CN204906884U - Selectivity wave soldering equipment - Google Patents

Selectivity wave soldering equipment Download PDF

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Publication number
CN204906884U
CN204906884U CN201520547475.2U CN201520547475U CN204906884U CN 204906884 U CN204906884 U CN 204906884U CN 201520547475 U CN201520547475 U CN 201520547475U CN 204906884 U CN204906884 U CN 204906884U
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Prior art keywords
guide rail
section guide
preheating
wave soldering
tin stove
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CN201520547475.2U
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罗文欣
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SHENZHEN HAOBAO TECHNOLOGY Co.,Ltd.
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HB AUTOMATION EQUIPMENT Co Ltd
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Abstract

The utility model relates to a wave soldering equipment field, concretely relates to selectivity wave soldering equipment. Selectivity wave soldering equipment includes spraying device, preheating device and the welding set of detachable connection, and spraying device includes the shower nozzle drive arrangement of the removal of spraying section guide rail, scaling powder shower nozzle and drive scaling powder shower nozzle, preheating device includes the mechanism of preheating with the preheating section guide rail of spraying section guide rail butt joint and below, welding set includes welding section guide rail, tin stove that docks with the preheating section guide rail and the tin stove drive arrangement who drives tin stove vertical lift. Can directly take spraying device, preheating device and welding set apart when the transportation is shifted, utilize the elevator conveniently to move between high low layer factory building, exempt work such as hoist and mount, wall body destruction and restoration. Through spraying device to PCB board selectivity spraying scaling powder, can reduce the waste of scaling powder by a wide margin, once only weld monoblock PCB board through welding set, be favorable to improving welding efficiency, welding precision and quality.

Description

A kind of selectivity Wave soldering apparatus
Technical field
The utility model relates to Wave soldering apparatus field, is specifically related to a kind of selectivity Wave soldering apparatus.
Background technology
Current PCB plate through hole element wave soldering device mainly contains traditional wave-soldering and selectivity spot-welding equipment two kinds; The wherein angle bond pattern of traditional wave-soldering employing, development time is the longest, applies also the most extensive, can adapt to most Product jointings, production capacity is higher, but when there are components and parts PCB bottom surface, namely welding may form shadow region, directly affects welding quality and even causes welding; Selectivity spot-welding equipment then has high accuracy, the advantage of high welding quality, but efficiency is very low, and equipment investment is very high, is only suitable for the product welding high value, does not have general applicability.And above-mentioned two kinds of Wave soldering apparatus are when transporting transfer, often need to destroy body of wall, and when transporting between high low layer factory building, need to lift, transport transfer is very inconvenient.
Utility model content
The technical problems to be solved in the utility model is, for the above-mentioned defect of prior art, a kind of selectivity Wave soldering apparatus is provided, have the high efficiency of traditional wave-soldering and the high accuracy of selectivity spot-welding equipment concurrently, the advantage of high welding quality, and overcome above-mentioned two kinds of Wave soldering apparatus when transporting transfer, often need to destroy body of wall, and when transporting between high low layer factory building, need to lift, the defect that transport transfer is very inconvenient.
The utility model solves the technical scheme that its technical problem adopts: provide a kind of selectivity Wave soldering apparatus, comprise spray equipment, preheating device and welder, the detachable connection of described spray equipment, preheating device and welder,
Described spray equipment comprises spraying section guide rail for transporting pcb board, be positioned at scaling powder shower nozzle below spraying section guide rail and drive the head drive device of described scaling powder shower nozzle movement;
Described preheating device comprises the preheating section guide rail docked with described spraying section guide rail and the preheating mechanism be positioned at below described preheating section guide rail;
Described welder comprise dock with described preheating section guide rail welding section guide rail, be positioned at the tin stove below described welding section guide rail and drive the tin stove drive unit of described tin stove vertical lift.
Further preferred version of the present utility model is: described head drive device comprises X-axis motion, the Y-axis motion be installed on described X-axis motion, and described scaling powder shower nozzle is installed on described Y-axis motion.
Further preferred version of the present utility model is: described spraying section guide rail is provided with the first blocking mechanism for locating pcb board.
Further preferred version of the present utility model is: described first blocking mechanism comprises the first stop cylinder, the first barrier plate be located on the first stop cylinder piston rod.
Further preferred version of the present utility model is: described preheating mechanism comprises preheater and hot blast motor, is provided with air outlet above described preheater.
Further preferred version of the present utility model is: the ball screw that described tin stove drive unit comprises tin stove carrier, lift motor and is located between described tin stove carrier and lift motor, and described lift motor drives described tin stove carrier vertical lift for driving described ball screw.
Further preferred version of the present utility model is: the screw rod of described ball screw is provided with belt wheel, and described belt wheel is provided with one for connecting the Timing Belt of described lift motor.
Further preferred version of the present utility model is: described welding section guide rail is provided with the clamp system for clamping pcb board and locates the second blocking mechanism of pcb board, and described second blocking mechanism comprises the second stop cylinder, the second barrier plate be located on the second stop cylinder piston rod.
Further preferred version of the present utility model is: described clamp system comprises clamping cylinder and is located at the resilient abutment mechanism on described clamping cylinder piston rod.
Further preferred version of the present utility model is: described spraying section guide rail, preheating section guide rail and welding section guide rail include the fixed guide and movable guiding rail that be arranged in parallel, be provided with connection Width adjusting mechanism each other between described fixed guide and movable guiding rail, described Width adjusting mechanism is for regulating the distance between described fixed guide and movable guiding rail.
The beneficial effects of the utility model are, directly spray equipment, preheating device and welder can be taken apart and utilize factory's elevator conveniently to move between high low layer factory building, exempt the work such as lifting, wall damage and reparation during transport transfer.By spray equipment to pcb board selective spray scaling powder, the waste of scaling powder significantly can be reduced; By welder is disposable, monoblock pcb board is welded, be conducive to improving welding efficiency, welding precision and quality.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:
Fig. 1 is selectivity Wave soldering apparatus perspective view of the present utility model;
Fig. 2 is selectivity Wave soldering apparatus disassembly and assembly structure schematic diagram of the present utility model;
Fig. 3 is A position close-up schematic view in Fig. 2;
Fig. 4 is scaling powder shower nozzle of the present utility model and head drive device perspective view;
Fig. 5 is conveying track perspective view of the present utility model;
Fig. 6 is the first blocking mechanism schematic perspective view of the present utility model;
Fig. 7 is preheater perspective view of the present utility model;
Fig. 8 is preheating mechanism floor map of the present utility model;
Fig. 9 is tin stove drive unit perspective view of the present utility model;
Figure 10 is tin stove of the present utility model and tin stove drive unit perspective view;
Figure 11 is clamp system perspective view of the present utility model;
Figure 12 is Width adjusting mechanism structural representation of the present utility model;
Embodiment
Now by reference to the accompanying drawings, preferred embodiment of the present utility model is elaborated.
As Figure 1-3, the selectivity Wave soldering apparatus of the present embodiment, comprise spray equipment 1, preheating device 2 and welder 3, described spray equipment 1, preheating device 2 and the detachable connection of welder 3, described spray equipment 1 comprises spraying section guide rail 11 for transporting pcb board, be positioned at scaling powder shower nozzle 12 below spraying section guide rail 11 and drive the head drive device 13 of described scaling powder shower nozzle 12 movement; Described preheating device 2 comprises the preheating section guide rail 21 docked with described spraying section guide rail 11 and the preheating mechanism 22 be positioned at below described preheating section guide rail 21; Described welder 3 comprise dock with described preheating section guide rail 21 welding section guide rail 31, be positioned at the tin stove 32 below described welding section guide rail 31 and drive the tin stove drive unit 33 of described tin stove 32 vertical lift.Described detachable connection can be bolt and connects, clamping etc., the present embodiment adopts the mode of clamping to realize, concrete, at spray equipment 1, the position that preheating device 2 and welder 3 connect, while arrange contiguous block 41, another side arranges the connector 42 matched with described contiguous block 41, only described contiguous block 41 need be inserted in described connector 42 during installation and just can complete connection, mobile spraying device 1 is only needed during dismounting, described contiguous block 41 shifts out in described connector 42 and just completes dismounting by preheating device 2 or welder 3, mount and dismount all fast very convenient.Spray equipment 1, preheating device 2 and welder 3 directly can be taken apart when transporting transfer and utilize factory's elevator conveniently to move between high low layer factory building by this selectivity Wave soldering apparatus, exempt the work such as lifting, wall damage and reparation.By spray equipment 1 pair of pcb board selective spray scaling powder, the waste of scaling powder significantly can be reduced; By welder 3 is disposable, monoblock pcb board is welded, be conducive to improving welding efficiency, welding precision and quality.
As Figure 4-Figure 6, described head drive device 13 comprises X-axis motion 131, the Y-axis motion 132 be installed on described X-axis motion 131, and described scaling powder shower nozzle 12 is installed on described Y-axis motion 132.Described scaling powder shower nozzle 12 carries out type selecting according to user demand and market product, is installed on Y-axis motion 132.Further, the drive motors that described X-axis motion 131 and Y-axis motion 132 include belt gear and drive described belt gear to move, described scaling powder shower nozzle 12 is installed on, and is installed on the belt of described Y-axis motion 132, just can be controlled the movement of described scaling powder shower nozzle 12 by X-axis motion 131 and Y-axis motion 132.After pcb board enters spray equipment 1, spraying section guide rail 11 is opened, pcb board transport is put in place, then spray section guide rail 11 and stop transport, X-axis motion 131 and Y-axis motion 132 start, drive scaling powder shower nozzle 12 position to be welded navigated on pcb board to carry out scaling powder spraying work, after having sprayed, spraying section guide rail 11 starts sends pcb board into preheating device 2.Further, described spraying section guide rail 11 is provided with the first blocking mechanism 14 for locating pcb board.Described first blocking mechanism 14 comprises the first stop cylinder 141, the first barrier plate 142 be located on the first stop cylinder 141 piston rod.Now, after pcb board enters spray equipment 1, spraying section guide rail 11 is opened, first stops that cylinder 141 stretches out is pushed on the transportation route of pcb board by described first barrier plate 142, when pcb board is transported to the first barrier plate 142 position with spraying section guide rail 11 to stop by described first barrier plate 142 and stop motion, then spray section guide rail 11 and stop transport, X-axis motion 131 and Y-axis motion 132 start, scaling powder shower nozzle 12 position each to be welded navigated on pcb board is driven to carry out scaling powder spraying work, after having sprayed, first stops that cylinder 141 is retracted, described first barrier plate 142 is also retracted thereupon, then spray section guide rail 11 to start pcb board is sent into preheating section guide rail 21.
As shown in Fig. 5,7,8, described preheating mechanism 22 comprises preheater 221 and hot blast motor 222, air outlet 223 is provided with above described preheater 221, described preheater 221 can be continual and steady generation hot-air and by described hot blast motor 222 by hot-air from the continual and steady blowout of described air outlet 223, the scaling powder applied by scaling powder shower nozzle 12 on pcb board is dried, and reaches certain activation temperature (being preferably 100 ~ 120 DEG C).Preferably, after pcb board enters preheating section guide rail 21, preheating section guide rail 21 continuous service (namely pcb board can not do any stop), air heat is kept temperature stabilization to certain temperature by preheater 221, when pcb board passes through, make pcb board reach the temperature of needs by heat exchange, be conducive to promoting welding quality.
As shown in figs. 9-11, described tin stove drive unit 33 comprises tin stove carrier 331, lift motor 332 and is located at the ball screw 333 between described tin stove carrier 331 and lift motor 332, and described lift motor 332 drives described tin stove carrier 331 vertical lift for driving described ball screw 333.Further, the screw rod of described ball screw 333 is provided with belt wheel 334, and described belt wheel 334 is provided with the Timing Belt 335 for connecting described lift motor 332.The present embodiment comprises four ball screws 333, is divided into four angles of described tin stove carrier 331, and the belt wheel 334 on the screw rod of each ball screw 333 is connected with the main shaft of lift motor 332 by same Timing Belt 335, to realize the steady lifting of tin stove 32.Described welding section guide rail 31 is provided with the clamp system 34 for clamping pcb board and locates the second blocking mechanism 35 of pcb board, described second blocking mechanism 35 comprises the second stop cylinder, the second barrier plate be located on the second stop cylinder piston rod, the structure of described second blocking mechanism 35 is identical with described first main file mechanism 14, repeats no more herein.Described clamp system 34 comprises clamping cylinder 341 and is located at the resilient abutment mechanism 342 on described clamping cylinder 341 piston rod.Welding section guide rail 31 is sent into by preheating section guide rail 21 after pcb board preheating, welding section guide rail 31 is opened, second stops that cylinder stretches out is pushed on the transportation route of pcb board by described second barrier plate, when pcb board is transported to the second barrier plate position with welding section guide rail 31 to stop by described second barrier plate and stop motion, then welding section guide rail 31 stops transport, clamping cylinder 341 stretches out, pcb board is completely fixed by the resilient abutment mechanism 342 be located on described clamping cylinder 341 piston rod, then, described tin stove drive unit 33 drives tin stove 32 to rise, uphill process tin ripple is played, first oxide on surface is washed from spout and be raised to that welding and assembling height is disposable to be welded monoblock PCB product again, weld rear tin stove 32 to decline, clamping cylinder 341 is retracted, second stops cylinders retract, when tin stove 32 drops to the height of a safety, welding section guide rail 31 starts, pcb board is transferred out welder 3.Adopt tin stove 32 to be elevated disposable method of welding monoblock PCB product, not only efficiency is high to compare selectivity spot-welding equipment, also effectively can avoid the pcb board cooling because welding sequential causes, affect welding quality; Above-mentioned welding process adopts PCB product static, the bond pattern that tin stove 32 moves, and effectively reduce the possibility of PCB product vibration, tin and pad metal can form better intermetallic compound, and Joint Strength is higher; The utility model adopts the spout according to welded PCB product customization, the position of welding is needed to touch tin by allowing, and do not need the position of welding there is no tin ripple to realize Selective Soldering, the pcb board that there are high components and parts bottom surface can be welded, the technique that compensate for traditional wave-soldering is not enough, achieves the automated production of this series products.
As shown in Fig. 5,12, described spraying section guide rail 11, preheating section guide rail 21 and welding section guide rail 31 form conveying track of the present utility model.For adapting to the transport to the pcb board of different size, described spraying section guide rail 11, preheating section guide rail 21 and welding section guide rail 31 include the fixed guide 123 and movable guiding rail 321 that be arranged in parallel, be provided with connection Width adjusting mechanism 4 each other between described fixed guide 123 and movable guiding rail 321, described Width adjusting mechanism 4 is for regulating the distance between described fixed guide 123 and movable guiding rail 321.Further, described Width adjusting mechanism 4 comprise two just to the fixed support 41 arranged, be located at the load-bearing polished rod 42 between two fixed supports 41 and adjust wide screw rod 43, be located at described load-bearing polished rod 42 and adjust the fixed guide mount pad 44 on wide screw rod 43 and movable guiding rail mount pad 45, described fixed guide 123 and movable guiding rail 321 are installed on the bottom of fixed guide mount pad 44 and movable guiding rail mount pad 45 respectively.Further; described Width adjusting mechanism 4 also comprises a Width adjusting mechanism cover 46; described fixed support 41, load-bearing polished rod 42 and adjust wide screw rod 43 etc. all to cover in described Width adjusting mechanism cover 46, to protect described fixed support 41, load-bearing polished rod 42 and to adjust wide screw rod 43 etc.Described fixed guide mount pad 44 fixedly mounts with described load-bearing polished rod 42, which is provided with one for the screw hole through the wide screw rod 43 of described tune, and the wide screw rod of described tune 43 is arranged with described screw hole activity; Described movable guiding rail mount pad 45 is provided with one for passing polished rod hole and the screwed hole be meshed with the wide screw rod 43 of described tune of described load-bearing polished rod 42, and described load-bearing polished rod 42 is arranged with the activity of described polished rod hole.Because described movable guiding rail mount pad 45 and described load-bearing polished rod 42 activity are arranged, with described tune wide screw rod 43 screw-threaded engagement, therefore, rotate the wide screw rod 43 of described tune, just can promote described movable guiding rail mount pad 45 to move along described load-bearing polished rod 42, thus regulate the distance between described movable guiding rail 321 and fixed guide 123.
Should be understood that, above embodiment only in order to the technical solution of the utility model to be described, is not intended to limit, for a person skilled in the art, technical scheme described in above-described embodiment can be modified, or equivalent replacement is carried out to wherein portion of techniques feature; And all such modifications and replacement, all should belong to the protection range of the utility model claims.

Claims (10)

1. a selectivity Wave soldering apparatus, comprises spray equipment, preheating device and welder, it is characterized in that: the detachable connection of described spray equipment, preheating device and welder,
Described spray equipment comprises spraying section guide rail for transporting pcb board, be positioned at scaling powder shower nozzle below spraying section guide rail and drive the head drive device of described scaling powder shower nozzle movement;
Described preheating device comprises the preheating section guide rail docked with described spraying section guide rail and the preheating mechanism be positioned at below described preheating section guide rail;
Described welder comprise dock with described preheating section guide rail welding section guide rail, be positioned at the tin stove below described welding section guide rail and drive the tin stove drive unit of described tin stove vertical lift.
2. selectivity Wave soldering apparatus according to claim 1, is characterized in that: described head drive device comprises X-axis motion, the Y-axis motion be installed on described X-axis motion, and described scaling powder shower nozzle is installed on described Y-axis motion.
3. selectivity Wave soldering apparatus according to claim 2, is characterized in that: described spraying section guide rail is provided with the first blocking mechanism for locating pcb board.
4. selectivity Wave soldering apparatus according to claim 3, is characterized in that: described first blocking mechanism comprises the first stop cylinder, the first barrier plate be located on the first stop cylinder piston rod.
5. selectivity Wave soldering apparatus according to claim 1, is characterized in that: described preheating mechanism comprises preheater and hot blast motor, is provided with air outlet above described preheater.
6. selectivity Wave soldering apparatus according to claim 1, it is characterized in that: the ball screw that described tin stove drive unit comprises tin stove carrier, lift motor and is located between described tin stove carrier and lift motor, described lift motor drives described tin stove carrier vertical lift for driving described ball screw.
7. selectivity Wave soldering apparatus according to claim 6, is characterized in that: the screw rod of described ball screw is provided with belt wheel, and described belt wheel is provided with one for connecting the Timing Belt of described lift motor.
8. selectivity Wave soldering apparatus according to claim 1, it is characterized in that: described welding section guide rail is provided with the clamp system for clamping pcb board and locates the second blocking mechanism of pcb board, and described second blocking mechanism comprises the second stop cylinder, the second barrier plate be located on the second stop cylinder piston rod.
9. selectivity Wave soldering apparatus according to claim 8, is characterized in that: described clamp system comprises clamping cylinder and is located at the resilient abutment mechanism on described clamping cylinder piston rod.
10. selectivity Wave soldering apparatus according to claim 1, it is characterized in that: described spraying section guide rail, preheating section guide rail and welding section guide rail include the fixed guide and movable guiding rail that be arranged in parallel, be provided with connection Width adjusting mechanism each other between described fixed guide and movable guiding rail, described Width adjusting mechanism is for regulating the distance between described fixed guide and movable guiding rail.
CN201520547475.2U 2015-07-27 2015-07-27 Selectivity wave soldering equipment Active CN204906884U (en)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106076704A (en) * 2016-07-05 2016-11-09 孙玉荣 Intelligence Welding compound spraying coater, method and there is the spraying machine of this device
CN106334852A (en) * 2016-11-16 2017-01-18 东莞职业技术学院 An Online Selective Wave Crest Welder
CN107931771A (en) * 2017-12-25 2018-04-20 惠州市协昌电子有限公司 A kind of tin stove
CN108031943A (en) * 2017-11-20 2018-05-15 深圳市浩宝自动化设备有限公司 One kind automation wave soldering device
CN108176907A (en) * 2018-02-06 2018-06-19 东莞市创威自动化科技有限公司 A kind of wave-soldering furnace
CN109317777A (en) * 2018-10-09 2019-02-12 美视伊汽车镜控(苏州)有限公司 A kind of preheating structure for small-sized selective wave-soldering
CN109676211A (en) * 2019-01-30 2019-04-26 西安中科麦特电子技术设备有限公司 A kind of full-automatic sealing-off repair system
CN114473107A (en) * 2022-03-23 2022-05-13 美的集团股份有限公司 Wave soldering apparatus
CN117425289A (en) * 2023-10-25 2024-01-19 佛山磐砻智能科技有限公司 Tin spraying technology for circuit board

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106076704B (en) * 2016-07-05 2018-09-07 孙玉荣 Intelligent Welding compound spraying coater, method and the spraying machine with the device
CN106076704A (en) * 2016-07-05 2016-11-09 孙玉荣 Intelligence Welding compound spraying coater, method and there is the spraying machine of this device
CN106334852A (en) * 2016-11-16 2017-01-18 东莞职业技术学院 An Online Selective Wave Crest Welder
CN108031943A (en) * 2017-11-20 2018-05-15 深圳市浩宝自动化设备有限公司 One kind automation wave soldering device
CN107931771B (en) * 2017-12-25 2024-02-09 惠州市协昌电子有限公司 Tin furnace
CN107931771A (en) * 2017-12-25 2018-04-20 惠州市协昌电子有限公司 A kind of tin stove
CN108176907A (en) * 2018-02-06 2018-06-19 东莞市创威自动化科技有限公司 A kind of wave-soldering furnace
CN109317777A (en) * 2018-10-09 2019-02-12 美视伊汽车镜控(苏州)有限公司 A kind of preheating structure for small-sized selective wave-soldering
CN109676211A (en) * 2019-01-30 2019-04-26 西安中科麦特电子技术设备有限公司 A kind of full-automatic sealing-off repair system
CN114473107A (en) * 2022-03-23 2022-05-13 美的集团股份有限公司 Wave soldering apparatus
CN114473107B (en) * 2022-03-23 2024-03-29 美的集团股份有限公司 Wave soldering apparatus
CN117425289A (en) * 2023-10-25 2024-01-19 佛山磐砻智能科技有限公司 Tin spraying technology for circuit board
CN117425289B (en) * 2023-10-25 2024-05-17 佛山磐砻智能科技有限公司 Tin spraying technology for circuit board

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Effective date of registration: 20220216

Address after: 518000 office building 201, No. 1, Tianyang Sixth Road, Dongfang community, Songgang street, Bao'an District, Shenzhen, Guangdong Province

Patentee after: SHENZHEN HAOBAO TECHNOLOGY Co.,Ltd.

Address before: 518000 Haobao Industrial Park, No. 43, Shajing xinerhongxiang Industrial Zone, Bao'an District, Shenzhen, Guangdong Province

Patentee before: HB AUTOMATION EQUIPMENT Co.,Ltd.

TR01 Transfer of patent right