CN205407986U - Pick -up module - Google Patents
Pick -up module Download PDFInfo
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- CN205407986U CN205407986U CN201620173100.9U CN201620173100U CN205407986U CN 205407986 U CN205407986 U CN 205407986U CN 201620173100 U CN201620173100 U CN 201620173100U CN 205407986 U CN205407986 U CN 205407986U
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- support
- camera module
- sensitive chip
- join domain
- pad
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Abstract
The utility model discloses a pick -up module, it includes a sensitization chip, an optical lens and a support. The sensitization chip has an aluminium pad, wherein the aluminium pad with the sense light zone territory of sensitization chip is located the same side of sensitization chip. The support has one and leads to an unthreaded hole and a nickel palau pad, wherein lead to the unthreaded hole intercommunication two sides of support, nickel palau pad predetermine in the downside of support, wherein the sensitization chip adorned in the downside of support to the copper ball is used for connecting the aluminium pad with nickel palau pad is in order to switch on the sensitization chip with the support, wherein optical lens set up in the sensitization route of sensitization chip, so that from optical lens gets into pick -up module's inside is in order to pass quilt behind the logical unthreaded hole the sensitization chip is received.
Description
Technical field
This utility model relates to optical imaging field, particularly to a camera module.
Background technology
Development along with the formula of advancing by leaps and bounds of science and technology, starting to obtain very fast popularizing with the various electronic equipments that mobile intelligent electronic equipment is representative, the fast development of electronic equipment has promoted the very fast development of the camera module being adapted to assist in the user acquisition data such as image or image of one of the standard configuration being taken as electronic equipment.The use of camera module makes electronic equipment in such as photography, pays and many fields such as security protection are obtained for and are widely applied, and brings great convenience and deep change to daily life.
In the past few years, in order to meet the user demand for electronic equipment, electronic equipment increasingly presents lightening development trend, and this Development area size for camera module of electronic equipment, the height dimension especially for camera module propose more stringent requirement, and on the other hand, user is also more and more higher for the requirement of the image quality of camera module.It is well known that, the image quality of camera module is not only based upon on the basis of the encapsulation technology of camera module, and be based upon the area of the photosensitive region increasing sensitive chip and increase resistance, electric capacity, on the basis of the quantity of the various electronic devices and components such as driver, for the camera module adopting the encapsulation technology of traditional such as COB (ClipOnBoard) to encapsulate, the increase of the area of the photosensitive region of sensitive chip and resistance, electric capacity, the increase of the quantity of the electronic devices and components such as driver, inevitably enlarge the size of camera module, and the image quality of camera module is required more high, the size of camera module is more big, there is situation about running in the opposite direction in the lightening development trend of this development trend and electronic equipment of directly results in camera module.
In order to solve this problem, the technique of present sealed in unit module is improved, such as in the technique of present encapsulation camera module, upside-down method of hull-section construction can be adopted to be directly encapsulated on support by sensitive chip during particularly in encapsulation sensitive chip and support, i.e. flipchip packaging technology, this packaging technology allows increase and the resistance of the area of the photosensitive region at sensitive chip, electric capacity, the basis of the increase of the quantity of the various electronic devices and components such as driver controls the size of camera module easily, so that the size of camera module meets the growth requirement of lightening electronic equipment.Under normal circumstances, the pad of sensitive chip is aluminum pad, and the pad of support is copper pad, in the packaging technology of prior art, makes the pad of sensitive chip and the pad mutual conduction of support by planting the mode of gold goal.Then, gold goal material often costly, to such an extent as to causes the relatively costly of camera module.
Utility model content
A purpose of the present utility model is in that to provide a camera module, wherein said camera module includes a sensitive chip and a support, described sensitive chip has aluminum pad, described support has copper pad, the described aluminum pad of wherein said sensitive chip and the described copper pad of described support are switched on by copper ball, relative to the mode of prior art, the manufacturing cost of described camera module of the present utility model is lower.
A purpose of the present utility model is in that to provide a camera module, described aluminum pad that wherein said copper ball is optionally planted in advance in described sensitive chip or the described copper pad of described support, while being mounted on described support at described sensitive chip, the described aluminum pad of described sensitive chip and the described copper pad of described support are automatically turned on by described copper ball, thus described camera module can by reduce its packaging process reduce described camera module manufacturing cost and improve described camera module production efficiency.
A purpose of the present utility model is in that to provide a camera module, and wherein said camera module has the feature of compact, so that described camera module can be applied to pursuing lightening electronic equipment.
A purpose of the present utility model is in that to provide a camera module, and wherein said camera module can be focus camera module, it is also possible to is zoom camera module.
In order to achieve the above object, this utility model provides a camera module, comprising:
One optical lens；
One sensitive chip, described sensitive chip has at least one aluminum pad, and the photosensitive region of wherein said aluminum pad and described sensitive chip is positioned at the same side of described sensitive chip；And
The support of one integrated circuit, described support has a light hole and at least one copper pad, wherein said light hole connects two sides of described support, described copper pad is predetermined in the downside of described support, wherein said sensitive chip is mounted on the downside of described support, and also include at least one copper ball, it is used to connect described aluminum pad and described copper pad, to turn on described sensitive chip and described support, wherein said optical lens is arranged at the photosensitive path of described sensitive chip, so that entering the inside of described camera module to be received by described sensitive chip after described light hole from described optical lens.
According to a preferred embodiment of the present utility model, described copper ball is planted the described aluminum pad in described sensitive chip in advance, thus while described sensitive chip is mounted on the downside of described support, described copper ball is switched on the described copper pad of described support.
According to a preferred embodiment of the present utility model, described copper ball is planted the described copper pad in described support in advance, thus while described sensitive chip is mounted on the downside of described support, described copper ball is switched on the described aluminum pad of described sensitive chip.
According to a preferred embodiment of the present utility model, described camera module farther includes a flexible circuit board, described support has a wiring board join domain, wherein while described flexible circuit board is mounted on described support, described flexible circuit board is automatically turned on the described wiring board join domain of described support.
According to a preferred embodiment of the present utility model, described wiring board join domain is predetermined in the downside of described support, and the plane at the plane at described wiring board join domain place and described copper pad place has difference in height, to form one first attachment groove in the downside of described support, described sensitive chip is positioned at described first attachment groove, so that described sensitive chip and described wiring board are not directly contacted with.
According to a preferred embodiment of the present utility model, described camera module farther includes at least one resistance-capacitance device, wherein said support has a resistance-capacitance device join domain, and while described resistance-capacitance device is mounted on described support, described resistance-capacitance device is automatically turned on described resistance-capacitance device join domain.
According to a preferred embodiment of the present utility model, the upper side of described support has one second attachment groove, and described resistance-capacitance device is positioned at described second attachment groove.
According to a preferred embodiment of the present utility model, described camera module farther includes a voice coil motor, wherein said support has a motor join domain, while described voice coil motor is mounted on described support, described voice coil motor is automatically turned on described motor join domain, and wherein said optical lens is driveably arranged at described voice coil motor.
According to a preferred embodiment of the present utility model, described camera module farther includes a filter element, and wherein said filter element is arranged at described support, so that described filter element is held between described optical lens and described sensitive chip.
According to a preferred embodiment of the present utility model, described filter element is positioned at described second attachment groove.
According to a preferred embodiment of the present utility model, the diameter range of described copper ball is 40um-100um.
According to a preferred embodiment of the present utility model, the altitude range of described copper ball is 30um-100um.It is understandable that above-mentioned numerical value is only used as citing and is not limiting as this utility model.
Accompanying drawing explanation
Fig. 1 is the structural representation after the camera module according to a preferred embodiment of the present utility model is cut open along centre position.
Fig. 2 is the Fig. 1 close-up schematic view at S location.
Detailed description of the invention
It is described below for disclosing this utility model so that those skilled in the art are capable of this utility model.Preferred embodiment in being described below is only used as citing, it may occur to persons skilled in the art that other apparent modification.The ultimate principle of the present utility model defined in the following description can apply to other embodiments, deformation program, improvement project, equivalent and the other technologies scheme without departing from spirit and scope of the present utility model.
Fig. 1 and Fig. 2 with reference to Figure of description of the present utility model, to be elucidated with according to the camera module of a preferred embodiment of the present utility model, wherein said camera module includes the support 30 with electric property of sensitive chip 10, optical lens 20 and an integrated circuit.
Described sensitive chip 10 has aluminum pad 11, and the described aluminum pad 11 of wherein said sensitive chip 10 is positioned at the same side of described sensitive chip 10 with the photosensitive region of described sensitive chip 10.Described support 30 has a light hole 31 and copper pad 32, wherein said light hole 31 connects two sides of described support 30, described copper pad 32 is predetermined in the downside of described support 30, wherein said sensitive chip 10 is mounted on the downside of described support 30 by upside-down method of hull-section construction, and at least copper ball 40 is used to the described copper pad 32 of described the aluminum pad 11 and described support 30 connecting described sensitive chip 10, to turn on described sensitive chip 10 and described support 30.Preferably, while described sensitive chip 10 is mounted on the downside of described support 30, the described aluminum pad 11 of described sensitive chip 10 is automatically connected to the described copper pad 32 of described support 30 by described copper ball 40, by above-mentioned such mode, it is possible to reduce the manufacturing cost of described camera module by reducing the packaging process of described camera module and improve the production efficiency of described camera module.
Described optical lens 20 is arranged at the photosensitive path of described sensitive chip 10.The light being reflected by the object can enter the inside of described camera module to carry out follow-up photoelectric conversion being received by described sensitive chip 10 after described light hole 31 from described optical lens 20, thus described camera module obtains the data such as the image relevant to object or image.
It is noted that can be one at described camera module of the present utility model to focus camera module, it is also possible to be a zoom camera module.Such as, in the embodiment of this deformation of shown in fig. 1 and 2 described camera module, described camera module is a zoom camera module, to improve the environmental suitability of described camera module, wherein said camera module farther includes a voice coil motor 50, described support 30 has been predetermined a motor join domain 33, and described motor join domain 33 and described copper pad 32 are connected to the various electronic devices and components of the inside being integrated in described support 30.While described voice coil motor 50 is mounted on described support 30, described voice coil motor 50 is automatically connected to described motor join domain 33.Described optical lens 20 is driveably arranged at described voice coil motor 50, wherein said voice coil motor 50 can drive described optical lens 20 to move along the short transverse of described camera module, to pass through to change the focal length of the distance described camera module of adjustment between described optical lens 20 and described sensitive chip 10, thus improving the environmental suitability of described camera module.
Preferably, described copper ball 40 can be planted in advance in the described aluminum pad 11 of described sensitive chip 10 and the described copper pad 32 of described support 30 any one, to be conducive to the described camera module of follow-up encapsulation.Such as in a preferred embodiment of described camera module of the present utility model, described copper ball is planted in the described copper pad 32 of described support 30 in advance, thus while described sensitive chip 10 is mounted on the downside of described support 30, the described aluminum pad 11 of described sensitive chip 10 because directly contacting, and turns on described sensitive chip 10 and described support 30 with the described copper ball 40 of described copper pad 32 planted in advance in described support 30 by described copper ball 40.And in another preferred embodiment of described camera module of the present utility model, as shown in Figure 2, described copper ball 40 is planted in the described aluminum pad 11 of described sensitive chip 10 in advance, thus while described sensitive chip 10 is mounted on described support 30, the described copper ball 40 of described aluminum pad 11 planted in advance in described sensitive chip 10 is because directly contacting with the described copper pad 32 of described support 30, and turns on described sensitive chip 10 and described support 30 by described copper ball 40.
What it will be appreciated by those skilled in the art that is, with the mode that the camera module of prior art passes through gold goal conducting sensitive chip and support, the described aluminum pad 11 of described sensitive chip 10 and the described copper pad 32 of described support 30 are attached by described camera module of the present utility model by described copper ball 40, to reduce material cost and the processing technology of described camera module, and use described copper ball 40 to turn on the described aluminum pad 11 of described sensitive chip 10 and the mode of the described copper pad 32 of described support 30, it is possible to increase the reliability and stability of described camera module.
It is noted that the diameter range of described copper ball 40 is 40um-100um, thus described copper ball 40 is prevented from turning on the adjacent described aluminum pad 11 of described sensitive chip 10, to ensure stability and the reliability of the structure of described camera module.The altitude range of described copper ball 40 is 30um-100um, thus the use of described copper ball 40 will not increase the height of described camera module, to pass through to control the height dimension of described camera module, described camera module is made to be particularly suitable for being applied to pursuing lightening electronic equipment.
With reference to Fig. 1, described camera module farther includes a wiring board 60, wherein said support 30 has a wiring board join domain 34, and while described wiring board 60 is mounted on described support 30, described wiring board 60 is automatically connected to the described wiring board join domain 34 of described support 30.Described camera module can be connected to the electronic equipment applying described camera module by described wiring board 60.It is understandable that, the various electronic devices and components of the inside that described wiring board join domain 34 is pre-attached to be integrated in described support 30, thus when described wiring board 60 is switched on described wiring board join domain 34, described wiring board 60 is connected to the various electronic devices and components of the inside being integrated in described support 30.
Under normal circumstances, described wiring board 60 may be implemented as flex circuit application.Additionally, described wiring board join domain 34 is predetermined in the downside of described support 30, and the plane at the plane at described wiring board join domain 34 place and described copper pad 12 place has difference in height, to form one first attachment groove 35 in the downside of described support 30, described sensitive chip 10 is positioned at described first attachment groove 35, so that described sensitive chip 10 and described wiring board 60 are not directly contacted with.
What it will be appreciated by those skilled in the art that is, described sensitive chip 10 and the described wiring board 60 of described camera module of the present utility model are not directly contacted with, thus on the one hand, in the process encapsulating described camera module, the flatness of described sensitive chip 10 will not be subject to the image of the flatness of described wiring board 60, on the other hand, in the process using described camera module, even if the heat that described sensitive chip 10 produces causes the deformation of described wiring board 60 without the flatness having influence on described sensitive chip 10, thus advantageously ensuring that the image quality of described camera module.
With reference to Fig. 1, described camera module farther includes at least one resistance-capacitance device 70, wherein said support 30 has a resistance-capacitance device join domain 36, and while described resistance-capacitance device 70 is mounted on described support 30, described resistance-capacitance device 70 is automatically turned on described resistance-capacitance device join domain 36.It is understandable that, the various electronic devices and components of the inside that described resistance-capacitance device join domain 36 is pre-attached to be integrated in described support 30, thus when described resistance-capacitance device 70 is switched on described resistance-capacitance device join domain 36, described resistance-capacitance device 70 is connected to the various electronic devices and components of the inside being integrated in described support 30.
Preferably, the upper side at described support 30 has one second attachment groove 37, and described resistance-capacitance device 70 is positioned at described second attachment groove 37, to reduce the height dimension of described camera module further.
With reference to Fig. 1, described camera module farther includes a filter element 80, and wherein said filter element 80 is arranged at described support 30, so that described filter element 80 is held between described sensitive chip 10 and described optical lens 20.The light being reflected by the object enters the inside of described camera module from described optical lens 20 and is received by described sensitive chip 10 after being filtered by described filter element 80 and carry out follow-up photoelectric conversion.It is noted that described filter element 80 can improve the imaging cortex of described camera module by the mode of noise reduction.Preferably, described filter element 80 is positioned at described second attachment groove 37, to reduce the height dimension of described camera module further.
It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as citing and is not limiting as this utility model.The purpose of this utility model is completely and be effectively realized.Function of the present utility model and structural principle are shown in an embodiment and illustrate, without departing under described principle, embodiment of the present utility model can have any deformation or amendment.
Claims (15)
1. a camera module, it is characterised in that including:
One optical lens；
One sensitive chip, described sensitive chip has at least one aluminum pad, and the photosensitive region of wherein said aluminum pad and described sensitive chip is positioned at the same side of described sensitive chip；And
The support of one integrated circuit, described support has a light hole and at least one copper pad, wherein said light hole connects two sides of described support, described copper pad is predetermined in the downside of described support, wherein said sensitive chip is mounted on the downside of described support, and also include at least one copper ball, it is used to connect described aluminum pad and described copper pad, to turn on described sensitive chip and described support, wherein said optical lens is arranged at the photosensitive path of described sensitive chip, so that entering the inside of described camera module to be received by described sensitive chip after described light hole from described optical lens.
2. camera module according to claim 1, wherein said copper ball is planted the described aluminum pad in described sensitive chip in advance, thus while described sensitive chip is mounted on the downside of described support, described copper ball is switched on the described copper pad of described support.
3. camera module according to claim 1, wherein said copper ball is planted the described copper pad in described support in advance, thus while described sensitive chip is mounted on the downside of described support, described copper ball is switched on the described aluminum pad of described sensitive chip.
4. according to described camera module arbitrary in claim 1,2 or 3, farther include a flexible circuit board, described support has a wiring board join domain, wherein while described flexible circuit board is mounted on described support, described flexible circuit board is automatically turned on the described wiring board join domain of described support.
5. camera module according to claim 4, wherein said wiring board join domain is predetermined in the downside of described support, and the plane at the plane at described wiring board join domain place and described copper pad place has difference in height, to form one first attachment groove in the downside of described support, described sensitive chip is positioned at described first attachment groove, so that described sensitive chip and described wiring board are not directly contacted with.
6. according to described camera module arbitrary in claim 1,2 or 3, farther include at least one resistance-capacitance device, wherein said support has a resistance-capacitance device join domain, and while described resistance-capacitance device is mounted on described support, described resistance-capacitance device is automatically turned on described resistance-capacitance device join domain.
7. camera module according to claim 5, farther include at least one resistance-capacitance device, wherein said support has a resistance-capacitance device join domain, and while described resistance-capacitance device is mounted on described support, described resistance-capacitance device is automatically turned on described resistance-capacitance device join domain.
8. camera module according to claim 7, the upper side of wherein said support has one second attachment groove, and described resistance-capacitance device is positioned at described second attachment groove.
9. according to described camera module arbitrary in claim 1,2 or 3, farther include a voice coil motor, wherein said support has a motor join domain, while described voice coil motor is mounted on described support, described voice coil motor is automatically turned on described motor join domain, and wherein said optical lens is driveably arranged at described voice coil motor.
10. camera module according to claim 8, farther include a voice coil motor, wherein said support has a motor join domain, while described voice coil motor is mounted on described support, described voice coil motor is automatically turned on described motor join domain, and wherein said optical lens is driveably arranged at described voice coil motor.
11. according to described camera module arbitrary in claim 1,2 or 3, farther include a filter element, wherein said filter element is arranged at described support, so that described filter element is held between described optical lens and described sensitive chip.
12. camera module according to claim 10, farther including a filter element, wherein said filter element is arranged at described support, so that described filter element is held between described optical lens and described sensitive chip.
13. camera module according to claim 12, wherein said filter element is positioned at described second attachment groove.
14. according to described camera module arbitrary in claim 1,2 or 3, the diameter range of wherein said copper ball is 40um-100um.
15. according to described camera module arbitrary in claim 1,2 or 3, the altitude range of wherein said copper ball is 30um-100um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620173100.9U CN205407986U (en) | 2016-03-07 | 2016-03-07 | Pick -up module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620173100.9U CN205407986U (en) | 2016-03-07 | 2016-03-07 | Pick -up module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205407986U true CN205407986U (en) | 2016-07-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620173100.9U Active CN205407986U (en) | 2016-03-07 | 2016-03-07 | Pick -up module |
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| CN (1) | CN205407986U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040532A (en) * | 2017-06-12 | 2018-12-18 | 宁波舜宇光电信息有限公司 | sensitive chip connection structure and camera module |
| KR20200027492A (en) * | 2017-06-08 | 2020-03-12 | 닝보 써니 오포테크 코., 엘티디. | Welding structure used in optical module and its application |
-
2016
- 2016-03-07 CN CN201620173100.9U patent/CN205407986U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200027492A (en) * | 2017-06-08 | 2020-03-12 | 닝보 써니 오포테크 코., 엘티디. | Welding structure used in optical module and its application |
| KR102431380B1 (en) * | 2017-06-08 | 2022-08-11 | 닝보 써니 오포테크 코., 엘티디. | Welding structure used in optical module and its application |
| US11714250B2 (en) | 2017-06-08 | 2023-08-01 | Ningbo Sunny Opotech Co., Ltd. | Welding structure for optical module and application thereof |
| CN109040532A (en) * | 2017-06-12 | 2018-12-18 | 宁波舜宇光电信息有限公司 | sensitive chip connection structure and camera module |
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