CN204946941U - 一种发光二极管 - Google Patents

一种发光二极管 Download PDF

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Publication number
CN204946941U
CN204946941U CN201520594059.8U CN201520594059U CN204946941U CN 204946941 U CN204946941 U CN 204946941U CN 201520594059 U CN201520594059 U CN 201520594059U CN 204946941 U CN204946941 U CN 204946941U
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CN
China
Prior art keywords
anode tap
led chip
wedge shape
cathode leg
shape support
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520594059.8U
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English (en)
Inventor
周明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANTONG MINGXIN MICROELECTRONICS CO Ltd
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NANTONG MINGXIN MICROELECTRONICS CO Ltd
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Priority to CN201520594059.8U priority Critical patent/CN204946941U/zh
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Publication of CN204946941U publication Critical patent/CN204946941U/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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  • Led Device Packages (AREA)

Abstract

本实用新型提供了一种发光二极管，包括阳极引线（1）、阴极引线（2）、楔形支架（3）、LED芯片（4）和环氧树脂外壳（5），所述的LED芯片（4）连在楔形支架（3）上，所述的阳极引线（1）和阴极引线（2）连在楔形支架（3）两侧，所述的LED芯片（4）设在阳极引线（1）和阴极引线（2）之间，所述的楔形支架（3）和LED芯片（4）设在环氧树脂外壳（5）内，所述的阳极引线（1）和阴极引线（2）的外部依次覆有胶粘层（6）和铜镍合金层（7）。本实用新型的发光二极管具有如下技术效果：1）引脚不容易被折弯或折断；2）引脚在镶嵌时不容易插入过深，不会导致焊接不稳固。

Description

一种发光二极管
技术领域
本实用新型涉及一种发光二极管，属于半导体技术领域。
背景技术
二极管是最常用的电子元件之一，它最大的特性就是单向导电，也就是电流只可以从二极管的一个方向流过，二极管的作用有整流电路，检波电路，稳压电路，各种调制电路，主要都是由二极管来构成的，其原理都很简单，正是由于二极管等元件的发明，才有我们现在丰富多彩的电子信息世界的诞生。
现有的二极管存在如下不足之处：
1）引脚容易被折弯或折断；
2）引脚在镶嵌时容易插入过深，导致焊接不稳固。
这些不足之处都严重影响了二极管的使用寿命。
发明内容
本实用新型的目的是克服现有技术的不足之处，提供一种发光二极管。
本实用新型的发光二极管，包括阳极引线（1）、阴极引线（2）、楔形支架（3）、LED芯片（4）和环氧树脂外壳（5），所述的LED芯片（4）连在楔形支架（3）上，所述的阳极引线（1）和阴极引线（2）连在楔形支架（3）两侧，所述的LED芯片（4）设在阳极引线（1）和阴极引线（2）之间，所述的楔形支架（3）和LED芯片（4）设在环氧树脂外壳（5）内，所述的阳极引线（1）和阴极引线（2）的外部依次覆有胶粘层（6）和铜镍合金层（7）。
优选地，
所述的阳极引线（1）和阴极引线（2）上设有定位块（8）。
本实用新型的发光二极管具有如下技术效果：
1）引脚不容易被折弯或折断；
2）引脚在镶嵌时不容易插入过深，不会导致焊接不稳固。
附图说明
图1是本实用新型的发光二极管的结构示意图。
其中，1为阳极引线，2为阴极引线，3为楔形支架，4为LED芯片，5为环氧树脂外壳，6为胶粘层，7为铜镍合金层，8为定位块。
具体实施方式
如图1所示，本实用新型的发光二极管，包括阳极引线（1）、阴极引线（2）、楔形支架（3）、LED芯片（4）和环氧树脂外壳（5），所述的LED芯片（4）连在楔形支架（3）上，所述的阳极引线（1）和阴极引线（2）连在楔形支架（3）两侧，所述的LED芯片（4）设在阳极引线（1）和阴极引线（2）之间，所述的楔形支架（3）和LED芯片（4）设在环氧树脂外壳（5）内，所述的阳极引线（1）和阴极引线（2）的外部依次覆有胶粘层（6）和铜镍合金层（7）。所述的阳极引线（1）和阴极引线（2）上设有定位块（8）。

Claims (2)

1.一种发光二极管，包括阳极引线（1）、阴极引线（2）、楔形支架（3）、LED芯片（4）和环氧树脂外壳（5），所述的LED芯片（4）连在楔形支架（3）上，所述的阳极引线（1）和阴极引线（2）连在楔形支架（3）两侧，所述的LED芯片（4）设在阳极引线（1）和阴极引线（2）之间，所述的楔形支架（3）和LED芯片（4）设在环氧树脂外壳（5）内，其特征在于，所述的阳极引线（1）和阴极引线（2）的外部依次覆有胶粘层（6）和铜镍合金层（7）。
2.根据权利要求1所述的发光二极管，其特征在于，所述的阳极引线（1）和阴极引线（2）上设有定位块（8）。
CN201520594059.8U 2015-08-10 2015-08-10 一种发光二极管 Expired - Fee Related CN204946941U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520594059.8U CN204946941U (zh) 2015-08-10 2015-08-10 一种发光二极管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520594059.8U CN204946941U (zh) 2015-08-10 2015-08-10 一种发光二极管

Publications (1)

Publication Number Publication Date
CN204946941U true CN204946941U (zh) 2016-01-06

Family

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Family Applications (1)

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CN201520594059.8U Expired - Fee Related CN204946941U (zh) 2015-08-10 2015-08-10 一种发光二极管

Country Status (1)

Country Link
CN (1) CN204946941U (zh)

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160106

Termination date: 20180810

CF01 Termination of patent right due to non-payment of annual fee