CN204946943U - A kind of light-emitting diode (LED) module - Google Patents
A kind of light-emitting diode (LED) module Download PDFInfo
- Publication number
- CN204946943U CN204946943U CN201520765543.2U CN201520765543U CN204946943U CN 204946943 U CN204946943 U CN 204946943U CN 201520765543 U CN201520765543 U CN 201520765543U CN 204946943 U CN204946943 U CN 204946943U
- Authority
- CN
- China
- Prior art keywords
- instant
- heat abstractor
- led
- support
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The utility model discloses a kind of light-emitting diode (LED) module, belong to LED technology field.It comprises epoxy encapsulation, support is packaged with in it, support stub end is fixed with diode chip for backlight unit by elargol, welding gold thread one end, diode chip for backlight unit top, the gold thread other end is welded on the little head end of support, two lead-in wires are drawn by support both sides bottom epoxy encapsulation, lead-in wire is mounted with the instant-plugging heat abstractor of a L-type, instant-plugging heat abstractor back is the mounting ring of arc flange shape, mounting ring and lead-in wire interference fit, the horizontal radiating surface of instant-plugging heat abstractor is provided with the equally spaced longitudinal direction vertical with vertical radiating surface and dispels the heat.The utility model is convenient for production, quick, and the light-emitting diode of design instant-plugging heat abstractor, simplicity of design, easy for installation, good heat dissipation effect, extend its useful life greatly while solving LED heat radiating problem, cost is low.
Description
Technical field
The utility model relates to a kind of light-emitting diode (LED) module, belongs to LED technology field.
Background technology
Light-emitting diode is as the one of semiconductor diode, electric energy conversion can be luminous energy by it, along with the progress of LED high brightness and multicolor, it is widely used in indicator light, display screen, signal lamp and special lighting field, the large raw material of existing light-emitting diode five is respectively wafer, support, elargol, gold thread and epoxy resin, because LED operation heat is far longer than common semiconductor diode, in order to extend the useful life of light-emitting diode, heat dissipation design is added in diode package of being everlasting, existing light-emitting diode be everlasting lead outlet end draw fin, fin ends is inserted in epoxy resin, this kind of heat dissipation design radiating effect is general, cost is high, and be unfavorable for epoxy resin encapsulating, operation easier is large, the utility model is mainly used in solving the problem.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of light-emitting diode (LED) module, and it designs a kind of light-emitting diode with instant-plugging heat abstractor, and simplicity of design is easy for installation, good heat dissipation effect.
Technical problem to be solved in the utility model is taked following technical scheme to realize:
A kind of light-emitting diode (LED) module, it comprises epoxy encapsulation, support is packaged with in it, support stub end is fixed with diode chip for backlight unit by elargol, welding gold thread one end, diode chip for backlight unit top, the gold thread other end is welded on the little head end of support, two lead-in wires are drawn by support both sides bottom epoxy encapsulation, it is characterized in that: the instant-plugging heat abstractor described lead-in wire being mounted with a L-type, described instant-plugging heat abstractor back is the mounting ring of arc flange shape, mounting ring and lead-in wire interference fit, the described horizontal radiating surface of instant-plugging heat abstractor is provided with the equally spaced longitudinal fin vertical with vertical radiating surface.
As preferred embodiment, described longitudinal fin is vertically provided with the heatsink transverse sheet of two panels level.
As preferred embodiment, described longitudinal fin and instant-plugging heat abstractor wide.
As preferred embodiment, described instant-plugging heat abstractor is aluminum products.
The beneficial effects of the utility model are: the utility model is convenient for production, quick, the light-emitting diode of design instant-plugging heat abstractor, simplicity of design, easy for installation, good heat dissipation effect, extend its useful life greatly while solving LED heat radiating problem, cost is low.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
In figure: 1, epoxy encapsulation, 2, diode chip for backlight unit, 3, elargol, 4, instant-plugging heat abstractor, 5, lead-in wire, 6, support, 7, gold thread, 41, longitudinal fin, 42, heatsink transverse sheet, 43, mounting ring.
Embodiment
In order to technological means of the present utility model, creation characteristic, reach object and effect is easy to understand, below in conjunction with concrete diagram, set forth the utility model further.
As shown in Figure 1, a kind of light-emitting diode (LED) module, it comprises epoxy encapsulation 1, support 6 is packaged with in it, support 6 stub end is fixed with diode chip for backlight unit 2 by elargol 3, welding gold thread 7 one end, diode chip for backlight unit 2 top, gold thread 7 other end is welded on the little head end of support 6, two lead-in wires 5 are drawn by support 6 both sides bottom epoxy encapsulation 1, lead-in wire 5 is mounted with the instant-plugging heat abstractor 4 of a L-type, instant-plugging heat abstractor 4 back is the mounting ring 43 of arc flange shape, mounting ring 43 and lead-in wire 5 interference fit, the horizontal radiating surface of instant-plugging heat abstractor 4 is provided with the equally spaced longitudinal fin 41 vertical with vertical radiating surface.
Longitudinal fin 41 is vertically provided with the heatsink transverse sheet 42 of two panels level.
Longitudinal fin 41 is wide with instant-plugging heat abstractor 4.
Instant-plugging heat abstractor 4 is aluminum products.
More than show and describe general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; under the prerequisite not departing from the utility model spirit and scope, the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (4)
1. a light-emitting diode (LED) module, it comprises epoxy encapsulation, support is packaged with in it, support stub end is fixed with diode chip for backlight unit by elargol, welding gold thread one end, diode chip for backlight unit top, the gold thread other end is welded on the little head end of support, two lead-in wires are drawn by support both sides bottom epoxy encapsulation, it is characterized in that: the instant-plugging heat abstractor described lead-in wire being mounted with a L-type, described instant-plugging heat abstractor back is the mounting ring of arc flange shape, mounting ring and lead-in wire interference fit, the described horizontal radiating surface of instant-plugging heat abstractor is provided with the equally spaced longitudinal fin vertical with vertical radiating surface.
2. a kind of light-emitting diode (LED) module according to claim 1, is characterized in that: the heatsink transverse sheet described longitudinal fin being vertically provided with two panels level.
3. a kind of light-emitting diode (LED) module according to claim 1, is characterized in that: described longitudinal fin and instant-plugging heat abstractor wide.
4. a kind of light-emitting diode (LED) module according to claim 1, is characterized in that: described instant-plugging heat abstractor is aluminum products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520765543.2U CN204946943U (en) | 2015-09-30 | 2015-09-30 | A kind of light-emitting diode (LED) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520765543.2U CN204946943U (en) | 2015-09-30 | 2015-09-30 | A kind of light-emitting diode (LED) module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204946943U true CN204946943U (en) | 2016-01-06 |
Family
ID=55014343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520765543.2U Expired - Fee Related CN204946943U (en) | 2015-09-30 | 2015-09-30 | A kind of light-emitting diode (LED) module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204946943U (en) |
-
2015
- 2015-09-30 CN CN201520765543.2U patent/CN204946943U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160106 Termination date: 20160930 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |