CN204732400U - Lead frame structure - Google Patents

Lead frame structure Download PDF

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Publication number
CN204732400U
CN204732400U CN201520400029.9U CN201520400029U CN204732400U CN 204732400 U CN204732400 U CN 204732400U CN 201520400029 U CN201520400029 U CN 201520400029U CN 204732400 U CN204732400 U CN 204732400U
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CN
China
Prior art keywords
groove
lead frame
slide glass
frame structure
glass portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520400029.9U
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Chinese (zh)
Inventor
黄文义
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Yea Shin Technology Co Ltd
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Yea Shin Technology Co Ltd
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Priority to CN201520400029.9U priority Critical patent/CN204732400U/en
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Publication of CN204732400U publication Critical patent/CN204732400U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
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Abstract

The utility model relates to a kind of lead frame structure, this lead frame structure comprises a first noumenon and one second body, this the first noumenon has the slide glass portion presenting groove-like, this slide glass portion and a die bonding, the bossed flange part of surrounding's tool in this slide glass portion, have one first groove between this flange part and this slide glass portion, this second body has an adhesive portion bonding with a bronze medal clip one end, and the rear of this adhesive portion has one second groove.Lead frame structure provided by the utility model, it is by flange part and groove structure, make when use solder by die bonding to slide glass portion time, solder can be stoped to expand spilling from slide glass portion.

Description

Lead frame structure
Technical field
The utility model about a kind of lead frame structure, particularly about a kind of lead frame structure that can effectively prevent solder from overflowing.
Background technology
Lead frame is the basic element of character manufacturing semiconductor separate elements, such as, be applied in electronic components such as being combined into various diode, transistor.As shown in Figure 1, be a kind of diode structure that industry is common, the base material of the lead frame 100 of prior art is copper alloy, aluminium alloy or ferroalloy.Comprise slide glass portion 101 and multiple pin 102, described lead frame is a burnishing surface, in production process, needs to be welded chip in the slide glass portion of lead frame, is generally in slide glass portion, to add the plumbous molten material of liquid tin, for slide glass portion and chip attach.But, because lead frame is a burnishing surface, if solder is excessive in above process will cause spilling, very fewly easily cause rosin joint, the generation of two kinds of situations all can have influence on the strong bonded of lead frame and chip chamber, and finally affects production efficiency and the qualification rate of diode.Obviously, how to guarantee the strong bonded of lead frame and chip chamber, and it is tangible quite important effectively to prevent solder from overflowing.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of lead frame structure.
To achieve the above object, the utility model provides a kind of lead frame structure, this lead frame structure comprises a first noumenon and one second body, this the first noumenon has the slide glass portion presenting groove-like, this slide glass portion and a die bonding, the bossed flange part of surrounding's tool in this slide glass portion, has one first groove between this flange part and this slide glass portion, this second body has an adhesive portion bonding with a bronze medal clip one end, and the rear of this adhesive portion has one second groove.
Preferably, wherein this first noumenon has an outward extending pin portion further.
Preferably, wherein there is between this pin portion and this first groove one the 3rd groove.
Preferably, wherein this first groove and the 3rd groove all in swallow-tail form.
Preferably, wherein this first groove and the 3rd groove have a stop part of inside giving prominence to and formation further.
Preferably, wherein this second groove is V-shaped.
Lead frame structure provided by the utility model, when lead frame utilizes solder attach chip and copper clip, by groove and flange part as barrier, when effectively can prevent adhering chip and copper clip, excess solder connection overflows, to guarantee that the electronic component combined can maintain normal operation, and lead frame structure power can be improved by flange part and prevent aqueous vapor from invading.
Accompanying drawing explanation
Fig. 1 is the stereogram of the lead frame of prior art;
Fig. 2 is the stereogram of lead frame of the present utility model;
Fig. 3 is the schematic diagram that lead frame of the present utility model utilizes solder attach chip and copper clip;
Fig. 4 is lead frame of the present utility model rear generalized section bonding with chip and copper clip;
Fig. 4 A is groove close-up schematic view of the present utility model.
[main element symbol description]
Lead frame-1; Lead frame-100; Slide glass portion-101; Pin-102; The first noumenon-11; Slide glass portion-111; Flange part-112; First groove-113; 3rd groove-114; Pin portion-115; Second body-12; Adhesive portion-121; Second groove-122; Stop part-13;
Chip-2;
Copper clip-3;
Solder-4.
Embodiment
Because the utility model discloses a kind of lead frame, its utilize the relative theory of lead frame and chip and copper clip for correlative technology field has usually to know that the knowledgeable can understand, therefore with explanation hereinafter, no longer do complete description.Meanwhile, with hereinafter contrasted accompanying drawing, express the structural representation relevant with the utility model feature, also do not need according to the complete drafting of actual size.
Please, with reference to figure 2, be the preferred embodiment according to lead frame of the present utility model, this lead frame 1 be for having the lead frame of conductivity such as known copper or copper alloy metal type, and this lead frame 1 comprises the first noumenon 11 and one second body 12.
As shown in Figure 2 to Figure 3, the first noumenon 11 of this lead frame 1 has the slide glass portion 111 presenting groove-like, utilize a solder 4 bonding with a chip 2, the bossed flange part 112 of surrounding's tool in this slide glass portion 111, there is between this flange part 112 and slide glass portion 111 one first groove 113, this second body 12 has an adhesive portion 121 bonding with one end of a bronze medal clip 3, the rear of this adhesive portion 121 has one second groove 122, in addition, the first noumenon 11 has an outward extending pin portion 115 further, between this pin portion 115 and first groove 113, there is one the 3rd groove 114, this first groove 113 and the 3rd groove 114 are for being swallow-tail form in the present embodiment, and the second groove 122 is V-shaped, and first groove 113 and the 3rd groove 114 there is an inwardly outstanding and stop part 13 that is that formed further, this stop part 13 can prevent this first groove 113, solder 4 in 3rd groove 114 outwards overflows again, as shown in Figure 4 A.
Pass through aforementioned structure, Fig. 4 please be coordinate, and referring to figs. 2 to shown in Fig. 3, when lead frame 1 utilizes solder attach chip 2 and copper clip 3, the utility model passes through the first groove 113, second groove 122, the 3rd groove 114 and flange part 112 as barrier, solder 4 excessive spilling when effectively can prevent adhering chip 2 and copper clip 3, to guarantee that the electronic component combined can maintain normal operation, and the structural capacity of lead frame 1 can be improved by flange part 112 and prevent aqueous vapor from invading.
The above; be only preferred embodiment of the present utility model; and be not used to limit scope of patent protection of the present utility model, the equivalent structure change etc. of such as using the utility model patent spirit to do, is all in like manner contained in scope of patent protection of the present utility model.

Claims (6)

1. a lead frame structure, it is characterized in that, this lead frame structure comprises a first noumenon and one second body, this the first noumenon has the slide glass portion presenting groove-like, this slide glass portion and a die bonding, the bossed flange part of surrounding's tool in this slide glass portion, has one first groove between this flange part and this slide glass portion, this second body has an adhesive portion bonding with a bronze medal clip one end, and the rear of this adhesive portion has one second groove.
2. lead frame structure as claimed in claim 1, it is characterized in that, this first noumenon has an outward extending pin portion further.
3. lead frame structure as claimed in claim 2, is characterized in that having one the 3rd groove between this pin portion and this first groove.
4. lead frame structure as claimed in claim 3, it is characterized in that, this first groove and the 3rd groove are all in swallow-tail form.
5. lead frame structure as claimed in claim 3, is characterized in that, this first groove and the 3rd groove have further inwardly to be given prominence to and a stop part of formation.
6. lead frame structure as claimed in claim 1, it is characterized in that, this second groove is V-shaped.
CN201520400029.9U 2015-06-11 2015-06-11 Lead frame structure Expired - Fee Related CN204732400U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105895592A (en) * 2016-06-24 2016-08-24 扬州扬杰电子科技股份有限公司 Frame, diode comprising same and processing technology of diode
CN109755205A (en) * 2017-11-08 2019-05-14 株式会社东芝 Semiconductor device
WO2021072731A1 (en) * 2019-10-18 2021-04-22 深圳市大疆创新科技有限公司 Semiconductor chip packaging structure, packaging method, and electronic device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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