetermine in the surface of support, wherein the sensitization chip adorned in the support, so that chip solder joint with the support solder joint corresponds each other and is switched on each other, buffering portion set up in the sensitization chip with between the support, with at dress the sensitization chip in be used for the buffering to result from during the support the sensitization chip with the pressure of support, thus prevent chip solder joint with the support solder joint damages because of undue the impact, wherein optical lens set up in the sensitization route of sensitization chip.
Description
Technical field
This utility model relates to optical imaging field, particularly to a camera module.
Background technology
Development along with the formula of advancing by leaps and bounds of science and technology, camera module has had become as the standard configuration of electronic equipment, it serves mainly to facilitate user and obtains the data such as image or image, formal because electronic equipment is configured for camera module so that electronic equipment is obtained at numerous areas such as such as payment, security protections and is widely applied.
Whether camera module can be conditioned to be divided into according to focal length focuses camera module and zoom camera module, wherein focusing camera module and refer to that the focal length of the camera module manufactured cannot be conditioned, zoom camera module is to can needing by adjustment either automatically or manually according to user by the focal length of the camera module after having manufactured.Regardless of whether focus camera module or zoom camera module, it all includes support and sensitive chip, generally, sensitive chip and support are combined together by pressing by outside force under heating or hyperacoustic environment, in combination with process in, it is desirable to the solder joint of sensitive chip and the solder joint of support are mutually corresponding to switched on.Existence due to the restriction of manufacturing process and error, the surface smoothness of sensitive chip and support all also exists certain difference, therefore, in the process of attachment sensitive chip and support, the pressure force that external force provides cannot be applied in each solder joint of sensitive chip and support equably, which results in a portion solder joint because being damaged by excessive compression, another part solder joint then probably due to stress is not enough and the situation of poor flow occur, finally affects product yield and the image quality of camera module.
Utility model content
A purpose of the present utility model is in that to provide a camera module, wherein said camera module includes a support and a sensitive chip, described support has a pack support solder joint, described sensitive chip has one group of chip welding spot, wherein described sensitive chip is being mounted in the process of described support, the each described chip welding spot of described sensitive chip and each described support solder joint pressure experienced ratio of described support are more uniform, thus preventing each described support solder joint of each described chip welding spot of described sensitive chip and described support all will not be damaged because of undue stress.
A purpose of the present utility model is in that to provide a camera module, wherein said camera module includes a buffer part, wherein when mounting described sensitive chip in described support, described buffer part is arranged between described sensitive chip and described support, described sensitive chip and the pressure of described support is put on, thus the described support solder joint of the described chip welding spot of the described buffer part described sensitive chip of prevention and described support is damaged for buffering.
A purpose of the present utility model is in that to provide a camera module, and wherein said buffer part is predetermined in described support, and described buffer part is adjacent with the described support solder joint of described support, in order to follow-up, described sensitive chip is mounted on described support.
A purpose of the present utility model is in that to provide a camera module, wherein said buffer part is predetermined in described sensitive chip, and described buffer part is adjacent with the described chip welding spot of described sensitive chip, in order to follow-up, described sensitive chip is mounted on described support.
A purpose of the present utility model is in that to provide a camera module, diverse location or the different described buffer part of wherein said buffer part have difference in height, so that each described support solder joint uniform force when described sensitive chip is mounted on described support of each described chip welding spot of described sensitive chip and described support, to ensure the described camera module reliability when being subsequently to be used and to improve the image quality of described camera module.
A purpose of the present utility model is in that to provide a camera module, wherein said buffer part can improve overall ability to bear and the impact resistance of described support, thus reducing the operation easier when mounting described sensitive chip in described support, to improve the reliability of described camera module.
In order to achieve the above object, this utility model provides a camera module, comprising:
One optical lens；
One sensitive chip, described sensitive chip has one group of chip welding spot；
One or more buffer part；And
nullThe support of one integrated circuit，Described support has a light hole and a pack support solder joint，Wherein said light hole connects two sides of described support，Described support solder joint is predetermined in the outer surface of described support，Wherein said sensitive chip is mounted on described support，So that described chip welding spot and described support solder joint are mutually corresponding and by mutual conduction，Described buffer part is arranged between described sensitive chip and described support，To be used for when mounting described sensitive chip in described support cushioning the pressure resulting from described sensitive chip and described support，Thus preventing described chip welding spot and described support solder joint from damaging because too impacting，Wherein said optical lens is arranged at the photosensitive path of described sensitive chip，So that the light entering the inside of described camera module from described optical lens is being received by described sensitive chip after described light hole.
According to a preferred embodiment of the present utility model, described camera module farther includes a voice coil motor, and wherein said voice coil motor is mounted on described support, and described optical lens is driveably arranged at described voice coil motor.
According to a preferred embodiment of the present utility model, described camera module farther includes a filter element, and wherein said filter element is arranged at described support, so that described filter element is held between described optical lens and described sensitive chip.
According to a preferred embodiment of the present utility model, described camera module farther includes a filter element, and wherein said filter element is arranged at described support, so that described filter element is held between described optical lens and described sensitive chip.
According to a preferred embodiment of the present utility model, described support extends to form an attachment platform to described light hole, upper side at described attachment platform forms an attachment groove, and described filter element is mounted on described attachment platform, and described filter element is housed inside described attachment groove.
According to a preferred embodiment of the present utility model, described buffer part is predetermined in described support, and described buffer part is adjacent with described support solder joint.
According to a preferred embodiment of the present utility model, described buffer part is predetermined in described sensitive chip, and described buffer part is adjacent with described sensitive chip.
According to a preferred embodiment of the present utility model, each described buffer part has difference in height.
According to a preferred embodiment of the present utility model, the material of described buffer part is selected from the material group of insulating polymer, conducting polymer, metal and metal-oxide composition.
According to a preferred embodiment of the present utility model, the shape group that the cross sectional shape of described buffer part forms selected from rectangle, circle, triangle, pentagon, hexagon.
According to a preferred embodiment of the present utility model, a described buffer part is disposed adjacently in support solder joint described at least two.
According to a preferred embodiment of the present utility model, buffer part described at least two is disposed adjacently in a described support solder joint.
Accompanying drawing explanation
Fig. 1 is the structural representation after the camera module according to a preferred embodiment of the present utility model is cut open along centre position.
Fig. 2 is the schematic top plan view of the support of the camera module according to above preferred embodiment of the present utility model.
Fig. 3 is the sensitive chip of the camera module according to above preferred embodiment of the present utility model cross-sectional schematic when being mounted on support.
Detailed description of the invention
It is described below for disclosing this utility model so that those skilled in the art are capable of this utility model.Preferred embodiment in being described below is only used as citing, it may occur to persons skilled in the art that other apparent modification.The ultimate principle of the present utility model defined in the following description can apply to other embodiments, deformation program, improvement project, equivalent and the other technologies scheme without departing from spirit and scope of the present utility model.
nullShown in Fig. 1 to Fig. 3 according to Figure of description of the present utility model，It is elucidated with according to the camera module of a preferred embodiment of the present utility model，Wherein said camera module includes a sensitive chip 10、One optical lens 20、The support 30 with electric property of one integrated circuit and one or more buffer part 40，Wherein said buffer part 40 is arranged between described sensitive chip 10 and described support 30 when described sensitive chip 10 is mounted on described support 30，For alleviating the pressure putting on described sensitive chip 10 and described support 30，Described optical lens 20 is arranged at the photosensitive path of described sensitive chip 10，So that the light being reflected by the object is received by described sensitive chip 10 after described optical lens 20 enters the inside of described camera module and carries out photoelectric conversion follow-up，Thus described camera module obtains the image relevant to object.
Described sensitive chip 10 has one group of chip welding spot 11.Accordingly, described support 30 has a pack support solder joint 31, and wherein said support solder joint 31 is predetermined in the outer surface of described support 30.Such as in an embodiment of described camera module of the present utility model, described support solder joint 31 can be predetermined in the lower surface of described support 30, with at the lower surface that described sensitive chip 10 is mounted on support 30 subsequently through upside-down method of hull-section construction, and make the described chip welding spot 11 of described sensitive chip 10 mutually corresponding with the described support solder joint 31 of described support 30 and by mutual conduction.In another embodiment of the described camera module of utility model, described support solder joint 31 can also be predetermined gives you surface in what of described support 30, with at the follow-up upper surface that described sensitive chip 10 is mounted on support 30, and make the described chip welding spot 11 of described sensitive chip 10 mutually corresponding with the described support solder joint 31 of described support 30 and by mutual conduction.
What it will be appreciated by those skilled in the art that is, the such as resistance of described camera module it has been integrated in the inside of the described support 30 of described camera module of the present utility model, the various electronic devices and components such as electric capacity and driver, and it is predetermined the resistance of described support solder joint 31 and the inside being integrated in described support 30 of outer surface in described support 30, the various electronic devices and components such as electric capacity and driver are connected with each other, thus when the described chip welding spot 11 that described sensitive chip 10 is mounted on described support 30 and described sensitive chip 10 is turned on by the described support solder joint 31 with described support 30, described sensitive chip 10 is integrated in the resistance within described support 30, the various electronic devices and components such as electric capacity and driver.
nullDescribed sensitive chip 10 is being mounted in the process of described support 30，Described buffer part 40 is arranged between described sensitive chip 10 and described support 30，And described buffer part 40 is adjacent with the described support solder joint 31 of the described chip welding spot 11 of described sensitive chip 10 and described support 30，By such mode，Time under heating or ultrasonic environment by sensitive chip 10 described in pressure pressing and described support 30，Described buffer part 40 1 aspect can alleviate the described chip welding spot 11 of described sensitive chip 10 and described chip welding spot 31 impact force of described support 30，Thus avoiding the described chip welding spot 11 of described sensitive chip 10 and the described support solder joint 31 of described support 30 to damage because being subject to undue impulsive force，On the other hand described buffer part 40 can make each described support solder joint 31 pressure experienced of each described chip welding spot 11 of described sensitive chip 10 and described support 30 uniform，Thus ensureing that each described chip welding spot 11 of described sensitive chip 10 can both be switched on each described support solder joint 31 of described support 30，By such mode，Ensure that the reliability of described camera module and image quality.
It is noted that in an embodiment of described camera module of the present utility model, described buffer part 40 is to be arranged between described sensitive chip 10 and described support 30 being mounted in the process of described support 30 by described sensitive chip 10.In another embodiment of described camera module of the present utility model, described buffer part 40 is predetermined in described support 30, and described buffer part 40 is adjacent with the described support solder joint 31 of described support 30, thus directly described sensitive chip 10 being mounted on described support 30 follow-up being easy to.In the yet another embodiment of described camera module of the present utility model, described buffer part 40 is predetermined in described sensitive chip 10, and described buffer part 40 is adjacent with the described chip welding spot 11 of described sensitive chip 10, thus described sensitive chip 10 being mounted on described support 30 at follow-up support of being easy to.
Further, described buffer part 40 can have difference in height, discrepant described sensitive chip 10 and described support 30 is had for making up flatness, thus when the described sensitive chip 10 of follow-up attachment and described support 30, each position pressure experienced making described sensitive chip 10 and described support 30 is generally uniform.Such as in an embodiment of the present utility model, the height of described buffer part 40 can be set and tilt from side to opposite side, can also be configured to stepped, and in another embodiment of the present utility model, described camera module can include buffer part 40 described in a group, the described buffer part 40 of diverse location can also have different height, and it is provided according to the specifically used needs of described camera module.
It is worth mentioning that, the material of described buffer part 40 is unrestricted, so that being designed to of described camera module is more flexible, it is preferable that the material of described buffer part 40 is selected from the material group of insulating polymer, conducting polymer, metal and metal-oxide composition.
Referring to figs. 2 and 3, the distribution of described buffer part 40 includes but not limited to each described chip welding spot 11 of described sensitive chip 10 and the periphery of each described support solder joint 31 of described support 30, part of its periphery, part electronic component periphery or partial blank position.Such as in an embodiment of described camera module of the present utility model, a described buffer part 40 is disposed adjacently in support solder joint 31 described at least two.And in another embodiment of described camera module of the present utility model, buffer part 40 described at least two is disposed adjacently in a described support solder joint 31.It is noted that the shape group that the cross sectional shape of described buffer part 40 forms selected from rectangle, circle, triangle, pentagon, hexagon.
With reference to Fig. 1, described support 30 has a light hole 32 further, described light hole 32 connects two sides of described support 30, and the light being wherein reflected by the object enters the inside of described camera module from described optical lens 20 and received by described sensitive chip 10 after the described light hole 32 of traverse and carry out photoelectric conversion follow-up.Preferably, described light hole 32 is a central hole, so that the inwall for forming described light hole 32 of described support 30 will not block the photosensitive path of described sensitive chip 10.
Described camera module farther includes a filter element 50, wherein said filter element 50 is arranged at described support 30, so that described filter element 50 is held between described optical lens 20 and described sensitive chip 10, thus the light being reflected by the object enters the inside of described camera module from described optical lens 20 and can be received by described sensitive chip 10 after being filtered by described filter element 50, the function of noise reduction can be realized, to improve the image quality of described camera module by described filter element 50.
It is worth mentioning that, the type of described filter element 50 is unrestricted, such as in a specific embodiment of described camera module of the present utility model, described filter element 50 may be implemented as cutoff filter, so that described filter element 50 can filter the infrared part in the light of the inside entering described camera module from described optical lens 20, by such mode, it is possible to increase use the image quality of the image that described camera module obtains in the environment that light is stronger.Further, described support 30 extends to form an attachment platform 33 to described light hole 32, upper side at described attachment platform 33 forms an attachment groove 34, described filter element 50 is mounted on described attachment platform 33 and described filter element 50 is positioned at described attachment groove 34, by such mode, the use of described filter element 50 will not increase the height dimension of described camera module, so that described camera module can be applied to pursuing lightening electronic equipment.
Described camera module can be focus camera module, it is also possible to is zoom camera module.In Fig. 1 of Figure of description of the present utility model, such as give the structure of the described camera module being implemented as zoom camera module, wherein said camera module farther includes a voice coil motor 60, described voice coil motor 60 is arranged at described support 30, and described optical lens 20 is driveably arranged at described voice coil motor 60.Described voice coil motor 60 can drive described optical lens 20 to move along the short transverse of described camera module, changes the distance between described optical lens 20 and described sensitive chip 10 with isomorphism and adjusts the focal length of described camera module.
It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as citing and is not limiting as this utility model.The purpose of this utility model is completely and be effectively realized.Function of the present utility model and structural principle are shown in an embodiment and illustrate, without departing under described principle, embodiment of the present utility model can have any deformation or amendment.
Claims (12)
1. a camera module, it is characterised in that including:
One optical lens；
One sensitive chip, described sensitive chip has one group of chip welding spot；
One or more buffer part；And
nullThe support of one integrated circuit，Described support has a light hole and a pack support solder joint，Wherein said light hole connects two sides of described support，Described support solder joint is predetermined in the outer surface of described support，Wherein said sensitive chip is mounted on described support，So that described chip welding spot and described support solder joint are mutually corresponding and by mutual conduction，Described buffer part is arranged between described sensitive chip and described support，To be used for when mounting described sensitive chip in described support cushioning the pressure resulting from described sensitive chip and described support，Thus preventing described chip welding spot and described support solder joint from damaging because too impacting，Wherein said optical lens is arranged at the photosensitive path of described sensitive chip，So that the light entering the inside of described camera module from described optical lens is being received by described sensitive chip after described light hole.
2. camera module according to claim 1, farther includes a voice coil motor, and wherein said voice coil motor is mounted on described support, and described optical lens is driveably arranged at described voice coil motor.
3. camera module according to claim 1, farther includes a filter element, and wherein said filter element is arranged at described support, so that described filter element is held between described optical lens and described sensitive chip.
4. camera module according to claim 2, farther includes a filter element, and wherein said filter element is arranged at described support, so that described filter element is held between described optical lens and described sensitive chip.
5. camera module according to claim 4, wherein said support extends to form an attachment platform to described light hole, upper side at described attachment platform forms an attachment groove, and described filter element is mounted on described attachment platform, and described filter element is housed inside described attachment groove.
6. the camera module according to claim 1,2,3,4 or 5, wherein said buffer part is predetermined in described support, and described buffer part is adjacent with described support solder joint.
7. the camera module according to claim 1,2,3,4 or 5, wherein said buffer part is predetermined in described sensitive chip, and described buffer part is adjacent with described sensitive chip.
8. the camera module according to claim 1,2,3,4 or 5, wherein each described buffer part has difference in height.
9. the camera module according to claim 1,2,3,4 or 5, the material of wherein said buffer part is selected from the material group of insulating polymer, conducting polymer, metal and metal-oxide composition.
10. the camera module according to claim 1,2,3,4 or 5, the shape group that the cross sectional shape of wherein said buffer part forms selected from rectangle, circle, triangle, pentagon, hexagon.
11. according to the camera module described in claim 1,2,3,4 or 5, one of them described buffer part is disposed adjacently in support solder joint described at least two.
12. according to the camera module described in claim 1,2,3,4 or 5, buffer part described at least two of which is disposed adjacently in a described support solder joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620172667.4U CN205407983U (en) | 2016-03-07 | 2016-03-07 | Pick -up module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620172667.4U CN205407983U (en) | 2016-03-07 | 2016-03-07 | Pick -up module |
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| Publication Number | Publication Date |
|---|---|
| CN205407983U true CN205407983U (en) | 2016-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620172667.4U Active CN205407983U (en) | 2016-03-07 | 2016-03-07 | Pick -up module |
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| CN (1) | CN205407983U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040532A (en) * | 2017-06-12 | 2018-12-18 | 宁波舜宇光电信息有限公司 | sensitive chip connection structure and camera module |
| CN114068327A (en) * | 2021-10-29 | 2022-02-18 | 深圳基本半导体有限公司 | Power semiconductor device and preparation process |
-
2016
- 2016-03-07 CN CN201620172667.4U patent/CN205407983U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040532A (en) * | 2017-06-12 | 2018-12-18 | 宁波舜宇光电信息有限公司 | sensitive chip connection structure and camera module |
| CN114068327A (en) * | 2021-10-29 | 2022-02-18 | 深圳基本半导体有限公司 | Power semiconductor device and preparation process |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |