CN205081112U - Integrated circuit basement with heat dissipation function - Google Patents
Integrated circuit basement with heat dissipation function Download PDFInfo
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- CN205081112U CN205081112U CN201520909850.3U CN201520909850U CN205081112U CN 205081112 U CN205081112 U CN 205081112U CN 201520909850 U CN201520909850 U CN 201520909850U CN 205081112 U CN205081112 U CN 205081112U
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- heat
- integrated circuit
- heat dissipation
- metal ring
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Abstract
The utility model discloses an integrated circuit basement with heat dissipation function, the top fixed connection of back sheath line and silicon through hole electrode, the top of solid becket no. 1 and the bottom fixed connection of back sheath line left end, the top of solid becket no. 2 and the bottom fixed connection of back sheath line right -hand member, the dead lever sets up the right side at solid becket no. 2, the bottom and the fixation clamp of dead lever are connected, the heat dissipation storehouse one is disposed under the solid becket two, the heat dissipation fan sets up the middle part in heat dissipation storehouse no. 1, the left end and the right -hand member in heat dissipation storehouse no. 1 all are equipped with fixed heat dissipation fan, heat dissipation storehouse no. 2 sets up the bottom in heat dissipation storehouse no. 1, the inside in heat dissipation storehouse no. 2 evenly is equipped with the heat dissipation bars. This integrated circuit basement simple structure, convenient to use, the cost is low moreover, is fit for generally using.
Description
Technical field
The utility model belongs to integrated circuit substrate technical field, is specifically related to a kind of integrated circuit substrate with heat sinking function.
Background technology
Integrated circuit (integratedcircuit) is a kind of microelectronic device or parts.Adopt certain technique, together with the elements such as transistor required in a circuit, resistance, electric capacity and inductance and wire interconnects, be produced on a fritter or a few fritter semiconductor wafer or dielectric substrate, be then encapsulated in a shell, become the microstructure with required circuit function; Wherein all elements structurally form a whole, make electronic component stride forward major step towards microminaturization, low-power consumption, intellectuality and high reliability aspect.It represents with letter " IC " in circuit.Integrated circuit inventor is that Jack Kiel ratio (integrated circuit based on germanium (Ge)) and Robert's noy think (integrated circuit based on silicon (Si)).The application of current semi-conductor industry great majority be integrated circuit based on silicon.It is a kind of semiconductor device grown up the sixties in later stage the 1950's one.It is through the semiconductor fabrication process such as oxidation, photoetching, diffusion, extension, evaporation of aluminum, the element such as semiconductor, resistance, electric capacity formed needed for the circuit with certain function and the connection wire between them are all integrated on a fritter silicon chip, then weld the electronic device be encapsulated in a shell.Its package casing has the various ways such as round shell-type, flat or dual inline type.Integrated circuit technique comprises chip fabrication techniques and designing technique, is mainly reflected in process equipment, processing technology, packaging and testing, in the ability of batch production and design innovation.For integrated circuit pedestal, due to computer integrate circuit heating especially severe, so the problem of integrated circuit pedestal heat radiation is exactly the problem that everybody very pays close attention to, but the existing integrated circuit substrate with heat sinking function mostly radiating effect is bad, and cost is higher, so we need a novel integrated circuit substrate with heat sinking function to solve the problems referred to above, meet the demand of people.
Utility model content
The purpose of this utility model is to provide a kind of integrated circuit substrate with heat sinking function, to solve the problem proposed in above-mentioned background technology.
For achieving the above object, the utility model provides following technical scheme: a kind of integrated circuit substrate with heat sinking function, comprise rear sheath line, silicon through hole electrode, solid metal ring one, solid metal ring two, heat-dissipating storehouse one, heat emission fan, fixed leg, heat-dissipating storehouse two, fixed lever, described rear sheath line is fixedly connected with the top of silicon through hole electrode, the top of described solid metal ring one is fixedly connected with the bottom of rear sheath line left end, the top of described solid metal ring two is fixedly connected with the bottom of rear sheath line right-hand member, described fixed lever is arranged on the right side of solid metal ring two, and the top of fixed lever is fixedly connected with the bottom of rear sheath line, the bottom of described fixed lever is connected with geometrical clamp, described heat-dissipating storehouse one is arranged on the below of solid metal ring two, described heat emission fan is arranged on the middle part of heat-dissipating storehouse one, and heat emission fan is fixedly connected with heat-dissipating storehouse one by fixed leg, left end and the right-hand member of described heat-dissipating storehouse one are equipped with fixing heat emission fan, described heat-dissipating storehouse two is arranged on the bottom of heat-dissipating storehouse one, the inner homogeneous of described heat-dissipating storehouse two is provided with heat radiation grid.
Preferably, described rear sheath line, silicon through hole electrode, solid metal ring one, solid metal ring two, geometrical clamp and fixed lever are symmetrical arranged about in the middle part of integrated circuit substrate.
Preferably, the below of described heat emission fan is set to screen cloth.
Preferably, the outside of described silicon through hole electrode is provided with protective sleeve.
Preferably, described fixed leg is the fixed leg be made up of metal material.
Technique effect of the present utility model and advantage: this integrated circuit substrate structure with heat sinking function is simple, easy to use, and cost is low, is applicable to generally using; The setting of heat emission fan and fixing heat emission fan can carry out radiating treatment to the integrated circuit substrate that this has heat sinking function, prevents integrated circuit from burning because of overheated; The hot gas that heat emission fan ejects can shed by the setting of heat radiation grid, more further enhances the function of heat radiation.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1, rear sheath line; 2, silicon through hole electrode; 3, solid metal ring one; 4, solid metal ring two; 5, geometrical clamp; 6, heat-dissipating storehouse one; 7, heat emission fan; 8, fixed leg; 9, fixing heat emission fan; 10, heat-dissipating storehouse two; 11, dispel the heat grid; 12, fixed lever.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
The utility model provides a kind of integrated circuit substrate with heat sinking function as shown in Figure 1, comprise rear sheath line 1, silicon through hole electrode 2, solid metal ring 1, solid metal ring 24, heat-dissipating storehouse 1, heat emission fan 7, fixed leg 8, heat-dissipating storehouse 2 10, fixed lever 12, described rear sheath line 1 is fixedly connected with the top of silicon through hole electrode 2, the outside of described silicon through hole electrode 2 is provided with protective sleeve, the top of described solid metal ring 1 is fixedly connected with the bottom of rear sheath line 1 left end, the top of described solid metal ring 24 is fixedly connected with the bottom of rear sheath line 1 right-hand member, described fixed lever 12 is arranged on the right side of solid metal ring 24, and the top of fixed lever 12 is fixedly connected with the bottom of rear sheath line 1, the bottom of described fixed lever 12 is connected with geometrical clamp 5, described rear sheath line 1, silicon through hole electrode 2, solid metal ring 1, solid metal ring 24, geometrical clamp 5 and fixed lever 12 are symmetrical arranged about in the middle part of integrated circuit substrate, described heat-dissipating storehouse 1 is arranged on the below of solid metal ring 24, described heat emission fan 7 is arranged on the middle part of heat-dissipating storehouse 1, and heat emission fan 7 is fixedly connected with heat-dissipating storehouse 1 by fixed leg 8, described fixed leg 8 is the fixed legs be made up of metal material, the below of described heat emission fan 7 is set to screen cloth, the left end of described heat-dissipating storehouse 1 and right-hand member are equipped with fixing heat emission fan 9, described heat-dissipating storehouse 2 10 is arranged on the bottom of heat-dissipating storehouse 1, the inner homogeneous of described heat-dissipating storehouse 2 10 is provided with heat radiation grid 11.
Operation principle: when this integrated circuit substrate with heat sinking function uses, the heat that the heat produced when the top of heat-dissipating storehouse 1 works is produced by the heat emission fan 7 of heat-dissipating storehouse 1 inside and fixing heat emission fan 9 pairs of tops of both sides carries out preliminary heat radiation, and the heat that heat radiation grid 11 pairs of heat emission fan 7 of heat-dissipating storehouse 2 10 inside eject carries out secondary heat radiation, reach the effect of thoroughly heat radiation like this.
Last it is noted that the foregoing is only preferred embodiment of the present utility model; be not limited to the utility model; although be described in detail the utility model with reference to previous embodiment; for a person skilled in the art; it still can be modified to the technical scheme described in foregoing embodiments; or equivalent replacement is carried out to wherein portion of techniques feature; all within spirit of the present utility model and principle; any amendment of doing, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (5)
1. one kind has the integrated circuit substrate of heat sinking function, comprise rear sheath line (1), silicon through hole electrode (2), solid metal ring one (3), solid metal ring two (4), heat-dissipating storehouse one (6), heat emission fan (7), fixed leg (8), heat-dissipating storehouse two (10), fixed lever (12), it is characterized in that: described rear sheath line (1) is fixedly connected with the top of silicon through hole electrode (2), the top of described solid metal ring one (3) is fixedly connected with the bottom of rear sheath line (1) left end, the top of described solid metal ring two (4) is fixedly connected with the bottom of rear sheath line (1) right-hand member, described fixed lever (12) is arranged on the right side of solid metal ring two (4), and the top of fixed lever (12) is fixedly connected with the bottom of rear sheath line (1), the bottom of described fixed lever (12) is connected with geometrical clamp (5), described heat-dissipating storehouse one (6) is arranged on the below of solid metal ring two (4), described heat emission fan (7) is arranged on the middle part of heat-dissipating storehouse one (6), and heat emission fan (7) is fixedly connected with heat-dissipating storehouse one (6) by fixed leg (8), left end and the right-hand member of described heat-dissipating storehouse one (6) are equipped with fixing heat emission fan (9), described heat-dissipating storehouse two (10) is arranged on the bottom of heat-dissipating storehouse one (6), the inner homogeneous of described heat-dissipating storehouse two (10) is provided with heat radiation grid (11).
2. a kind of integrated circuit substrate with heat sinking function according to claim 1, is characterized in that: described rear sheath line (1), silicon through hole electrode (2), solid metal ring one (3), solid metal ring two (4), geometrical clamp (5) and fixed lever (12) are symmetrical arranged about in the middle part of integrated circuit substrate.
3. a kind of integrated circuit substrate with heat sinking function according to claim 1, is characterized in that: the below of described heat emission fan (7) is set to screen cloth.
4. a kind of integrated circuit substrate with heat sinking function according to claim 1, is characterized in that: the outside of described silicon through hole electrode (2) is provided with protective sleeve.
5. a kind of integrated circuit substrate with heat sinking function according to claim 1, is characterized in that: described fixed leg (8) is the fixed leg be made up of metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520909850.3U CN205081112U (en) | 2015-11-16 | 2015-11-16 | Integrated circuit basement with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520909850.3U CN205081112U (en) | 2015-11-16 | 2015-11-16 | Integrated circuit basement with heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205081112U true CN205081112U (en) | 2016-03-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520909850.3U Active CN205081112U (en) | 2015-11-16 | 2015-11-16 | Integrated circuit basement with heat dissipation function |
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| CN (1) | CN205081112U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023279512A1 (en) * | 2021-07-07 | 2023-01-12 | 长鑫存储技术有限公司 | Heat dissipation structure, forming method for heat dissipation structure, and semiconductor structure |
-
2015
- 2015-11-16 CN CN201520909850.3U patent/CN205081112U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023279512A1 (en) * | 2021-07-07 | 2023-01-12 | 长鑫存储技术有限公司 | Heat dissipation structure, forming method for heat dissipation structure, and semiconductor structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Kodak Economic Development Zone 277200 Shandong province Zaozhuang City Yicheng District Road Patentee after: SHANDONG HANQI TECHNOLOGY CO., LTD. Address before: Kodak Economic Development Zone 277200 Shandong province Zaozhuang City Yicheng District Road Patentee before: ZAOZHUANG HANQI COMMUNICATION TECHNOLOGY CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Integrated circuit basement with heat dissipation function Effective date of registration: 20170904 Granted publication date: 20160309 Pledgee: Agricultural Bank of China, Limited by Share Ltd, Zaozhuang branch Pledgor: SHANDONG HANQI TECHNOLOGY CO., LTD. Registration number: 2017370000132 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211119 Granted publication date: 20160309 Pledgee: Agricultural Bank of China Limited by Share Ltd. Zaozhuang branch Pledgor: SHANDONG HANTURE TECHNOLOGY CO.,LTD. Registration number: 2017370000132 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |