CN204706557U - 一种智能功率模块 - Google Patents

一种智能功率模块 Download PDF

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CN204706557U
CN204706557U CN201520322754.9U CN201520322754U CN204706557U CN 204706557 U CN204706557 U CN 204706557U CN 201520322754 U CN201520322754 U CN 201520322754U CN 204706557 U CN204706557 U CN 204706557U
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lead frame
power module
intelligent power
pcb board
chip
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罗艳玲
陶少勇
农一清
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JILIN HUAWEI SIPAKE ELECTRIC Co Ltd
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JILIN HUAWEI SIPAKE ELECTRIC Co Ltd
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Abstract

一种智能功率模块，涉及芯片技术领域，其结构包括PCB板和引线框架，所述PCB板设有焊盘，所述引线框架设有用于焊接至所述焊盘的第一引脚，通过在PCB板上设焊盘，在引线框架上设置第一引脚，使得PCB板与引线框架之间可通过焊接来配合，方便PCB板拆装到引线框架，可在不更改引线框架的结构的情况下更换PCB板，成本低，同时提高了引线框架的兼容性。

Description

一种智能功率模块
技术领域
本实用新型涉及芯片技术领域，特别是涉及一种智能功率模块。
背景技术
功率模块是功率电力电子器件按一定的功能组合后灌封的一个模块。
智能功率模块是以IGBT为内核的先进混合集成功率部件，由高速低功耗管芯（IGBT）和优化的门极驱动电路，以及快速保护电路构成。
智能功率模块一般包括PCB板和引线框架，是一种微型电子器件或部件。PCB板是采用一定的工艺，把一个电路中所需的晶体管、二极管、电阻、电容和电感等元件及布线互连一起。
引线框架作为集成电路的芯片载体，是一种借助于键合材料(金丝、铝丝和铜丝等)实现芯片内部电路引出端与外引线的电气连接，形成电气回路的关键结构件，它起到了和外部导线连接的桥梁作用，绝大部分的半导体集成块中都需要使用引线框架，是电子信息产业中重要的基础材料。
现有技术的PCB板和引线框架通常是直接连接在一起，再通过导线将PCB板上的芯片的引脚与引线框架的引脚连接，比如申请号为201410836707.6 的中国专利申请公开了功率模块及其封装方法，该功率模块包括引线框架、PCB印制板和芯片，PCB印制板连接在引线框架上并相互导通，芯片的第一侧面上的电极焊接在PCB印制板的芯片焊盘上；功率模块还包括铝基印制板，芯片的与第一侧面相对的第二侧面上的电极焊接在铝基印制板的芯片焊盘上，铝基印制板连接在引线框架上并相互导通。
以上的设计更换PCB板的电路时，需要将整个PCB板和引线框架全部换掉，成本较高，且不利于更换PCB板。
实用新型内容
本实用新型的目的在于避免现有技术中的不足之处而提供一种智能功率模块，该种智能功率模块可在不更改引线框架的结构的情况下更换PCB板，成本低，同时提高了引线框架的兼容性。
本实用新型的目的通过以下技术方案实现：
提供一种智能功率模块，包括PCB板和引线框架，所述PCB板设有焊盘，所述引线框架设有用于焊接至所述焊盘的第一引脚。
所述PCB板焊接有一个用于驱动IGBT芯片工作的驱动芯片。
还包括陶瓷电路板，所述陶瓷电路板设有用于固定引线框架的固定位，所述引线框架设有用于固定至所述固定位的延伸脚。
所述陶瓷电路板焊接有多个IGBT芯片。
所述IGBT芯片设置有六个，所述六个IGBT芯片并排设置。
所述驱动芯片分别与多个IGBT芯片电连接。
所述驱动芯片与每个所述IGBT芯片通过金线连接。
所述陶瓷电路板还设有数量与所述IGBT芯片相同的快恢复二极管，每个所述快恢复二极管与一个IGBT芯片电连接。
所述引线框架设有与所述快恢复二极管电连接的第二引脚，所述第二引脚通过导线与所述快恢复二极管电连接。
所述第二引脚通过银线与所述快恢复二极管电连接。
本实用新型的有益效果：
（1）本实用新型通过在PCB板上设焊盘，在引线框架上设置第一引脚，使得PCB板与引线框架之间可通过焊接来配合，方便PCB板拆装到引线框架，可在不更改引线框架的结构的情况下更换PCB板，成本低，同时提高了引线框架的兼容性。
（2）本实用新型通过设置陶瓷电路板代替引线框架的焊接位置，可提高散热效果。
（3）本实用新型通过在陶瓷电路板设有用于固定引线框架的固定位，所述引线框架设有用于固定至所述固定位的延伸脚，引线框架通过延伸脚焊接至陶瓷电路板的固定位，可方便装配和拆卸。
（4）本实用新型的一个驱动芯片可驱动六个IGBT芯片工作，效率更高，成本更低。
附图说明
利用附图对实用新型作进一步说明，但附图中的实施例不构成对本实用新型的任何限制，对于本领域的普通技术人员，在不付出创造性劳动的前提下，还可以根据以下附图获得其它的附图。
图1是本实用新型的一种智能功率模块的PCB板、引线框架和陶瓷电路板的配合示意图。
图2是本实用新型的一种智能功率模块的引线框架的结构示意图。
图3是本实用新型的一种智能功率模块的PCB板和陶瓷电路板的配合示意图。
图4是本实用新型的一种智能功率模块的结构示意图。
图中包括有：
1——PCB板、11——焊盘、12——驱动芯片；
2——引线框架、21——第一引脚、22——第二引脚；
3——陶瓷电路板、31——固定位。
具体实施方式
结合以下实施例对本实用新型作进一步描述。
本实施例的一种智能功率模块，如图1至图4所示，包括PCB板1和引线框架2，所述PCB板1设有焊盘11，所述引线框架2设有用于焊接至所述焊盘11的第一引脚21。
本实施例通过在PCB板1上设焊盘11，在引线框架2上设置第一引脚21，使得PCB板1与引线框架2之间可通过焊接来配合，方便PCB板1拆装到引线框架2，可在不更改引线框架2的结构的情况下更换PCB板1，成本低，同时提高了引线框架2的兼容性。
本实施例的一种智能功率模块还包括陶瓷电路板3，所述陶瓷电路板3设有用于固定引线框架2的固定位31，所述引线框架2设有用于固定至所述固定位31的延伸脚，陶瓷电路板3可提高散热效果，引线框架2通过延伸脚焊接至陶瓷电路板3的固定位31，可方便装配和拆卸。
所述PCB板1焊接有一个用于驱动IGBT芯片工作的驱动芯片12，所述陶瓷电路板3焊接有六个IGBT芯片，所述驱动芯片12分别与六个IGBT芯片电连接，使得一个驱动芯片12可驱动六个IGBT芯片工作，效率更高，成本更低。
所述驱动芯片12与每个所述IGBT芯片通过金线连接，金线的稳定性更好，更加耐用。
所述陶瓷电路板3还设有数量与所述IGBT芯片相同的快恢复二极管（即图中的FRD），每个所述快恢复二极管与一个IGBT芯片电连接， IGBT芯片大多数使用在感性负载条件下，反向并联快恢复二极管FRD在IGBT芯片开关状态时提供续流通道，因此快恢复二极管也称为续流二极管，封装在一起的话使用起来就方便，可靠性也比外接并联的更高。
所述引线框架2设有与所述快恢复二极管电连接的第二引脚22，所述第二引脚22通过导线与所述快恢复二极管电连接，通过导线的连接方式方便更改。
所述第二引脚22通过银线与所述快恢复二极管电连接，银线的稳定性更好，更加耐用。
最后应当说明的是，以上实施例仅用以说明本实用新型的技术方案，而非对本实用新型保护范围的限制，尽管参照较佳实施例对本实用新型作了详细地说明，本领域的普通技术人员应当理解，可以对本实用新型的技术方案进行修改或者等同替换，而不脱离本实用新型技术方案的实质和范围。

Claims (10)

1.一种智能功率模块，其特征在于：包括PCB板和引线框架，所述PCB板设有焊盘，所述引线框架设有用于焊接至所述焊盘的第一引脚。
2.如权利要求1所述的一种智能功率模块，其特征在于：所述PCB板焊接有一个用于驱动IGBT芯片工作的驱动芯片。
3.如权利要求2所述的一种智能功率模块，其特征在于：还包括陶瓷电路板，所述陶瓷电路板设有用于固定引线框架的固定位，所述引线框架设有用于固定至所述固定位的延伸脚。
4.如权利要求3所述的一种智能功率模块，其特征在于：所述陶瓷电路板焊接有多个IGBT芯片。
5.如权利要求4所述的一种智能功率模块，其特征在于：所述IGBT芯片设置有六个，所述六个IGBT芯片并排设置。
6.如权利要求4所述的一种智能功率模块，其特征在于：所述驱动芯片分别与多个IGBT芯片电连接。
7.如权利要求6所述的一种智能功率模块，其特征在于：所述驱动芯片与每个所述IGBT芯片通过金线连接。
8.如权利要求4所述的一种智能功率模块，其特征在于：所述陶瓷电路板还设有数量与所述IGBT芯片相同的快恢复二极管，每个所述快恢复二极管与一个IGBT芯片电连接。
9.如权利要求8所述的一种智能功率模块，其特征在于：所述引线框架设有与所述快恢复二极管电连接的第二引脚，所述第二引脚通过导线与所述快恢复二极管电连接。
10.如权利要求9所述的一种智能功率模块，其特征在于：所述第二引脚通过银线与所述快恢复二极管电连接。
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106787461A (zh) * 2016-12-19 2017-05-31 深圳市依思普林科技有限公司 用于电机的igbt模块
CN109411462A (zh) * 2018-10-31 2019-03-01 广东美的制冷设备有限公司 高集成功率模块和电器
CN109427744A (zh) * 2017-08-22 2019-03-05 比亚迪股份有限公司 Ipm模块、车辆及ipm模块的制作方法
WO2021063267A1 (zh) * 2019-09-30 2021-04-08 华为技术有限公司 引线框架、封装集成电路板、电源芯片及电路板封装方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106787461A (zh) * 2016-12-19 2017-05-31 深圳市依思普林科技有限公司 用于电机的igbt模块
CN109427744A (zh) * 2017-08-22 2019-03-05 比亚迪股份有限公司 Ipm模块、车辆及ipm模块的制作方法
CN109427744B (zh) * 2017-08-22 2023-11-24 比亚迪半导体股份有限公司 Ipm模块、车辆及ipm模块的制作方法
CN109411462A (zh) * 2018-10-31 2019-03-01 广东美的制冷设备有限公司 高集成功率模块和电器
WO2021063267A1 (zh) * 2019-09-30 2021-04-08 华为技术有限公司 引线框架、封装集成电路板、电源芯片及电路板封装方法
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