CN105472218A - Camera module group, electrical support, and assembly method and application of camera module group - Google Patents
Camera module group, electrical support, and assembly method and application of camera module group Download PDFInfo
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- CN105472218A CN105472218A CN201510868840.4A CN201510868840A CN105472218A CN 105472218 A CN105472218 A CN 105472218A CN 201510868840 A CN201510868840 A CN 201510868840A CN 105472218 A CN105472218 A CN 105472218A
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- tie point
- electric support
- electrically connected
- camera module
- camera modules
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The invention discloses a camera module group, an electrical support, and an assembly method and application of the camera module group. The camera module group comprises an optical lens, a light-sensing chip, and an electrical support. The optical lens is located above the light-sensing chip, and the light-sensing chip is electrically connected to an inner side of the electrical support. The electrical support can be made into any shape, and also has functions of supporting a light filter like a conventional pedestal and serving as a motor base support besides the functions (electric signal conduction of chip, motor and other electronic devices) of a conventional circuit board.
Description
Technical field
The present invention relates to camera module field, in more detail relate to camera module and electric support and assemble method thereof and application.
Background technology
Along with the fast development of electronic product, its status in people's daily life is more and more important.For realizing saving space, the portable market demand, electronic equipment is pursued lightening day by day, this requires the size of all parts of electronic equipment, especially the gauge of all parts is more and more less, and such as, camera module as one of the standard configuration parts of electronic equipment also has lightening development trend.
Traditional C OB (ChiponBoard) processing procedure camera module structure is Rigid Flex, sensitive chip, microscope base, motor drive, lens assembling forms.Each electronic devices and components are positioned over wiring board top layer, non-overlapping copies between device.Along with the requirement of high pixel, ultra-thin module, the imaging requirements of camera module is also more and more higher, and then assembling difficulty strengthens, and device specification is higher.Meanwhile, pixel is larger, and chip area can corresponding increase, and drive the Passive components such as resistance capacitance also correspondingly to increase, namely module size also can be increasing.
Existing cell-phone camera module package structure and mobile phone contradict the slimming of camera module demand, miniaturization, so need to invent a kind of compact camera module and novel encapsulated technology thereof, meet the demand of production development.
Although described camera module is widely used in current camera module field, also there is many drawbacks in it simultaneously.
First, in the manufacturing process of described camera module, carry out also needing motor to be welded in wiring board, to realize be energized to the connection of motor after assembling completes to camera module.Not only complex procedures, also likely because this welding sequence produces many extra problems, such as conforming product rate is probably subject to the impact of welding difficulty action accomplishment.Meanwhile, the connection of this welding is also insecure, is easy to be damaged in operation and maintenance process.
Secondly, owing to being provided with base between motor and base, so the connection between motor and wiring board needs to cross over base, not only take up room, and fastness is relatively weak.
Again, according to traditional handicraft, the connection between motor with base is external welds the impact that electrical connection is more easily subject to external environment, and such as dust may affect its effect connected and useful life.
In addition, for making base have good supporting role, it must have larger size and take larger space, and the size of whole like this camera module increases.If be the size reducing camera module and reduce the size of base, so the supporting role of base then may be affected.
In addition, the wiring board of traditional camera module is separately set in the bottom of camera module, and the relative distance of the element that itself and motor, sensitive chip etc. need energy to supply is far away.This not only needs to consume more energy conducting element, such as wire, and fully do not carry out rational position design to the element of built-up circuit as required in the whole circuit arrangement of described camera module, thus the space that each element of built-up circuit takies rationally is not reduced.That is, if carry out reasonable Arrangement to the wiring board of camera module and the relative position relation of other element, the necessary space shared by circuit element of described camera module can be reduced further, and then reduce the size of described camera module further.Width dimensions or the gauge of camera module can certainly be reduced according to market demand selectivity.
In addition, the mode of the base plate bonding apparatus in camera module of the prior art has two kinds, and a kind of is attaching type connection, and another is that plug-in type connects.Plug-in type connects the general mode adopting connector master-slave seat to combine, and plug-in type connection is general adopts base plate bottom Pin pin golden finger, utilizes the mode that thimble contacts.And no matter the substrate of described camera module adopts that mode, all there is a problem, that is exactly that substrate can only realize being connected to each other of upper and lower orientation.That is, on described substrate, attach sensitive chip, connection device below described substrate, but cannot do simultaneously attaching type connect be connected with plug-in type.Therefore, camera module structure of the prior art can not meet the demand connecting distinct device.
Therefore, those skilled in the art urgently invent a kind of camera module, to solve the above-mentioned problems in the prior art.
Summary of the invention
One object of the present invention is to provide a camera module and electric support and assemble method thereof and application, and wherein said shooting mould does not need the base in traditional handicraft.
Another object of the present invention is to provide a camera module and electric support and assemble method thereof and application, wherein said camera module comprises an electric support, wherein said electric support can make random appearance, except possessing function (signal of telecommunication conducting of the electronic device such as chip, motor) that traditional circuit plate possesses, also possess conventional base and support filter, effect as motor base support.
Another object of the present invention is to provide a camera module and electric support and assemble method thereof and application, wherein said electric support is integrated with the effect of base in traditional camera module and wiring board, makes more compact structure.
Another object of the present invention is to provide a camera module and electric support and assemble method thereof and application, wherein default electric device and conducting element be arranged at described electric support, with in described electrically between form preinstalled circuit.
Another object of the present invention is to provide a camera module and electric support and assemble method thereof and application, wherein electrically support has thin features of shape, to adapt to the thin demand of camera module, and enables electronic equipment be designed to thinner style further.
Another object of the present invention is to provide a camera module and electric support and assemble method thereof and application, wherein electrically the structure of support and other element of shape and described camera module adapt, to reduce the size of whole camera module.
Another object of the present invention is to provide a camera module and electric support and assemble method thereof and application, wherein said camera module physical dimension is less, and thinner thickness.
Another object of the present invention is to provide a camera module and electric support and assemble method thereof and application, wherein said camera module does not have microscope base class formation components and parts, saves Material Cost.
Another object of the present invention is to provide a camera module and electric support and assemble method thereof and application, be embedded in electric support in the passive electrical component of wherein said camera module, save module manufacture processing, reduce processing step, save assembly cost.
Another object of the present invention is to provide a camera module and electric support and assemble method thereof and application, wherein said camera module has little, the well-set advantage of size.
Another object of the present invention is to provide a camera module and electric support and assemble method thereof and application, bury in the resistance capacitor device of wherein said camera module, can avoid capacitance resistance ware region solder resist, dust etc. to put the dirty stain of the module come bad, improving product yield.
Another object of the present invention is to provide a camera module and electric support and assemble method thereof and application, the market competitiveness of wherein said camera module strengthens, the market competitiveness particularly in high-end product strengthens, and then strengthens the market competitiveness of the electronic equipment using described camera module.
Another object of the present invention is to provide a camera module and electric support and assemble method thereof and application, the market competitiveness of wherein said electric support is strong, and then strengthen the market competitiveness of the camera module applying described electric support, and wild phase answers the market competitiveness of electronic equipment further.
One object of the present invention is to provide a camera module and an electric support and assemble method thereof and application, wherein said electric support can not only remove as support component all elements of supporting in described camera module, the element in described camera module can also be electrically connected as a circuit board, thus simplify the structure of described camera module.
Another object of the present invention is to provide a camera module and an electric support and assemble method thereof and application, wherein said electric support can not only be electrically connected in upper and lower orientation and described sensitive chip, can also realize realizing being electrically connected with sensitive chip, electronic component or equipment etc. in outside in described electric support.
Another object of the present invention is to provide a camera module and an electric support and assemble method thereof and application, wherein said electric support can realize being connected with equipment in 5 directions, be conducive to follow-up developments pin pin too much time periphery connect.
Another object of the present invention is to provide a camera module and an electric support and assemble method thereof and application, wherein said sensitive chip is arranged at the inner hollow place of described electric support, thus reduce the thickness of described electric support, be conducive to reducing the thickness of the equipment utilizing described shooting molding further.
Another object of the present invention is to provide a camera module and an electric support and assemble method thereof and application, wherein said electric support all draws tie point in 5 directions, can not only realize being electrically connected with described sensitive chip, and other equipment can be connected more.
Another object of the present invention is to provide a camera module and an electric support and assemble method thereof and application, the inside of wherein said electric support can be established step or be gone out tie point in the inner side of described electric support, for electrically interconnected with described sensitive chip, and the connection of described electric support and described sensitive chip includes but not limited to gold thread, silver-colored line, copper cash or aluminum steel.
Another object of the present invention is to provide a camera module and an electric support and assemble method thereof and application, it is electrically interconnected that wherein said electric support lower can arrange pad or solder joint and described flexible circuit board, and described electric support includes but not limited to anisotropy conductiving glue with the mutual contact mode of described flexible circuit board, the mode such as to weld.
Another object of the present invention is to provide a camera module and an electric support and assemble method thereof and application, wherein said electric support can arrange tie point, and described tie point may be used for and other equipment conductive interconnections, also may be used for fixing other equipment.
Another object of the present invention is to provide a camera module and an electric support and assemble method thereof and application, the outside of wherein said electric support can to carry out conducting interconnected with other external equipments, thus the function realizing described camera module maximizes.
Described camera module has high-flatness performance compared with conventional COB mode module, and its portrait corner uniformity is better than existing conventional camera module.
By description below, other advantage of the present invention and feature will become apparent, and can be accomplished with combination by the means particularly pointed out in claims.
According to the present invention, aforementioned and other object and advantage can by electric support realizations, and wherein said electric support is used to a camera module, and it comprises a rack body and a circuit, wherein said circuit is arranged at described rack body, and is suitable for being electrically connected on a sensitive chip.
In one embodiment, described electric support also comprises a series of jockey, wherein said jockey is arranged at the surface of described rack body, and wherein said jockey comprises a series of sensitive chip tie point, a series of wiring board tie point and a series of electronic component tie point.
In one embodiment, described electric support can do stepped, for carrying IRCF or eyeglass.
In one embodiment, the Passive components such as described electric support built-in capacity, resistance.
In one embodiment, described electric support can arrange pad, pin in step-like main body, to do circuit interconnects with chip, motor.
In one embodiment, sensitive chip can pull out lead-in wire (gold thread, copper cash, aluminum steel, silver-colored line) by traditional C OB mode and to be connected energising with the electric pin on the step of electric support or pad or to be connected energising with the electric pin of the side of electric support or pad.
In one embodiment, there is pad or pin in the top of described electric support, for electrically conducting, above wherein said electric support, pad or pin can upwards prolong, with interconnected with components and parts conductings such as motors, wherein said conducting mutual contact mode is selected from welding, anisotropy conductiving glue or hot pressing; Or below described electric support wiring board position upwards conducting until module group lens end face formed Housing.
According to a further aspect of the invention, the invention provides a camera module, wherein said camera module comprises:
One optical lens;
One sensitive chip; With
One above-mentioned electric support;
The described rack body of wherein said electric support also can comprise a camera lens supporter, and wherein said optical lens is supported in described camera lens supporter, and wherein said sensitive chip can be energized and be connected to described electric support.Described camera module may be embodied as and focuses camera module.
According to a further aspect of the invention, the invention provides a camera module, wherein said camera module comprises:
One optical lens;
One sensitive chip;
One motor;
One filter;
One flexible circuit board; With
One above-mentioned electric support;
Wherein said optical lens can drive by described motor, described motor is subject to the support of described electric support, wherein said sensitive chip and described flexible circuit board can be energized respectively and be connected to described electric support, and wherein said filter is arranged between described optical lens and described sensitive chip; Or
The mode that described electric support and described motor, described sensitive chip or described flexible circuit board are connected for being energized does laminated resin on reinforcement steel plate or copper coin, and internal wiring UNICOM conduction; Or
Described electric support bottom sinking hollow out, and can make chip mount in support.
Wherein said camera module is embodied as automatic focusing camera module.
In other words, for reaching above-mentioned purpose, the invention provides an electric support, described electric support is used to support one camera module, described electric support comprises a rack body and a circuit, and wherein said circuit is arranged at described rack body becomes a circuit board to make described electric support.
In certain embodiments, wherein said rack body is a hollow ring structure, to comprise outside a top surface, a basal surface, one and inside one and a light hole, described top surface, basal surface, outside and inner side respectively by described circuit electrical communication, the described top surface of the through described rack body of described light hole and described basal surface.
Preferably, the inside of wherein said rack body comprises the step of at least one pair of axially symmetrical step or an annular further, described step extends the described inner side of described rack body and is positioned at the top of described through hole, the top surface of described step and described circuit electrical communication.
In certain embodiments, wherein said rack body includes a jockey further, and described jockey is arranged at the surface of described rack body and the described circuit be electrically connected in described rack body.
Further, wherein said jockey includes a sensitive chip tie point, and described sensitive chip tie point is arranged at the both sides of described light hole, for being electrically connected the sensitive chip in described camera module.
Further, wherein said sensitive chip tie point is a pad or solder joint, and described sensitive chip tie point and described sensitive chip are electrically connected by a gold thread.
Preferably, include a wiring board tie point in wherein said jockey further, described wiring board tie point is arranged at the basal surface of described rack body, for being electrically connected the flexible circuit board in described camera module.
In certain embodiments, wherein said wiring board tie point is a pad or solder joint, and described wiring board tie point realizes being electrically connected by welding with described flexible circuit board.
As selection, wherein said wiring board tie point and described flexible circuit board are that sticking type is connected or plug-in type is electrically connected.
In certain embodiments, include a motor tie point in wherein said jockey further, described motor tie point is arranged at the top surface of described rack body, for being electrically connected the driving element in described camera module.
Preferably, wherein said motor tie point is a pad or solder joint, and described motor tie point realizes being electrically connected by welding with described driving element.
As selection, wherein said motor tie point and described driving element are that sticking type or plug-in type are electrically connected.
In certain embodiments, include an electronic component tie point in wherein said jockey further, described electronic component tie point is arranged at the top surface of described step, for being electrically connected an electronic component.
Preferably, wherein said electronic component tie point is a pad or solder joint, and described electronic component tie point realizes being electrically connected by welding with described electronic component.
As selection, wherein said electronic component tie point and described electronic component are that sticking type or plug-in type are electrically connected.
In certain embodiments, wherein said jockey includes an external equipment tie point further, and described external equipment tie point is arranged at the outside of described rack body, for being electrically connected an external equipment.
Preferably, wherein said external equipment tie point is a pad or solder joint, and described external equipment tie point realizes being electrically connected by welding with described external equipment.
As selection, wherein said external equipment tie point and described external equipment are electrically connected by attaching type or plug-in type.
As selection, wherein said jockey includes at least one strong point further, and the described strong point is arranged at the surface of described rack body, and the described strong point is non-conductive.
In addition, the present invention further provides a camera module, described camera module comprises:
One optical lens;
One sensitive chip; And above-mentioned electric support, described optical lens is positioned at the top of described sensitive chip, and described sensitive chip is electrically connected at the inner side of described electric support.
Further, in certain embodiments, wherein said camera module comprises a driving element further, and described driving element is electrically connected at described electric support and connects described optical lens, to enable described driving element by the focal length driven for adjusting described optical lens.
Particularly, described driving element is a motor.
Preferably, wherein said sensitive chip and described electric support are electrically connected by a gold thread.
Further, wherein said sensitive chip is electrically connected by the described sensitive chip tie point on a gold thread and described electric support.
In certain embodiments, wherein said camera module comprises a filter further, and described filter is fixedly set in described electric support and between described optical lens and described sensitive chip.
Particularly, being fixed by described a pair step of described electric support or fixed by holistic ring-shaped step of wherein said filter.
In certain embodiments, wherein said camera module comprises a flexible circuit board further, and described flexible circuit board is electrically connected at the basal surface of described electric support.
Preferably, the wiring board tie point on wherein said flexible PCB and described electric support is electrically connected.
Preferably, the wiring board tie point on wherein said flexible PCB and described electric support goes between by one and realizes being electrically connected.
Particularly, wherein said lead-in wire is gold thread, silver-colored line, copper cash or aluminum steel.
As selection, the wiring board tie point on wherein said flexible PCB and described electric support is that sticking type, plug-in type or attaching type are electrically connected.
In certain embodiments, wherein said camera module comprises at least one electronic component further, and described electronic component and described electric support are electrically connected.
Preferably, the described electronic component tie point wherein on electronic component and described electric support is electrically connected.
Particularly, wherein said electronic component and described electronic component tie point realize being electrically connected by gold thread, silver-colored line, copper cash or aluminum steel.
As selection, wherein said electronic component and described electronic component tie point are that sticking type, plug-in type or attaching type are electrically connected.
Further, wherein said camera module comprises a reinforced element further, and described reinforced element is fixed on described flexible circuit board and is electrically connected with described flexible circuit board.
Preferably, wherein said reinforced element and described flexible circuit board are achieved a fixed connection by resin, and the inside of described resin is provided with conducting wire, are electrically connected to make described reinforced element and described flexible circuit board.
Concrete, wherein said reinforced element is steel plate or copper coin.
In certain embodiments, wherein said camera module can be electrically connected at an external equipment.
In sum, adopt camera module of the present invention and electric support, some beneficial effect following can be reached:
(1) sensitive chip and the interconnected energising of described electric support;
(2) can built-in capacity, resistance, driving chip in described electric support;
(3) described electric support can establish step, can carry chip interconnect conductive line, and described place does not limit gold thread, aluminum steel, copper cash or silver-colored line;
(4) described electric support can establish step, can carry colour filter;
(5) described electric support can arrange pad in below, and interconnected with flexible circuit board conducting, described place does not limit the mode of operation such as anisotropy conductiving glue, welding.
(6) sensitive chip under described electric support scheme and connection device are no longer confined to mode interconnected up and down of the prior art, can also realize inside and outside interconnected simultaneously, and provide more cabling space for jockey.
(7) described electric support can connect by Supporting connectivity equipment on 5 directions of described electric support, be conducive to follow-up developments Pin quantity too much time, can carry out interconnected in the periphery of described electric support.
(8) described electric support scheme is owing to can carry out interconnected with connection device in 5 directions, therefore, it is possible to reduce the bottom thickness of described camera module.
(9) inner side of described electric support also can draw tie point, directly can be connected by modes such as gold threads with sensitive chip, thus makes simple and light.
By the understanding to description subsequently and accompanying drawing, further aim of the present invention and advantage will be fully demonstrated.
These and other objects of the present invention, characteristics and advantages, by following detailed description, accompanying drawing and claim are fully demonstrated.
Accompanying drawing explanation
Fig. 1 is the cutaway view of the camera module according to one first preferred embodiment of the present invention.
Fig. 2 is the partial enlarged drawing of the described camera module according to above-mentioned first preferred embodiment of the present invention.
Fig. 3 is the installation diagram of the described camera module according to above-mentioned first preferred embodiment of the present invention.
Fig. 4 is the cutaway view of the camera module according to one second preferred embodiment of the present invention.
Fig. 5 is the partial enlarged drawing of the described camera module according to above-mentioned second preferred embodiment of the present invention.
Embodiment
Below describe and realize the present invention for disclosing the present invention to enable those skilled in the art.Preferred embodiment in below describing only as an example, it may occur to persons skilled in the art that other apparent modification.The general principle of the present invention defined in the following description can be applied to other embodiments, deformation program, improvement project, equivalent and not deviate from the other technologies scheme of the spirit and scope of the present invention.
Fig. 1 to Fig. 3 illustrates the camera module according to one first preferred embodiment of the present invention.Described camera module comprises electric support 10, flexible circuit board 20, sensitive chip 30, optical lens 40 and a driving element 50.
In the first preferred embodiment of camera module of the present invention, described driving element 50 is set to a motor, but those skilled in the art can select the type of described driving element 50 according to actual conditions, the embodiment of camera module of the present invention is not as limit.
Described optical lens 40 is installed in described motor 50, and described optical lens 40 can be driven to be suitable for auto-focusing by described motor 50.Described flexible circuit board 20 and described motor 50 are arranged at the not homonymy of described electric support 10, with the photosensitive path making described optical lens 40 be positioned at described sensitive chip 30, thus when described camera module is for gathering the image of object, the light be reflected by the object can be accepted to be suitable for carrying out photoelectric conversion by described sensitive chip 30 further after the process by described optical lens 40.That is, in the present invention, described electric support 10 may be used for connecting described flexible circuit board 20 and described motor 50.Namely described electric support 10 is integrated with the base of traditional camera module and the function of wiring board simultaneously, to be used for assembling motor lens assembly and the effect of flexible circuit board being connected sensitive chip.
As shown in Figure 1 to Figure 3, described electric support 10 comprises rack body 11, circuit 12 and a series of jockey 13 and has a light hole 100.Described circuit 12 is embedded in described rack body 11 by interior, and wherein said jockey 13 is arranged at the surface of described rack body 11.Described circuit 12 comprises multiple electric device 121 and one group of conductor 122, wherein said group of conductor 122 can be energized with predetermined manner and connect described electric device 121 and realize being connected with described motor 50, described flexible circuit board 20 and being energized of described sensitive chip 30 by described jockey 13, thus make described camera module form preinstalled circuit, drive and adjustment to carry out presetting.
As depicted in figs. 1 and 2, according to described first preferred embodiment of the present invention, described rack body 11 comprises one first cradle portion 111 and one second cradle portion 112, and wherein said first cradle portion 111 forms an outer shroud.Described second cradle portion 112 is integrated the inner side being arranged at described first cradle portion 111.Described light hole 100 is arranged at described second cradle portion 112.Described second cradle portion 112 forms an inner ring main body.Described first cradle portion 111 has one first top surface 1111.Described second cradle portion 112 has one second top surface 1121.Described second top surface 1121 relative to described first top surface 1111 indent, to form one first groove 1110.According to the described rack body 11 of the described electric support 10 of the described camera module of described first preferred embodiment of the present invention this stair-stepping structure and firm support can be provided by described first cradle portion 111 to described motor 50 and described optical lens 40, be conducive to again making full use of space, for other element of described camera module provides rational installation space.Such as, according to described first preferred embodiment of the present invention, described camera module also comprises a filter 70 and a series of electronic component 80, and wherein said filter 70 is used to filtering veiling glare, to improve pickup quality further.Described filter 70 and described electronic component 80 are all arranged at described second top surface 1121 of described second cradle portion 112, thus described first groove 1110 provides installation space for described filter 70 and described electronic component 80.
The setting position of described sensitive chip 20 and the position of described light hole 100 adapt.First preferred embodiment according to the present invention, described sensitive chip 20 be arranged at described light hole 100 and enclose by described second cradle portion 112, thus take full advantage of the space of described light hole 100.
Described sensitive chip 30 is electrically connected on described electric support 10.Particularly, described sensitive chip 30 comprises a series of sensitive chip electric conductor 31 and a sensitive chip main body 32, and wherein said sensitive chip electric conductor 31 is arranged at described sensitive chip main body 32.The described jockey 13 of described electric support 10 comprises a series of sensitive chip tie point 131, wherein said sensitive chip electric conductor 31 carries out being energized with corresponding sensitive chip tie point 131 and is connected, and then realizes the interconnected energising of described sensitive chip 30 and described electric support 10.According to described first preferred embodiment of the present invention, each sensitive chip electric conductor 31 and corresponding sensitive chip tie point 131 are undertaken being energized by traditional C OB mode and are connected.That is, described sensitive chip 30 pulls out a lead-in wire 60 (gold thread, copper cash, aluminum steel, silver-colored line) by traditional C OB mode and is connected energising with the sensitive chip tie point 131 of described electric support 10.First preferred embodiment according to the present invention, described sensitive chip tie point 131 can be specifically embodied as pin or pad, but is not limited to pin and pad.That is, being energized to being connected of described sensitive chip 30 and described electric support 10 can make full use of existing ripe electric connection technology, to reduce the cost of technological improvement, makes full use of, avoid the wasting of resources to traditional technology and equipment.Certainly, those skilled in the art should be understood that, being energized to being connected of described sensitive chip 30 and described electric support 10 also can be realized by other any be energized to connected mode that can realize goal of the invention of the present invention.The present invention is unrestricted in this regard.
According to described first preferred embodiment of the present invention, described sensitive chip tie point 131 is arranged at the inner side of described second cradle portion 112.Described light hole 100 is that described lead-in wire 60 provides sufficient setting and guard space.
As shown in the figure, described electric support 10 carries out being energized with described flexible circuit board 20 and is connected.The described jockey 13 of described electric support 10 also comprises a series of wiring board tie point 132 particularly.Described flexible circuit board 20 comprises a series of wiring board electric conductor 21 and a wiring board main body 22, and wherein said wiring board electric conductor 21 is arranged at described wiring board main body 22.Described wiring board electric conductor 21 carries out being energized with corresponding wiring board tie point 132 and is connected, and then realizes described electric support 10 and be connected with described being energized of flexible circuit board 20, thus enables described electric support be electrically connected on electric supply installation.
First preferred embodiment according to the present invention, described electric support 10 is mounted on described flexible circuit board 20, and carrying out being energized with described electric support 10 while obtaining described flexible circuit board 20 stable support to make described electric support 10 is connected.It is worth mentioning that, the position of the position of described wiring board electric conductor 21 in described wiring board main body 22 and the described wiring board tie point 132 on described electric support 10 adapts.When being mounted on described electric support 10 to make described flexible circuit board 20, described flexible circuit board 20 can be carried out being energized with described circuit 12 and is connected.Described wiring board electric conductor 21 carries out being energized with the described wiring board tie point 132 on described electric support 10 and is connected, and its connected mode that can be energized can be, but not limited to welding.
According to described first preferred embodiment of the present invention, described wiring board tie point 132 is embodied as circuit pads.Described electric support 10 is welded to connect with described flexible circuit board 20.Those skilled in the art should be understood that, the set-up mode of this attachment and the connected mode of this welding are all only unrestricted to example of the present invention.Connection between described electric support 10 with described flexible circuit board 20 may be embodied as but is not limited to weld.
Described jockey 13 also comprises a series of motor tie point 133 and a series of electronic component tie point 134, and wherein said motor tie point 133 is arranged at described first top surface 1111 of described first cradle portion 111.According to described first preferred embodiment of the present invention, described motor tie point 133 is embodied as a motor pad.Described motor pad is used to described motor 50 to be energized be connected to described circuit 12, to make described motor 50 also can be driven described optical lens 40 further by driving, and then regulates described camera module.
Described motor 50 comprises a series of motor electric conductor 51 and a motor body 52, and wherein said motor electric conductor 51 is arranged at described motor body 52.It is worth mentioning that, the position of the position of described motor electric conductor 51 in described motor body 52 and the described motor tie point 133 on described electric support 10 adapts.When being arranged at described electric support 10 to make described motor 50, described motor 50 can carry out being energized with described circuit 12 and be connected, and then carries out being energized with described flexible circuit board 20 and be connected.More specifically, described motor electric conductor 51 carries out being energized with the described motor tie point 133 on described electric support 10 and is connected, and its connected mode that can be energized can be, but not limited to ACP (anisotropic conductive adhesive), ultrasonic bonding, thermal compression welding, Reflow Soldering welding.
According to described first preferred embodiment of the present invention, described electronic component tie point 134 is arranged at described second top surface 1121 of described second cradle portion 112.Described electronic component tie point 134 is embodied as electronic pads, connects described electronic component 80 for being energized.Those skilled in the art should be understood that; described electronic component 80 can be, but not limited to weld be energized to the connected mode of described electric support 10; also can be specifically embodied as electronic component lacquer disk(-sc) or solder joint etc.; all belong within protection scope of the present invention, the specific embodiment of the present invention is not as limit.
It is worth mentioning that, not only can be applied to zoom camera module according to electric support of the present invention, can also be applied to and focus camera module.
Electronic component tie point 134 electronic component tie point 134 electronic component tie point 134 as shown in Figure 4 and Figure 5, according to described second preferred embodiment of the present invention, described rack body 11A comprises one first cradle portion 111A, one second cradle portion 112A and a camera lens supporter 114A.It is worth mentioning that, described first cradle portion 111A is connected with described second cradle portion 112A one.Described camera lens supporter 114A can be connected and also can removably connect with the described first cradle portion 111A of described rack body 11A or described second cradle portion 112A with the described first cradle portion 111A of described rack body 11A or described second cradle portion 112A one.According to described second preferred embodiment of the present invention, the described first cradle portion 111A of described camera lens supporter 114A and described rack body 11A removably connects.The present invention is unrestricted in this regard.
According to described second preferred embodiment of the present invention, described first cradle portion 111A forms an outer shroud.Described second cradle portion 112A is integrated the inner side being arranged at described first cradle portion 111A.Described light hole 100A is arranged at described second cradle portion 112A.Described second cradle portion 112A forms an inner ring main body.Described first cradle portion 111A has one first top surface 1111A.Described second cradle portion 112A has one second top surface 1121A.Described second top surface 1121A relative to described first top surface 1111A indent, to form one first groove 1110A.According to the described rack body 11A of the described electric support 10A of the described camera module of described second preferred embodiment of the present invention this stair-stepping structure and can by described first cradle portion 111A to described camera lens supporter 114A and and then provide firm support to described optical lens 40A, be conducive to again making full use of space, for other element of described camera module provides rational installation space.Such as, according to described second preferred embodiment of the present invention, described camera module also comprises a filter 70A and a series of electronic component 80A, and wherein said filter is used to filtering veiling glare, to improve pickup quality further.Described filter 70A and described electronic component 80A is all arranged at the described second top surface 1121A of described second cradle portion 112A, thus described first groove 1110A provides installation space for described filter 70A and described electronic component 80A.
The setting position of described sensitive chip 20A and the position of described light hole 100A adapt.Second preferred embodiment according to the present invention, described sensitive chip 20A be arranged at described light hole 100A and enclose by described second cradle portion 112A, thus take full advantage of the space of described light hole 100A.
Described sensitive chip 30A is electrically connected on described electric support 10A.Particularly, described sensitive chip 30A comprises an a series of sensitive chip electric conductor 31A and sensitive chip main body 32A, and wherein said sensitive chip electric conductor 31A is arranged at described sensitive chip main body 32A.The described jockey 13A of described electric support 10A comprises a series of sensitive chip tie point 131A, wherein said sensitive chip electric conductor 31A carries out being energized with corresponding sensitive chip tie point 131A and is connected, and then realizes the interconnected energising of described sensitive chip 30A and described electric support 10A.According to described second preferred embodiment of the present invention, each sensitive chip electric conductor 31A and corresponding sensitive chip tie point 131A are undertaken being energized by traditional C OB mode and are connected.That is, described sensitive chip 30A pulls out a lead-in wire 60A (gold thread, copper cash, aluminum steel, silver-colored line) by traditional C OB mode and is connected energising with the sensitive chip tie point 131A of described electric support 10A.Second preferred embodiment according to the present invention, described sensitive chip tie point 131A can be specifically embodied as pin or pad, but is not limited to pin and pad.That is, being energized to being connected of described sensitive chip 30A and described electric support 10A can make full use of existing ripe electric connection technology, to reduce the cost of technological improvement, makes full use of, avoid the wasting of resources to traditional technology and equipment.Certainly, those skilled in the art should be understood that, being energized to being connected of described sensitive chip 30A and described electric support 10A also can be realized by other any be energized to connected mode that can realize goal of the invention of the present invention.The present invention is unrestricted in this regard.
According to described second preferred embodiment of the present invention, described sensitive chip tie point 131A is arranged at the inner side of described second cradle portion 112A.Described light hole 100A is that described lead-in wire 60A provides sufficient setting and guard space.
As shown in the figure, described electric support 10A carries out being energized with described flexible circuit board 20A and is connected.The described jockey 13A of described electric support 10A also comprises the basal surface that a series of wiring board tie point 132A is arranged at described electric support 10A particularly.Described flexible circuit board 20A comprises an a series of wiring board electric conductor 21A and wiring board main body 22A, and wherein said wiring board electric conductor 21A is arranged at described wiring board main body 22A.Described wiring board electric conductor 21A carries out being energized with corresponding wiring board tie point 132A and is connected, and then realizes described electric support 10A and be connected with being energized of described flexible circuit board 20A, thus enables described electric support be electrically connected on electric supply installation.
Second preferred embodiment according to the present invention, described electric support 10A is mounted on described flexible circuit board 20A, and carrying out being energized with described electric support 10A while obtaining described flexible circuit board 20A stable support to make described electric support 10A is connected.It is worth mentioning that, the position of the position of described wiring board electric conductor 21A on described wiring board main body 22A and the described wiring board tie point 132A on described electric support 10A adapts.When being mounted on described electric support 10A to make described flexible circuit board 20A, described flexible circuit board 20A can carry out being energized with described circuit 12A and be connected.Described wiring board electric conductor 21A carries out being energized with the described wiring board tie point 132A on described electric support 10A and is connected, and its connected mode that can be energized can be, but not limited to welding.
According to described second preferred embodiment of the present invention, described wiring board tie point 132A is embodied as circuit pads.Described electric support 10A and described flexible circuit board 20A is welded to connect.Those skilled in the art should be understood that, the set-up mode of this attachment and the connected mode of this welding are all only unrestricted to example of the present invention.Described electric support 10A may be embodied as with the connection between described flexible circuit board 20A but is not limited to weld.
Described jockey 13A also comprises a series of camera lens supporter tie point 133A and a series of electronic component tie point 134A, and wherein said camera lens supporter tie point 133A is arranged at the described first top surface 1111A of described first cradle portion 111A.According to described second preferred embodiment of the present invention, described camera lens supporter tie point 133A is embodied as a camera lens supporter pad.It is worth mentioning that, not only the described first cradle portion 111A of described rack body 11A and described second cradle portion 112A buries circuit in can being used to, bury circuit in described camera lens supporter 114A also can be used to, also reduce the size of whole camera module with the utilized space increasing intrinsic element further further.Described camera lens supporter pad is used to the circuit buried in described camera lens supporter 114A to be energized the circuit being connected to and burying in described first cradle portion 111A and described second cradle portion 112A, and forms described circuit 12A further.Those skilled in the art should be understood that, in the embodiment that described camera lens supporter 114A is connected with described first cradle portion 111A or described second cradle portion 112A one, then do not need described camera lens supporter tie point 133A.
As camera module of the present invention the second embodiment further preferably, described camera lens supporter 114A can be structure as a whole with described electric support 10A.That is, described camera lens supporter 114A directly electrically extends the top surface of described electric support 10A, and both manage it into as a whole.Setting like this, described jockey 13A just need not comprise described camera lens supporter tie point 133A further, thus makes the more exquisite simplification of structure of described electric support 10A.
According to described second preferred embodiment of the present invention, described camera lens supporter 114A comprises an a series of camera lens supporter electric conductor 1141A and camera lens supportive body 1142A, and wherein said camera lens supporter electric conductor 1141A is arranged at described camera lens supportive body 1142A.It is worth mentioning that, the position of the position of described camera lens supporter electric conductor 1141A on described camera lens supportive body 1142A and the described camera lens supporter tie point 133A on described electric support 10A adapts.When being arranged at described electric support 10A to make described camera lens supporter 114A, described camera lens supporter 114A can carry out being energized with described circuit 12A and be connected, and then carries out being energized with described flexible circuit board 20A and be connected.More specifically, described camera lens supporter electric conductor 1141A carries out being energized with the described camera lens supporter tie point 133A on described electric support 10A and is connected, and its connected mode that can be energized can be, but not limited to ACP (anisotropic conductive adhesive), ultrasonic bonding, thermal compression welding, Reflow Soldering welding.
According to described second preferred embodiment of the present invention, described electronic component tie point 134A is arranged at the described second top surface 1121A of described second cradle portion 112A.Described electronic component tie point 134A is embodied as electronic pads, connects described electronic component 80A for being energized.Those skilled in the art should be understood that, described electronic component 80A can be, but not limited to weld be energized to the connected mode of described electric support 10A.
Described jockey 13A comprises a series of external equipment tie point 135A further, described external equipment tie point 135A is arranged at the outside 1112A of described first cradle portion 111, described external equipment tie point 135A is for connecting a series of external equipment, described external equipment includes but not limited to PCB, application apparatus etc., and the connected mode of described external equipment tie point 135A includes but not limited to welding, splicing etc., as long as realize the electric connection with described sensitive chip 30A by described circuit 12A and described sensitive chip 131.。In other words, described jockey 13 can be comprised by described circuit 12A by described sensitive chip 30A and described electric support 10A described sensitive chip tie point 131A, described wiring board tie point 132A, described camera lens supporter tie point 133A, described electronic component tie point 134A and described external equipment tie point 135A realize interconnected conducting.As long as have employed the same or analogous technical scheme with the present invention; solve the same or analogous technical problem with the present invention; and reach the same or analogous technique effect with the present invention, all belong within protection scope of the present invention, the specific embodiment of the present invention is not as limit.
As the one distortion application of the described preferred implementation of camera module of the present invention, the one or more strong points is may further include in described jockey 13A, the described strong point can conduct electricity setting, the electrical equipment applied of needs can be connected after the described strong point is conducted electricity, certainly, the described strong point also can be set to non-conductive, such as solder joint or pad etc., only as the use of fixture, those skilled in the art can carry out the type of each strong point determined in described jockey 13A according to the actual requirements.
It should be noted that, those skilled in the art can determine the described sensitive chip tie point 131A that described jockey 13A comprises according to the actual requirements, described wiring board tie point 132A, described camera lens supporter tie point 133A, the material of described electronic component tie point 134A and described external equipment tie point 135A and connected mode, such as, described sensitive chip tie point 131A, described wiring board tie point 132A, described camera lens supporter tie point 133A, described electronic component tie point 134A and described external equipment tie point 135A includes but not limited to gold thread, aluminum steel, copper cash or silver-colored line etc., described sensitive chip tie point 131A, described wiring board tie point 132A, described camera lens supporter tie point 133A, the connected mode of described electronic component tie point 134A and described external equipment tie point 135A also includes but is not limited to welding, glued joint, sticking type connects, the modes such as plug-in type connection or attaching type connection.
In addition, the described sensitive chip tie point 131A that described jockey 13A comprises, described wiring board tie point 132A, described camera lens supporter tie point 133A, described electronic component tie point 134A and described external equipment tie point 135A all can be embodied as arbitrary shape and the types such as a pad, welding column or glue point, glue post, are electrically connected described sensitive chip 30A and described electric support 10A as long as can reach and are interconnectedly each other energized.In other words; as long as have employed the same or analogous technical scheme with the present invention; and reach the same or analogous technique effect with the present invention, all belong within protection scope of the present invention, camera module of the present invention embodiment not as limit.
In addition, as camera module of the present invention further preferably, described camera module comprises a reinforced element further, and described reinforced element is fixed with described flexible circuit board 20A and is electrically connected, for increasing the intensity of described flexible circuit board 20A.Particularly, in the described preferred embodiment of camera module of the present invention, described reinforced element is arranged at the below of described flexible circuit board 20A, for be electrically connected between described reinforced element and described flexible circuit board 20A.In other words, utilize described reinforced element to increase the intensity of described flexible circuit board 20A, the setting of described reinforced element simultaneously does not affect the connection of described camera module and external equipment.Preferably, in the described preferred implementation of camera module of the present invention, described reinforced element is a metallic plate, because metallic plate can not only realize function that is firm and conduction, and the effect of heat radiation can be taken into account, thus improve the performance of camera module of the present invention further simultaneously.
More specifically, in the described preferred embodiment of camera module of the present invention, described metallic plate includes but not limited to steel plate or copper coin, and on described steel plate or copper coin, do laminated resin to connect described steel plate/copper coin and described flexible circuit board 20A, increase UNICOM's circuit in the inside of described laminated resin, thus realize the electric connection of described flexible circuit board 20A and described steel plate/copper coin.
Those skilled in the art can select the material of described reinforced element according to actual conditions; as long as have employed the technical scheme identical or approximate with the present invention; and reach the technique effect identical or approximate with the present invention; within the protection range all belonging to camera module of the present invention, the specific embodiment of the present invention is not as limit.
One skilled in the art will understand that the embodiments of the invention shown in foregoing description and accompanying drawing only limit the present invention as an example and not.Object of the present invention is complete and effectively realize.Function of the present invention and structural principle are shown in an embodiment and are illustrated, do not deviating under described principle, embodiments of the present invention can have any distortion or amendment.
Claims (58)
1. an electric support, described electric support is used to support one camera module, it is characterized in that, described electric support comprises a rack body and a circuit, and wherein said circuit is arranged at described rack body becomes a circuit board to make described electric support.
2. electric support according to claim 1, wherein said rack body is a hollow ring structure, to comprise outside a top surface, a basal surface, one and inside one and a light hole, described top surface, basal surface, outside and inner side respectively by described circuit electrical communication, the described top surface of the through described rack body of described light hole and described basal surface.
3. electric support according to claim 2, the inside of wherein said rack body comprises the step of at least one pair of axially symmetrical step or an annular further, described step extends the described inner side of described rack body and is positioned at the top of described through hole, the top surface of described step and described circuit electrical communication.
4. electric support according to claim 3, wherein said rack body includes a jockey further, and described jockey is arranged at the surface of described rack body and the described circuit be electrically connected in described rack body.
5. electric support according to claim 4, wherein said jockey includes a sensitive chip tie point, and described sensitive chip tie point is arranged at the both sides of described light hole, for being electrically connected the sensitive chip in described camera module.
6. electric support according to claim 5, wherein said sensitive chip tie point is a pad or solder joint, and described sensitive chip tie point and described sensitive chip are electrically connected by a gold thread.
7. electric support according to claim 5, a wiring board tie point is included further in wherein said jockey, described wiring board tie point is arranged at the basal surface of described rack body, for being electrically connected the flexible circuit board in described camera module.
8. electric support according to claim 7, wherein said wiring board tie point is a pad or solder joint, and described wiring board tie point realizes being electrically connected by welding with described flexible circuit board.
9. electric support according to claim 7, wherein said wiring board tie point and described flexible circuit board are that sticking type is connected or plug-in type is electrically connected.
10. electric support according to claim 7, include a motor tie point in wherein said jockey further, described motor tie point is arranged at the top surface of described rack body, for being electrically connected the driving element in described camera module.
11. electric supports according to claim 10, wherein said motor tie point is a pad or solder joint, and described motor tie point realizes being electrically connected by welding with described driving element.
12. electric supports according to claim 10, wherein said motor tie point and described driving element are that sticking type or plug-in type are electrically connected.
13. electric supports according to claim 10, include an electronic component tie point in wherein said jockey further, described electronic component tie point is arranged at the top surface of described step, for being electrically connected an electronic component.
14. electric supports according to claim 13, wherein said electronic component tie point is a pad or solder joint, and described electronic component tie point realizes being electrically connected by welding with described electronic component.
15. electric supports according to claim 13, wherein said electronic component tie point and described electronic component are that sticking type or plug-in type are electrically connected.
16. electric supports according to claim 13, wherein said jockey includes an external equipment tie point further, and described external equipment tie point is arranged at the outside of described rack body, for being electrically connected an external equipment.
17. electric supports according to claim 16, wherein said external equipment tie point is a pad or solder joint, and described external equipment tie point realizes being electrically connected by welding with described external equipment.
18. electric supports according to claim 16, wherein said external equipment tie point and described external equipment are electrically connected by attaching type or plug-in type.
19. electric supports according to claim 4, wherein said jockey includes at least one strong point further, and the described strong point is arranged at the surface of described rack body, and the described strong point is non-conductive.
20. 1 camera modules, is characterized in that, described camera module comprises:
One optical lens;
One sensitive chip; And
Electric support according to any one of claim 1 ~ 19, described optical lens is positioned at the top of described sensitive chip, and described sensitive chip is electrically connected at the inner side of described electric support.
21. camera modules according to claim 20, wherein said sensitive chip and described electric support are electrically connected by a gold thread.
22. camera modules according to claim 20, wherein said sensitive chip is electrically connected by the described sensitive chip tie point on a gold thread and described electric support.
23. camera modules according to claim 21, wherein said camera module comprises a filter further, and described filter is fixedly set in described electric support and between described optical lens and described sensitive chip.
24. camera modules according to claim 23, being fixed by described a pair step of described electric support or fixed by holistic ring-shaped step of wherein said filter.
25. camera modules according to claim 24, wherein said camera module comprises a flexible circuit board further, and described flexible circuit board is electrically connected at the basal surface of described electric support.
26. camera modules according to claim 25, the wiring board tie point on wherein said flexible PCB and described electric support is electrically connected.
27. camera modules according to claim 26, the wiring board tie point on wherein said flexible PCB and described electric support goes between by one and realizes being electrically connected.
28. camera modules according to claim 27, wherein said lead-in wire is gold thread, silver-colored line, copper cash or aluminum steel.
29. camera modules according to claim 26, the wiring board tie point on wherein said flexible PCB and described electric support is that sticking type, plug-in type or attaching type are electrically connected.
30. camera modules according to claim 29, wherein said camera module comprises at least one electronic component further, and described electronic component and described electric support are electrically connected.
31. camera modules according to claim 30, the described electronic component tie point wherein on electronic component and described electric support is electrically connected.
32. camera modules according to claim 31, wherein said electronic component and described electronic component tie point realize being electrically connected by gold thread, silver-colored line, copper cash or aluminum steel.
33. camera modules according to claim 32, wherein said electronic component and described electronic component tie point are that sticking type, plug-in type or attaching type are electrically connected.
34. camera modules according to claim 33, wherein said camera module can be electrically connected at an external equipment.
35. camera modules according to claim 34, wherein said camera module is electrically connected described external equipment by the described external equipment tie point on described electric support.
36. camera modules according to claim 35, wherein said camera module comprises a reinforced element further, and described reinforced element is fixed on described flexible circuit board and is electrically connected with described flexible circuit board.
37. camera modules according to claim 36, wherein said reinforced element and described flexible circuit board are achieved a fixed connection by resin, and the inside of described resin is provided with conducting wire, are electrically connected to make described reinforced element and described flexible circuit board.
38. according to camera module according to claim 37, and wherein said reinforced element is steel plate or copper coin.
39. camera modules according to claim 20, wherein said camera module comprises a driving element further, described driving element is electrically connected at described electric support and connects described optical lens, to enable described driving element by the focal length driven for adjusting described optical lens.
40. according to camera module according to claim 39, and wherein said driving element is a motor.
41. camera modules according to claim 40, wherein said sensitive chip and described electric support are electrically connected by a gold thread.
42. camera modules according to claim 40, wherein said sensitive chip is electrically connected by the described sensitive chip tie point on a gold thread and described electric support.
43. camera modules according to claim 41, wherein said camera module comprises a filter further, and described filter is fixedly set in described electric support and between described optical lens and described sensitive chip.
44. camera modules according to claim 42, being fixed by described a pair step of described electric support of wherein said filter.
45. camera modules according to claim 43, wherein said camera module comprises a flexible circuit board further, and described flexible circuit board is electrically connected at the basal surface of described electric support.
46. camera modules according to claim 45, the wiring board tie point on wherein said flexible PCB and described electric support is electrically connected.
47. camera modules according to claim 46, the wiring board tie point on wherein said flexible PCB and described electric support goes between by one and realizes being electrically connected.
48. camera modules according to claim 47, wherein said lead-in wire is gold thread, silver-colored line, copper cash or aluminum steel.
49. camera modules according to claim 46, the wiring board tie point on wherein said flexible PCB and described electric support is that sticking type, plug-in type or attaching type are electrically connected.
50. camera modules according to claim 49, wherein said camera module comprises at least one electronic component further, and described electronic component and described electric support are electrically connected.
51. camera modules according to claim 50, the described electronic component tie point wherein on electronic component and described electric support is electrically connected.
52. camera modules according to claim 51, wherein said electronic component and described electronic component tie point realize being electrically connected by gold thread, silver-colored line, copper cash or aluminum steel.
53. camera modules according to claim 50, wherein said electronic component and described electronic component tie point are that sticking type, plug-in type or attaching type are electrically connected.
54. camera modules according to claim 53, wherein said camera module comprises a reinforced element further, and described reinforced element is fixed on described flexible circuit board and is electrically connected with described flexible circuit board.
55. camera modules according to claim 54, wherein said reinforced element and described flexible circuit board are achieved a fixed connection by resin, and the inside of described resin is provided with conducting wire, are electrically connected to make described reinforced element and described flexible circuit board.
56. camera modules according to claim 55, wherein said reinforced element is steel plate or copper coin.
57. camera modules according to claim 56, wherein said camera module can be electrically connected at an external equipment.
58. camera modules according to claim 57, wherein said camera module is electrically connected described external equipment by the described external equipment tie point on described electric support.
Priority Applications (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510868840.4A CN105472218B (en) | 2015-12-01 | 2015-12-01 | Camera module, electric bracket, assembling method and application thereof |
| PCT/CN2016/108244 WO2017092695A2 (en) | 2015-12-01 | 2016-12-01 | Image capturing module and electrical support thereof |
| US15/780,532 US10701255B2 (en) | 2015-12-01 | 2016-12-01 | Photographing module and electric bracket thereof |
| KR1020207031177A KR102248434B1 (en) | 2015-12-01 | 2016-12-01 | Image capturing module and electrical support thereof |
| EP16870004.5A EP3386181B1 (en) | 2015-12-01 | 2016-12-01 | Photographing module and electric bracket thereof |
| KR1020207031189A KR102403631B1 (en) | 2015-12-01 | 2016-12-01 | Photographing module abd electrical bracket thereof |
| JP2018528239A JP2019500747A (en) | 2015-12-01 | 2016-12-01 | Imaging module and electrical support thereof |
| KR1020187018608A KR20180093962A (en) | 2015-12-01 | 2016-12-01 | An imaging module and its electrical support |
| KR1020187018609A KR20180093963A (en) | 2015-12-01 | 2016-12-01 | An imaging module and its electrical support |
| US15/780,534 US10771666B2 (en) | 2015-12-01 | 2016-12-01 | Image capturing module and electrical support thereof |
| PCT/CN2016/108243 WO2017092694A1 (en) | 2015-12-01 | 2016-12-01 | Photographing module and electric bracket thereof |
| JP2018528295A JP2018538749A (en) | 2015-12-01 | 2016-12-01 | Imaging module and electrical support thereof |
| EP16870005.2A EP3386182A4 (en) | 2015-12-01 | 2016-12-01 | Image capturing module and electrical support thereof |
| JP2022000177A JP7299360B2 (en) | 2015-12-01 | 2022-01-04 | PHOTOGRAPHING MODULE AND ELECTRIC BRACKET THEREOF |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510868840.4A CN105472218B (en) | 2015-12-01 | 2015-12-01 | Camera module, electric bracket, assembling method and application thereof |
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| Publication Number | Publication Date |
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| CN105472218A true CN105472218A (en) | 2016-04-06 |
| CN105472218B CN105472218B (en) | 2019-12-27 |
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| CN201510868840.4A Active CN105472218B (en) | 2015-12-01 | 2015-12-01 | Camera module, electric bracket, assembling method and application thereof |
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| WO2017092694A1 (en) * | 2015-12-01 | 2017-06-08 | 宁波舜宇光电信息有限公司 | Photographing module and electric bracket thereof |
| US10701255B2 (en) | 2015-12-01 | 2020-06-30 | Ningbo Sunny Opotech Co., Ltd. | Photographing module and electric bracket thereof |
| CN105763780A (en) * | 2016-04-07 | 2016-07-13 | 宁波舜宇光电信息有限公司 | Photosensitive device with reinforcing circuit board, array camera module and manufacturing method thereof |
| CN112217969A (en) * | 2016-04-07 | 2021-01-12 | 宁波舜宇光电信息有限公司 | Photosensitive device with reinforced circuit board, array camera module and manufacturing method thereof |
| CN107277309A (en) * | 2016-04-08 | 2017-10-20 | 台湾东电化股份有限公司 | Camera module |
| CN106027863A (en) * | 2016-05-27 | 2016-10-12 | 维沃移动通信有限公司 | Camera base, camera and terminal |
| CN108307582A (en) * | 2017-01-11 | 2018-07-20 | 宁波舜宇光电信息有限公司 | The circuit board arrangement and its manufacturing method of circuit board arrangement and its manufacturing method of opening a window and embedding attachment component |
| CN109361834A (en) * | 2018-10-15 | 2019-02-19 | 信利光电股份有限公司 | Camera module structure |
| TWI697727B (en) * | 2018-10-29 | 2020-07-01 | 大陸商三贏科技（深圳）有限公司 | Lens module |
| US10748946B2 (en) | 2018-10-29 | 2020-08-18 | Triple Win Technology (Shenzhen) Co. Ltd. | Lens module |
| CN111866321A (en) * | 2019-04-30 | 2020-10-30 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof, electronic equipment and method for reducing stray light |
| CN111866321B (en) * | 2019-04-30 | 2022-03-29 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof, electronic equipment and method for reducing stray light |
| CN110620863A (en) * | 2019-09-29 | 2019-12-27 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
| CN110620863B (en) * | 2019-09-29 | 2021-02-23 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
| CN114827389A (en) * | 2021-01-18 | 2022-07-29 | 三赢科技（深圳）有限公司 | Camera module and electronic equipment |
| CN113347332A (en) * | 2021-05-12 | 2021-09-03 | 湖北三赢兴光电科技股份有限公司 | Camera module and mobile phone |
| CN115514864A (en) * | 2021-06-04 | 2022-12-23 | 胜丽国际股份有限公司 | Solderless sensing lens |
| CN115514864B (en) * | 2021-06-04 | 2024-01-23 | 同欣电子工业股份有限公司 | Non-welding type sensing lens |
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