CN205210805U

CN205210805U - Semiconductor refrigeration piece formula computer cooling ware

Info

Publication number: CN205210805U
Application number: CN201521074498.2U
Authority: CN
Inventors: 胡绪瑞; 刘云萍
Original assignee: Individual
Current assignee: Individual
Priority date: 2015-12-20
Filing date: 2015-12-20
Publication date: 2016-05-04
Anticipated expiration: 2025-12-20

Abstract

The utility model discloses a semiconductor refrigeration piece formula computer cooling ware, including the semiconductor refrigeration piece, computer CPU's cooling surface is connected to the cold junction face of semiconductor refrigeration piece, the hot junction face of semiconductor refrigeration piece is connected with leads cold fin, it is connected with the thermal conductance nest of tubes to lead cold fin, the heat pipe group link is to computer case body. The utility model has the advantages of simple and reasonable structure, job stabilization is reliable, and the radiating efficiency is high, and long service life is suitable for popularization and application.

Description

Semiconductor refrigeration sheet type computer radiator

Technical field

The utility model relates to central processor radiating technical field, is specifically related to a kind of semiconductor refrigeration sheet type computer radiator.

Background technology

CPU is the core devices of computer; it is also the core thermal source of computer; heating is the basic reason causing computer stability to decline; therefore the computer of a new generation is all equipped with the temperature of temperature sensor measurement CPU in the below of CPU; when its temperature reaches 40 DEG C; open fan air cooling way to lower the temperature, when temperature reaches 80 DEG C, automatic alarm frequency reducing or shut down with the safety protecting CPU.Although there is the advantage of simple in structure and low in cost with air cooling way cooling, there is the disadvantages such as cooling efficiency is low, reaction velocity slow, the mechanical rotation degree of reliability of fan is poor, noise is large in wind cooling temperature lowering.

Utility model content

Technical problem to be solved in the utility model be to provide a kind of simple and reasonable, working stability is reliable, radiating efficiency is high, the semiconductor refrigeration sheet type computer radiator of long service life.

For solving the problems of the technologies described above, the technical solution of the utility model is: semiconductor refrigeration sheet type computer radiator, comprise semiconductor chilling plate, the cold junction face of described semiconductor chilling plate connects the radiating surface of computer CPU, the face, hot junction of described semiconductor chilling plate is connected with conduction cooling fin, described conduction cooling fin is connected with heat pipe group, and described heat pipe group is connected to computer housing housing.

As preferred technical scheme, between the cold junction face of described semiconductor chilling plate and the radiating surface of described CPU, be provided with interior thermal conductive silicon lipid layer.

As preferred technical scheme, the face, hot junction of described semiconductor chilling plate and the surface of contact of described conduction cooling fin are coated with and are covered with outer thermal conductive silicon lipid layer.

As preferred technical scheme, described heat pipe group comprises complex root heat pipe, and the evaporation ends of heat pipe described in every root is connected with described conduction cooling fin respectively, and the condensation end of heat pipe described in every root is connected with described computer housing housing respectively.

As the improvement to technique scheme, the condensation end of heat pipe described in complex root is distributed on the different lateral of described computer housing housing.

The utility model is by adopting technique scheme, there is following beneficial effect: the problem solving existing computer CPU wind-cooling heat dissipating weak effect, fan work instability, semiconductor chilling plate is adopted to be used for the heat transfer of computer CPU, adopt heat pipe to realize the Rapid Circulation transfer of heat simultaneously, thus the heat making computer CPU distribute is conducted continuously, not only structural design advantages of simple, working stability is reliable, and radiating efficiency is high, long service life, is suitable for wide popularization and application.

Accompanying drawing explanation

The following drawings is only intended to schematically illustrate the utility model and explain, does not limit scope of the present utility model.Wherein:

Fig. 1 is the structural representation of the utility model embodiment;

Fig. 2 is the assembling schematic diagram of the utility model embodiment.

In figure: 1-semiconductor chilling plate; 11-cold junction face; Face, 12-hot junction; 2-CPU; 3-conduction cooling fin; 4-heat pipe group; 41-evaporation ends; 42-condensation end; 5-cabinet housing; Thermal conductive silicon lipid layer in 7-; The outer thermal conductive silicon lipid layer of 8-.

Embodiment

Below in conjunction with drawings and Examples, set forth the utility model further.

As depicted in figs. 1 and 2, semiconductor refrigeration sheet type computer radiator, comprises semiconductor chilling plate 1, semiconductor chilling plate, also be thermoelectric module, be a kind of heat pump, there is no slide unit, functional reliability is high, and it is common structure known in this field, is not described in detail in this; The cold junction face 11 of described semiconductor chilling plate 1 connects the radiating surface of computer CPU 2, and the face, hot junction 12 of described semiconductor chilling plate 1 is connected with conduction cooling fin 3, and described conduction cooling fin 3 is connected with heat pipe group 4, and described heat pipe group 4 is connected to computer housing housing 5.By adopting semiconductor chilling plate 1 for the heat transfer of computer CPU, adopt heat pipe group 4 to realize the Rapid Circulation transfer of heat simultaneously, because heat pipe utilizes sweat cooling, make heat pipe two ends temperature difference very large, heat can be made to conduct fast, thus the heat that computer CPU is distributed is conducted continuously, structure is simple, reliable operation, good heat dissipation effect.

With reference to figure 1, in the present embodiment, in order to improve radiating effect further, preferably have employed following structure, interior thermal conductive silicon lipid layer 7 is set between the cold junction face 11 and the radiating surface of described CPU2 of described semiconductor chilling plate 1.Meanwhile, the face, hot junction 12 of described semiconductor chilling plate 1 is coated with the surface of contact of described conduction cooling fin 3 and is covered with outer thermal conductive silicon lipid layer 8.

With reference to figure 2, in the present embodiment, described heat pipe group 4 comprises 6 heat pipes, the evaporation ends 41 of heat pipe described in every root is connected with described conduction cooling fin 3 respectively, the condensation end 42 of heat pipe described in every root is connected with described computer housing housing 5 respectively, and the condensation end 42 of described heat pipe is distributed on the different lateral of described computer housing housing 5, is beneficial to quick heat conduction.Certainly, the quantity of heat pipe can suitably be arranged as required, also can be set to other quantity, and it all should belong to protection domain of the present utility model, no longer repeats at this.

The foregoing is only the schematic embodiment of the utility model, and be not used to limit scope of the present utility model.Any those skilled in the art, equivalent variations done under the prerequisite not departing from design of the present utility model and principle and amendment, all should belong to the scope of the utility model protection.

Claims

1. semiconductor refrigeration sheet type computer radiator, it is characterized in that: comprise semiconductor chilling plate, the cold junction face of described semiconductor chilling plate connects the radiating surface of computer CPU, the face, hot junction of described semiconductor chilling plate is connected with conduction cooling fin, described conduction cooling fin is connected with heat pipe group, and described heat pipe group is connected to computer housing housing.

2. semiconductor refrigeration sheet type computer radiator as claimed in claim 1, is characterized in that: be provided with interior thermal conductive silicon lipid layer between the cold junction face of described semiconductor chilling plate and the radiating surface of described CPU.

3. semiconductor refrigeration sheet type computer radiator as claimed in claim 2, is characterized in that: the face, hot junction of described semiconductor chilling plate and the surface of contact of described conduction cooling fin are coated with and are covered with outer thermal conductive silicon lipid layer.

4. semiconductor refrigeration sheet type computer radiator as claimed in claim 3, it is characterized in that: described heat pipe group comprises complex root heat pipe, the evaporation ends of heat pipe described in every root is connected with described conduction cooling fin respectively, and the condensation end of heat pipe described in every root is connected with described computer housing housing respectively.

5. semiconductor refrigeration sheet type computer radiator as claimed in claim 4, is characterized in that: the condensation end of heat pipe described in complex root is distributed on the different lateral of described computer housing housing.