CN204792845U - High power spotlight solar energy chip location structure - Google Patents
High power spotlight solar energy chip location structure Download PDFInfo
- Publication number
- CN204792845U CN204792845U CN201520491754.1U CN201520491754U CN204792845U CN 204792845 U CN204792845 U CN 204792845U CN 201520491754 U CN201520491754 U CN 201520491754U CN 204792845 U CN204792845 U CN 204792845U
- Authority
- CN
- China
- Prior art keywords
- chip
- boss
- basal plate
- utility
- radiating basal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a high power spotlight solar energy chip location structure, including radiating basal plate and chip, the chip pass through soldering tin welding on radiating basal plate, the position of radiating basal plate etching solder mask on form a boss or a recess as chip location structure, the chip passes through the soldering tin welding on radiating basal plate's boss or recess. Because the utility model discloses a mode direct punching press on metal radiating basal plate of stamping forming goes out shapes such as required rectangle, hexagon, changeable shape, and this kind of shaping method is with low costs, positioning accuracy is high, can can not increase extra cost at metal radiating basal plate one -time molding.
Description
Technical field
The utility model relates to field of solar energy, particularly relates to a kind of high concentration solar chip positioning structure.
Background technology
As shown in Figure 1A, at present, the locate mode of high concentration solar battery generally adopts the mode of solder mask 1 ' to position, then the mode of tin cream or the welding of silver slurry is utilized to be welded on by chip 2 ' in the solder mask 1 ' on heat-radiating substrate 3 ', this mode needs printed by solder mask 1 ' and be etched on heat-radiating substrate 3 ', utilize the mode positioning chip 2 ' that solder mask 1 hinders scolding tin to flow, this locate mode cost is higher, precision is wayward and solder mask 1 ' occurs often to come off etc. bad; If the solder mask come off 1 ' is clipped on chip 2 ', gently then can power reduction be caused, heavy then can burning be caused.
Summary of the invention
The purpose of this utility model is to provide the high concentration solar chip positioning structure that a kind of cost is low, positioning precision is high.
For achieving the above object, technical solution of the present utility model is:
The utility model is a kind of high concentration solar chip positioning structure, comprises heat-radiating substrate and chip; Described chip is welded on heat-radiating substrate by scolding tin; The position of described heat-radiating substrate etching solder mask forms a boss as chip positioning structure or groove, on the boss that chip is welded on heat-radiating substrate by scolding tin or groove.
Described boss or groove rectangular, four angles of rectangle are all provided with circular round ear.
Described boss or groove are hexagon or polygon.
Described boss or groove adopt punch forming.
After adopting such scheme, because the utility model adopts stamping forming mode directly to stamp out the shapes such as required rectangle, hexagon, shape changeable on heat dissipation metal substrate, this forming method cost is low, positioning precision is high, at heat dissipation metal substrate disposal molding, can not increase extra cost.
In addition, the utility model also has the following advantages:
1, the advantage of boss location:
1. high reliability: boss location feature is formed by metal material, there are not the nonmetallic materials such as solder mask; Under high power concentrator condition, there is not burning, peel off equivalent risk; Reliability is high.
2. registration: due to the surface tension of tin cream in welding process, even if chip deviation position within the specific limits, also can under the effect of tin cream tension force automatic centering.
3. easy machining control: boss adopts Sheet Metal Forming Technology to be formed, and the precision of Sheet Metal Forming Technology can be ensured by mould, and the precision of mould adopts slow wire feeding machining accuracy very good.
4. cost is low: the processing of boss is formed in heat-dissipating aluminium plate production process, does not need extra procedure of processing and cost;
2, the advantage of ear is justified:
The overflow volume of scolding tin can be increased and four angles of chip can be dodged, to guarantee that chip can not rotate or deflection.
Below in conjunction with the drawings and specific embodiments, the utility model is further described.
Accompanying drawing explanation
Fig. 1 is forward axonometric drawing of the present utility model;
Figure 1A is the forward axonometric drawing of existing structure;
Fig. 2 is inversion axis mapping of the present utility model;
Fig. 3 is the installation shaft mapping of the utility model chip.
Embodiment
As shown in Figure 1, the utility model is a kind of high concentration solar chip positioning structure, comprises heat-radiating substrate 1 and chip 2.
Described heat-radiating substrate 1 material is aluminium sheet or copper coin, heat-radiating substrate 1 forms a boss 11 as the rectangle of chip positioning structure on the former position that need etch solder mask 2, four angles of the boss 11 of this rectangle are all provided with circular round ear 12, and this circle ear 12 is used for dodging four right angles of chip 2.The boss 11 of this rectangle can adopt punch forming process one-shot forming.
Described chip 2 is welded on the boss 11 of heat-radiating substrate 1 by scolding tin.
It should be noted that:
1, boss 11 also can be other shape such as hexagon or polygon.
2, as chip positioning structure also can be the groove of other shapes such as rectangle, hexagon or polygon.
Operation principle of the present utility model:
After tin cream is fused into liquid state, surface tension can be formed, the boundary characteristic having difference in height is not easily flowed out during now tin cream flowing, chip 2 is suspended in above the tin of fusing, be subject to the effect of molten tin surfaces tension force simultaneously, play the effect of positioning chip 2, along with the reduction of temperature, chip 2 is soldered on boss 11; Wherein round ear 12 shape feature is used to the unnecessary molten tin of overflow, and can dodge four right angles of chip 2.
Emphasis of the present utility model is just: on the position of heat-radiating substrate etching solder mask, form a boss as chip positioning structure or groove.
The above, be only the utility model preferred embodiment, therefore can not limit with this scope that the utility model implements, the equivalence namely done according to the utility model claim and description change with modify, all should still belong in scope that the utility model patent contains.
Claims (4)
1. a high concentration solar chip positioning structure, comprises heat-radiating substrate and chip; Described chip is welded on heat-radiating substrate by scolding tin; It is characterized in that: the position of described heat-radiating substrate etching solder mask forms a boss as chip positioning structure or groove, on the boss that chip is welded on heat-radiating substrate by scolding tin or groove.
2. high concentration solar chip positioning structure according to claim 1, is characterized in that: described boss or groove rectangular, four angles of rectangle are all provided with circular round ear.
3. high concentration solar chip positioning structure according to claim 1, is characterized in that: described boss or groove are hexagon or polygon.
4. high concentration solar chip positioning structure according to claim 1, is characterized in that: described boss or groove adopt punch forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520491754.1U CN204792845U (en) | 2015-07-09 | 2015-07-09 | High power spotlight solar energy chip location structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520491754.1U CN204792845U (en) | 2015-07-09 | 2015-07-09 | High power spotlight solar energy chip location structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204792845U true CN204792845U (en) | 2015-11-18 |
Family
ID=54532838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520491754.1U Expired - Fee Related CN204792845U (en) | 2015-07-09 | 2015-07-09 | High power spotlight solar energy chip location structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204792845U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105610393A (en) * | 2016-02-18 | 2016-05-25 | 安徽旭能光伏电力有限公司 | Combined anti-drop fixed frame for polycrystalline assembly |
-
2015
- 2015-07-09 CN CN201520491754.1U patent/CN204792845U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105610393A (en) * | 2016-02-18 | 2016-05-25 | 安徽旭能光伏电力有限公司 | Combined anti-drop fixed frame for polycrystalline assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151118 Termination date: 20190709 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |