CN110620863B - Camera assembly and electronic equipment - Google Patents
Camera assembly and electronic equipment Download PDFInfo
- Publication number
- CN110620863B CN110620863B CN201910935716.3A CN201910935716A CN110620863B CN 110620863 B CN110620863 B CN 110620863B CN 201910935716 A CN201910935716 A CN 201910935716A CN 110620863 B CN110620863 B CN 110620863B
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- lens
- circuit board
- camera assembly
- support
- protective cover
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The present disclosure provides a camera assembly and electronic equipment, wherein, camera assembly includes: the camera comprises a first circuit board, a protective cover, a first electronic element, a first photosensitive chip, a first lens support and a first lens. The protective cover is covered on the first circuit board, and an accommodating cavity is formed between the protective cover and the first circuit board; the first electronic element is arranged on the first circuit board and is positioned in the accommodating cavity; the first photosensitive chip is arranged on one surface of the protective cover, which is far away from the first circuit board; the first lens support is covered on the first circuit board, and the support side walls on the periphery of the first lens support are flush with the periphery of the first circuit board; the first lens is connected with one end, far away from the first circuit board, of the first lens support, and the lens side walls on the periphery of the first lens are flush with the side wall of the support. The technical problem of space waste caused by the fact that the side face of the lens support protrudes relative to the side face of the lens is solved.
Description
Technical Field
The present disclosure relates to the field of cameras, and in particular, to a camera assembly and an electronic apparatus.
Background
Along with the development of the technology, the size of a camera assembly in electronic equipment has become smaller and smaller, at present, the size of a lens in the camera assembly can be smaller than that of a photosensitive chip, but because the size of a camera circuit board is slightly larger, if the lens support and the camera circuit board are parallel and level all around (so as to enable all components on the camera circuit board to be arranged in an accommodating cavity between the lens support and the camera circuit board, the components are better protected), only the side face of part of the lens support protrudes relative to the side face of the lens, and thus space waste is caused.
Disclosure of Invention
One purpose of the present disclosure is to solve the technical problem of space waste caused by the side surface of the lens holder of the camera assembly protruding relative to the side surface of the lens in the prior art;
another object of the present disclosure is to provide a camera assembly and an electronic apparatus.
In order to solve the technical problem, the following technical scheme is adopted in the disclosure:
according to one aspect of the present disclosure, there is provided a camera assembly comprising:
a first circuit board;
the protective cover is covered on the first circuit board, and an accommodating cavity is formed between the protective cover and the first circuit board;
the first electronic element is arranged on the first circuit board and is positioned in the accommodating cavity;
the first photosensitive chip is arranged on one surface of the protective cover, which is far away from the first circuit board;
the first lens support is covered on the first circuit board, and the support side walls on the periphery of the first lens support are flush with the periphery of the first circuit board;
the first lens is connected with one end, far away from the first circuit board, of the first lens support, and the first lens side wall on the periphery of the first lens is flush with the support side wall.
According to another aspect of the present disclosure, there is provided an electronic apparatus, comprising:
the main board comprises a main board seat;
the first camera assembly comprises the camera assembly, the camera assembly further comprises an interface seat and a flexible circuit, the interface seat is connected with the main board seat in a matched mode, and the camera assembly is electrically connected with the main board through the flexible circuit.
According to the technical scheme, the method has the advantages that:
in this disclosure, will originally carry first sensitization chip and the separation of first electronic component on same circuit board through the safety cover, divide into the structure of two-layer circuit board, wherein first sensitization chip is located the safety cover deviates from the one side of first circuit board, first electronic component establish with on the first circuit board, like this, just can reduce the circuit board size, and is guaranteeing first camera lens support lateral wall all around with under the prerequisite of the parallel and level all around of first circuit board, make first camera lens lateral wall all around with support lateral wall parallel and level. The technical problem of space waste caused by the fact that the side face of the lens support protrudes relative to the side face of the lens is solved.
Drawings
FIG. 1 is a perspective view of one embodiment of the camera assembly.
Figure 2 is an exploded view of one embodiment of the camera assembly.
FIG. 3 is a top view of one embodiment of the camera assembly.
Fig. 4 is a cross-sectional view of the camera assembly at section line AA.
Fig. 5 is a cross-sectional view of the camera assembly at section line BB.
Fig. 6 is a schematic structural view of the protective cover.
Fig. 7 is a schematic structural view of one embodiment of the camera assembly.
Fig. 8 is a schematic structural diagram of one embodiment of the electronic device.
Fig. 9 is a schematic structural diagram of one embodiment of the electronic device.
Fig. 10 is a schematic structural diagram of one embodiment of the electronic device.
Detailed Description
Exemplary embodiments that embody features and advantages of the present disclosure will be described in detail in the following description. It is to be understood that the disclosure is capable of various modifications in various embodiments without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.
The present disclosure provides a camera assembly 100, as shown in fig. 1 to 4, the camera assembly 100 includes a first circuit board 110, a protective cover 120, a first photosensitive chip 140, a first electronic element 150, a first lens holder 160, a first lens 180, and a chip via 190.
The protective cover 120 covers the first circuit board 110, and a receiving cavity 130 is formed between the protective cover and the first circuit board 110. The first electronic component 150 is disposed in the receiving cavity 130 and on the first circuit board 110. The first photosensitive chip 140 is disposed on a surface of the protection cover 120 away from the first circuit board 110, and is disposed on two sides of the protection cover 120 with the first electronic component 150, and electrically connected to the first circuit board 110 through a chip conducting wire 190. Therefore, the electronic elements originally arranged around the photosensitive chip in the related technology are separated from and concentrated on the photosensitive chip, and a laminated structure is formed with the photosensitive chip, so that the circuit board can be reduced to a size slightly larger than the photosensitive chip, the periphery of the circuit board can be flush with the periphery of the lens, and the space waste caused by the protrusion of the support part in the related technology is avoided.
The first lens holder 160 covers the first circuit board 110, wherein the periphery of the first lens holder 160 is flush with the periphery of the first circuit board 110. The first lens 180 is connected to an end of the first lens holder 160 away from the first circuit board 110, wherein the periphery of the first lens 180 is flush with the periphery of the first lens holder 160, so that the periphery of the first circuit board 110 is flush with the periphery of the first lens 180. It is understood that the first lens holder 160 may include a holder sidewall 161 and the first lens 180 may include a lens sidewall. The holder sidewall 161 is located around the first lens holder 160, one end of which is connected to the first circuit board 110, and the other end of which is connected to the first lens 180, and the outer surface of which is flush with the periphery of the first circuit board 110. The lens sidewall is located around the first lens 180, connected to the first lens holder 160, and the outer surface of the lens sidewall is flush with the outer surface of the holder sidewall 161, that is, the outer surface of the lens sidewall, the outer surface of the holder sidewall 161 and the periphery of the first circuit board 110 are flush with each other and located on the same plane. Therefore, the first circuit board 110 and the first lens holder 160 do not have a portion protruding from the first lens 180, and space waste caused by the protruding portion is avoided.
As shown in fig. 6, the protecting cover 120 includes a protecting cover sidewall 121 and a carrying platform 122, the protecting cover sidewall 121 is disposed around the carrying platform 122, the carrying platform 122 is fixedly connected to the first circuit board 110, and a closed receiving cavity 130 is formed between the carrying platform 122 and the first circuit board 110, so that the first electronic component 150 disposed on the first circuit board 110 is well protected. The bearing platform 122 is used for bearing the first photosensitive chip 140, and the first photosensitive chip 140 is fixedly connected to the bearing platform 122. It can be understood that an adhesive layer 101 is further present between the first photosensitive chip 140 and the bearing platform 122, and the first photosensitive chip 140 is fixedly connected to the bearing platform 122 through the adhesive layer 101, wherein the adhesive layer 101 may be an adhesive layer formed by glue or gum, a welding layer formed by solder, a dispensing layer formed by dispensing, and the like, and the disclosure is not limited herein.
It is understood that, as shown in fig. 7, the sidewall 121 of the protective cover 120 may be fixedly connected to the sidewall 161 of the stand, besides leaving a gap with the sidewall 161 of the stand, and in particular, in one embodiment, the sidewall 161 of the stand and the sidewall 121 of the protective cover are integrally formed to form an integral sidewall 105. It is understood that the sidewall 105 may be made of a material having good electrical and thermal conductivity, such as copper, iron, aluminum, and other metal materials. Therefore, the first circuit board 110 and the side wall 105 can be electrically connected, then the side wall 105 and the first photosensitive chip 140 are connected through the chip conducting wire 190, and then the first photosensitive chip 140 and the first circuit board 110 are electrically connected, so that the inconvenience that the chip conducting wire 190 needs to be arranged outside the main body structure or penetrates through the protective cover 120 to enable the first photosensitive chip 140 and the first circuit board 110 to be electrically connected under the condition of the structure is avoided. Meanwhile, since the side wall 105 has good thermal conductivity, a large amount of heat generated by the first electronic element 150 can be timely led out through the side wall 105, and the problem that the heat generated by the first electronic element 150 is always accumulated in the protective cover 120 and cannot be timely led out, which causes local overheating of the camera assembly 100, and affects the service life of the camera assembly 100 is avoided.
Thus, the space of the receiving cavity 130 formed between the protection cover 120 and the first circuit board 110 is larger. Moreover, since the accommodating cavity 130 is separated from the outside of the camera assembly 100 by only one layer of the side wall 105, heat dissipation of the first electronic element 150 in the accommodating cavity 130 is facilitated, and the problem that the heat generated by the first electronic element 150 is always accumulated in the protective cover 120 and cannot be led out in time, which causes local overheating of the camera assembly 100, and affects the service life of the camera assembly 100 is avoided.
Or under the condition that the size of the protection cover 120 is not changed, the size of the camera head assembly 100 can be further reduced, so that the periphery of the first circuit board 110 and the outer surface of the side wall of the lens are flush with the outer surface of the side wall 121 of the protection cover, and the space in the equipment is further saved.
The first electronic component 150 includes an Electrically Erasable Programmable Read-Only Memory (EEPROM) and a capacitor.
It is understood that the camera assembly 100 may further include an optical filter 170, as shown in fig. 1, 2, and 5.
The optical filter 170 is disposed between the first lens 180 and the first photosensitive chip 140, and when external light enters the camera assembly 100 through the first lens 180, infrared light is filtered by the optical filter 170 and then received by the first photosensitive chip 140, so as to generate a higher-quality image. The natural light also comprises infrared light and ultraviolet light besides visible light, and the sensing chip of the color camera can sense infrared light besides visible light, and the infrared light can influence the calculation of the camera assembly on the color of the image, so that the color of the acquired image is distorted. Therefore, the infrared light affecting the image formation needs to be filtered by the filter 170, so as to improve the image quality of the camera assembly.
It can be understood that the filter 170 may be a coated filter, which has high penetrability, and the coated filter may filter out infrared light, and may also filter out oblique light that does not enter the camera assembly directly, so as to avoid the light affecting an adjacent photoreceptor, for example, a photoreceptor chip of another camera assembly of the dual-camera device.
It is understood that the filter 170 may also be a blue glass filter, which has a high transmittance and a low cost without the risk of coating film falling off. Compared with a red-orange glass filter, the blue glass filter has better penetrability and can block light with spectrum falling in 640-650 nm. And because the blue glass filter achieves the purpose of filtering light by absorbing infrared rays, the problem of interference of reflected light is avoided.
The first lens holder 160 includes a holder protrusion 162 and a limiting wall 163 in addition to a holder sidewall 161. The bracket protrusion 162 is disposed on the bracket sidewall 161 and protrudes between the first sensor chip 140 and the first lens 180 to form a through hole 165. The limiting wall 163 is disposed on a surface of the bracket protrusion 162 facing the first lens 180, and is fixedly connected to the first lens 180, so that the first lens 180 is fixedly connected to the first lens bracket 160.
It can be understood that the filter 170 may be disposed on the support protrusion 162, fixedly connected to the support protrusion 162, and in abutting contact with the limiting wall 163 surrounding the support protrusion. Thus, the light entering the transmission filter 170 can be irradiated on the first photosensitive chip 140 through the through hole 165. Meanwhile, the filter 170 is in abutting contact with the limiting wall 163, so that the installation of the filter 170 is facilitated, and the movement of the filter 170 caused by the infirm connection is avoided.
The present disclosure also provides an electronic apparatus, as shown in fig. 8, including a first camera assembly 10 and a main board 90.
Wherein, the main board 90 is provided with a main board seat 91.
The first camera assembly 10 includes the camera assembly 100 as described above, the first camera assembly 10 includes the circuit board 110, the protective cover 120, the first photosensitive chip 140, the first electronic component 150, the first lens holder 160, the first lens 180, the chip conducting wire 190, and the like as described above, and further includes an interface socket 109 and a flexible circuit 108, wherein the interface socket 109 is electrically connected to the first circuit board 110 through the flexible circuit 108. Meanwhile, the interface seat 109 can be connected with the main board seat 21 in a matching way. When the interface seat 109 is mated with the motherboard seat 91, the first camera assembly 10 is electrically connected to the motherboard 90.
It is understood that, as shown in fig. 9, the first camera assembly 10 may be a front camera, and the electronic device may further include a rear case 50 and a screen 60 in addition to the first camera assembly 10 and the main board 90. A cavity 70 is formed between the rear housing 50 and the screen 60 for receiving the first camera assembly 10 and the main board 90. The first camera assembly 10 is located in the cavity 70, the first circuit board 110 of the first camera assembly abuts against the rear case 50, the first lens 180 abuts against the screen 60, and the cavity 70 is filled in the thickness direction of the electronic device.
In the related art, the front camera assembly has a larger volume, but the height (the distance between the lens and the camera circuit board, the same applies below) of the front camera assembly is not as high as that of the rear camera assembly, and is larger than the thickness of the electronic device. Generally, the height of the front camera assembly is smaller than the thickness of the electronic device, so that a gap exists between the circuit board and the rear shell 50, but because the heat generation of the camera assembly is large and the circuit board is a single-sided printed circuit, electronic elements cannot be added in the gap, and the gap is utilized. In the present embodiment, due to the first camera assembly 10, the cavity 70 is filled in the thickness direction of the electronic device, so that the utilization of the gap is realized, and the space of the electronic device in the length direction and/or the width direction is saved, thereby realizing the maximum utilization of the internal space of the electronic device. Meanwhile, since one end of the first camera assembly 10 is in abutting contact with the rear case 50 and the other end of the first camera assembly 10 is in abutting contact with the screen 60, if the first camera assembly 10 falls off from the middle frame or the main board 90 of the electronic device, the first camera assembly 10 is not likely to move due to a gap between the first camera assembly and the rear case 50, so that the first camera assembly 10 is more firmly fixed in the electronic device.
It is understood that the electronic device may include a second camera assembly 20 in addition to the first camera assembly 10 and the main board 90, as shown in fig. 10. The second camera assembly 20 is disposed in the electronic device in parallel with the first camera assembly 10, and a focal length of the second camera assembly 20 is greater than a focal length of the first camera assembly 10.
The second camera assembly 20 includes a second circuit board 210, a second photosensitive chip 240, a second electronic component 250, a second lens holder 260, and a second lens 280.
The second photosensitive chip 240 and the second electronic component 250 are disposed on the second circuit board 210, wherein the second electronic component 250 is disposed around the second photosensitive chip 240. The second lens holder 260 covers the second circuit board 210, and the periphery of the second lens holder is flush with the periphery of the second circuit board 210, so that the second photosensitive chip 240 and the second electronic element 250 on the second circuit board 210 are both disposed, and the second photosensitive chip 240 and the second electronic element 250 are better protected. The second lens 280 is fixedly connected to an end of the second lens holder 260 away from the second circuit board 210. The second circuit board 210 is flush with the first circuit board 110, and the second lens 280 is flush with the first lens 180.
At present, the lens combination of a telephoto lens and a standard lens or a telephoto lens and a wide-angle lens is mostly adopted by the double-shooting electronic equipment on the market, the focal lengths of the two camera assemblies are different, so that the two cameras can mutually make up respective defects, and obtain images with better viewing angles and depth of field, and because the focal lengths of the two cameras are different, the optical zooming in a certain range can be realized. However, the two cameras have different heights due to different focal lengths, and therefore, the height difference exists, which is not beneficial to the lens combination installation. When the lens assembly is installed in the electronic device, there is a risk that a structural member in the electronic device blocks the field angle of the shorter lens, so that the field angle of the shorter lens is reduced, and the imaging field range of the electronic device is affected.
In the embodiment, due to the existence of the protective cover 120 in the first camera assembly 10, the first photo sensor chip 140 is raised, so that the height of the first camera assembly 10 is approximately equal to the focal length of the first camera assembly 10 plus the distance between the first photo sensor chip 140 and the first circuit board 110. Even if the focal length of the second camera assembly 20 is larger than that of the first camera assembly 10, the first camera assembly 10 can also heighten the first photosensitive chip 140 through the protective cover 120 to make the overall height of the first camera assembly 10 equal to that of the second camera assembly 20, so that inconvenience in the installation process is avoided, and the image acquired by the first camera assembly 10 cannot be influenced by shielding of structural members in the electronic device.
It will be appreciated that the second camera assembly 20 may also be constructed the same as camera assembly 100, including a protective cover. In this case, as long as the height difference of the protective cover 120 of the first camera assembly 10 higher than the protective cover of the second camera assembly 20 is equal to the focal length difference between the second camera assembly 20 and the first camera assembly 10, the heights of the second camera assembly 20 and the first camera assembly 10 can be equal, and compared with the above scheme, the space in the length direction and the width direction of the electronic device is further saved.
It is understood that in an electronic device with three shots and other multiple shots, the heights of the cameras can be consistent by using the scheme. For example, taking a three-camera device as an example, if the camera assembly of the three-camera device includes a telephoto lens, a wide-angle lens and an ultra-wide-angle lens. Then, on the basis of the above-mentioned dual-camera device scheme, the structure of the ultra-wide-angle lens is also changed to the same structure as that of the first camera module 10, and the height of the protection cover of the ultra-wide-angle lens is made larger than that of the protection cover of the wide-angle lens, so that the ultra-wide-angle lens can be highly identical to the telephoto lens and the wide-angle lens.
It is understood that the second circuit board 210 and the first circuit board 110 can be integrally formed to form a one-piece circuit board, and the second lens holder 260 and the first lens holder 160 can also be integrally formed to form a one-piece lens holder.
While the present disclosure has been described with reference to several exemplary embodiments, it is understood that the terminology used is intended to be in the nature of words of description and illustration, rather than of limitation. As the present disclosure may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.
Claims (11)
1. A camera head assembly, comprising:
a first circuit board;
the protective cover is covered on the first circuit board, and an accommodating cavity is formed between the protective cover and the first circuit board;
the first electronic element is arranged on the first circuit board and is positioned in the accommodating cavity;
the first photosensitive chip is arranged on one surface of the protective cover, which is far away from the first circuit board;
the first lens support is covered on the first circuit board, and the support side walls on the periphery of the first lens support are flush with the periphery of the first circuit board;
the first lens is connected with one end, far away from the first circuit board, of the first lens support, and the lens side walls on the periphery of the first lens are flush with the side wall of the support.
2. A camera assembly according to claim 1, further comprising:
and the optical filter is arranged between the first photosensitive chip and the first lens and filters the infrared light passing through the first lens.
3. The camera assembly of claim 2, wherein the first lens holder comprises:
the bracket side wall is flush with the periphery of the first circuit board, one end of the bracket side wall is connected with the first circuit board, and the other end of the bracket side wall is connected with the first lens;
the support bulge is arranged on the side wall of the support, the support bulge protrudes towards the space between the first photosensitive chip and the first lens to form a through hole, and the support bulge is fixedly connected with the optical filter.
4. The camera assembly according to claim 3, wherein a limiting wall is further disposed on a surface of the protrusion of the bracket facing the first lens, and the limiting wall surrounds the periphery of the optical filter and abuts against the optical filter for limiting.
5. A camera assembly according to claim 1, wherein the shield side walls around the shield are fixedly connected to the frame side walls.
6. A camera assembly according to claim 5, wherein the shroud side walls are integrally formed with the bracket side walls.
7. A camera assembly according to claim 1, further comprising:
and the chip conducting wire is used for electrically connecting the first photosensitive chip with the first circuit board.
8. The camera assembly of claim 1, wherein an adhesive layer is disposed between the first photo sensor chip and the protective cover, the adhesive layer fixedly attaching the first photo sensor chip to the protective cover.
9. An electronic device, characterized in that the electronic device comprises:
the main board comprises a main board seat;
a first camera assembly comprising a camera assembly according to any of claims 1-8, the first camera assembly further comprising an interface socket and a flexible circuit, the interface socket being cooperatively connected with the motherboard socket and electrically connecting the first camera assembly to the motherboard via the flexible circuit.
10. The electronic device of claim 9, further comprising a rear housing and a screen, wherein the first camera assembly is positioned between the rear housing and the screen glass, the first circuit board abuts the rear housing, and the first lens abuts the screen.
11. The electronic device of claim 9, further comprising a second camera assembly having a focal length greater than the first camera, the second camera assembly comprising:
a second circuit board flush with the first circuit board;
the second photosensitive chip is arranged on the second circuit board;
the second electronic element is arranged on the second circuit board and surrounds the second photosensitive chip;
the second lens bracket is covered on the second circuit board;
and the second lens is connected with one end, far away from the second circuit board, of the second lens support, and the second lens is flush with the first lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910935716.3A CN110620863B (en) | 2019-09-29 | 2019-09-29 | Camera assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910935716.3A CN110620863B (en) | 2019-09-29 | 2019-09-29 | Camera assembly and electronic equipment |
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| Publication Number | Publication Date |
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| CN110620863A CN110620863A (en) | 2019-12-27 |
| CN110620863B true CN110620863B (en) | 2021-02-23 |
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| CN201910935716.3A Active CN110620863B (en) | 2019-09-29 | 2019-09-29 | Camera assembly and electronic equipment |
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| CN111711719B (en) * | 2020-07-03 | 2021-10-15 | Oppo（重庆）智能科技有限公司 | Camera assembly and electronic equipment |
| CN111818248B (en) * | 2020-07-17 | 2022-02-15 | Oppo广东移动通信有限公司 | Support structure, camera assembly and electronic equipment |
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| CN109819142A (en) * | 2017-11-20 | 2019-05-28 | 宁波舜宇光电信息有限公司 | Seperated pair is taken the photograph mould group and photosensory assembly and manufacturing method and electronic equipment |
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