CN204558643U - A kind of wireless charging antenna - Google Patents
A kind of wireless charging antenna Download PDFInfo
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- CN204558643U CN204558643U CN201520307357.4U CN201520307357U CN204558643U CN 204558643 U CN204558643 U CN 204558643U CN 201520307357 U CN201520307357 U CN 201520307357U CN 204558643 U CN204558643 U CN 204558643U
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Abstract
The utility model proposes a kind of wireless charging antenna, comprise: be formed with the coil of mutually insulated and the pcb layer of short lead, described coil two ends are the second technique contact and the first function contact, and described short lead two ends are the first technique contact and the second function contact; Be positioned at the solder mask layer on described pcb layer, on described solder mask layer, corresponding second technique contact, the first function contact, the first technique contact and the second function contact place are provided with opening; Be positioned at the wire jumper layer on the opening after the deoxidation of the corresponding first technique contact of described solder mask layer and the second technique contact, the described wire jumper layer described first technique contact of electrical connection and the second technique contact; And the coat of metal on opening after the deoxidation being positioned at the corresponding first function contact of described wire jumper layer and described solder mask layer and the second function contact.The utility model can reduce manufacturing cost, reduces antenna thickness, promotes entire physical signal transmission performance.
Description
Technical field
The utility model belongs to electronic circuit communication field, particularly be a kind of wireless charging antenna.
Background technology
Wireless charging antenna uses magnetic resonance principle, the air transmission electric charge between charger and equipment can be utilized, realize the wireless charging between equipment and charger, such as can be used in wireless telephonic charging, existing wireless charging antenna includes the substrate layer adopting flexible circuit board to be formed, substrate layer is provided with coil and short lead, one end of coil and one end of short lead are electrically connected by wire jumper layer, also to comprise on substrate layer and wire jumper layer or between other layer of formation antenna generating, the conductivity of wire jumper layer is not as good as copper conductor, wire jumper layer is made to become the weakest part of signal transmission, have impact on the overall efficiency of antenna, in order to ensure the conductivity of wire jumper layer, usually multi-protective layer and separator are set down thereon, increasing of the number of plies makes antenna thickness increase, and add the manufacturing process burden of antenna, increase manufacturing cost.
Utility model content
Object to be solved in the utility model is to provide a kind of antenna structure, can reduce manufacturing cost, reduces antenna thickness, promotes entire physical signal transmission performance.
For solving the problem, the utility model proposes a kind of wireless charging antenna, comprising:
Be formed with the coil of mutually insulated and the pcb layer of short lead, described coil two ends are the second technique contact and the first function contact, and described short lead two ends are the first technique contact and the second function contact;
Be positioned at the solder mask layer on described pcb layer, on described solder mask layer, corresponding second technique contact, the first function contact, the first technique contact and the second function contact place are provided with opening;
Be positioned at the wire jumper layer on the opening after the deoxidation of the corresponding first technique contact of described solder mask layer and the second technique contact, the described wire jumper layer described first technique contact of electrical connection and the second technique contact; And
Be positioned at the coat of metal on the opening after the deoxidation of described wire jumper layer and the corresponding first function contact of described solder mask layer and the second function contact.
According to an embodiment of the present utility model, described pcb layer is flexible PCB or hardboard, and the electric conductor in it is copper medium.
According to an embodiment of the present utility model, the coil on described pcb layer and short lead are formed on described pcb layer by etching.
According to an embodiment of the present utility model, described wire jumper layer is silver slurry wire jumper layer.
According to an embodiment of the present utility model, described coat of metal is gold-plated protective layer, copper facing protective layer, zinc-plated protective layer, plating palladium protective layer or alloy plating material protection layer.
After adopting technique scheme, the utility model has following beneficial effect compared to existing technology: the utility model is by being grown directly upon on the opening of the corresponding first technique contact of solder mask layer and the second technique contact by wire jumper layer, be electrically connected the first technique contact and the second technique contact, handicapping solder paste layer of ink can make edge of opening level and smooth, more easily grow wire jumper layer, make it not easy to crack, and after solidification solder mask layer, before growth wire jumper layer, the opening part of the corresponding first technique contact of solder mask layer and the second technique contact carries out the deoxidation of layers of copper oxide layer, strengthen the conductivity of the wire jumper layer then formed, at described wire jumper layer, and the opening of the corresponding first function contact of described solder mask layer and the second function contact generates coat of metal, play the effect fixing this wire jumper layer, without the need to ink for screen printing protective layer again between wire jumper layer and coat of metal, save ink silk screen printing cost, the antenna structure reduced thickness that the technical program is formed, and reduce manufacture technics cost.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the wireless charging method for manufacturing antenna of the utility model embodiment;
Fig. 2 a ~ 2e is the schematic top plan view of each step of a kind of wireless charging method for manufacturing antenna of the utility model embodiment;
Fig. 3 a ~ 3e is the cross-sectional view of each step of the wireless charging method for manufacturing antenna of Fig. 2 a ~ 2e;
Fig. 4 is the cross-sectional view of a kind of antenna structure of the utility model embodiment.
Embodiment
For enabling above-mentioned purpose of the present utility model, feature and advantage become apparent more, are described in detail embodiment of the present utility model below in conjunction with accompanying drawing.
Set forth a lot of detail in the following description so that fully understand the utility model.But the utility model can be much different from alternate manner described here to implement, those skilled in the art can when doing similar popularization without prejudice to when the utility model intension, and therefore the utility model is by the restriction of following public concrete enforcement.
Referring to Fig. 1, it illustrates the wireless charging method for manufacturing antenna of the present embodiment, comprising:
Step S10: provide and be formed with the coil of mutually insulated and the pcb layer of short lead, described coil two ends are the second technique contact and the first function contact, and described short lead two ends are the first technique contact and the second function contact;
Step S20: grow solder mask layer on described pcb layer, on described solder mask layer, corresponding second technique contact, the first function contact, the first technique contact and the second function contact place are provided with opening, solidify described solder mask layer;
Step S30: the layers of copper oxide layer that the opening part of corresponding second technique contact on solder mask layer described in deoxidation, the first function contact, the first technique contact and the second function contact is formed;
Step S40: grow wire jumper layer, the described wire jumper layer described first technique contact of electrical connection and the second technique contact on the described solder mask layer correspondence first technique contact of deoxidation and the opening of the second technique contact;
Step S50: growing metal protective layer on described wire jumper layer and the corresponding first function contact of described solder mask layer of deoxidation and the opening of the second function contact.
Below in conjunction with Fig. 1 and 2a ~ 2e, 3a ~ 3e, the method is specifically described.
Referring to Fig. 1,2a and 3a, first step S10 is performed, there is provided and be formed with the coil 201b of mutually insulated and the pcb layer 201a of short lead 201c, described coil 201b two ends are the second technique contact m2 ' and the first function contact f1 ', and described short lead 201c two ends are the first technique contact m1 ' and the second function contact f2 '.Described pcb layer 201a is flexible PCB or common PCB (printed circuit board) hardboard, conductor is wherein as a rule copper medium conductor, as a nonrestrictive example, this pcb layer is copper coin laminating PI (polyimides) base material, and coil 201b and short lead 201c forms the pcb layer 201a with coil 201b and short lead 201c by etching copper coin.
Wherein, because coil 201b is for be formed on pcb layer 201a with coiling form, thus two contacts of coil 201b are not in same one end of coil 201b, draw for the ease of contact weld, signal, one short lead 201c is set, using the contact of coil 201b inner ring as the second technique contact m2 ', be connected by the wire jumper layer in technical process with the first technique contact m1 ' of short lead 201c, and the contact of coil 201b outer shroud is used for external as the first function contact f1 ' and the second function contact f2 ' of short lead 201c.Technique contact is by contact that wire jumper layer connects in industrial manufacturing process; Function contact is the contact for other connections after antenna is formed.
Referring to Fig. 1,2b and 3b, perform step S20 afterwards, described pcb layer 201a grows solder mask layer 202, and on described solder mask layer 202, corresponding second technique contact m2 ', the first function contact f1 ', the first technique contact m1 ' and the second f2 ' place, function contact are provided with opening; Solder mask layer 202 is formed on described pcb layer 201a by silk-screen, and on solder mask layer 202, establish opening by exposed to the second technique contact m2 ', the first function contact f1 ', the first technique contact m1 ' and the second function contact f2 ', after silk-screen solder mask layer 202, it is cured, solder mask layer 202 can make edge of opening level and smooth, easilier on opening, grow wire jumper layer, make it not easy to crack.Layers of copper oxide layer C may be formed at the opening part that the second technique contact m2 ', the first function contact f1 ', the first technique contact m1 ' and the second function contact f2 ' are corresponding, the electric conductivity that this layers of copper oxide layer C will affect after the formation of wire jumper layer in solder mask layer 202 solidification process.
Referring to Fig. 1, 2c and 3c, perform step S30 afterwards, deoxidation step, due to second technique contact m2 ' corresponding on solder mask layer 202, first function contact f1 ', the opening part of the first technique contact m1 ' and the second function contact f2 ' is because of the solidification of solder mask layer 202, layers of copper oxide layer C may be formed, this step is by layers of copper oxide layer C deoxidation, such as by the method deoxidation of conventional copper oxide layer deoxidation, do not destroy solder mask layer 202, the second technique contact m2 ' is made after deoxidation, first function contact f1 ', first technique contact m1 ' and the second function contact f2 ' is again exposed, thus the conductivity of the wire jumper layer formed on exposed technique contact strengthens, and also there is good contact electric conductivity when function contact is external.
Referring to Fig. 1,2d and 3d, perform step S40 afterwards, the opening of the corresponding first technique contact m1 ' of the described solder mask layer 202 after deoxidation and the second technique contact m2 ' grows wire jumper layer 203, the first exposed technique contact m1 ' namely after deoxidation and the second technique contact m2 ' upper growth wire jumper layer 203, this wire jumper layer 203 covers the first technique contact m1 ' and the second technique contact m2 ' and region between the two, makes wire jumper layer 203 be electrically connected described first technique contact m1 ' and the second technique contact m2 '; Thus the first function contact f1 ' is communicated with the second function contact f2 '.
Referring to Fig. 1, 2e and 3e, perform step S50 afterwards, at described wire jumper layer 203, and (the first exposed function contact f1 ' namely after deoxidation and the second function contact f2 ') generates coat of metal 204 on the opening of the corresponding first function contact f1 ' of described solder mask layer 202 after deoxidation and the second function contact f2 ', this coat of metal 204 covers wire jumper layer 203, and first function contact f1 ' and the second function contact f2 ' protect, when the firstth function contact f1 ' and the second function contact f2 ' is external, can be connected by the coat of metal 204 on both, coat of metal plays the effect of fixing wire jumper layer.As nonrestrictive example, described coat of metal 204 is gold-plated protective layer, copper facing protective layer, zinc-plated protective layer, plating palladium protective layer or alloy plating material protection layer.
Because interlayer structure is different in traditional handicraft, to need on wire jumper layer ink for screen printing again to carry out insulation blocking, cause product thickness to increase; manufacture technics cost increases; and by the wireless charging method for manufacturing antenna of the present embodiment without the need to ink for screen printing again, method is simple, cost-saving.
Preferably, described wire jumper layer 203 is silver slurry wire jumper layer, due to solder mask layer setting and after solidification solder mask layer 202 deoxidation layers of copper oxide layer C, make silver slurry wire jumper layer be convenient to printing, and not easy to crack, electric conductivity strengthens simultaneously.
Adopt the antenna structure of the method formation of Fig. 1 and 2a ~ 2e, 3a ~ 3e as Fig. 4, comprise: be formed with the coil 201b of mutually insulated and the pcb layer 201a of short lead 201c, described coil 201b two ends are the second technique contact m2 ' and the first function contact f1 ', and described short lead 201c two ends are the first technique contact m1 ' and the second function contact f2 '; Be positioned at the solder mask layer 202 on described pcb layer 201a, on described solder mask layer 202, corresponding second technique contact m2 ', the first function contact f1 ', the first technique contact m1 ' and the second f2 ' place, function contact are provided with opening; Be positioned at the wire jumper layer 203 after the deoxidation on the opening of the corresponding first technique contact m1 ' of described solder mask layer 202 and the second technique contact m2 ', described wire jumper layer 203 is electrically connected described first technique contact m1 ' and the second technique contact m2 '; And the coat of metal 204 on opening after the deoxidation being positioned at described wire jumper layer 203 and the corresponding first function contact f1 ' of described solder mask layer 202 and the second function contact f2 '.More particular contents please refer to the description in the formation method of previous embodiment.
The utility model is by being grown directly upon on the opening of the corresponding first technique contact of solder mask layer and the second technique contact by wire jumper layer, be electrically connected the first technique contact and the second technique contact, handicapping solder paste layer of ink can make edge of opening level and smooth, more easily grow wire jumper layer, make it not easy to crack, and after solidification solder mask layer, before growth wire jumper layer, the opening part of the corresponding first technique contact of solder mask layer and the second technique contact carries out the deoxidation of layers of copper oxide layer, strengthen the conductivity of the wire jumper layer then formed, at described wire jumper layer, and the opening of the corresponding first function contact of described solder mask layer and the second function contact generates coat of metal, play the effect fixing this wire jumper layer, without the need to ink for screen printing protective layer again between wire jumper layer and coat of metal, save ink silk screen printing cost, the antenna structure reduced thickness that the technical program is formed, and reduce manufacture technics cost.
Although the utility model with preferred embodiment openly as above; but it is not for limiting claim; any those skilled in the art are not departing from spirit and scope of the present utility model; can make possible variation and amendment, the scope that therefore protection range of the present utility model should define with the utility model claim is as the criterion.
Claims (5)
1. a wireless charging antenna, is characterized in that, comprising:
Be formed with the coil of mutually insulated and the pcb layer of short lead, described coil two ends are the second technique contact and the first function contact, and described short lead two ends are the first technique contact and the second function contact;
Be positioned at the solder mask layer on described pcb layer, on described solder mask layer, corresponding second technique contact, the first function contact, the first technique contact and the second function contact place are provided with opening;
Be positioned at the wire jumper layer on the opening after the deoxidation of the corresponding first technique contact of described solder mask layer and the second technique contact, the described wire jumper layer described first technique contact of electrical connection and the second technique contact; And
Be positioned at the coat of metal on the opening after the deoxidation of described wire jumper layer and the corresponding first function contact of described solder mask layer and the second function contact.
2. wireless charging antenna as claimed in claim 1, it is characterized in that, described pcb layer is flexible PCB or hardboard, and the electric conductor in it is copper medium.
3. wireless charging antenna as claimed in claim 1, it is characterized in that, the coil on described pcb layer and short lead are formed on described pcb layer by etching.
4. wireless charging antenna as claimed in claim 1, is characterized in that, described wire jumper layer is silver slurry wire jumper layer.
5. wireless charging antenna as claimed in claim 1, it is characterized in that, described coat of metal is gold-plated protective layer, copper facing protective layer, zinc-plated protective layer, plating palladium protective layer or alloy plating material protection layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520307357.4U CN204558643U (en) | 2015-05-13 | 2015-05-13 | A kind of wireless charging antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520307357.4U CN204558643U (en) | 2015-05-13 | 2015-05-13 | A kind of wireless charging antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204558643U true CN204558643U (en) | 2015-08-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520307357.4U Withdrawn - After Issue CN204558643U (en) | 2015-05-13 | 2015-05-13 | A kind of wireless charging antenna |
Country Status (1)
| Country | Link |
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| CN (1) | CN204558643U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104868246A (en) * | 2015-05-13 | 2015-08-26 | 上海安费诺永亿通讯电子有限公司 | Wireless charging antenna manufacturing method and wireless charging antenna |
-
2015
- 2015-05-13 CN CN201520307357.4U patent/CN204558643U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104868246A (en) * | 2015-05-13 | 2015-08-26 | 上海安费诺永亿通讯电子有限公司 | Wireless charging antenna manufacturing method and wireless charging antenna |
| CN104868246B (en) * | 2015-05-13 | 2017-08-25 | 上海安费诺永亿通讯电子有限公司 | A kind of wireless charging operation manufacture method and wireless charging operation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150812 Effective date of abandoning: 20170825 |