CN204834572U - Automatic tipping arrangement of semiconductor chip material pipe - Google Patents
Automatic tipping arrangement of semiconductor chip material pipe Download PDFInfo
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- CN204834572U CN204834572U CN201520376846.5U CN201520376846U CN204834572U CN 204834572 U CN204834572 U CN 204834572U CN 201520376846 U CN201520376846 U CN 201520376846U CN 204834572 U CN204834572 U CN 204834572U
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- rickstand
- sheet stock
- core sheet
- semiconductor core
- stock pipe
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Abstract
The utility model relates to an automatic tipping arrangement of semiconductor chip material pipe. Wherein, automatic tipping arrangement includes: feed arrangement, feed arrangement includes the rickstand and pushes away the material piece, push away material piece be used for with semiconductor chip material pipe is followed the bottom propelling movement of rickstand extremely the top of rickstand, separator, separator is used for picking up and is located the top of rickstand semiconductor chip material pipe is carried it to turning device, and turning device, turning device actuates component and image collection component including the upset, the upset actuates the component and is used for fixing and upset to come from separator semiconductor chip expects the pipe, the image is gathered the component and is used for gathering and judging semiconductor chip material pipe is in the upset actuates the direction on the component.
Description
Technical field
The utility model relates to semiconductor preparation field.More specifically, the utility model relates to a kind of automatic tipping arrangement of semiconductor core sheet stock pipe.
Background technology
After prepared by semiconductor core flake products, need to put in feeding pipe (also claiming, " packing tube " or " package tube ") and be delivered to next link.See Fig. 1, material pipe 100 is constructed to have planar side 101 and the concave side 102 relative with this planar side 101 usually, and semiconductor product 200 is placed in the space between planar side 101 and concave side 102.Usually, be stacked on together at multiple material pipe and be just transported to next link.It should be noted that described multiple material pipe 100 must be undertaken stacking by identical direction, otherwise also can make a mistake due to the incorrect stacking of material pipe in the pin direction of multiple product.In the prior art, usually by manually completing corresponding stack operation.But quantity and the speed of artificial folded material (stacking material pipe) are all limited, and this affects production efficiency.What is more important, the reliability of artificial folded material is not high, than being easier to the direction misplacing material pipe, can cause like this expecting that pipe clamp cannot be carried at feed rail entrance and have the risk of damage pin.
Utility model content
In order to solve the problem, the utility model provides a kind of automatic tipping arrangement of semiconductor core sheet stock pipe, comprise: feed arrangement, described feed arrangement comprises rickstand and pusher part, and described pusher part is used for the top described semiconductor core sheet stock pipe being pushed to described rickstand from the bottom of described rickstand; Separator, described separator is for picking up the described semiconductor core sheet stock pipe on the top being positioned at described rickstand and being delivered to turning device; And turning device, described turning device comprises upset actuating member and image collection component, the described semiconductor core sheet stock pipe that described upset actuating member is used for fixing and overturns from described separator, described image collection component is for gathering and judging the described direction of semiconductor core sheet stock pipe on described upset actuating member.
By this, the automatic tipping arrangement of semiconductor core sheet stock pipe of the present utility model can identify based on the direction of image system to material pipe and the incorrect material pipe of orientation is carried out to automatic turning and is delivered to material-gathering device.This can not only improve folded material speed, can also effectively improve stacking correctness, more save human cost, improve production efficiency.
Accompanying drawing explanation
Fig. 1 shows the sectional view of material tubular construction.
Fig. 2 shows the schematic diagram of the automatic tipping arrangement of semiconductor core sheet stock pipe described in the utility model.
Fig. 3 shows the schematic diagram of pusher part described in the utility model.
Embodiment
As follows, the automatic tipping arrangement of semiconductor core sheet stock pipe of the present utility model is described in more detail.
The schematic diagram of the automatic tipping arrangement of semiconductor core sheet stock pipe of the present utility model as shown in Figure 2.The automatic tipping arrangement 300 of this semiconductor core sheet stock pipe comprises feed arrangement 301, separator 302 and turning device 303.
Wherein, feed arrangement 301 comprises rickstand 3011 and pusher part 3012, and semiconductor core sheet stock pipe 100 is positioned at one end of described rickstand 3011 and is pushed to the other end of described rickstand 3011 by described pusher part 3012.In a specific embodiment, semiconductor core sheet stock pipe 100 is positioned at the low side of described rickstand 3011 and is pushed to the top of described rickstand 3011 by described pusher part 3012.
In a specific embodiment, such as shown in Figure 3, pusher part 3012 can comprise the block 3014 of the push rod 3013 that can move between the two ends of rickstand 3011 and the one end being positioned at push rod 3013 further.Further, push rod 3013 can be driven by motor 3015.In a specific embodiment, the distance of motor 3015 distance or each stepping one material pipe height h (see Fig. 1) that can be configured to each stepping one material pipe width w (see Fig. 1) drives pusher part 3012 to move upward.In another specific embodiment, motor 3015 also can be configured at the uniform velocity drive pusher part 3012 to move upward.Block 3014 is configured to push open when push rod 3013 moves to its other end (such as bottom) from one end (such as top) of rickstand 3011 semiconductor core sheet stock pipe 100 and promotes semiconductor core sheet stock pipe 100 when described push rod 3013 moves to one end (such as top) of rickstand 3011 from the other end (such as bottom) of rickstand 3011 and moves to one end (such as top) of rickstand 3011.In a preferred embodiment, one end of the close push rod 3013 of block 3014 has discharge face 3016, and it contributes to being pushed open by semiconductor core sheet stock pipe 100 during the bottom of block 3014 from the tip motions of rickstand 3011 to rickstand 3011.
In a specific embodiment, feed arrangement 301 comprises folded material transducer 3017 and lastics part 3018 further.Folded material transducer 3017 is positioned at one end (such as top) of rickstand 3011 for the quantity detecting the semiconductor core sheet stock pipe 100 arriving this end of rickstand 3011 (such as top).Lastics part 3018 is also positioned at this end (such as top) of rickstand 3011 for the other end (such as bottom) ejected by semiconductor core sheet stock pipe 100 to rickstand 3011.In the preferred case, folded material transducer 3017 and lastics part 3018 are arranged side by side.When the quantity of the semiconductor core sheet stock pipe 100 that folded material transducer 3017 detects is not equal to 1, this illustrates the situation that likely there is semiconductor core sheet stock pipe and stack together or do not have semiconductor core sheet stock pipe pushed at all, the situation of semiconductor core sheet stock pipe 1001 and 1002 as shown in Figure 2.Now, lastics part 3018 be activated with multiple semiconductor core sheet stock pipes (such as 1001 and 1002) that these are stacked together bullet go down to ensure only to capture a semiconductor core sheet stock pipe by later separation device 302 at every turn.For semiconductor core sheet stock pipe unnecessary under avoiding once bullet, the size of lastics part is preferably configured to the width w (see Fig. 1) being not more than semiconductor core sheet stock pipe.In the preferred case, lastics part 3018 is arranged in a pin width w ' (see Fig. 1) of the semiconductor core sheet stock pipe 100 in top apart from rickstand 3011.The size of lastics part 3018 correspondingly can be configured to the width w being approximately equal to semiconductor core sheet stock pipe 100 concave surface " (see Fig. 1).Like this, once semiconductor core sheet stock pipe 100 direction is wrong, can guarantee that lastics part 3018 extend out in semiconductor core sheet stock pipe 100 concave surface can not adversely affect follow-up material pipe only to be ejected by this semiconductor core sheet stock pipe 100.
Further, rickstand 3011 is configured to have inclined-plane 3019 and moves between the bottom and top of rickstand 3011 to contribute to pusher part 3012.In a preferred embodiment, rickstand 3011 low side has baffle plate 3020, comes off to prevent semiconductor chip material pipe 100.
Wherein, separator 302 is for picking up the semiconductor core sheet stock pipe of the one end (such as top) being positioned at rickstand 3011 and being delivered to turning device 303.In a specific embodiment, separator 302 can be jaw or other similar components.
Wherein, turning device 303 comprises upset actuating member 3031 and image collection component 3032.Described upset actuating member 3031 fixing and the semiconductor core sheet stock pipe overturn from described separator 302; Described image collection component 3032 gathers and judges the direction of semiconductor core sheet stock pipe on upset actuating member 3031.
In a specific embodiment, overturn actuating member 3031 and can comprise jaw (not shown) or similar component, this jaw holding semiconductor chip material pipe.
In a specific embodiment, image collection component 3032 can be CCD image system, such as ccd image sensor.When the direction of the semiconductor core sheet stock pipe that image collection component 3032 captures and predetermined direction inconsistent time, then overturn actuating member 3031 by start to overturn this semiconductor core sheet stock pipe.Such as, in a specific embodiment, set predetermined direction be the plane of semiconductor core sheet stock pipe upwards and concave surface is downward.If the direction of the semiconductor core sheet stock pipe (such as 1002) that image collection component 3032 detects is consistent with predetermined direction, then overturn actuating member 3031 not start.Otherwise, if the direction of semiconductor core sheet stock pipe (such as 1001) that detects of image collection component 3032 and predetermined direction inconsistent, then start upset actuating member 3031 has the direction consistent with predetermined direction to be turned into by semiconductor core sheet stock pipe.
Automatic conveying equipment of the present utility model comprises further, transfer member (not shown), when image collection component 3032 judges that semiconductor core sheet stock pipe is when overturning the direction on actuating member 3031 and being consistent with predetermined direction, described transfer member receives the semiconductor core sheet stock pipe of upset actuating member 3031 fixing and this semiconductor core sheet stock pipe is delivered to material-gathering device 304.
In a preferred embodiment, transfer member also comprises blowing inductive pick-up (not shown), and described transfer member is configured to the release semiconductor core sheet stock pipe when described blowing inductive pick-up detects the precalculated position that described semiconductor core sheet stock pipe arrives in described material-gathering device 304.This d/d semiconductor core sheet stock pipe falls in material-gathering device 304 under gravity automatically.
Automatic conveying equipment of the present utility model comprises material-gathering device 304 further, and this material-gathering device 304 is for receiving the semiconductor core sheet stock pipe carried by described transfer member.
In a preferred embodiment, described material-gathering device comprises upper limit transducer (not shown) further, and described upper limit transducer is for detecting the height of semiconductor core sheet stock pipe stacking in described material-gathering device 304.In a specific embodiment, if the height of described semiconductor core sheet stock pipe stacking in material-gathering device 304 reaches predetermined altitude value, then automatic tipping arrangement temporarily stops charging and feeding.Or in another embodiment, if the height of described semiconductor core sheet stock pipe stacking in material-gathering device 304 reaches predetermined altitude value, then these semiconductor core sheet stock pipes are delivered to next link or the sound teaching process person that gives notice by material-gathering device 304.
Although illustrated and described the different embodiments of this announcement, this announcement has been not limited to these embodiments.The technical characteristic only occurred in some claim or embodiment does not also mean that and can not combine with other features in other claims or embodiment to realize useful new technical scheme.When not deviating from the spirit and scope of this announcement described by claims, many amendments, change, distortion, substitute and equivalent be obvious to those skilled in the art.
Claims (11)
1. an automatic tipping arrangement for semiconductor core sheet stock pipe, is characterized in that, comprising:
Feed arrangement, described feed arrangement comprises rickstand and pusher part, and described pusher part is used for the top described semiconductor core sheet stock pipe being pushed to described rickstand from the bottom of described rickstand;
Separator, described separator is for picking up the described semiconductor core sheet stock pipe on the top being positioned at described rickstand and being delivered to turning device; And
Turning device, described turning device comprises upset actuating member and image collection component, the described semiconductor core sheet stock pipe that described upset actuating member is used for fixing and overturns from described separator, described image collection component is for gathering and judging the described direction of semiconductor core sheet stock pipe on described upset actuating member.
2. automatic tipping arrangement according to claim 1, is characterized in that, described pusher part comprises further:
Push rod, described push rod is configured to move between the bottom of described rickstand and the top of described rickstand; And
Block, described block is positioned at one end of described push rod, described block be used for push described semiconductor core sheet stock pipe open when described push rod moves to the bottom of described rickstand from the top of described rickstand and at described push rod from the bottom of described rickstand to promoting the tip motions of described semiconductor core sheet stock pipe to described rickstand during the tip motions of described rickstand.
3. automatic tipping arrangement according to claim 2, it is characterized in that, one end of the close described push rod of described block has discharge face, for being pushed open by described semiconductor core sheet stock pipe during the bottom of described block from the tip motions of described rickstand to described rickstand.
4. automatic tipping arrangement according to claim 1, is characterized in that, described feed arrangement comprises further:
Folded material transducer, described folded material transducer is positioned at the top of described rickstand for detecting the quantity being positioned at the described semiconductor core sheet stock pipe on described rickstand top; And
Lastics part, described lastics part is positioned at the top of described rickstand for the bottom of being ejected by described semiconductor core sheet stock pipe to described rickstand.
5. automatic tipping arrangement according to claim 4, is characterized in that, the size configurations of described lastics part is the width being not more than described semiconductor core sheet stock pipe.
6. automatic tipping arrangement according to claim 2, is characterized in that, described rickstand is configured to have inclined-plane, and described push rod moves between the bottom of described rickstand and the top of described rickstand along described inclined-plane.
7. automatic tipping arrangement according to claim 1, is characterized in that, comprises further:
Transfer member, described transfer member is used for described semiconductor core sheet stock pipe to be delivered to material-gathering device from described turning device.
8. automatic tipping arrangement according to claim 7, is characterized in that, described transfer member comprises further:
Blowing inductive pick-up, described transfer member is configured to discharge described semiconductor core sheet stock pipe when described blowing inductive pick-up detects the precalculated position that described semiconductor core sheet stock pipe arrives in described material-gathering device.
9. automatic tipping arrangement according to claim 7, is characterized in that, described material-gathering device comprises further:
Upper limit transducer, described upper limit transducer is for detecting the height of the described semiconductor core sheet stock pipe be stacked in described material-gathering device.
10. automatic tipping arrangement according to claim 1, is characterized in that, described image collection component is ccd image sensor.
11. automatic tipping arrangements according to claim 1, is characterized in that, described semiconductor core sheet stock pipe has plane and is positioned at the concave surface with described planar opposite side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520376846.5U CN204834572U (en) | 2015-06-03 | 2015-06-03 | Automatic tipping arrangement of semiconductor chip material pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520376846.5U CN204834572U (en) | 2015-06-03 | 2015-06-03 | Automatic tipping arrangement of semiconductor chip material pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204834572U true CN204834572U (en) | 2015-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520376846.5U Expired - Fee Related CN204834572U (en) | 2015-06-03 | 2015-06-03 | Automatic tipping arrangement of semiconductor chip material pipe |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882398A (en) * | 2015-06-03 | 2015-09-02 | 苏州日月新半导体有限公司 | Automatic turnover equipment for semiconductor chip material pipe and operation method thereof |
| CN113140495A (en) * | 2021-03-24 | 2021-07-20 | 杭州沃镭智能科技股份有限公司 | Automatic unloader of IGBT chip |
| CN116721957A (en) * | 2023-08-10 | 2023-09-08 | 四川明泰微电子科技股份有限公司 | Packaged chip pushing mechanism and chip forming device |
-
2015
- 2015-06-03 CN CN201520376846.5U patent/CN204834572U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882398A (en) * | 2015-06-03 | 2015-09-02 | 苏州日月新半导体有限公司 | Automatic turnover equipment for semiconductor chip material pipe and operation method thereof |
| CN104882398B (en) * | 2015-06-03 | 2017-09-08 | 苏州日月新半导体有限公司 | Automatic turnover equipment for semiconductor chip material pipe and operation method thereof |
| CN113140495A (en) * | 2021-03-24 | 2021-07-20 | 杭州沃镭智能科技股份有限公司 | Automatic unloader of IGBT chip |
| CN113140495B (en) * | 2021-03-24 | 2024-04-02 | 杭州沃镭智能科技股份有限公司 | Automatic blanking machine for IGBT chips |
| CN116721957A (en) * | 2023-08-10 | 2023-09-08 | 四川明泰微电子科技股份有限公司 | Packaged chip pushing mechanism and chip forming device |
| CN116721957B (en) * | 2023-08-10 | 2023-10-13 | 四川明泰微电子科技股份有限公司 | Packaged chip pushing mechanism and chip forming device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Patentee after: Riyuexin semiconductor (Suzhou) Co.,Ltd. Address before: 215026 No.188 Suhong West Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee before: SUZHOU ASEN SEMICONDUCTORS Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 |