CN205140938U - Support device and automatic feed equipment of semiconductor chip material pipe - Google Patents
Support device and automatic feed equipment of semiconductor chip material pipe Download PDFInfo
- Publication number
- CN205140938U CN205140938U CN201520951309.9U CN201520951309U CN205140938U CN 205140938 U CN205140938 U CN 205140938U CN 201520951309 U CN201520951309 U CN 201520951309U CN 205140938 U CN205140938 U CN 205140938U
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- CN
- China
- Prior art keywords
- material pipe
- support
- semiconductor chip
- sheet stock
- core sheet
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- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 80
- 239000000463 material Substances 0.000 title claims abstract description 76
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000007664 blowing Methods 0.000 claims description 4
- 230000001939 inductive effect Effects 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- GBIHOLCMZGAKNG-UHFFFAOYSA-N flucythrinate Chemical compound C=1C=C(OC(F)F)C=CC=1C(C(C)C)C(=O)OC(C#N)C(C=1)=CC=CC=1OC1=CC=CC=C1 GBIHOLCMZGAKNG-UHFFFAOYSA-N 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 230000005484 gravity Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a support device and automatic feed equipment of semiconductor chip material pipe, the device that supports semiconductor chip material pipe includes: a pedestal. Support piece, support piece rotatably attached connect to the base, support piece is last to be attached to have connect and props the material bracket and support in order being used for semiconductor material pipe, the driving piece, the driving piece is through the configuration in order to be used for the drive the rotation of support piece between horizontal direction and vertical direction, and connecting piece, the connecting piece rotatably attached connect to base and warp configuration are in order to connect support piece with the driving piece. The utility model discloses a device that supports semiconductor chip material pipe has improved pay -off efficiency, and simple structure, is suitable for and conveniently assembles on the feeding production line.
Description
Technical field
The utility model relates to semiconductor preparation field.More specifically, the utility model relates to a kind of device and automatic feed equipment of support semiconductor chip material pipe.
Background technology
After prepared by semiconductor core flake products, need to be placed in semiconductor core sheet stock pipe (also claiming, " material pipe ", " packing tube " or " package tube ") and be delivered to feeding rack to perform follow-up link.But, before being delivered to feeding rack, also needing first clamp material pipe by switching mechanism and overturn to ensure that all material Guan Jun have identical orientation to it, complete conveying by charging jaw gripping material pipe more afterwards.
But, because switching mechanism is only positioned at the side of material pipe, the therefore easy error problem due to gravity or switching mechanism itself and cause expecting pipe run-off the straight after being reversed.Such as, as shown in Figure 1A (end view), switching mechanism 102 clamps the side of material pipe 101, and material pipe 101 occurs tilted upward due to gravity relative to charging jaw 103.Again as shown in Figure 1B (vertical view), the material pipe 101 that switching mechanism 102 clamps also may occur tilting relative to charging jaw 103 due to the reason of switching mechanism 102 self.If the run-off the straight of material pipe, so certain one end of charging jaw 103 possibly successfully cannot clip to material pipe 101, and this will cause exactly material pipe cannot being put into feeding rack, also damage the possibility of stock pipe.
Therefore, before charging jaw gripping material pipe, must ensure that the position of expecting pipe is accurately, namely neither occur that tilting does not appear in tilted upward yet, such guarantee charging jaw successfully clamps material pipe.Therefore, need a kind of device of support semiconductor chip material pipe in prior art, its guarantee material pipe does not occur tilting and charging jaw can be managed to material exactly in gripping.
Utility model content
In order to solve the problem, the utility model provides a kind of device of support semiconductor chip material pipe, and it comprises: pedestal; Strutting piece, described strutting piece is rotatably attached to described pedestal, described strutting piece is attached with support material bracket for the described semiconductor material pipe of support; Actuator, described actuator is configured for use in and drives the rotation of described strutting piece in the horizontal direction and between vertical direction; And connector, described connector is rotatably attached to described pedestal and is configured to connect described strutting piece and described actuator.
The utility model provides a kind of automatic feed equipment of semiconductor core sheet stock pipe further, it comprises: switching mechanism, described switching mechanism comprises upset actuating member and image collection component, described upset actuating member fixing and the described semiconductor core sheet stock pipe of upset, described image collection component collection and judge the described direction of semiconductor core sheet stock pipe on described upset actuating member; Conveying mechanism, described conveying mechanism is for picking up the described semiconductor core sheet stock pipe of described switching mechanism fixing and described semiconductor core sheet stock pipe being delivered to collecting mechanism from described switching mechanism; And the device of foregoing support semiconductor chip material pipe, its for pick up described semiconductor core sheet stock pipe at described conveying mechanism front support described in semiconductor core sheet stock pipe.
By this, the device of support semiconductor chip material pipe of the present utility model can be raised up to horizontal level and support material pipe to ensure that it can not tilt, then, after charging jaw gripping material pipe, rotated back to upright position by horizontal level not hinder charging jaw that material pipe is delivered to feeding rack.Therefore, the device of support semiconductor chip material pipe of the present utility model improves feeding efficiency, and structure is simple, is suitable for being assemblied in easily on charging production line.
Accompanying drawing explanation
Figure 1A and 1B shows the schematic diagram of charging jaw gripping material pipe in prior art.
Fig. 2 shows the first schematic diagram of the device of support semiconductor chip material pipe described in the utility model.
Fig. 3 shows the second schematic diagram of the device of support semiconductor chip material pipe described in the utility model.
Fig. 4 A-4D shows the operating diagram of the device of support semiconductor chip material pipe described in the utility model.
Fig. 5 shows the schematic diagram utilizing device of the present utility model to carry out support semiconductor chip material pipe.
Embodiment
As follows, the device of support semiconductor chip material pipe of the present utility model is described in more detail.
The schematic diagram of the device of support semiconductor chip material pipe of the present utility model is shown as Fig. 2 and 3.The device 200 of this support semiconductor chip material pipe comprises pedestal 201, strutting piece 202, actuator 203 and connector 204, and wherein, described strutting piece 202 and connector 204 are all attached to pedestal 201.Pedestal 201 is for being fixed to the appropriate location (such as, being fixed near switching mechanism) of production line by the device 200 of described support semiconductor chip material pipe.
Strutting piece 202 is rotatably attached to described pedestal 201.Described strutting piece 202 is attached with at least one support material bracket 202a for holding also support semiconductor chip material pipe thus.Particularly, support material bracket 202a is constructed to comprise two limited post 202a' and 202a be oppositely arranged ".In a specific embodiment, two limited post 202a' and 202a " laminated structure that is parallel to each other can be configured to.Or, in a preferred embodiment, described two limited post 202a' and 202a " infrastructure be to be parallel to each other but superstructure is extend (as shown in Figures 2 and 3) to direction away from each other.Usually, two limited post 202a' and 202a " bottom between distance be set to slightly larger than semiconductor core sheet stock pipe width, and top is to be 45 degree with level, and direction extends to direction away from each other.Thisly in distance, present being configured with of " up big and down small " be each other beneficial to support material bracket 202a and more easily capture semiconductor material pipe.
Strutting piece 202 can also be arranged at intervals with two or more stopper slot 202b to be placed in respectively wherein by limited post.Distance between adjacent two described stopper slot 202b is set to the width slightly larger than described semiconductor core sheet stock pipe.Thus, the position of support material bracket 202a on strutting piece can be adjusted to be conducive to supporting material pipe more reposefully according to the size of material pipe.
Actuator 203 is configured for use in and drives the rotation of described strutting piece 202 in the horizontal direction between x and vertical direction y.After material pipe is reversed mechanism's upset, actuator 203 drives strutting piece 202 to rotate to horizontal direction x to support material pipe, and guarantee material pipe can not tilt or offset.Then, after charging jaw clamps material pipe, actuator 203 drives strutting piece 202 to be rotated down to vertical direction y from horizontal direction x, thus does not stop that material pipe is transported to feeding rack by charging jaw.
In a specific embodiment, actuator 203 comprises cylinder 203a and the telescopic cylinder rod 203b from cylinder 203a extension.Cylinder 203a drive cylinder rod 203b carries out stretching motion and rotates between x and vertical direction in the horizontal direction to make strutting piece 202.In a preferred embodiment, actuator 203 can be connected with connector 204.More specifically, the cylinder rod 203b of actuator 203 can be connected with connector 204, specifically described as follows.
Connector 204 is rotatably attached to described pedestal 201 and is configured to connect strutting piece 202 and actuator 203.In one embodiment, connector 204 comprises the first contiguous block 204a and the second contiguous block 204b that rotatably link together.Wherein, the other end of the first contiguous block 204a is connected with cylinder rod 203b, and together with the other end of the second contiguous block 204b is permanently connected with strutting piece 202.
In a specific embodiment, together with the first contiguous block 204a is screwed in cylinder rod 203b.The flexible drive first contiguous block 204a of cylinder rod 203b moves.Junction between first contiguous block 204a with the second contiguous block 204b is that the axle of similar turning joint is connected (can 360 degree rotate).The motion of the first contiguous block 204a drives the rotation of the second contiguous block 204b.Second contiguous block 204b and strutting piece 202 are to be connected perpendicular to angle each other.Second contiguous block 204b and strutting piece 202 are fixed together to make the motion of the second contiguous block 204b can drive the rotation of strutting piece 202 by bearing and fixed screw.Fig. 4 A-4D particularly illustrates the motion conditions of above-mentioned each parts when strutting piece 202 rotates between (Fig. 4 A) and horizontal direction (Fig. 4 D) in the vertical direction.
Get back to accompanying drawing 2 and 3, in a preferred embodiment, the device 200 of support semiconductor chip material pipe comprises the locating part 205 being attached to described pedestal 201 further.Locating part 205 is provided with multiple stopper slot 205a for height when regulating described strutting piece 202 to be ported to horizontal level.
Further, Fig. 5 shows the schematic diagram utilizing device of the present utility model to carry out support semiconductor chip material pipe.Switching mechanism 502 clamps one end of material pipe 501, the device 504 of support semiconductor chip material pipe of the present utility model closer in material pipe 501 the other end away from switching mechanism 502 and support material pipe 501 and occur up and down to avoid it or tilt.Which ensure that the two ends of charging jaw 503 all can be clamped to material pipe 501.
The utility model provides a kind of automatic feed equipment of semiconductor core sheet stock pipe further, comprises the device of switching mechanism, conveying mechanism and previously described support semiconductor chip material pipe.
Wherein, described switching mechanism comprises upset actuating member and image collection component.Described upset actuating member fixing and the described semiconductor core sheet stock pipe of upset, described image collection component collection and judge the described direction of semiconductor core sheet stock pipe on described upset actuating member.
Upset actuating member can comprise jaw or similar component, this jaw holding semiconductor chip material pipe.
Image collection component can be CCD image system, such as ccd image sensor.When the direction of the semiconductor core sheet stock pipe that image collection component captures and predetermined direction inconsistent time, then overturn actuating member by start to overturn this semiconductor core sheet stock pipe.Such as, in a specific embodiment, set predetermined direction be the plane of semiconductor core sheet stock pipe upwards and concave surface is downward.If the direction of the semiconductor core sheet stock pipe that image collection component detects is consistent with predetermined direction, then overturn actuating member not start.Otherwise, if the direction of semiconductor core sheet stock pipe that detects of image collection component and predetermined direction inconsistent, then start upset actuating member has the direction consistent with predetermined direction to be turned into by semiconductor core sheet stock pipe.
When image collection component judges that semiconductor core sheet stock pipe is when overturning the direction on actuating member and being consistent with predetermined direction, described conveying mechanism receives the semiconductor core sheet stock pipe of upset actuating member fixing and this semiconductor core sheet stock pipe is delivered to collecting mechanism.
In a preferred embodiment, conveying mechanism also comprises blowing inductive pick-up, and described conveying mechanism is configured to the release semiconductor core sheet stock pipe when described blowing inductive pick-up detects the precalculated position that described semiconductor core sheet stock pipe arrives in described collecting mechanism.This d/d semiconductor core sheet stock pipe falls in collecting mechanism under gravity automatically.
Collecting mechanism is for receiving the semiconductor core sheet stock pipe carried by described conveying mechanism.In a preferred embodiment, described collecting mechanism comprises upper limit transducer further, and described upper limit transducer is for detecting the height of semiconductor core sheet stock pipe stacking in described collecting mechanism.In a specific embodiment, if the height of described semiconductor core sheet stock pipe stacking in collecting mechanism reaches predetermined altitude value, then automatic tipping arrangement temporarily stops charging and feeding.Or in another embodiment, if the height of described semiconductor core sheet stock pipe stacking in collecting mechanism reaches predetermined altitude value, then these semiconductor core sheet stock pipes are delivered to next link or the sound teaching process person that gives notice by collecting mechanism.
Although illustrated and described the different embodiments of this announcement, this announcement has been not limited to these embodiments.The technical characteristic only occurred in some claim or embodiment does not also mean that and can not combine with other features in other claims or embodiment to realize useful new technical scheme.When not deviating from the spirit and scope of this announcement described by claims, many amendments, change, distortion, substitute and equivalent be obvious to those skilled in the art.
Claims (10)
1. a device for support semiconductor chip material pipe, is characterized in that, comprising:
Pedestal;
Strutting piece, described strutting piece is rotatably attached to described pedestal, described strutting piece is attached with support material bracket for the described semiconductor material pipe of support;
Actuator, described actuator is configured for use in and drives the rotation of described strutting piece in the horizontal direction and between vertical direction; With
Connector, described connector is rotatably attached to described pedestal and is configured to connect described strutting piece and described actuator.
2. the device of support semiconductor chip material pipe according to claim 1, is characterized in that, described support material bracket comprises two limited posts, and the infrastructure of described two limited posts is to be parallel to each other and superstructure is extend to direction away from each other.
3. the device of support semiconductor chip material pipe according to claim 2, it is characterized in that, described strutting piece is arranged at intervals with two or more stopper slot, described limited post is placed in described stopper slot.
4. the device of support semiconductor chip material pipe according to claim 3, is characterized in that, the distance between two adjacent described stopper slots is set to the width slightly larger than described semiconductor material pipe.
5. the device of support semiconductor chip material pipe according to claim 1, it is characterized in that, described actuator comprises cylinder, and the cylinder rod extended from described cylinder is connected to described connector.
6. the device of support semiconductor chip material pipe according to claim 5, it is characterized in that, described connector comprises the first contiguous block and the second contiguous block that rotatably link together, wherein said first contiguous block is connected with described cylinder rod, together with described second contiguous block and described strutting piece are permanently connected in relative to each other vertical mode.
7. the device of support semiconductor chip material pipe according to claim 1, it is characterized in that, described device comprises further:
Locating part, described locating part is attached to described pedestal, described locating part is provided with multiple stopper slot for height when regulating described strutting piece to be ported to horizontal level.
8. an automatic feed equipment for semiconductor core sheet stock pipe, is characterized in that, comprising:
Switching mechanism, described switching mechanism comprises upset actuating member and image collection component, described upset actuating member fixing and the described semiconductor core sheet stock pipe of upset, described image collection component collection and judge the described direction of semiconductor core sheet stock pipe on described upset actuating member;
Conveying mechanism, described conveying mechanism is for picking up the described semiconductor core sheet stock pipe of described switching mechanism fixing and described semiconductor core sheet stock pipe being delivered to collecting mechanism from described switching mechanism; And
The device of the support semiconductor chip material pipe as described in any one of claim 1-7, its for pick up described semiconductor core sheet stock pipe at described conveying mechanism front support described in semiconductor core sheet stock pipe.
9. automatic feed equipment according to claim 8, is characterized in that, described conveying mechanism comprises further:
Blowing inductive pick-up, described conveying mechanism is configured to discharge described semiconductor core sheet stock pipe when described blowing inductive pick-up detects the precalculated position that described semiconductor core sheet stock pipe arrives in described collecting mechanism.
10. automatic feed equipment according to claim 8, is characterized in that, described collecting mechanism comprises further:
Upper limit transducer, described upper limit transducer is for detecting the height of the described semiconductor core sheet stock pipe be stacked in described collecting mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520951309.9U CN205140938U (en) | 2015-11-25 | 2015-11-25 | Support device and automatic feed equipment of semiconductor chip material pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520951309.9U CN205140938U (en) | 2015-11-25 | 2015-11-25 | Support device and automatic feed equipment of semiconductor chip material pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205140938U true CN205140938U (en) | 2016-04-06 |
Family
ID=55626703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520951309.9U Expired - Fee Related CN205140938U (en) | 2015-11-25 | 2015-11-25 | Support device and automatic feed equipment of semiconductor chip material pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205140938U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112082587A (en) * | 2020-08-27 | 2020-12-15 | 广东利扬芯片测试股份有限公司 | Chip gravity test tube-pouring auxiliary tool |
-
2015
- 2015-11-25 CN CN201520951309.9U patent/CN205140938U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112082587A (en) * | 2020-08-27 | 2020-12-15 | 广东利扬芯片测试股份有限公司 | Chip gravity test tube-pouring auxiliary tool |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215101 No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee after: Riyuexin semiconductor (Suzhou) Co.,Ltd. Address before: No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Patentee before: SUZHOU ASEN SEMICONDUCTORS Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160406 |