CN205159303U - 磁检测装置 - Google Patents
磁检测装置 Download PDFInfo
- Publication number
- CN205159303U CN205159303U CN201520899596.3U CN201520899596U CN205159303U CN 205159303 U CN205159303 U CN 205159303U CN 201520899596 U CN201520899596 U CN 201520899596U CN 205159303 U CN205159303 U CN 205159303U
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- CN
- China
- Prior art keywords
- magnetic
- mentioned
- stress
- sensor
- detection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Measuring Magnetic Variables (AREA)
- Hall/Mr Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014256453A JP6301823B2 (ja) | 2014-12-18 | 2014-12-18 | 磁気検知装置 |
JP2014-256453 | 2014-12-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205159303U true CN205159303U (zh) | 2016-04-13 |
Family
ID=55694966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520899596.3U Active CN205159303U (zh) | 2014-12-18 | 2015-11-12 | 磁检测装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6301823B2 (ja) |
CN (1) | CN205159303U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11360160B2 (en) | 2016-12-23 | 2022-06-14 | Huawei Technologies Co., Ltd. | Electronic device |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6839938B2 (ja) | 2016-07-25 | 2021-03-10 | 旭化成エレクトロニクス株式会社 | 半導体装置、磁気検出装置、半導体装置の製造方法および電子コンパス |
JP6516057B1 (ja) | 2017-12-26 | 2019-05-22 | Tdk株式会社 | 磁気センサ |
JP7138261B1 (ja) | 2022-06-30 | 2022-09-15 | 旭化成エレクトロニクス株式会社 | 半導体パッケージ、及び駆動装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8559139B2 (en) * | 2007-12-14 | 2013-10-15 | Intel Mobile Communications GmbH | Sensor module and method for manufacturing a sensor module |
JP2010056260A (ja) * | 2008-08-28 | 2010-03-11 | Fujikura Ltd | 磁気スイッチ、および磁界検出方法 |
JP5467210B2 (ja) * | 2009-10-27 | 2014-04-09 | アルプス電気株式会社 | 磁気センサ |
JP5688251B2 (ja) * | 2010-08-31 | 2015-03-25 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | モータ制御用半導体装置 |
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2014
- 2014-12-18 JP JP2014256453A patent/JP6301823B2/ja active Active
-
2015
- 2015-11-12 CN CN201520899596.3U patent/CN205159303U/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11360160B2 (en) | 2016-12-23 | 2022-06-14 | Huawei Technologies Co., Ltd. | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
JP6301823B2 (ja) | 2018-03-28 |
JP2016118409A (ja) | 2016-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: Alpine Alpine Company Address before: Tokyo, Japan, Japan Patentee before: Alps Electric Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder |