CN204675828U - A kind of MEMS level Hermetic Package cover plate - Google Patents
A kind of MEMS level Hermetic Package cover plate Download PDFInfo
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- CN204675828U CN204675828U CN201520402192.9U CN201520402192U CN204675828U CN 204675828 U CN204675828 U CN 204675828U CN 201520402192 U CN201520402192 U CN 201520402192U CN 204675828 U CN204675828 U CN 204675828U
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Abstract
The utility model discloses a kind of MEMS level Hermetic Package cover plate, comprise cover board body and Au80Sn20 alloy weld tabs, the one side of described cover board body is laser-etched with the rectangular box-like line trenches being slightly less than weld tabs inside casing, fetter in regular shape and cover plate metallurgical binding by line trenches after described Au80Sn20 alloy weld tabs fusing, ensure location and the packaging air tightness of solder and cover plate.The utility model can improve traditional airtight soldering packaging technology flow process greatly, the problem that solution cover plate, weld tabs, device contraposition are forbidden, and improves efficiency, ensure that air-tightness, improve product percent of pass and product quality.
Description
Technical field
The utility model relates to MEMS level Hermetic Package technical field, particularly relates to a kind of encapsulation cover plate being connected with Au80Sn20 alloy weld tabs.
Background technology
Microelectromechanical systems (also known as MEMS, MEMS) utilizes miromaching to make the sensing system with mechanical property.MEMS, as a new and high technology in intelligent field in future, is widely used in various fields such as electronics, information, biology, automobile, national defence at present.Its important application comprises: sensing MEMS, Bio-MEMS, optical MEMS and RF MEMS etc.
The air-tight packaging of MEMS, effectively can isolate the infringement that may cause the pollutants such as the steam of damage to chip, ensures that device realizes more excellent performance, effectively extends the service life of device.Therefore, the air-tight packaging of MEMS is this technology important technological problems urgently to be resolved hurrily in course of industrialization.
At present, improve the high reliability of MEMS level Hermetic Package, adopt preset gold-tin alloy cover plate to be best selection.And in level Hermetic Package technique, applying maximum is soldering tech.Traditional soldering processes flow process is: gold-plated cover plate manufacture-alloy weld tabs stamping-out-cover plate location-alloy weld tabs location-soldering.In actual application, this technological process is loaded down with trivial details, particularly the MEMS of size from millimeter to micron level, and its operating efficiency is extremely low, poor air-tightness, and finished product rate is low, and this have impact on the development in MEMS level Hermetic Package field greatly.
Utility model content
The technical problems to be solved in the utility model is, provides a kind of MEMS level Hermetic Package cover plate, and this cover plate can solve contraposition in traditional level Hermetic Package process is forbidden, and flow process is loaded down with trivial details, the problem that yield rate is low.
For solving the problems of the technologies described above, the utility model provides a kind of MEMS level Hermetic Package cover plate, comprise a cover board body, the one side of described cover board body is laser-etched with rectangular box-like line trenches, and the peripheral metallurgical binding of described rectangular box-like line trenches has the Au80Sn20 alloy weld tabs of correspondingly-shaped.
Preferred technical approach is, the 4J29 kovar alloy body of described cover board body to be length be respectively 0.6mm, 0.3mm, 0.23mm.
Wherein, described cover board body is kovar alloy body, electroless nickel layer and plating layer gold from the inside to the outside successively.
Wherein, the thickness of described electroless nickel layer is 5 μm or 6 μm; The thickness of described plating layer gold is 1.3 μm or 1.5 μm.
Preferred technical approach is, the degree of depth of described rectangular box-like line trenches is 20 μm or 15 μm; The line width of described rectangular box-like line trenches is 0.05mm or 0.08mm.
Microminiature surface gold-plating has the cover plate of accurate etched line groove and Au80Sn20 solder alloy to combine by the utility model, forms the preset Au80Sn20 alloy cover plate that lid surface is connected with weld tabs.The utility model can improve traditional airtight soldering packaging technology flow process greatly, the problem that solution cover plate, weld tabs, device contraposition are forbidden, and improves efficiency, ensure that air-tightness, improve product percent of pass and product quality.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of MEMS level Hermetic Package of the utility model cover plate.
In upper figure, 1-cover plate; 2-preformed Au80Sn20 weld tabs.
Detailed description of the invention
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail.Should be understood that these embodiments are only not used in restriction scope of the present utility model for illustration of the utility model.In addition should be understood that those skilled in the art make various changes or modifications the utility model, and these equivalent form of values fall within the application's appended claims limited range equally after the content of having read the utility model instruction.
embodiment 1
4J42 kovar alloy precision is etched into the sheet material of 0201 size in SMD package dimension (the wide * of long * high=0.6mm*0.3mm*0.23mm), the nickel dam of a layer thickness 5.0 μm is first electroplated afterwards on this sheet material, and then electroplate the layer gold of a layer thickness 1.3 μm, obtain the cover plate 1 that six faces are all coated with uniform nickel layer and layer gold.
Au80Sn20 alloy cast ingot is pressed into the foil material that thickness is 0.25mm, the punching of foil material is become to be of a size of the long * of housing wide=0.59mm*0.29mm, the long * of inside casing be wide=the Au80Sn20 alloy weld tabs 2 of the rectangular frame shape of 0.49mm*0.19mm.
Again the wherein one side of cover plate 1 use the method precision of laser ablation etch one 20 μm dark, the rectangular box-like line trenches of 0.05mm live width, line trenches length and width distance * is wide=0.48mm*0.18mm, Au80Sn20 alloy weld tabs 2 is aimed at the surface being positioned over above-mentioned rectangular box-like line trenches, adopt the heating of nitrogen reflux stove, preferred comrade's science and technology TM200+ model device, maximum temperature controls at 300 DEG C, time is 1min, Au80Sn20 alloy weld tabs 2 is melted, solder after fusing fetters by line trenches, still in frame-shaped, metallurgical binding is produced with cover plate 1 overlay coating, thus cover plate 1 and Au80Sn20 alloy weld tabs 2 are fixed together, form MEMS level Hermetic Package cover plate of the present utility model.
embodiment 2
4J29 kovar alloy precision is etched into the sheet material of 0201 size in SMD package dimension (the wide * of long * high=0.6mm*0.3mm*0.23mm), the nickel dam of a layer thickness 6.0 μm is first electroplated afterwards on this sheet material, and then electroplate the layer gold of a layer thickness 1.5 μm, obtain the cover plate 1 that six faces are all coated with uniform nickel layer and layer gold.
Au80Sn20 alloy cast ingot is pressed into the foil material that thickness is 0.25mm, the punching of foil material is become to be of a size of the long * of housing wide=0.58mm*0.28mm, the long * of inside casing be wide=the Au80Sn20 alloy weld tabs 2 of the rectangular frame shape of 0.48mm*0.18mm.
The wherein one side of cover plate 1 use the method precision of laser ablation etch one 15 μm dark, the rectangular box-like line trenches of 0.08mm live width, line trenches length and width distance * is wide=0.47mm*0.17mm, Au80Sn20 alloy weld tabs 2 is aimed at and is positioned over above-mentioned rectangular box-like line trenches surface, adopt the heating of nitrogen reflux stove, , preferred comrade's science and technology TM200+ model device, maximum temperature controls at 300 DEG C, time is 2min, Au80Sn20 alloy weld tabs 2 is melted, be still frame-shaped under line trenches hinders after weld tabs fusing, metallurgical binding is produced with cover plate 1 overlay coating, thus cover plate and Au80Sn20 alloy weld tabs 2 are fixed together, form MEMS level Hermetic Package cover plate of the present utility model.
Finally it should be noted that; the foregoing is only preferred embodiment of the present utility model; instead of the restriction to technical solutions of the utility model, any equivalent replacement of doing the utility model technical characteristic or corresponding improvement, still within protection domain of the present utility model.
Claims (5)
1. a MEMS level Hermetic Package cover plate, comprise a cover board body and Au80Sn20 alloy weld tabs, it is characterized in that, the one side of described cover board body is laser-etched with rectangular box-like line trenches, the peripheral metallurgical binding of described rectangular box-like line trenches has the Au80Sn20 alloy weld tabs of correspondingly-shaped.
2. a kind of MEMS level Hermetic Package cover plate as claimed in claim 1, is characterized in that, the 4J29 kovar alloy body of described cover board body to be length be respectively 0.6mm, 0.3mm, 0.23mm.
3. a kind of MEMS level Hermetic Package cover plate as claimed in claim 2, is characterized in that, described cover board body is kovar alloy body, electroless nickel layer and plating layer gold from the inside to the outside successively.
4. a kind of MEMS level Hermetic Package cover plate as claimed in claim 3, is characterized in that, the thickness of described electroless nickel layer is 5 μm or 6 μm; The thickness of described plating layer gold is 1.3 μm or 1.5 μm.
5. a kind of MEMS level Hermetic Package cover plate as claimed in claim 1, is characterized in that, the degree of depth of described rectangular box-like line trenches is 20 μm or 15 μm; The live width of described rectangular box-like line trenches is 0.05mm or 0.08mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520402192.9U CN204675828U (en) | 2015-06-12 | 2015-06-12 | A kind of MEMS level Hermetic Package cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520402192.9U CN204675828U (en) | 2015-06-12 | 2015-06-12 | A kind of MEMS level Hermetic Package cover plate |
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| CN204675828U true CN204675828U (en) | 2015-09-30 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108909085A (en) * | 2018-07-13 | 2018-11-30 | 安徽晶赛科技股份有限公司 | A kind of upper cover and preparation method thereof suitable for the encapsulation of laser welding quartz crystal |
| CN114932314A (en) * | 2022-06-01 | 2022-08-23 | 武汉逸飞激光股份有限公司 | Laser welding method for sealing nail |
| CN116884923A (en) * | 2023-09-07 | 2023-10-13 | 广州先艺电子科技有限公司 | Cover plate packaging structure and preparation method thereof |
-
2015
- 2015-06-12 CN CN201520402192.9U patent/CN204675828U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108909085A (en) * | 2018-07-13 | 2018-11-30 | 安徽晶赛科技股份有限公司 | A kind of upper cover and preparation method thereof suitable for the encapsulation of laser welding quartz crystal |
| CN114932314A (en) * | 2022-06-01 | 2022-08-23 | 武汉逸飞激光股份有限公司 | Laser welding method for sealing nail |
| CN116884923A (en) * | 2023-09-07 | 2023-10-13 | 广州先艺电子科技有限公司 | Cover plate packaging structure and preparation method thereof |
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