CN204721721U - A kind of flush type double-layer circuit board - Google Patents

A kind of flush type double-layer circuit board Download PDF

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Publication number
CN204721721U
CN204721721U CN201520301780.3U CN201520301780U CN204721721U CN 204721721 U CN204721721 U CN 204721721U CN 201520301780 U CN201520301780 U CN 201520301780U CN 204721721 U CN204721721 U CN 204721721U
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CN
China
Prior art keywords
layer
copper foil
circuit board
foil layer
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520301780.3U
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Chinese (zh)
Inventor
刘建春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Xingzhiguang Industrial Development Co Ltd
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Shenzhen Xingzhiguang Industrial Development Co Ltd
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Priority to CN201520301780.3U priority Critical patent/CN204721721U/en
Application granted granted Critical
Publication of CN204721721U publication Critical patent/CN204721721U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The utility model discloses a kind of flush type double-layer circuit board, its integral thickness is little; Whole circuit board can realize realizing expanding area after multiple hard circuit board unit is connected.The utility model comprises at least two circuit board units, and adjacent circuit Slab element is electrically connected conducting by flexible connecting member; Circuit board unit comprises upper and lower two-layer copper foil layer, is respectively the first copper foil layer and the second copper foil layer, sets gradually a PP layer from top to bottom, bury resistance central layer between upper and lower two-layer copper foil layer, and the 2nd PP layer, buries appearance central layer; Bury resistance central layer and bury appearance central layer be connected with the first copper foil layer and the second copper foil layer respectively by conducting copper; One PP layer, buries resistance central layer, and the 2nd PP layer and burying holds central layer runs through simultaneously offers conductive through hole, and rivets the metal needle of column in this conductive through hole; First copper foil layer and the second copper foil layer offering some grooves, in described groove, being provided with the circuit incoming end for the electronic component of inserting in groove and corresponding copper foil layer being conducted.

Description

A kind of flush type double-layer circuit board
Technical field
The utility model relates to a kind of multilayer circuit board, particularly relates to a kind of double-layer circuit board comprising two copper foil layers.
Background technology
Along with electronic product is to light, thin, little future development, it is also proposed higher requirement to flexible PCB, the circuit board of same area must comprise more circuit to improve greater functionality.Flexible PCB develops into double sided board and multi-panel from single sided board gradually.The double-layer circuit board that we often say just refers to the circuit board comprising two copper foil layers, all can arranging electronic element on two copper foil layers;
But along with the increase of the scope of application, the application of conventional rigid circuit board (relative to flexible PCB) receives obstruction, people start to adopt flexible PCB, but flexible PCB is when large area is sprawled, due to it, flexibility is very large on the whole, be not easy to assembling, be also not easy to very much after assembling ensure reliability of structure, in Long-Time Service, easily cause the premature breakdown of electric power-feeding structure; How both can ensure that circuit board section is provided with the intensity possessing the hard circuit board that matches in excellence or beauty is unusual contradiction needing flexibility when bending to ensure simultaneously; Meanwhile, multilayer circuit board adds the thickness of circuit board itself, and we in the urgent need to reducing circuit board thickness while reduction board area, and this mode is to electronic devices and components, and the installation of resistance and electric capacity proposes new requirement.
Utility model content
Technical problem to be solved in the utility model is that, for above-mentioned deficiency of the prior art, provide a kind of flush type double-layer circuit board, its integral thickness is little; Whole circuit board can realize realizing expanding area after multiple hard circuit board unit is connected, and circuit board unit possesses reliable intensity, and whole bending position concentrates on the position of flexible connecting member, and flexible connecting member possesses reliable electric connection structure.
The utility model solves the technical scheme that its technical problem adopts: a kind of flush type double-layer circuit board, comprises at least two circuit board units, and adjacent circuit Slab element is electrically connected conducting by flexible connecting member; Described flexible connecting member comprises multichannel conducting wire and multichannel conducting wire is encapsulated in inside and by the flexible glue of adjacent circuit Slab element adhesion; Described conducting wire is made up of copper or copper alloy, and each conducting wire is roughly rectangular, offers multiple hollow-out parts that are spaced and that be arranged side by side along the length direction of conducting wire in the middle part of it; Hollow-out parts is rectangular, and conducting wire is divided into the first wire and the second wire that are parallel to each other by it, and perpendicular to and the connection wire be connected with the second wire with the first wire, and the width of the first wire and the second wire is equal;
Described circuit board unit is encapsulated in screen; Described circuit board unit comprises upper and lower two-layer copper foil layer, is respectively the first copper foil layer and the second copper foil layer, sets gradually a PP layer from top to bottom, bury resistance central layer between upper and lower two-layer copper foil layer, and the 2nd PP layer, buries appearance central layer; The described resistance central layer that buries is connected with the first copper foil layer and the second copper foil layer respectively by conducting copper; The described appearance central layer that buries is connected with the first copper foil layer and the second copper foil layer respectively by conducting copper; Described conductive copper is arranged in via; Described via comprises and is opened in the 3rd via on a PP layer and the 2nd PP layer and the first via; Described via also comprises simultaneously through the 2nd PP layer, buries resistance central layer, the second via of a PP layer; Described via also comprises simultaneously through the 2nd PP layer and the 4th via burying appearance central layer;
A described PP layer, buries resistance central layer, and the 2nd PP layer and burying holds central layer runs through simultaneously offers conductive through hole, and rivets the metal needle of column in this conductive through hole, and this metal needle is electrically connected with described first copper foil layer and the second copper foil layer;
Described first copper foil layer and the second copper foil layer offering some grooves, in described groove, being provided with the circuit incoming end for the electronic component of inserting in groove and corresponding copper foil layer being conducted; Described circuit incoming end is arranged on the bottom of groove, and described groove is for being inverted taper type; Be placed in filled conductive glue between electronic component in groove and groove cell wall.
As a kind of preferred implementation of the present utility model, the two ends of described multichannel conducting wire conduct with corresponding circuit board unit respectively.
The utility model compared with prior art has the following advantages:
1, conductive through hole offered by the material of the utility model in the middle of upper and lower copper foil layer, rivet the metal needle of column in conductive through hole, structure is simple, and in processing, operation is convenient; The metal needle of riveted joint column, in conjunction with very firm, can improve circuit board functional reliability; The whole structure that conducts is beneficial to the manufacturing cost reducing circuit board;
2, employing flexible connecting member of the present utility model connects multiple circuit board unit, flexible connecting member can free bend, flexible and folding, now just can ensure by circuit board unit this as the higher hard board structure of circuit of conventional strength, flexible location is on the whole concentrated on flexible connecting member place; In order to ensure the reliable electrical connection at flexible connecting member place, the multichannel conducting wire be encapsulated in flexible glue can realize multi-way conduction (along the first wire, the second wire and the conducting connecting wire direction), after bending, many places fracture can be accepted, as long as ensure to rupture when the first wire of same hollow-out parts upper and lower is different with the second wire, the normal work of flexible circuit board can be ensured, the break resistance of conducting wire is greatly improved; Because the situation odds ruptured at the first wire and second wire of same hollow-out parts upper and lower is very little simultaneously, thus can ensure that flexible circuit board still can normally work after repeatedly bending, improve its break resistance;
3, the utility model all resistance of grafting assembling and electric capacity should be integrated in bury resistance central layer and bury and holds on central layer respectively by circuit board, layer structure and bury underground to mat formation and reduce integral thickness; Can enhance productivity, improve the circuit board life-span; Bury resistance central layer and bury and hold central layer by via and conductive copper and copper foil layer conducting, very reliably;
4, the flush type that the electronic component on copper foil layer of the present utility model realizes electronic component by the structure of recessing is installed, and reduces multiple-plate thickness; Electronic component is inserted in groove after grooving again, protects electronic component itself and reduce product rejection probability.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of a kind of embodiment of the present utility model;
Fig. 2 is the structural representation of a kind of embodiment of flexible connecting member of the present utility model;
Fig. 3 is the structural representation of a kind of embodiment of circuit board unit of the present utility model.
Description of reference numerals:
100-circuit board unit, 110-screen, 200-flexible connecting member, 210-flexible glue, 220-conducting wire, 22a-first wire, 22b-second wire, 22c-connects wire, 230-hollow-out parts;
101-first copper foil layer, 102-the one PP layer, 103-buries resistance central layer, 104-the 2nd PP layer, 105-buries appearance central layer, 106-second copper foil layer, 107-first via, 108-second via, 109-the 3rd via, 111-conductive copper, 112-the 4th via, 113-conducting resinl, 114-electronic component, 115-groove, 116-conductive through hole, 117-metal needle.
Embodiment
Below in conjunction with drawings and Examples, the utility model embodiment is described:
As shown in Figures 1 to 3, it illustrates embodiment of the present utility model, as shown in the figure, a kind of flush type double-layer circuit board of the utility model, comprise at least two circuit board units 100, adjacent circuit Slab element is electrically connected conducting by flexible connecting member 200; Described flexible connecting member comprises multichannel conducting wire 220 and multichannel conducting wire is encapsulated in inside and by the flexible glue 210 of adjacent circuit Slab element adhesion; Described conducting wire is made up of copper or copper alloy, and each conducting wire is roughly rectangular, offers multiple hollow-out parts 230 that are spaced and that be arranged side by side along the length direction of conducting wire in the middle part of it; Hollow-out parts is rectangular, and conducting wire is divided into the first wire 22a and the second wire 22b that are parallel to each other by it, and perpendicular to and the connection wire 22c be connected with the second wire with the first wire, and the width of the first wire and the second wire is equal;
As shown in the figure, described circuit board unit is encapsulated in screen 110; Described circuit board unit comprises upper and lower two-layer copper foil layer, is respectively the first copper foil layer 101 and the second copper foil layer 106, sets gradually a PP layer 102 between upper and lower two-layer copper foil layer from top to bottom, buries resistance central layer the 103, two PP layer 104, buries and hold central layer 105; The described resistance central layer that buries is connected with the first copper foil layer and the second copper foil layer respectively by conducting copper; The described appearance central layer that buries is connected with the first copper foil layer and the second copper foil layer respectively by conducting copper 111; Described conductive copper is arranged in via; Described via comprises the 3rd via 109 and the first via 107 be opened on a PP layer and the 2nd PP layer; Described via also comprises simultaneously through the 2nd PP layer, buries resistance central layer, the second via 108 of a PP layer; Described via also comprises simultaneously through the 2nd PP layer and the 4th via 112 burying appearance central layer;
As shown in the figure, a described PP layer, buries resistance central layer, and the 2nd PP layer and burying holds central layer runs through simultaneously offers conductive through hole 116, and in this conductive through hole, rivet the metal needle 117 of column, and this metal needle is electrically connected with described first copper foil layer and the second copper foil layer;
As shown in the figure, described first copper foil layer and the second copper foil layer offering some grooves 115, in described groove, being provided with the circuit incoming end for the electronic component of inserting in groove 114 and corresponding copper foil layer being conducted; Described circuit incoming end is arranged on the bottom of groove, and described groove is for being inverted taper type; Be placed in filled conductive glue 113 between electronic component in groove and groove cell wall.
Preferably, as shown in the figure, the two ends of described multichannel conducting wire conduct with corresponding circuit board unit respectively.
By reference to the accompanying drawings the utility model preferred implementation is explained in detail above, but the utility model is not limited to above-mentioned execution mode, in the ken that those of ordinary skill in the art possess, can also make a variety of changes under the prerequisite not departing from the utility model aim.
Do not depart from design of the present utility model and scope can make many other and change and remodeling.Should be appreciated that the utility model is not limited to specific execution mode, scope of the present utility model is defined by the following claims.

Claims (2)

1. a flush type double-layer circuit board, is characterized in that: comprise at least two circuit board units, and adjacent circuit Slab element is electrically connected conducting by flexible connecting member; Described flexible connecting member comprises multichannel conducting wire and multichannel conducting wire is encapsulated in inside and by the flexible glue of adjacent circuit Slab element adhesion; Described conducting wire is made up of copper or copper alloy, and each conducting wire is roughly rectangular, offers multiple hollow-out parts that are spaced and that be arranged side by side along the length direction of conducting wire in the middle part of it; Hollow-out parts is rectangular, and conducting wire is divided into the first wire and the second wire that are parallel to each other by it, and perpendicular to and the connection wire be connected with the second wire with the first wire, and the width of the first wire and the second wire is equal;
Described circuit board unit is encapsulated in screen; Described circuit board unit comprises upper and lower two-layer copper foil layer, is respectively the first copper foil layer and the second copper foil layer, sets gradually a PP layer from top to bottom, bury resistance central layer between upper and lower two-layer copper foil layer, and the 2nd PP layer, buries appearance central layer; The described resistance central layer that buries is connected with the first copper foil layer and the second copper foil layer respectively by conducting copper; The described appearance central layer that buries is connected with the first copper foil layer and the second copper foil layer respectively by conducting copper; Described conductive copper is arranged in via; Described via comprises and is opened in the 3rd via on a PP layer and the 2nd PP layer and the first via; Described via also comprises simultaneously through the 2nd PP layer, buries resistance central layer, the second via of a PP layer; Described via also comprises simultaneously through the 2nd PP layer and the 4th via burying appearance central layer;
A described PP layer, buries resistance central layer, and the 2nd PP layer and burying holds central layer runs through simultaneously offers conductive through hole, and rivets the metal needle of column in this conductive through hole, and this metal needle is electrically connected with described first copper foil layer and the second copper foil layer;
Described first copper foil layer and the second copper foil layer offering some grooves, in described groove, being provided with the circuit incoming end for the electronic component of inserting in groove and corresponding copper foil layer being conducted; Described circuit incoming end is arranged on the bottom of groove, and described groove is for being inverted taper type; Be placed in filled conductive glue between electronic component in groove and groove cell wall.
2. a kind of flush type double-layer circuit board as claimed in claim 1, is characterized in that: the two ends of described multichannel conducting wire conduct with corresponding circuit board unit respectively.
CN201520301780.3U 2015-05-07 2015-05-07 A kind of flush type double-layer circuit board Expired - Fee Related CN204721721U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520301780.3U CN204721721U (en) 2015-05-07 2015-05-07 A kind of flush type double-layer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520301780.3U CN204721721U (en) 2015-05-07 2015-05-07 A kind of flush type double-layer circuit board

Publications (1)

Publication Number Publication Date
CN204721721U true CN204721721U (en) 2015-10-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107300436A (en) * 2017-07-18 2017-10-27 南昌欧菲光科技有限公司 Touch control display apparatus and its pressure sensor
CN107889348A (en) * 2017-12-21 2018-04-06 河南省林晓科技开发有限公司 A kind of circuit board with multiple contraposition
CN108575049A (en) * 2017-03-08 2018-09-25 鹏鼎控股(深圳)股份有限公司 Flexible PCB and preparation method thereof
WO2022222282A1 (en) * 2021-04-20 2022-10-27 梅州市志浩电子科技有限公司 Method for manufacturing circuit board in which capacitor and resistor are embedded, and circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108575049A (en) * 2017-03-08 2018-09-25 鹏鼎控股(深圳)股份有限公司 Flexible PCB and preparation method thereof
CN108575049B (en) * 2017-03-08 2021-03-23 鹏鼎控股(深圳)股份有限公司 Flexible circuit board and manufacturing method thereof
CN107300436A (en) * 2017-07-18 2017-10-27 南昌欧菲光科技有限公司 Touch control display apparatus and its pressure sensor
CN107300436B (en) * 2017-07-18 2022-08-23 安徽精卓光显技术有限责任公司 Touch display device and pressure sensor thereof
CN107889348A (en) * 2017-12-21 2018-04-06 河南省林晓科技开发有限公司 A kind of circuit board with multiple contraposition
WO2022222282A1 (en) * 2021-04-20 2022-10-27 梅州市志浩电子科技有限公司 Method for manufacturing circuit board in which capacitor and resistor are embedded, and circuit board

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151021

Termination date: 20180507