CN204585586U - The mounting or dismounting movement collision prevention device of the bonding crystalline substance holder of silicon ingot - Google Patents

Abstract

The mounting or dismounting movement collision prevention device of the bonding crystalline substance holder of a kind of silicon ingot, comprise cantilever fixed head and inclined-plane cantilever beam, inclined-plane cantilever beam is fixedly mounted on cantilever fixed head, two inclined-plane cantilever beams and V-arrangement docking orbit contact surface are bearing-surface, distance between two bearing-surface bottoms connects between neck breadth degree and V-arrangement docking orbit top width between crystalline substance holder, distance between two bearing-surface tops is less than V-arrangement docking orbit top width, and the shape of the bearing-surface of two inclined-plane cantilever beams matches with V-arrangement docking orbit.Because the inclined-plane cantilever beam of this collision prevention device matches with V-arrangement docking orbit, contact surface is ask by crystalline substance to change V-arrangement docking orbit into from crystalline substance holder rectangle bonding plane, inclined-plane cantilever beam all can not collide with crystalline silicon rod or finished product silicon chip in any case, stop in the operating process of upper and lower rod, crystalline silicon rod or finished product silicon chip collide with earth-moving equipment the damage caused because sliding, without waste paper, production efficiency is high, reduces production cost.

Description

The mounting or dismounting movement collision prevention device of the bonding crystalline substance holder of silicon ingot

Technical field:

The utility model relates to silicon chip manufacture field, particularly relates to bar device under a kind of NTC442 slicer of anticollision.

Background technology:

Crystal silicon solar energy battery is more and more applied to energy field, containing some silicon chips in crystal silicon solar energy battery, silicon chip is formed through multi-line cutting machine cutting by the silicon ingot of sizing, before silicon ingot cutting, silicon ingot must be bonded in the brilliant holder of cutting, the brilliant holder of cutting is as shown in Figure 1 by V-arrangement docking orbit 11, connection neck 12 and rectangle adhesive sheet 13 form, V-arrangement docking orbit 11 and rectangle adhesive sheet 13 are separately positioned on the two ends being up and down connected neck 12, silicon ingot must will be bonded with the cutting crystalline substance holder movement of silicon ingot on cutting machine with earth-moving equipment before upper machine cutting, V-arrangement docking orbit 11 on it is relied on to be inserted on cutting machine, with earth-moving equipment the holder of the cutting of bonding silicon chip crystalline substance shifted out from cutting machine again after cutting terminates and turn Degumming Procedures.Existing earth-moving equipment as shown in Figure 2 to 3, comprise cantilever fixed head 1 and cantilever beam 2, cantilever beam 2 is fixedly mounted on cantilever fixed head 1, the cross section of cantilever beam 2 is rectangle, distance between two cantilever beams 2 is greater than silicon ingot width and is less than the width of the rectangle adhesive sheet 13 in the brilliant holder of cutting, earth-moving equipment is that the slotting rectangle adhesive sheet 13 held in the brilliant holder of cutting of dependence two cantilever beams 2 realizes when the brilliant holder of scraper cutting, due to the cantilever beam of two on earth-moving equipment 2 medial surface between spacing only slightly wide than silicon ingot, during upper rod, two cantilever beams 2 get out of the way silicon ingot and insert on the lower surface of rectangle adhesive sheet 13, then the cutting crystalline substance being bonded with silicon ingot has been lifted the V-arrangement docking orbit 11 making to cut in brilliant holder concordant with erector's station guide rail on cutting machine, manually the holder of cutting crystalline substance is pushed in multi-wire saw working bench guide rail, install rear extraction cantilever beam 2, start to cut.After cutting terminates, first the cantilever beam 2 on earth-moving equipment is risen to the lower surface correspondence position of the rectangle adhesive sheet 13 in the brilliant holder of cutting, and then manually the holder of cutting crystalline substance is pulled out from multi-wire saw working bench guide rail, by cantilever beam 2 insert be bonded with silicon chip cutting crystalline substance holder rectangle adhesive sheet 13 below and dodge the silicon chip cut, slotting lower surface of holding rectangle adhesive sheet 13, the cutting crystalline substance holder that finally will be bonded with silicon chip all pulls out also movement to Degumming Procedures.Though the rod up and down that this cutting brilliant holder board migration device can be convenient and strength-saving, but, because the gap between cantilever beam 2 and crystalline silicon rod or finished product silicon chip edge is 2mm, therefore high to the insertion movement technical requirement of operator, if the insertion of cantilever beam 2 has excessive deviation in operating process, cantilever beam 2 will be caused to collide silicon ingot or finished product silicon chip, cause that crystal ingot is damaged or silicon chip is broken, because finished product silicon wafer thickness only has 200um, and silicon chip fragility is very big, silicon chip can be caused broken once produce collision, direct affect finished product silicon chip sheet rate, add up according to applicant, therefore the silicon chip breakage rate produced is up to 1.2%, the AOF calculation of 100,000,000 silicon chips is produced per year by applicant, thereby produce 1,200,000 silicon chips every year, the sale price of every block silicon chip is 6 yuan, bring direct losses up to 7,200,000 yuan to enterprise.

Utility model content:

The utility model provides the mounting or dismounting movement collision prevention device of the bonding crystalline substance holder of a kind of silicon ingot, it can not only be convenient and strength-saving the movement up and down completing the brilliant holder of cutting, and stopped the bonding crystalline substance holder of silicon ingot in upper and lower movement process to silicon ingot or silicon chip impact failure phenomenon, the silicon chip eliminating this operation is damaged, can improve silicon chip and obtain sheet rate 1.2%, economic benefit and social benefit are all very remarkable.

The technical scheme that the utility model adopts is:

The mounting or dismounting movement collision prevention device of the bonding crystalline substance holder of a kind of silicon ingot, it is characterized in that: comprise cantilever fixed head and inclined-plane cantilever beam, two inclined-plane cantilever beams are fixedly mounted on cantilever fixed head, the opposite face of two inclined-plane cantilever beams is set to and the bearing-surface cutting the brilliant V-arrangement docking orbit held in the palm and contact, distance between two bearing-surface bottoms is between the width and the width on V-arrangement docking orbit top of crystalline substance holder connection neck, distance between two bearing-surface tops is less than the width on V-arrangement docking orbit top, the shape of the bearing-surface of two inclined-plane cantilever beams matches with V-arrangement docking orbit.

Use procedure of the present invention is, during upper rod, two inclined-plane cantilever beams insert V-arrangement docking orbit, the cutting crystalline substance being bonded with silicon ingot is lifted the V-arrangement docking orbit making to cut in brilliant holder concordant with erector's station guide rail on cutting machine, manually the holder of cutting crystalline substance is pushed in multi-wire saw working bench guide rail, install rear extraction inclined-plane cantilever beam, start to cut.After cutting terminates, first the inclined-plane cantilever beam on the mounting or dismounting movement collision prevention device of bonding for silicon ingot crystalline substance holder is risen to position corresponding to the V-arrangement docking orbit cut in brilliant holder, and then manually the holder of cutting crystalline substance is pulled out from multi-wire saw working bench guide rail, inclined-plane cantilever beam is inserted the V-arrangement docking orbit of the cutting crystalline substance holder being bonded with silicon chip, insert and hold V-arrangement docking orbit, the cutting crystalline substance holder that finally will be bonded with silicon chip all pull-out movement to Degumming Procedures.

Because the inclined-plane cantilever beam of the mounting or dismounting movement collision prevention device of the bonding crystalline substance holder of this silicon ingot asks V-arrangement docking orbit to match with crystalline substance, change the mounting or dismounting movement collision prevention device of bonding for silicon ingot crystalline substance holder into crystalline substance with the brilliant contact surface held in the palm from crystalline substance holder rectangle adhesive sheet and hold in the palm V-arrangement docking orbit, the V-arrangement docking orbit held in the palm by crystalline substance carries out upper and lower rod, the inclined-plane cantilever beam of the mounting or dismounting movement collision prevention device of the bonding crystalline substance holder of such silicon ingot all can not collide with crystalline silicon rod or finished product silicon chip in any case, stop in the operating process of upper and lower rod, the mounting or dismounting movement collision prevention device that crystalline silicon rod or finished product silicon chip hold in the palm because of the crystalline substance bonding with silicon ingot that slide collides the damage caused, without waste paper, production efficiency is high, stop the loss that producer causes because of upper and lower rod motion, reduce production cost.

Accompanying drawing illustrates:

Fig. 1 is the structural representation of brilliant holder;

Fig. 2 is the structural representation of existing crystalline substance holder fixture;

Fig. 3 is existing crystalline substance holder fixture using state structural representation;

Fig. 4 is structural representation of the present utility model;

Fig. 5 is the right view of Fig. 4;

Fig. 6 is the utility model using state schematic diagram;

In figure: 1-cantilever fixed head; 2-cantilever beam; 3-inclined-plane cantilever beam; 4-bearing-surface; 11-V shape docking orbit; 12-connects neck; 13-rectangle adhesive sheet.

Detailed description of the invention:

Below in conjunction with accompanying drawing, specific embodiments of the present utility model is described:

The mounting or dismounting movement collision prevention device of the bonding crystalline substance holder of a kind of silicon ingot, as shown in Fig. 4 ~ Fig. 6, comprise cantilever fixed head 1 and inclined-plane cantilever beam 3, two inclined-plane cantilever beams 3 are fixedly mounted on cantilever fixed head 1, the opposite face of two inclined-plane cantilever beams 3 is set to and the bearing-surface 4 cutting the brilliant V-arrangement docking orbit 11 held in the palm and contact, distance between two bearing-surface 4 bottoms is between the width and the width on V-arrangement docking orbit 11 top of crystalline substance holder connection neck 12, distance between two bearing-surface 4 tops is less than the width on V-arrangement docking orbit 11 top, the shape of the bearing-surface 4 of two inclined-plane cantilever beams 3 matches with V-arrangement docking orbit 11.

Claims (1)

1. the mounting or dismounting movement collision prevention device of the bonding crystalline substance holder of silicon ingot, it is characterized in that: comprise cantilever fixed head (1) and inclined-plane cantilever beam (3), two inclined-plane cantilever beams (3) are fixedly mounted on cantilever fixed head (1), the opposite face of two inclined-plane cantilever beams (3) is set to and the bearing-surface (4) cutting the brilliant V-arrangement docking orbit (11) held in the palm and contact, distance between two bearing-surface (4) bottoms is between the width and the width on V-arrangement docking orbit (11) top of crystalline substance holder connection neck (12), distance between two bearing-surface (4) tops is less than the width on V-arrangement docking orbit (11) top, the shape of the bearing-surface (4) of two inclined-plane cantilever beams (3) matches with V-arrangement docking orbit (11).