CN211184047U - Base, camera module and electronic device - Google Patents
Base, camera module and electronic device Download PDFInfo
- Publication number
- CN211184047U CN211184047U CN201921853892.4U CN201921853892U CN211184047U CN 211184047 U CN211184047 U CN 211184047U CN 201921853892 U CN201921853892 U CN 201921853892U CN 211184047 U CN211184047 U CN 211184047U
- Authority
- CN
- China
- Prior art keywords
- light
- camera module
- photosensitive
- arc surface
- photosensitive chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
A base, comprising: the bearing part is used for bearing the optical filter and comprises an arc surface; and the bearing part is positioned at the bottom of the first accommodating groove, the first accommodating groove is used for accommodating the photosensitive chip, the photosensitive chip is provided with a photosensitive area and a light reflecting area arranged around the photosensitive area, the arc surface faces the photosensitive chip, and the circle center of the arc surface falls in the light reflecting area of the photosensitive chip, so that light rays incident in the light reflecting area are reflected by the arc surface and then fall outside the photosensitive chip. The utility model discloses still relate to a camera module and an electron device. The utility model provides a base, camera module and electron device can avoid penetrating light in the reflection of light region is reflected extremely in the sensitization region to can prevent that facula phenomenon and not have no dark edge risk, further improve the imaging quality of camera module.
Description
Technical Field
The utility model relates to an electron and optical device field especially relate to a base, a camera module and an application the electron device of camera module.
Background
Most camera modules in the market at present consist of six parts, namely a lens, a motor, a filter, a photosensitive chip, a base and a circuit board. The photosensitive chip comprises a photosensitive area and a non-photosensitive area, a bearing part for bearing the optical filter is formed in the base, and the bearing part is provided with an inclined surface which inclines towards the circuit board and faces the photosensitive chip. And external light is shot on the photosensitive area of the photosensitive chip through the lens to form an image. But also some light rays can be shot on the non-photosensitive area of the photosensitive chip, the light rays shot on the non-photosensitive area are shot on the inclined plane of the bearing part of the base after being reflected by the non-photosensitive area, and the light rays can fall in the photosensitive area after being reflected by the inclined plane, so that light spots are formed, and the imaging quality of the camera module can be influenced by the light spots.
In the prior art, the non-photosensitive area of the photosensitive chip is usually blackened or delustred, or the size of the screen printing window is reduced or the inclined plane is blackened or delustred. However, these treatment methods have the following disadvantages: 1. the non-photosensitive area of the photosensitive chip is blackened or delustered, so that the risk of imaging dark edges exists, the width of the non-photosensitive area is narrow, and the operation is difficult. 2. The inclined plane of the bearing part of the base is blackened or delustred, so that the delustring is incomplete and the facula phenomenon is still serious. 3. The size of the light through hole is reduced, the facula phenomenon is weakened, and the risk of dark edges exists.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a can prevent facula phenomenon, do not have dark limit risk and the good base of image quality.
The utility model discloses still provide an use the camera module of base.
The utility model discloses still provide an use the electron device of camera module.
A base, comprising: the bearing part is used for bearing an optical filter and comprises an arc surface; the bearing part is positioned at the bottom of the first accommodating groove, the first accommodating groove is used for accommodating a photosensitive chip, the photosensitive chip is provided with a photosensitive area and a light reflecting area arranged around the photosensitive area, the arc surface faces the photosensitive chip, the center of the arc surface is located in the light reflecting area of the photosensitive chip, and light rays incident in the light reflecting area are reflected by the arc surface and then fall outside the photosensitive chip.
Further, the base further comprises a second accommodating groove, the bearing part is formed at the joint of the first accommodating groove and the second accommodating groove, a light through hole is formed in the middle of the bearing part, the first accommodating groove and the second accommodating groove are communicated through the light through hole, and the light through hole is opposite to the light sensing area of the light sensing chip.
The utility model provides a camera module, camera module includes: the base comprises a bearing part and a first accommodating groove, and the bearing part is positioned at the bottom of the first accommodating groove; the bearing part comprises an arc surface; and the photosensitive chip is accommodated in the first accommodating groove, the photosensitive chip is provided with a photosensitive area and a light reflecting area arranged around the photosensitive area, the arc surface faces the photosensitive chip, and the circle center of the arc surface falls in the light reflecting area of the photosensitive chip, so that light rays incident in the light reflecting area are reflected by the arc surface and then fall outside the photosensitive chip.
Further, the base further comprises a second accommodating groove, the bearing part is formed at the joint of the first accommodating groove and the second accommodating groove, a light through hole is formed in the middle of the bearing part, and the first accommodating groove and the second accommodating groove are communicated through the light through hole; the light through hole is opposite to the photosensitive area of the photosensitive chip.
Furthermore, the camera module further comprises an optical filter, wherein the optical filter is accommodated in the second accommodating groove and is positioned on the bearing part; the optical filter is opposite to the light through hole.
Furthermore, the camera module further comprises a lens, the lens is formed on the base, and the optical filter is opposite to the lens.
Furthermore, the camera module further comprises a circuit board, and the photosensitive chip is fixed on the circuit board and electrically connected with the circuit board.
Further, the camera module further comprises a voice coil motor, and the voice coil motor is fixed on the base and electrically connected with the circuit board.
Further, the voice coil motor comprises a lens accommodating groove, and the lens is accommodated in the lens accommodating groove; an internal thread is formed on the inner wall of the lens containing groove, an external thread is formed on the outer wall of the lens, and the external thread is matched with the internal thread.
An electronic device comprises a body and a camera module, wherein the camera module is installed in the body.
The utility model provides a pair of camera module, will the base bearing part towards the inclined plane of sensitization chip designs into a centre of a circle and falls on arc surface in the reflection of light region of sensitization chip can make and penetrate light process in the reflection of light region the arc surface reflects outside the sensitization chip, thereby can avoid penetrating light in the reflection of light region is reflected extremely in the sensitization region to can prevent facula phenomenon and do not have no dark limit risk, further improve the imaging quality of camera module.
Drawings
Fig. 1 is a schematic perspective view of a camera module according to a preferred embodiment of the present invention.
Fig. 2 is a schematic sectional view of the camera module shown in fig. 1 along the direction II-II.
Fig. 3 is an exploded view of the camera module shown in fig. 1.
Fig. 4 is a schematic perspective view of an electronic device using the camera module shown in fig. 1 according to a preferred embodiment of the present invention.
Description of the main elements
First receiving groove 33
Second receiving groove 34
Light-passing hole 35
Bearing part 36
Arc surface 361
First hard plate portion 41
Second hard plate portion 42
Light reflecting area 62
First adhesive layer 71
Second adhesive layer 72
Third adhesive layer 73
Reinforcing glue 90
The following detailed description of the invention will be further described in conjunction with the above-identified drawings.
Detailed Description
In order to further illustrate the technical means and effects adopted by the present invention to achieve the intended purpose, the following detailed description is made with reference to the accompanying drawings 1-4 and preferred embodiments for the specific embodiments, structures, features and effects of the camera module according to the present invention.
Referring to fig. 1-3, a camera module 100 according to a preferred embodiment of the present invention is provided. In the present embodiment, the camera module 100 is an auto-focus camera module. In other embodiments, the camera module 100 may also be a fixed focus camera module.
In the present embodiment, the camera module 100 includes a lens 10, a voice coil motor 20, a base 30, a circuit board 40, a filter 50 and a photo sensor chip 60.
The lens 10 is accommodated in the vcm 20, and the vcm 20 is fixed to the chassis 30. The base 30 is fixed on the circuit board 40. The filter 50 is received and fixed in the base 30. The photosensitive chip 60 is fixed on the circuit board 40 and is accommodated in the base 30.
Wherein, an external thread 11 is formed on the outer wall of the lens 10.
Wherein, the voice coil motor 20 is fixed on the base 30 and electrically connected to the circuit board 40. Specifically, the voice coil motor 20 is fixed on the base 30 by a first adhesive layer 71. Preferably, the first adhesive layer 71 is a heat conductive adhesive with good heat dissipation performance.
The voice coil motor 20 includes a lens receiving cavity 21, and the lens 10 is received in the lens receiving cavity 21. An internal thread 22 is formed on an inner wall of the lens receiving groove 21, and the internal thread 22 is engaged with the external thread 11 to fix the lens 10 in the lens receiving groove 21. The engagement of the internal thread 22 and the external thread 11 facilitates the lens 10 moving up and down in the lens accommodating groove 21, thereby realizing automatic focusing and making the image clearer.
Wherein the base 30 is used for supporting the voice coil motor 20 and disposing the filter 50. The base 30 is fixed on the circuit board 40. Specifically, the base 30 is fixed on the circuit board 40 by a second adhesive layer 72. Preferably, the second adhesive layer 72 is a heat conductive adhesive with good heat dissipation performance.
In particular, the base 30 is substantially square.
The base 30 includes a first surface 31 and a second surface 32 opposite to the first surface 31. The voice coil motor 20 is fixed on the first surface 31, and the second surface 32 is in contact with the circuit board 40.
A first receiving groove 33 is formed from the second surface 32 to the first surface 31, a second receiving groove 34 is formed from the first surface 31 to the second surface 32, a bearing portion 36 is formed at a junction of the first receiving groove 33 and the second receiving groove 34, a light-passing hole 35 is formed in a middle portion of the bearing portion 36, and the first receiving groove 33 and the second receiving groove 34 are communicated through the light-passing hole 35. That is, the receiving portion 36 may be regarded as a bottom portion of the first receiving groove 33 and the second receiving groove 34. The light through hole 35 faces the lens 10. The second receiving groove 34 is used for receiving the optical filter 50. The first receiving groove 33 is used for receiving the photosensitive chip 60 and the like. The supporting portion 36 is used for supporting the optical filter 50.
The carrying portion 36 includes an arc surface 361, the arc surface 361 faces the photosensitive chip 60, and a center of the arc surface 361 falls within the light reflection region 62 (see below) of the photosensitive chip 60, so that a reflected light ray L2 of an incident light ray L1 incident in the light reflection region 62 after being reflected by the arc surface 361 falls outside the photosensitive chip 60.
The circuit board 40 may be one of a ceramic substrate, a flexible board, a hard board, or a rigid-flexible board. In the present embodiment, the circuit board 40 is a rigid-flex board.
Specifically, the circuit board 40 includes a first hard board portion 41, a second hard board portion 42, and a soft board portion 43 located between the first hard board portion 41 and the second hard board portion 42.
Wherein, a plurality of electronic components 80 arranged around the photosensitive chip 60 are further formed on the circuit board 40. The electronic component 80 is electrically connected to the circuit board 40. In the present embodiment, the electronic component 80 is located on the first hard board portion 41. The electronic component 80 may be a resistor, a capacitor, a diode, a transistor, a relay, a charged erasable programmable read-only memory (EEPROM), or other passive components.
Wherein an electrical connection portion 421 is further mounted on the second hard plate portion 42. The electrical connection portion 421 is used for externally connecting an electronic component (not shown). The electrical connection 421 may be a connector or a gold finger. The electrical connection portion 421 and the electronic element 80 may be located on the same surface of the circuit board 40, or may be located on different surfaces. In the present embodiment, the electrical connection portion 421 is located on the same surface of the circuit board 40 as the electronic component 80.
The filter 50 is received and fixed in the second receiving groove 34. The filter 50 is used to filter stray light and only allow light with a specific wavelength to pass through, so as to reduce the influence of the stray light on the imaging quality.
In this embodiment, the filter 50 is fixed on the supporting portion 36 by a third adhesive layer 73.
The photosensitive chip 60 is fixed on the circuit board 40 and electrically connected to the circuit board 40, the photosensitive chip 60 includes a photosensitive area 61 and a light reflecting area 62 disposed around the photosensitive area 61, the photosensitive area 61 faces the light passing hole 35, a center of the circular arc surface 361 falls within the light reflecting area 62, and a reflected light ray L2, which is a light ray L1 incident in the light reflecting area 62 and reflected by the circular arc surface 361, falls outside the photosensitive chip 60.
The camera module 100 further includes a reinforcing adhesive 90, wherein the reinforcing adhesive 90 is bonded to the base 30 and the circuit board 40 to enhance the strength and the overall reliability of the camera module 100. Preferably, the reinforcing adhesive 90 is a heat-conducting adhesive with good heat dissipation performance, so as to enhance the heat dissipation effect of the camera module 100.
Referring to fig. 4, the present invention further provides an electronic device 200 using the camera module 100. The electronic device 200 includes a body 201, and the camera module 100 is installed in the body 201. The electronic device 200 may be a mobile phone, a wearable device, a computer device, a vehicle or a monitoring device, etc. In this embodiment, the electronic device 200 is a mobile phone.
The utility model provides a pair of camera module, will the base bearing part towards the inclined plane of sensitization chip designs into a centre of a circle and falls on arc surface in the reflection of light region of sensitization chip can make and penetrate light process in the reflection of light region the arc surface reflects outside the sensitization chip, thereby can avoid penetrating light in the reflection of light region is reflected extremely in the sensitization region to can prevent facula phenomenon and do not have no dark limit risk, further improve the imaging quality of camera module.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any form, and although the present invention has been disclosed in the above description as a preferred embodiment, it is not intended to limit the present invention, and any person skilled in the art can make modifications or changes to equivalent embodiments by utilizing the above-mentioned technical contents without departing from the scope of the present invention, but all the technical contents of the present invention do not depart from the technical contents of the present invention, and any simple modification, equivalent changes and modifications made to the above embodiments by the technical matters of the present invention still belong to the scope of the present invention.
Claims (10)
1. A base, comprising:
the bearing part is used for bearing an optical filter and comprises an arc surface; and
the bearing part is positioned at the bottom of the first accommodating groove; the first accommodating groove is used for accommodating a photosensitive chip; the photosensitive chip is provided with a photosensitive area and a light reflecting area arranged around the photosensitive area; the arc surface faces the photosensitive chip, and the circle center of the arc surface is located in the light reflecting area of the photosensitive chip, so that light rays incident in the light reflecting area are reflected by the arc surface and then fall outside the photosensitive chip.
2. The base of claim 1, wherein the base further comprises a second receiving slot, the supporting portion is formed at a junction of the first receiving slot and the second receiving slot, a light hole is formed in a middle portion of the supporting portion, the first receiving slot and the second receiving slot are communicated through the light hole, and the light hole faces the light sensing area of the light sensing chip.
3. The utility model provides a camera module which characterized in that, camera module includes:
the base comprises a bearing part and a first accommodating groove; the bearing part is positioned at the bottom of the first accommodating groove; the bearing part comprises an arc surface; and
the photosensitive chip is accommodated in the first accommodating groove; the photosensitive chip is provided with a photosensitive area and a light reflecting area arranged around the photosensitive area; the arc surface faces the photosensitive chip, and the circle center of the arc surface is located in the light reflecting area of the photosensitive chip, so that light rays incident in the light reflecting area are reflected by the arc surface and then fall outside the photosensitive chip.
4. The camera module of claim 3, wherein the base further includes a second receiving groove, the supporting portion is formed at a junction of the first receiving groove and the second receiving groove, a light-passing hole is formed at a middle portion of the supporting portion, the first receiving groove and the second receiving groove are communicated through the light-passing hole, and the light-passing hole faces the light-sensing area of the light-sensing chip.
5. The camera module of claim 4, further comprising a filter received in the second receiving cavity and located on the supporting portion; the optical filter is opposite to the light through hole.
6. The camera module of claim 5, further comprising a lens formed on the base, wherein the filter is opposite to the lens.
7. The camera module of claim 6, further comprising a circuit board, wherein the photo sensor chip is fixed on the circuit board and electrically connected to the circuit board.
8. The camera module of claim 7, further comprising a voice coil motor secured to said base and electrically connected to said circuit board.
9. The camera module of claim 8, wherein the voice coil motor includes a lens receiving cavity, the lens being received in the lens receiving cavity; an internal thread is formed on the inner wall of the lens containing groove, an external thread is formed on the outer wall of the lens, and the external thread is matched with the internal thread.
10. An electronic device comprising a body, wherein the electronic device further comprises the camera module according to any one of claims 3-9, and the camera module is mounted in the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921853892.4U CN211184047U (en) | 2019-10-29 | 2019-10-29 | Base, camera module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921853892.4U CN211184047U (en) | 2019-10-29 | 2019-10-29 | Base, camera module and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211184047U true CN211184047U (en) | 2020-08-04 |
Family
ID=71805262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921853892.4U Active CN211184047U (en) | 2019-10-29 | 2019-10-29 | Base, camera module and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211184047U (en) |
-
2019
- 2019-10-29 CN CN201921853892.4U patent/CN211184047U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4405062B2 (en) | Solid-state imaging device | |
| US10261225B2 (en) | Filter assembly and camera module having the same | |
| JP4555732B2 (en) | Imaging device | |
| JP3915513B2 (en) | Imaging device | |
| WO2001065836A1 (en) | Image pickup device, and image pickup device assembling method | |
| JP2002320150A (en) | Image sensor module and manufacturing method therefor | |
| CN111405147B (en) | Lens module and electronic device | |
| US20030146998A1 (en) | Small-size imaging apparatus, in particular photographic appliance or camera | |
| CN110648980A (en) | Chip packaging structure and camera device | |
| JP2010252164A (en) | Solid-state image sensing device | |
| KR20180033701A (en) | Camera module and optical apparatus | |
| CN110661934B (en) | Lens module | |
| JP4714233B2 (en) | Imaging module, method for manufacturing the same, and electronic information device | |
| CN211184047U (en) | Base, camera module and electronic device | |
| JP2009111334A (en) | Optical device and method of manufacturing the same, and semiconductor device | |
| TWI735070B (en) | Bracket, lens module, and electronic device using the same | |
| JP4696192B2 (en) | Solid-state image pickup device unit, manufacturing method thereof, and image pickup apparatus | |
| JP2008160757A (en) | Imaging apparatus | |
| JP2007147729A (en) | Camera module | |
| CN111432097A (en) | Lens module and electronic device | |
| US20050237419A1 (en) | Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module | |
| JP5093324B2 (en) | Solid-state image pickup device unit, manufacturing method thereof, and image pickup apparatus | |
| CN112269234A (en) | Lens module and electronic device | |
| JP2003046824A (en) | Solid state imaging device | |
| KR100658149B1 (en) | Image sensor module and camera module package therewith |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |