CN205140941U - Ceramic insulator for electronic packaging - Google Patents
Ceramic insulator for electronic packaging Download PDFInfo
- Publication number
- CN205140941U CN205140941U CN201520889732.0U CN201520889732U CN205140941U CN 205140941 U CN205140941 U CN 205140941U CN 201520889732 U CN201520889732 U CN 201520889732U CN 205140941 U CN205140941 U CN 205140941U
- Authority
- CN
- China
- Prior art keywords
- layer
- ceramic
- metal
- metal wire
- gnd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a ceramic insulator for electronic packaging. An encapsulation shell technical field that be used for electron device is related to. The insulator through ceramic insulator built -in electric plate wire way design, does not adopt the plating method to accomplish porcelain spare nickel gold protective layer plating under not adopting the condition of chemical plating and key silk connecting circuit, guarantees plating layer quality promptly and can guarantee the demand that the outward appearance is complete again. All circuits of ceramic insulator through the preparation of above -mentioned method all can switch on with external circuit to the plating that can adopt the plating method to accomplish nickel gold layer after accomplishing all metal plating, is polished the metallization of porcelain spare terminal surface, has so both realized that the outward appearance of ceramic insulator circuit is complete, has guaranteed the reliability of its structure and electrical property again, has improved the wholeness ability of device.
Description
Technical field
The utility model relates to the package casing technical field for electronic device, particularly relates to a kind of ceramic insulator used for electronic packaging.
Background technology
Ceramic insulator is most important building block in ceramet package casing, and large-scale application is in photoelectric communication field.For the ceramic insulator of step-like double-deck pad structure, its upper layer circuit is control electric layer, and lower sandwich circuit is radio layer, all needs plated nickel gold protective layer to improve the reliability of its structure and electrical property.
Two kinds are had at present: after first (1) porcelain piece realizes exposed metal portions nickel dam plating by chemical plating method to the method that said structure ceramic insulator metal deposition adopts, soldering assembling is carried out with metal parts, carry out electronickelling gold by gold ball bonding key silk method by after disconnected connection conducting afterwards, again wire shovel is fallen after realizing nickel-gold layer plating; (2) follow-up not key silk, realizes the plating of nickel-gold layer by the method for chemical gilding.
But after connecting realization plating by key silk, need wire shovel to fall, so just will inevitably leave shovel trace on the line, affect porcelain piece outward appearance and unfailing performance.In addition compared with electro-plating method, adopt chemical plating method, its plating densities and bond strength are all relatively low, can not meet the demand day by day of premium quality product.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of ceramic insulator used for electronic packaging; when described insulator does not adopt chemical plating and key silk connecting circuit; by the built-in electroplating line design of ceramic insulator; galvanoplastic are adopted to complete porcelain piece nickel gold protective layer plating; not only ensure coating layer quality but also the demand of complete appearance can be ensured, improve the overall performance of device.
For solving the problems of the technologies described above, technical solution adopted in the utility model is: a kind of ceramic insulator used for electronic packaging, it is characterized in that: comprise the first ceramic layer arranged from top to bottom, second ceramic layer, middle ceramic component layer and the 3rd ceramic layer, the upper surface of described first ceramic layer is provided with electric controlled layer, upper electric controlled layer comprises some first metal wires identical with the pad number of insulator, insulate between first metal wire and do not interconnect, first ceramic layer corresponding with the pad locations of insulator is provided with several first via holes, the first connection metal line is provided with in first via hole, first connection metal line and the first metal wire one_to_one corresponding also interconnect, the upper surface of described second ceramic layer is provided with electroplating line layer, described upper electroplating line layer comprises some the second metal wires, second metal wire and the first connection metal line one_to_one corresponding also interconnect, the left and right sides of the second ceramic layer is provided with several the second via holes, be provided with the second connection metal line in second via hole, the second connection metal line and the second metal wire one_to_one corresponding also interconnect, the left and right sides of described middle ceramic component layer is provided with several the 3rd via holes, the position of the 3rd via hole and the position one_to_one corresponding of the second via hole, the 3rd connection metal line is provided with, the 3rd connection metal line and the second connection metal line one_to_one corresponding and interconnect in 3rd via hole, the upper surface of the 3rd ceramic layer is provided with lower electroplating line layer, described lower electroplating line layer comprises some articles of the 3rd metal wires, insulate between 3rd metal wire and do not interconnect, 3rd metal wire and the 3rd connection metal line one_to_one corresponding and interconnect, and one end of the 3rd metal wire extends to the edge of the 3rd ceramic layer, make described 3rd metal wire can realize being electrically connected with the device of ceramic member outside.
Further technical scheme is: described middle ceramic component layer comprises the 4th ceramic layer, the 5th ceramic layer and the 6th ceramic layer, the upper surface of described 4th ceramic layer is provided with GND layer, the upper surface of described 5th ceramic layer is provided with radio layer, the upper surface of described 6th ceramic layer is provided with lower GND layer, and described upper GND layer, radio layer and lower GND layer and the 3rd connection metal line insulate and do not interconnect.
Further technical scheme is: described radio layer comprises some articles of the 4th metal wires, and the two ends of the 4th metal wire extend to the outside of the 5th ceramic layer, makes described 4th metal wire can realize being electrically connected with the device of ceramic member outside.
Further technical scheme is: described upper GND layer and lower GND layer respectively comprise piece of metal electrode, GND metal wire in described electrode and radio layer, by interlevel via metallization interconnect, makes described upper GND layer and lower GND layer can realize being electrically connected with the GND circuit of radio layer.
Further technical scheme is: the upper surface of described first ceramic layer is provided with structural beams.
The beneficial effect that produces of technique scheme is adopted to be: when described insulator does not adopt chemical plating and key silk connecting circuit; by the built-in electroplating line design of ceramic insulator; not only adopt galvanoplastic to complete porcelain piece nickel gold protective layer plating, ensure coating layer quality but also the demand of complete appearance can be ensured.The all circuits of described ceramic insulator all can with external circuit conducting, thus galvanoplastic can be adopted to complete the plating of nickel-gold layer, after completing all metal depositions, the metallization of porcelain piece end face is polished off, so both achieve the complete appearance of ceramic insulation electronic circuit, in turn ensure that the reliability of its structure and electrical property, improve the overall performance of device.
Accompanying drawing explanation
Fig. 1 is the blast perspective structure schematic diagram of insulator described in the utility model;
Fig. 2 is the detonation configuration schematic diagram of insulator described in the utility model;
Fig. 3-4 is manufacture method flow charts of insulator described in the utility model;
Wherein: 1, the first ceramic layer 2, second ceramic layer 3, the 3rd ceramic layer 4, middle ceramic component layer 5, first metal wire 6, first connection metal line 7, second metal wire 8, second connection metal line 9, the 3rd connection metal line 10, the 3rd metal wire 11, the 4th metal wire 12, structural beams 41, the 4th ceramic layer 42, the 5th ceramic layer 43, the 6th ceramic layer.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only a part of embodiment of the present utility model, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Set forth a lot of detail in the following description so that fully understand the utility model, but the utility model can also adopt other to be different from alternate manner described here to implement, those skilled in the art can when doing similar popularization without prejudice to when the utility model intension, and therefore the utility model is by the restriction of following public specific embodiment.
As shown in Figure 1-2, the utility model discloses a kind of ceramic insulator used for electronic packaging, comprise the first ceramic layer 1, second ceramic layer 2 arranged from top to bottom, middle ceramic component layer 4 and the 3rd ceramic layer 3, the upper surface of described first ceramic layer is provided with structural beams 12, in order to increase the intensity of described overall insulator.The upper surface of described first ceramic layer 1 is provided with electric controlled layer, upper electric controlled layer comprises some first metal wires 5 identical with the pad number of insulator, insulate between first metal wire 5 and do not interconnect, first ceramic layer 1 corresponding with the pad locations of insulator is provided with several the first via holes, be provided with the first connection metal line 6, first connection metal line 6 and the first metal wire 5 one_to_one corresponding in first via hole and interconnect.
The upper surface of described second ceramic layer 2 is provided with electroplating line layer, and described upper electroplating line layer comprises some the second metal wire 7, second metal wires 7 and the first connection metal line 6 one_to_one corresponding and interconnects; The left and right sides of the second ceramic layer 2 is provided with several the second via holes, is provided with the second connection metal line 8, second connection metal line 8 and the second metal wire 7 one_to_one corresponding and interconnects in the second via hole.
The left and right sides of described middle ceramic component layer 4 is provided with several the 3rd via holes, the position of the 3rd via hole and the position one_to_one corresponding of the second via hole, be provided with the 3rd connection metal line the 9, three connection metal line 9 and the second connection metal line 8 one_to_one corresponding in 3rd via hole and interconnect; Described middle ceramic component layer 4 comprises the 4th ceramic layer 41, the 5th ceramic layer 42 and the 6th ceramic layer 43, the upper surface of described 4th ceramic layer 41 is provided with GND layer, the upper surface of described 5th ceramic layer 42 is provided with radio layer, the upper surface of described 6th ceramic layer 43 is provided with lower GND layer, and described upper GND layer, radio layer and lower GND layer and the 3rd connection metal line insulate and do not interconnect.
The two ends that described radio layer comprises some articles of the 4th metal wire the 11, four metal wires 11 extend to the outside of the 5th ceramic layer 42, make described 4th metal wire 11 can realize being electrically connected with the device of ceramic member outside.Described upper GND layer and lower GND layer respectively comprise piece of metal electrode, GND metal wire in described electrode and radio layer, by interlevel via metallization interconnect (hole count is determined according to radio-frequency performance), makes described upper GND layer and lower GND layer can realize being electrically connected with the GND circuit of radio layer.
The upper surface of the 3rd ceramic layer 3 is provided with lower electroplating line layer, described lower electroplating line layer comprises some articles of the 3rd metal wires 10, insulate between 3rd metal wire 10 and do not interconnect, 3rd metal wire 10 and the 3rd connection metal line 9 one_to_one corresponding and interconnect, and one end of the 3rd metal wire 10 extends to the edge of the 3rd ceramic layer 3, make described 3rd metal wire 10 can realize being electrically connected with the device of ceramic member outside.
Described ceramic insulator manufacture method used for electronic packaging, comprises the steps:
1) punching in the pad locations of the first ceramic layer 1 of ceramic insulator, and by hole solid metal, the upper automatically controlled sandwich circuit of printing after the solid metal of hole, upper automatically controlled sandwich circuit comprises some strip metal lines, insulation between metal wire and not interconnecting, the metal one_to_one corresponding in metal wire and hole also interconnects;
2) downside of the first ceramic layer 1 is the second ceramic layer 2, and the second ceramic layer 2 respectively rushes a round and solid metal hole corresponding to the both sides, position in hole on the first ceramic layer, makes the hole count of both sides be added the number equaling hole on the first ceramic layer;
3) electroplating line layer in the upper surface printing of the second ceramic layer 2, upper electroplating line layer comprises some strip metal lines, connected one to one by metal in hole on metal in two side holes on second ceramic layer and the first ceramic layer by the metal wire of printing, the metal wire of the second ceramic layer upper surface insulate to each other and does not interconnect;
4) downside of the second ceramic layer 2 is provided with middle ceramic component layer 4, middle ceramic component layer 4 two side punchings and by hole solid metal, position, hole is corresponding with the hole on the second ceramic layer with hole count;
5) in the middle of, the downside of ceramic component layer 4 is provided with the 3rd ceramic layer 3, electroplating line layer under the upper surface printing of the 3rd ceramic layer 3, lower electroplating line layer comprises some strip metal lines, insulate between metal wire and do not interconnect, by printing metal wire and middle ceramic component layer 4 hole in metal connect one to one, and the edge that one end of metal wire on the 3rd ceramic layer 3 extends to the 3rd ceramic layer 3 forms exit, make described 3rd metal wire can realize being electrically connected with the device of ceramic member outside, by above step by built-in for green part electroplating line.
In the utility model embodiment, described middle ceramic component layer 4 comprises the 4th ceramic layer 41, the 5th ceramic layer 42 and the 6th ceramic layer 43.The upper surface of described 4th ceramic layer 41 is provided with GND layer, the upper surface of described 5th ceramic layer 42 is provided with radio layer, the upper surface of described 6th ceramic layer 43 is provided with lower GND layer, the metal-insulator in described upper GND layer, radio layer and lower GND layer and middle ceramic component layer hole and not interconnecting.
In the utility model embodiment, described radio layer comprises some strip metal lines, and the two ends of metal wire extend to the outside formation exit of the 5th ceramic layer, make described metal wire can realize being electrically connected with the device of ceramic member outside; Described upper GND layer and lower GND layer respectively comprise piece of metal electrode, GND metal wire in described electrode and radio layer, by interlevel via metallization interconnect (hole count is determined according to radio-frequency performance), makes described upper GND layer and lower GND layer can realize being electrically connected with the GND circuit of radio layer.
6) exit of green part is metallized.
7) sintering step, for sintering ripe porcelain piece (idiographic flow of described method please refer to Fig. 3-4, forms whole flow chart after the A wherein in Fig. 3 in A and Fig. 4 connects) by green part.
Not only when described insulator does not adopt chemical plating and key silk connecting circuit, by the built-in electroplating line design of ceramic insulator, adopt galvanoplastic to complete porcelain piece nickel gold protective layer plating, ensure coating layer quality but also the demand of complete appearance can be ensured.The all circuits of described ceramic insulator all can with external circuit conducting, thus galvanoplastic can be adopted to complete the plating of nickel-gold layer, after completing all metal depositions, the metallization of porcelain piece end face is polished off, so both achieve the complete appearance of ceramic insulation electronic circuit, in turn ensure that the reliability of its structure and electrical property, improve the overall performance of device.
Claims (5)
1. a ceramic insulator used for electronic packaging, it is characterized in that: comprise the first ceramic layer (1) arranged from top to bottom, second ceramic layer (2), middle ceramic component layer (4) and the 3rd ceramic layer (3), the upper surface of described first ceramic layer (1) is provided with electric controlled layer, upper electric controlled layer comprises some first metal wires (5) identical with the pad number of insulator, insulate between first metal wire (5) and do not interconnect, first ceramic layer (1) corresponding with the pad locations of insulator is provided with several the first via holes, the first connection metal line (6) is provided with in first via hole, first connection metal line (6) and the first metal wire (5) one_to_one corresponding also interconnect, the upper surface of described second ceramic layer (2) is provided with electroplating line layer, described upper electroplating line layer comprises some the second metal wires (7), second metal wire (7) and the first connection metal line (6) one_to_one corresponding also interconnect, the left and right sides of the second ceramic layer (2) is provided with several the second via holes, be provided with the second connection metal line (8) in second via hole, the second connection metal line (8) and the second metal wire (7) one_to_one corresponding also interconnect, the left and right sides of described middle ceramic component layer (4) is provided with several the 3rd via holes, the position of the 3rd via hole and the position one_to_one corresponding of the second via hole, the 3rd connection metal line (9) is provided with, the 3rd connection metal line (9) and the second connection metal line (8) one_to_one corresponding and interconnect in 3rd via hole, the upper surface of the 3rd ceramic layer (3) is provided with lower electroplating line layer, described lower electroplating line layer comprises some articles of the 3rd metal wires (10), insulate between 3rd metal wire (10) and do not interconnect, 3rd metal wire (10) and the 3rd connection metal line (9) one_to_one corresponding and interconnect, and one end of the 3rd metal wire (10) extends to the edge of the 3rd ceramic layer (3), make described 3rd metal wire (10) can realize being electrically connected with the device of ceramic member outside.
2. ceramic insulator used for electronic packaging as claimed in claim 1, it is characterized in that: described middle ceramic component layer (4) comprises the 4th ceramic layer (41), the 5th ceramic layer (42) and the 6th ceramic layer (43), the upper surface of described 4th ceramic layer (41) is provided with GND layer, the upper surface of described 5th ceramic layer (42) is provided with radio layer, the upper surface of described 6th ceramic layer (43) is provided with lower GND layer, and described upper GND layer, radio layer and lower GND layer and the 3rd connection metal line insulate and do not interconnect.
3. ceramic insulator used for electronic packaging as claimed in claim 2, it is characterized in that: described radio layer comprises some articles of the 4th metal wires (11), the two ends of the 4th metal wire (11) extend to the outside of the 5th ceramic layer (42), make described 4th metal wire (11) can realize being electrically connected with the device of ceramic member outside.
4. ceramic insulator used for electronic packaging as claimed in claim 2, it is characterized in that: described upper GND layer and lower GND layer respectively comprise piece of metal electrode, GND metal wire in described electrode and radio layer, by interlevel via metallization interconnect, makes described upper GND layer and lower GND layer can realize being electrically connected with the GND circuit of radio layer.
5. ceramic insulator used for electronic packaging as claimed in claim 1, is characterized in that: the upper surface of described first ceramic layer is provided with structural beams (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520889732.0U CN205140941U (en) | 2015-11-10 | 2015-11-10 | Ceramic insulator for electronic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520889732.0U CN205140941U (en) | 2015-11-10 | 2015-11-10 | Ceramic insulator for electronic packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205140941U true CN205140941U (en) | 2016-04-06 |
Family
ID=55626706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520889732.0U Withdrawn - After Issue CN205140941U (en) | 2015-11-10 | 2015-11-10 | Ceramic insulator for electronic packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205140941U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105244324A (en) * | 2015-11-10 | 2016-01-13 | 河北中瓷电子科技有限公司 | Ceramic insulator for electronic packaging and manufacturing method thereof |
| CN112687617A (en) * | 2020-12-24 | 2021-04-20 | 中国电子科技集团公司第十三研究所 | Preparation method of insulator needle and insulator needle |
-
2015
- 2015-11-10 CN CN201520889732.0U patent/CN205140941U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105244324A (en) * | 2015-11-10 | 2016-01-13 | 河北中瓷电子科技有限公司 | Ceramic insulator for electronic packaging and manufacturing method thereof |
| CN105244324B (en) * | 2015-11-10 | 2017-09-29 | 河北中瓷电子科技有限公司 | Ceramic insulator used for electronic packaging and preparation method thereof |
| CN112687617A (en) * | 2020-12-24 | 2021-04-20 | 中国电子科技集团公司第十三研究所 | Preparation method of insulator needle and insulator needle |
| CN112687617B (en) * | 2020-12-24 | 2022-07-22 | 中国电子科技集团公司第十三研究所 | Preparation method of insulator needle and insulator needle |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105244324A (en) | Ceramic insulator for electronic packaging and manufacturing method thereof | |
| CN102281702B (en) | Substrate layout and forming method thereof | |
| CN103460822A (en) | Multilayer substrate with integrated chip component and method for manufacturing same | |
| CN103367180A (en) | Semiconductor packaging structure and manufacturing method thereof | |
| CN106340498B (en) | A kind of encapsulating structure and its manufacturing method with electromagnetic shielding grounding function | |
| US6847116B2 (en) | Chip-type semiconductor light-emitting device | |
| CN205140941U (en) | Ceramic insulator for electronic packaging | |
| CN101989593B (en) | Packaging substrate as well as manufacturing method and packaging structure thereof | |
| CN102543908A (en) | Flip chip encapsulating piece and manufacturing method thereof | |
| CN104282637A (en) | Flip chip semiconductor encapsulation structure | |
| CN210926014U (en) | Sip packaging structure of semiconductor chip | |
| CN102244972A (en) | Circuit board and application thereof | |
| CN105489504B (en) | A kind of production method of package substrate | |
| CN101626011B (en) | Base plate having pad-free type conductive traces and using for encapsulation | |
| CN104185357B (en) | Circuit board | |
| CN110021831A (en) | Microwave vertical transition connection structure and microwave device | |
| CN205793635U (en) | The attachment structure of pcb board | |
| CN204558643U (en) | A kind of wireless charging antenna | |
| US9693453B2 (en) | Wiring board | |
| CN105489542A (en) | Chip packaging method and chip packaging structure | |
| CN110890284A (en) | Chip stacking and packaging structure and process method thereof | |
| CN213752692U (en) | Packaging base and packaging base combined board | |
| CN214592153U (en) | Improved multilayer circuit board structure | |
| CN221225982U (en) | Copper electrode magnetic core assembly and common mode inductor | |
| CN102163556B (en) | Method for electric-lead-free electroplating by adopting buried circuit substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160406 Effective date of abandoning: 20170929 |
|
| AV01 | Patent right actively abandoned |