CN203536421U - A novel structure of preventing a bonding material overflowing when a semiconductor welds a chip - Google Patents
A novel structure of preventing a bonding material overflowing when a semiconductor welds a chip Download PDFInfo
- Publication number
- CN203536421U CN203536421U CN201320561108.9U CN201320561108U CN203536421U CN 203536421 U CN203536421 U CN 203536421U CN 201320561108 U CN201320561108 U CN 201320561108U CN 203536421 U CN203536421 U CN 203536421U
- Authority
- CN
- China
- Prior art keywords
- semiconductor
- chip
- lead frame
- conjunction
- preventing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides a novel structure of preventing a bonding material overflowing when a semiconductor welds a chip. The novel structure comprises a lead frame and a semiconductor chip. The semiconductor chip is bonded on the lead frame through the bonding material. The periphery of the bonding material is provided with a glue-blocking wall. The glue-blocking wall is a protruding stopper frame on the lead frame and may be a recessed groove in the lead frame. The novel structure of preventing the bonding material overflowing when the semiconductor welds the chip solves a problem that when the semiconductor welds the semiconductor chip, the bonding material overflows due to overabundance, and improves the efficiency and the packaging quality for subsequent processes such as packaging.
Description
Technical field
The utility model relates to semiconductor welding encapsulation, is specifically related to a kind of new structure overflowing in conjunction with material while preventing semiconductor welding chip.
Background technology
Development along with modern science and technology, semiconductor device and assembly are in engineering, commercial being widely applied, it is at radar, remote-control romote-sensing, the extensive application of Aero-Space etc. has proposed more and more higher requirement to its reliability, and also more and more caused people's attention because of the bad inefficacy causing of chips welding (stickup), because this inefficacy is fatal often, irreversible, chips welding (stickup) is a lot of in the method for packaging body, can be summarized as metal alloy welding (or being called low melting point welding) and the large class of resin mounting method two, resin mounting method because of equipment in its operating process simple, be easy to realize automation technolo operation and running cost low and be used widely, especially in integrated circuit and low-power device, application is more extensive.
Existing semiconductor welding chip is as Fig. 1, comprise between lead frame 1, chip 2, described lead frame 1 and chip 2 and being pasted with in conjunction with material 3, in taping process usually because of in conjunction with material too much overflow precalculated position, thereby affect the processes such as bonding wire and follow-up encapsulation.
Application number is that 201010624106.0 Chinese patent discloses the patent of invention that name is called " die-bonding device ", its chip is pasted on lead frame by adhesive, in adhesion process, there will be adhesive spillover, thereby affect the processes such as bonding wire and follow-up encapsulation.
Utility model content
The utility model object is to provide a kind of new structure overflowing in conjunction with material while preventing semiconductor welding chip, while solving semiconductor welding semiconductor chip, present situation in conjunction with material because too much causing overflowing, for the processes such as follow-up encapsulation have improved efficiency and package quality.
In order to realize above object, the utility model provides a kind of new structure overflowing in conjunction with material while preventing semiconductor welding chip, comprise lead frame, semiconductor chip, described semiconductor chip is by being bonded in conjunction with material on described lead frame, improvements of the present utility model are, the surrounding of described combination material is provided with resistance Jiao Qiang.
As a kind of execution mode, the block frame that described resistance Jiao Qiang is a projection on lead frame.
As a kind of execution mode, described resistance Jiao Qiang is the groove of a depression on lead frame.
Further, described resistance Jiao Qiang is a rectangle frame.
The utility model provides a kind of new structure overflowing in conjunction with material while preventing semiconductor welding chip, while having solved existing semiconductor welding semiconductor chip, present situation in conjunction with material because too much causing overflowing, for the processes such as follow-up encapsulation have improved efficiency and package quality.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of existing semiconductor welding chip;
Fig. 2 is the structural representation of the utility model embodiment mono-;
Fig. 3 is the main schematic diagram of the utility model embodiment mono-;
Fig. 4 is the structural representation of the utility model embodiment bis-.
Embodiment
Below in conjunction with the accompanying drawing in the utility model, the technical scheme in the utility model is clearly and completely described, obviously, described is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, the every other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work, belongs to the scope that the utility model is protected.
Embodiment mono-
Referring to Fig. 2, Fig. 3, a kind of new structure overflowing in conjunction with material while preventing semiconductor welding chip, comprise lead frame 10, semiconductor chip 11, described semiconductor chip 11 is by being bonded in conjunction with material 12 on described lead frame 10, the surrounding of described combination material 12 is provided with resistance Jiao Qiang, described resistance Jiao Qiang is the block frame 13 of a projection on lead frame 10, described block frame forms for utilizing 3D printing technique to print, described block frame is a rectangle frame, while having solved existing semiconductor welding semiconductor chip, present situation in conjunction with material because too much causing overflowing, for the processes such as follow-up encapsulation have improved efficiency and package quality.
Embodiment bis-
Referring to Fig. 4, a kind of new structure overflowing in conjunction with material while preventing semiconductor welding chip, comprise lead frame 10, semiconductor chip 11, described semiconductor chip 11 is by being bonded in conjunction with material 12 on described lead frame 10, the surrounding of described combination material 12 is provided with resistance Jiao Qiang, described resistance Jiao Qiang is the groove 23 of a depression on lead frame 10, described groove is for utilizing engraving method etching to form, described groove 23 is a rectangle frame, while having solved existing semiconductor welding semiconductor chip, present situation in conjunction with material because too much causing overflowing, for the processes such as follow-up encapsulation have improved efficiency and package quality.
Known by above description, the utility model provides a kind of new structure overflowing in conjunction with material while preventing semiconductor welding chip, while having solved existing semiconductor welding semiconductor chip, the present situation in conjunction with material because too much causing overflowing, for the processes such as follow-up encapsulation have improved efficiency and package quality.
Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (4)
1. the new structure overflowing in conjunction with material while preventing semiconductor welding chip, comprises lead frame, semiconductor chip, and described semiconductor chip, by being bonded on described lead frame in conjunction with material, is characterized in that, the surrounding of described combination material is provided with resistance Jiao Qiang.
2. a kind of new structure overflowing in conjunction with material while preventing semiconductor welding chip according to claim 1, is characterized in that, described resistance Jiao Qiang is the block frame of a projection on lead frame.
3. a kind of new structure overflowing in conjunction with material while preventing semiconductor welding chip according to claim 1, is characterized in that, described resistance Jiao Qiang is the groove of a depression on lead frame.
4. the new structure overflowing in conjunction with material while preventing semiconductor welding chip according to a kind of described in claim 1-3 any one, is characterized in that, described resistance Jiao Qiang is a rectangle frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320561108.9U CN203536421U (en) | 2013-09-11 | 2013-09-11 | A novel structure of preventing a bonding material overflowing when a semiconductor welds a chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320561108.9U CN203536421U (en) | 2013-09-11 | 2013-09-11 | A novel structure of preventing a bonding material overflowing when a semiconductor welds a chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203536421U true CN203536421U (en) | 2014-04-09 |
Family
ID=50422600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320561108.9U Expired - Lifetime CN203536421U (en) | 2013-09-11 | 2013-09-11 | A novel structure of preventing a bonding material overflowing when a semiconductor welds a chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203536421U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109524363A (en) * | 2017-09-18 | 2019-03-26 | 株洲中车时代电气股份有限公司 | A kind of compression joint type subelement and the method for manufacturing it |
-
2013
- 2013-09-11 CN CN201320561108.9U patent/CN203536421U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109524363A (en) * | 2017-09-18 | 2019-03-26 | 株洲中车时代电气股份有限公司 | A kind of compression joint type subelement and the method for manufacturing it |
| CN109524363B (en) * | 2017-09-18 | 2020-07-03 | 株洲中车时代电气股份有限公司 | Compression joint type subunit and method for manufacturing same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140409 |
|
| CX01 | Expiry of patent term |