CN205039175U - Led抗震芯片组件 - Google Patents

Led抗震芯片组件 Download PDF

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Publication number
CN205039175U
CN205039175U CN201520785075.5U CN201520785075U CN205039175U CN 205039175 U CN205039175 U CN 205039175U CN 201520785075 U CN201520785075 U CN 201520785075U CN 205039175 U CN205039175 U CN 205039175U
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Prior art keywords
chip
led
antidetonation
mounting groove
copper sheet
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CN201520785075.5U
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Inventor
谭启龙
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And hung electric, Limited by Share Ltd
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Hehong Electric Co Ltd
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Abstract

本实用新型公开了一种LED抗震芯片组件，包括底板，其特征在于：所述底板的上表面设有芯片安装槽，所述安装槽的侧壁上设有点胶槽，所述芯片安装槽内安装有芯片，所述芯片的侧壁上连接有导电铜片，所述导电铜片安装在导线槽内，所述导线槽的侧壁上设有粘胶槽。本实用新型结构简单，安装简单牢固，抗震性能好。

Description

LED抗震芯片组件
技术领域
本实用新型涉及一种LED芯片零件，具体是一种LED抗震芯片组件。
背景技术
LED是英文lightemittingdiode（发光二极管）的缩写，它的基本结构是一块电致发光的半导体材料芯片，用银胶或白胶固化到支架上，然后用银线或金线连接芯片和电路板，然后四周用环氧树脂密封，起到保护内部芯线的作用，最后安装外壳。
现有技术中，存在结构复杂，散热效果好，结构不稳定，抗震性差，LED使用寿命低。
实用新型内容
本实用新型目的是提供了一种结构简单，安装简单牢固，抗震性能好的LED抗震芯片组件。
本实用新型解决技术问题提供如下方案：
一种LED抗震芯片组件，包括底板，其特征在于：所述底板的上表面设有芯片安装槽，所述安装槽的侧壁上设有点胶槽，所述芯片安装槽内安装有芯片，所述芯片的侧壁上连接有导电铜片，所述导电铜片安装在导线槽内，所述导线槽的侧壁上设有粘胶槽。
所述底板的左、右两端分别设有安装固定板。
本实用新型在底板上表面设有芯片安装槽，且在安装槽的侧壁上设有点胶槽，在安装槽内安装有芯片，且在芯片的四周的点胶槽内添加胶水，使得芯片安装更加稳定，且在芯片的四周粘结有导电铜片，使得铜片更加稳固，抗震性能提高。
附图说明
图1为本实用新型的结构示意图。
具体实施方式
参见附图，一种LED抗震芯片组件，包括底板1，所述底板1的上表面设有芯片安装槽2，所述安装槽2的侧壁上设有点胶槽3，所述芯片安装槽2内安装有芯片4，所述芯片4的侧壁上连接有导电铜片5，所述导电铜片5安装在导线槽内6，所述导线槽6的侧壁上设有粘胶槽7。
所述底板1的左、右两端分别设有安装固定板8。

Claims (2)

1.一种LED抗震芯片组件，包括底板，其特征在于：所述底板的上表面设有芯片安装槽，所述安装槽的侧壁上设有点胶槽，所述芯片安装槽内安装有芯片，所述芯片的侧壁上连接有导电铜片，所述导电铜片安装在导线槽内，所述导线槽的侧壁上设有粘胶槽。
2.根据权利要求1所述LED抗震芯片组件，其特征在于：所述底板的左、右两端分别设有安装固定板。
CN201520785075.5U 2015-10-09 2015-10-09 Led抗震芯片组件 Active CN205039175U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520785075.5U CN205039175U (zh) 2015-10-09 2015-10-09 Led抗震芯片组件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520785075.5U CN205039175U (zh) 2015-10-09 2015-10-09 Led抗震芯片组件

Publications (1)

Publication Number Publication Date
CN205039175U true CN205039175U (zh) 2016-02-17

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CN (1) CN205039175U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108870330A (zh) * 2018-04-03 2018-11-23 澳洋集团有限公司 一种用于led芯片的减震器件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108870330A (zh) * 2018-04-03 2018-11-23 澳洋集团有限公司 一种用于led芯片的减震器件

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CP01 Change in the name or title of a patent holder

Address after: 236000 Anhui city of Fuyang province Fuyang Yingquan District Industrial Park Road No. 55 top

Patentee after: And hung electric, Limited by Share Ltd

Address before: 236000 Anhui city of Fuyang province Fuyang Yingquan District Industrial Park Road No. 55 top

Patentee before: HEHONG ELECTRICAL CO., LTD.

PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: LED antidetonation chip subassembly

Effective date of registration: 20171227

Granted publication date: 20160217

Pledgee: Fuyang Yingquan financing Company limited by guarantee

Pledgor: And hung electric, Limited by Share Ltd

Registration number: 2017340000479

PC01 Cancellation of the registration of the contract for pledge of patent right
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Date of cancellation: 20190104

Granted publication date: 20160217

Pledgee: Fuyang Yingquan financing Company limited by guarantee

Pledgor: And hung electric, Limited by Share Ltd

Registration number: 2017340000479

PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: LED antidetonation chip subassembly

Effective date of registration: 20190305

Granted publication date: 20160217

Pledgee: Fuyang Yingquan financing Company limited by guarantee

Pledgor: And hung electric, Limited by Share Ltd

Registration number: 2019340000122

PC01 Cancellation of the registration of the contract for pledge of patent right
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