CN204614764U - Silicon chip surface microparticle scavenge unit - Google Patents
Silicon chip surface microparticle scavenge unit Download PDFInfo
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- CN204614764U CN204614764U CN201520081282.2U CN201520081282U CN204614764U CN 204614764 U CN204614764 U CN 204614764U CN 201520081282 U CN201520081282 U CN 201520081282U CN 204614764 U CN204614764 U CN 204614764U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a kind of silicon chip surface microparticle scavenge unit.It comprises conveyer belt and transmits rotating disk, transmit on rotating disk and be provided with bayonet socket, the below of transmitting rotating disk is provided with light sensor, light sensor connects PLC control system, driving turntable is outside equipped with blow device, blow device is placed with gas hole, driving turntable is all connected PLC control system with blow device, PLC control system can control to transmit dial rotation, when bayonet socket rotates between blow device, PLC control system can be made to control the tow sides of blow device to silicon chip and to purge simultaneously.After adopting above-mentioned structure, achieve effective removing that crystal-silicon solar cell screen printing process silicon chip surface remains microparticle, reduce that the printing caused because microparticle remains is bad, half tone collapses version, cell piece batch is hidden many negative effects such as to split, and positive pressure can not be produced to silicon chip itself, thus achieve battery manufacture production Yield lmproved, cost decline.
Description
Technical field
The utility model relates to the servicing unit that a kind of crystal silicon solar cell sheet production process uses, specifically a kind of silicon chip surface microparticle scavenge unit.
Background technology
The technological process of conventional crystalline silicon solar cell generally includes following processing step: making herbs into wool → diffusion → etching → PECVD → silk screen printing → sintering → test.
In pecvd process section, for pursuing higher battery conversion efficiency, the use of tubular type PECVD is healed and is become general.But in tubular type pecvd process process, silicon chip is often in the more environment of microparticle.The source of these microparticles generally includes following several respects: the ceramic rod damage etc. that silicon chip surface damages, cold cycling causes that the hard collision between inserted sheet process silicon chip and graphite boat stuck point, plasma bombardment process cause.Through pecvd process process, part silicon chip surface will inevitably with a small amount of microparticle.In follow-up screen printing process, effectively remove if do not remained microparticle to silicon chip surface in advance, bad, the half tone of printing will be caused to collapse, and version, cell piece batch are hidden the series of negative impact such as to split, thus cause producing that yield declines, manufacturing cost rises.
Remove for silicon chip surface microparticle after PECVD, existing part measure in crystal-silicon solar cell manufacturing, as before material loading, adopt hand-hold type air gun to purge back and forth the silicon chip in the gaily decorated basket; Feeding process, installs blowning installation additional directly over silicon chip, carries out vertical purging to silicon chip surface.However, all there is obvious drawback in said method.Adopt hand-hold type air gun to purge, major drawbacks is: gun pressure is difficult to ensure, excessive initial air-flow may cause cell piece to break instantaneously, and too small air-flow is then not enough to effectively remove silicon chip surface microparticle; Meanwhile, the mode of hand-held air gun is adopted to feel simply helpless in the mode of production in the face of stack type silk screen printing material loading.The vertical purge mode in feeding process surface, because silicon chip itself is very thin, purges air flow rate and will be subject to obvious restriction, if but throughput is too small, and the microparticle being attached to silicon chip surface can not be removed; In addition, vertical purging once can only remove a surface of silicon chip, and the microparticle of silicon chip surface attachment is difficult to remove equally.
Summary of the invention
The technical problems to be solved in the utility model is to provide one can effectively remove silicon chip surface microparticle, again unlikely silicon chip surface microparticle scavenge unit crystal-silicon solar cell production being had to negative effect.
In order to solve the problems of the technologies described above, silicon chip surface microparticle scavenge unit of the present utility model, comprise for carrying the conveyer belt of silicon chip and being positioned at the transmission rotating disk of conveyer belt end, transmit bayonet socket rotating disk being provided with multiple along the circumferential direction radial arrangement, the rotation transmitting rotating disk can make one of them bayonet socket just to conveyer belt, silicon chip can be sent to just in the bayonet socket of conveyer belt under the conveying of conveyer belt, transmit the below of rotating disk to be provided with and can to detect silicon chip and whether deliver to the light sensor transmitted in rotating disk bayonet socket, light sensor connects PLC control system, Detection Information can be transferred to PLC control system by light sensor, transmit rotating disk and be outside equipped with the blow device being positioned at and transmitting the upper and lower both sides of rotating disk, blow device is placed with just to the gas hole transmitting rotating disk, transmit rotating disk and be all connected PLC control system with blow device, PLC control system can control to transmit dial rotation, when bayonet socket rotates between blow device, PLC control system can be made to control the tow sides of blow device to silicon chip purge simultaneously.
Described transmission rotating disk is installed on the rear of silk screen printing feeding platform.
Described transmission rotating disk comprises cylinder and is arranged on two tubular disk bodies of the cylinder left and right sides, and described bayonet socket is multiple V-arrangement fracture radially arranged on each tubular disk body.
After adopting above-mentioned structure, due to the transmission rotating disk with bayonet socket arranged, be positioned at the blow device of the transmission upper and lower both sides of rotating disk and light sensor and the PLC control system whether silicon chip delivers to transmission rotating disk bayonet socket can be detected, thus by blow device is arranged just to transmitting the gas hole of rotating disk to silicon chip up and down to blowing, achieve effective removing that crystal-silicon solar cell screen printing process silicon chip surface remains microparticle, reduce the printing caused because microparticle remains bad, half tone collapses version, cell piece batch is hidden many negative effects such as to split, and positive pressure can not be produced to silicon chip itself, crystal-silicon solar cell is not had a negative impact, thus achieve battery manufacture production Yield lmproved, cost declines.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model silicon chip surface microparticle scavenge unit;
Fig. 2 transmits rotating disk and blow device layout structure schematic diagram in the utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments, silicon chip surface microparticle scavenge unit of the present utility model is described in further detail.
As shown in the figure, silicon chip surface microparticle scavenge unit of the present utility model, comprise for carrying the conveyer belt 1 of silicon chip and being positioned at the transmission rotating disk 2 of conveyer belt end, transmit the rear that rotating disk 2 is installed on silk screen printing feeding platform, screen printing table board front, transmit the bayonet socket 3 rotating disk 2 being provided with multiple along the circumferential direction radial arrangement, the rotation transmitting rotating disk 2 can optionally make one of them bayonet socket just to conveyer belt 1, silicon chip can be sent to just in the bayonet socket of conveyer belt under the conveying of conveyer belt 1, transmit the below of rotating disk 2 to be provided with and can to detect silicon chip and whether deliver to the light sensor 4 transmitted in rotating disk bayonet socket, light sensor 4 connects PLC control system, Detection Information can be transferred to PLC control system by light sensor 4, transmit rotating disk 2 and be outside equipped with blow device 5, blow device 5 is provided with two and is oppositely arranged, two blow devices lay respectively at and transmit rotating disk about 2 both sides, two blow devices 5 are placed with respectively just to the gas hole 6 transmitting rotating disk, transmit rotating disk 2 and be all connected PLC control system with two blow devices 5, light sensor 4 responds to position of silicon wafer, induction information and PLC system link, PLC control system can control to transmit rotating disk 2 by PLC instruction and rotate, when bayonet socket rotates between blow device, PLC control system can be made to control the tow sides of blow device to silicon chip purge simultaneously, specifically PLC control system can control blow device (convection current blowning installation) and can carry out intermittent aeration to cell piece.
Wherein, in the utility model, said transmission rotating disk 2 comprises cylinder 7 and is arranged on two tubular disk bodies 8 of the cylinder left and right sides, bayonet socket 3 is multiple V-arrangement fracture radially arranged on each tubular disk body, transmits rotating disk by the multiple tooth position of the V-arrangement fracture design forming radially arranged multiple on each tubular disk body.
During work, the silicon chip completing PECVD enters silk screen printing line by feeding platform, and under conveyer belt (belt) drives, silicon chip is sent to a bayonet socket position of transmitting rotating disk; The process transmitting rotating disk bayonet socket is entered at silicon chip, silicon chip triggers the light sensor be installed on below its transmission lines, light sensor sends signal to PLC control system, PLC control system controls to transmit rotating disk and rotates, when transmission rotating disk is sent to next tooth position, this tooth position is between two blow devices, and PLC sends another instruction, be arranged on and will carry out air-flow to blowing to silicon chip surface with two of this tooth bit parallel blow devices, and then the residual microparticle of silicon chip surface is removed; Gassing time is controlled by PLC instruction, and time setting is slightly shorter than the time needed for the printing of monolithic battery sheet usually, is generally set as 2.0-3.0 second, specifically can carries out corresponding adjustment based on the cycle of monolithic printing.Stop the scheduled time in fixed teeth position, silicon chip completes surperficial microparticle and purges removal and be rotated further with rotating disk.
As can be seen here, the utility model by transmitting the application of rotating disk, silicon chip is turned to parallel current after purge again, air-flow stops by silicon chip cross section, and being split is two strands, removing while realizing silicon chip two remained on surface microparticles; In addition, in air blowing control, by PLC instruction, blow mode is set as intermittent aeration pattern, effectively reduces throughput, save cost.Test data of the present utility model is as follows:
Wherein scheme 1, scheme 2 are the result of the test adopting existing apparatus in current production, and scheme 3, scheme 4 adopt the result of the test of the utility model device, and concrete comparing result is as follows:
Scheme 1, gaily decorated basket material loading pattern, use hand-hold type air gun to clean back and forth before entering silk screen printing, then material loading, carries out silk screen printing production, follows the tracks of printing fraction defective, positive electrode half tone life-span, and silk screen printing section fragment rate.
Scheme 2, gaily decorated basket material loading pattern, use hand-hold type air gun to clean back and forth, then material loading before entering silk screen printing, before entering positive electrode printing, uprush purging is carried out to silicon chip surface, follow the tracks of printing fraction defective, positive electrode half tone life-span, and silk screen printing print zone fragment rate.
Scheme 3, gaily decorated basket material loading pattern, enter silk screen printing printing table before, adopt said apparatus gas flow purging is carried out to silicon chip surface, the gas flow purging time is set as 2.0 seconds, follow the tracks of printing fraction defective, positive electrode half tone life-span, and silk screen printing section fragment rate.
Scheme 4, gaily decorated basket material loading pattern, enter silk screen printing printing table before, adopt said apparatus gas flow purging is carried out to silicon chip surface, the gas flow purging time is set as 2.6 seconds, follow the tracks of printing fraction defective, positive electrode screen painting life-span, and silk screen printing section fragment rate.
Table 1: print fraction defective, half tone life-span and the contrast of silk screen printing section fragment rate under different schemes
Contrast finds, adopts the utility model device, and the bad and process fragment rate of the printing of crystal-silicon solar cell production process will effectively be declined, and the half tone life-span that silk screen printing uses will effectively be promoted; As can be seen from above-described embodiment, what the utility model employing was parallel with silicon chip carries out microparticle removing to blowing gas stream device to positive and negative two surfaces of silicon chip simultaneously, adopt intermittent aeration to control, while wananty costs is saved, the microparticle that silicon chip surface remains effectively is removed simultaneously.Follow the tracks of batch production, printing fraction defective, the silk screen printing fragment rate of crystal-silicon solar cell are all decreased significantly, and the positive electrode screen painting life-span then effectively improves.
Claims (3)
1. a silicon chip surface microparticle scavenge unit, it is characterized in that: comprise for carrying the conveyer belt of silicon chip (1) and being positioned at the transmission rotating disk (2) of conveyer belt end, described transmission rotating disk (2) is provided with the bayonet socket (3) of multiple along the circumferential direction radial arrangement, the rotation of described transmission rotating disk (2) can make one of them bayonet socket just to conveyer belt (1), described silicon chip can be sent to just in the bayonet socket of conveyer belt under the conveying of conveyer belt (1), the below of described transmission rotating disk (2) is provided with can be detected silicon chip and whether deliver to the light sensor (4) transmitted in rotating disk bayonet socket, described light sensor (4) connects PLC control system, Detection Information can be transferred to PLC control system by light sensor (4), described transmission rotating disk (2) is outside equipped with the blow device (5) being positioned at and transmitting the upper and lower both sides of rotating disk (2), described blow device (5) is placed with just to the gas hole (6) transmitting rotating disk, described transmission rotating disk (2) is all connected PLC control system with blow device (5), described PLC control system can control to transmit rotating disk (2) and rotate, when bayonet socket rotates between blow device, PLC control system can be made to control the tow sides of blow device to silicon chip purge simultaneously.
2. according to silicon chip surface microparticle scavenge unit according to claim 1, it is characterized in that: described transmission rotating disk (2) is installed on the rear of silk screen printing feeding platform.
3. according to silicon chip surface microparticle scavenge unit according to claim 1, it is characterized in that: described transmission rotating disk (2) comprises cylinder (7) and is arranged on two tubular disk bodies (8) of the cylinder left and right sides, described bayonet socket (3) is the V-arrangement fracture radially arranged multiple on each tubular disk body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520081282.2U CN204614764U (en) | 2015-02-04 | 2015-02-04 | Silicon chip surface microparticle scavenge unit |
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| CN201520081282.2U CN204614764U (en) | 2015-02-04 | 2015-02-04 | Silicon chip surface microparticle scavenge unit |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105845612A (en) * | 2016-04-07 | 2016-08-10 | 上海华力微电子有限公司 | Mechanical arm and method utilizing mechanical arm to reduce particle defect |
| CN106898570A (en) * | 2017-04-14 | 2017-06-27 | 常州亿晶光电科技有限公司 | Cleaning of silicon wafer device |
| CN112271132A (en) * | 2020-10-28 | 2021-01-26 | 上海中欣晶圆半导体科技有限公司 | Method for removing large particles on surface of polished surface of silicon wafer |
| CN112382702A (en) * | 2020-11-05 | 2021-02-19 | 横店集团东磁股份有限公司 | Annealing method for improving white point of crystalline silicon double-sided battery |
-
2015
- 2015-02-04 CN CN201520081282.2U patent/CN204614764U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105845612A (en) * | 2016-04-07 | 2016-08-10 | 上海华力微电子有限公司 | Mechanical arm and method utilizing mechanical arm to reduce particle defect |
| CN106898570A (en) * | 2017-04-14 | 2017-06-27 | 常州亿晶光电科技有限公司 | Cleaning of silicon wafer device |
| CN112271132A (en) * | 2020-10-28 | 2021-01-26 | 上海中欣晶圆半导体科技有限公司 | Method for removing large particles on surface of polished surface of silicon wafer |
| CN112271132B (en) * | 2020-10-28 | 2022-03-04 | 上海中欣晶圆半导体科技有限公司 | Method for removing large particles on surface of polished surface of silicon wafer |
| CN112382702A (en) * | 2020-11-05 | 2021-02-19 | 横店集团东磁股份有限公司 | Annealing method for improving white point of crystalline silicon double-sided battery |
| CN112382702B (en) * | 2020-11-05 | 2022-08-16 | 横店集团东磁股份有限公司 | Annealing method for improving white point of crystalline silicon double-sided battery |
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Address after: 033000 Wenshui County Economic Development Zone, Lvliang, Shanxi Patentee after: Jinneng clean energy technology stock company Address before: 033000 Wenshui County Economic Development Zone, Lvliang, Shanxi Patentee before: Jin Neng Clean-tech Co., Ltd |
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| CP01 | Change in the name or title of a patent holder |