CN103128865A - Silicon wafer cutting method - Google Patents
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- CN103128865A CN103128865A CN2011103885094A CN201110388509A CN103128865A CN 103128865 A CN103128865 A CN 103128865A CN 2011103885094 A CN2011103885094 A CN 2011103885094A CN 201110388509 A CN201110388509 A CN 201110388509A CN 103128865 A CN103128865 A CN 103128865A
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Abstract
The invention discloses a silicon wafer cutting method which comprises a first step of bonding a mucilage glue plate to a workpiece plate by a manner that glue is immersed into the water, a second step of bonding a silicon bar to the mucilage glue plate, and a third step of separating the workpiece plate from the mucilage glue plate through a water immersing method. According to the technical scheme, the mucilage glue plate and the workpiece plate are bonded by a manner that the glue is immersed into the water, when degumming is carried out on the mucilage glue plate, the separation between the mucilage glue plate and the workpiece plate can be achieved only through a poaching degumming method. Compared with a method of heating in high temperature in the prior art, according to the technical scheme, energy consumption is low, and pollution does not exist in the process of degumming of the mucilage glue plate.
Description
Technical field
The present invention relates to the solar silicon wafers manufacturing process technology field, more particularly, relate to a kind of method for cutting silicon chips.
Background technology
In energy crisis day by day serious today, developing new forms of energy is main directions of current energy field development.Solar energy is pollution-free, inexhaustible due to it, without advantages such as region restrictions, make solar electrical energy generation become the main direction of studying that present new energy development utilizes.Wherein solar cell is that people utilize a kind of principal mode of solar electrical energy generation.Silicon chip is the carrier of solar cell, is to be formed by the cutting of crystal silicon rod.Silicon chip cutting comprises that silicon rod viscose, silicon rod slicing, silicon wafer stripping, Wafer Cleaning, viscose board come unstuck and the technique such as silicon chip check.
Existing silicon chip cutting technique is to adopt epoxy glue that viscose board is bonded on work plate when carrying out silicon rod viscose technique, afterwards silicon rod is bondd on described viscose board by epoxy glue.Then, carry out silicon rod slicing.Existing silicon chip cutting technique adopts the scroll saw cutting preferably of cutting efficiency and quality when carrying out the silicon chip cutting.When silicon rod slicing, separate from silicon rod fully in order to guarantee silicon chip, the scroll saw heart yearn will with the viscose board of binding silicon rods on cut out in score corresponding to silicon chip.Simultaneously, the epoxy glue glue-line between silicon rod and viscose board will be cut into strip.After completing silicon rod slicing, come unstuck and the technique such as silicon chip check and then complete whole silicon chip cutting process by silicon wafer stripping, Wafer Cleaning, viscose board.
Due to can form on viscose board in cutting process score, the viscose board that needs to have used for the cut quality that guarantees next silicon chip separates, and changes new viscose board and carries out next time silicon rod slicing.
Prior art is being carried out viscose board when coming unstuck, when namely separating viscose board and work plate, because described viscose board and work plate are by whole epoxy glue glue-line bonding, area is large, cohesive force is strong, therefore, generally adopt the high-temperature heating mode with the evaporation of the binding agent between described viscose board and work plate, and then realize both separation.But, evaporate epoxy glue glue-line energy consumption by the mode of high-temperature heating high, and can produce pernicious gas, cause environmental pollution.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of silicon chip of solar cell cutting method, the method is used bubble glue bond work plate and viscose board, carry out viscose board when coming unstuck energy consumption low, and pollution-free.
For achieving the above object, the invention provides following technical scheme:
A kind of method for cutting silicon chips comprises step:
Adopt bubble glue that viscose board is bonded on work plate;
Silicon rod is bonded on described viscose board;
After the silicon chip cutting is completed, adopt the mode of water soaking to separate described work plate and viscose board.
Preferably, in said method, described viscose board is the resin viscose board.
Preferably, in said method, the thickness of described resin viscose board is 12mm-20mm.
Preferably, in said method, the silicon chip cutting mode comprises: adopt diamond fretsaw to carry out the silicon rod cutting;
Or adopt free abrasive multi-wire saw mode to carry out the silicon rod cutting.
Preferably, in said method, the mode of described employing water soaking separates described work plate and viscose board is: described resin viscose board and work plate are soaked 20min-30min in temperature in greater than the water of 90 ℃.
Preferably, in said method, described silicon rod bonds on described viscose board by epoxy glue.
Preferably, in said method, also comprise step after silicon chip cutting is completed with in the middle of separating described work plate and viscose board step: silicon chip is separated with described viscose board.
Preferably, in said method, the described concrete mode that silicon chip is separated with described viscose board is: it is 50 ℃ of-60 ℃ of water that silicon chip and viscose board coupling part are placed in temperature, soaks 10min-15min.
Preferably, in said method, after coming unstuck, described viscose board also comprises step: the silicon chip after described separation is cleaned, remove the impurity of silicon chip surface.
Preferably, in said method, also comprise: the silicon chip after cleaning is carried out quality inspection.
Can find out from technique scheme, method for cutting silicon chips provided by the present invention comprises step: adopt bubble glue that viscose board is bonded on work plate; Silicon rod is bonded on described viscose board; After the silicon chip cutting is completed, adopt the mode of water soaking to separate described work plate and viscose board.By to the description of technical scheme of the present invention as can be known, described method for cutting silicon chips adopts bubble glue bond viscose board and work plate, carrying out viscose board when coming unstuck, only need to realize separating of viscose board and work plate by the poach mode of coming unstuck, than high-temperature heating mode of the prior art, described technical scheme is being carried out viscose board when coming unstuck when coming unstuck carrying out viscose board, and energy consumption is low, and pollution-free.
Description of drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or description of the Prior Art, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The schematic flow sheet of a kind of method for cutting silicon chips that Fig. 1 provides for the embodiment of the present invention;
The schematic flow sheet of the another kind of method for cutting silicon chips that Fig. 2 provides for the embodiment of the present invention;
A kind of modular construction schematic diagram that adopt of the present invention institute technical scheme be bonded together of Fig. 3 for providing for the embodiment of the present invention;
Fig. 4 is assembly incision principle schematic diagram in Fig. 3.
The specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Just as described in the background section, existing silicon chip cutting technique adopts the high-temperature heating mode with the evaporation of the binding agent between described viscose board and work plate, and then realizes both separation.But, evaporate binding agent glue-line energy consumption by the mode of high-temperature heating larger, and can produce pernicious gas, cause environmental pollution.
Embodiment one
For addressing the above problem, the invention provides a kind of method for cutting silicon chips, with reference to figure 1, the schematic flow sheet of a kind of method for cutting silicon chips that Fig. 1 provides for the embodiment of the present invention, described method comprises step:
S1: adopt bubble glue that viscose board is bonded on work plate.
The shape of described work plate is complementary with the shape of the silicon rod that will cut, and described viscose board shape and described work plate shape are complementary.
Viscose board is as the carrier of silicon chip in crystal bar cutting, and its intensity and toughness all need the requirement that reaches certain.When carrying out silicon rod slicing, usually adopt cut quality scroll saw cutting mode preferably in prior art, as diamond fretsaw cutting or free abrasive multi-wire saw.Conventional viscose board is glass plate or graphite cake, according to the difference of the material of employing viscose board, selects corresponding cutting mode, and generally the diamond fretsaw cutting mode will use the graphite viscose board, and free abrasive multi-wire saw mode will be used the glass viscose board.
S2: silicon rod is bonded on described viscose board.
Complete silicon rod viscose, namely after completing steps S1 and step S2, select concrete scroll saw cutting mode according to viscose board used, silicon rod is carried out sectioning.Same as the prior art, as using the graphite viscose board, by diamond fretsaw, silicon rod is cut into slices; As use the glass viscose board to use free abrasive multi-wire saw mode that silicon rod is cut into slices.
S3: after the silicon chip cutting is completed, adopt the mode of water soaking to separate described work plate and viscose board.
After completing sectioning, silicon rod is cut into a plurality of silicon chips, described a plurality of silicon chip be by with viscose board between the epoxy glue that is cut into strip be connected, the width of epoxy adhesive tape is the thickness of silicon chip, be generally several millimeters at zero point, due to reducing of bond area, so by simple water soaking, just all silicon chips can be separated from viscose board.Concrete, after whole silicon rod cutting is completed, the junction of silicon chip and viscose board is become to be placed in the water of 50 ℃ of-60 ℃ of left and right, soak the 10min-15min left and right, silicon chip is separated with viscose board.Need to prove that described water temperature and soak time are not enough to separate viscose board and work plate owing to passing through the glue bond of large tracts of land bubble between viscose board and work plate.
Need to be by cleaning to remove surface impurity for the silicon chip that separates, described cleaning way comprises: chemical reagent cleans and ultrasonic washing with clean water.Then, through quality inspection, size and the surface cleanliness of check silicon chip.
All silicon chips with after viscose board separates, for the viscose board that is fixed together by the bubble glue bond and work plate, are placed in the hot water of 90 ℃ and soak 20min-30min, and then can realize separating of work plate and viscose board.When carrying out next silicon rod cutting, the new viscose board of bonding on work plate repeats aforesaid operations and gets final product.By above-mentioned discussion as can be known, described viscose board and work plate separation method are simple, easy to operate, and energy consumption is low, and be pollution-free.
By to the description of the method for cutting silicon chips of the present embodiment as can be known, described method for cutting silicon chips is completed the silicon rod cutting, carries out viscose board when separating with work plate, only need carry out hot-water soak can realize separating of work plate and viscose board, simple to operate, energy consumption is low, and safety is depolluted.
Embodiment two
Although the glass viscose board is widely used in the free abrasive multi-line cutting process.But because the viscose board of glass material is easily broken, so when carrying out silicon rod slicing, require the cutting force good uniformity of scroll saw, and be of moderate size, avoid causing because local pressure is excessive the glass viscose board broken, and then cause silicon chip to fall sheet, or even the generation of fragment problems.When carrying out the actual production of silicon rod slicing by the glass viscose board, broken for fear of the glass viscose board, the production of scroll saw with cutting force often less than its actual cutting force, although described mode has reduced fragment rate to a certain extent, but affected the silicon chip cutting efficiency, and then reduced production efficiency.Same, broken for fear of the glass viscose board when scroll saw is returned sword, need higher technological requirement, so also caused cutting efficiency low.
And in the diamond fretsaw cutting, because the diamond fretsaw cutting force is stronger, and the glass poor toughness is easily broken, so as using the glass viscose board as the viscose board of diamond fretsaw cutting, very easily cause glass plate broken.Therefore, the existing general preferred use graphite cake of diamond fretsaw cutting technique carries out the cutting of silicon rod as viscose board.
yet, although graphite material is softer, but graphite material belongs to lubriation material, when online saw is cut to the graphite viscose board, lubrication due to graphite, the cutting power of diamond fretsaw is reduced greatly, in order to overcome graphite to the impact of diamond wire cutting force weakening effect, need to increase the cutting power that line of cut bends to increase diamond wire, and then caused the consumption of diamond wire to increase, and due to graphite lubrication preferably, this mode is not very good to the effect that improves cutting efficiency, and bend to increase the cutting power of diamond wire because increasing line of cut in the cutting process of returning sword, make the silicon chip edge discontinuity, and then increase silicon chip edge sheet proportion.
Wherein, described diamond wire is the instrument that scroll saw is used for cutting silicon rod, in diamond fretsaw, the diamond wire surface is fixed with diamond abrasive grains, be common diamond wire in free abrasive multi-wire saw scroll saw, at this moment, mainly rely on diamond or silicon-carbide particle in free abrasive to cut; Described silicon chip edge sheet is: silicon chip edge does not run through the SOL zone of silicon chip, its size is provided by radial depth and peripheral chord length, or silicon chip edge or side be due to not polishing, polishing is insufficient or the reason such as line cutting causes the continuous zigzag defective of silicon chip edge, and edge piece is the slightly poor silicon chip of credit rating.
For the problems referred to above, on the basis of embodiment one, the present embodiment provides another kind of method for cutting silicon chips, and with reference to figure 2, described method comprises step:
S11: adopt bubble glue that the resin viscose board is bonded on work plate.
Wherein, the shape of described work plate is complementary with the shape of the silicon rod that will cut, and described resin viscose board shape and described work plate shape are complementary.
In actual silicon rod sectioning, in order to guarantee the silicon chip cutting fully, guarantee that namely silicon chip separates fully from silicon rod, the darkest degree of depth that will cut viscose board 10mm left and right of scroll saw.So described viscose board is the resin viscose board of thickness between 12mm-20mm, guaranteeing that silicon chip cuts completely simultaneously, avoid causing whole viscose board to be cut because viscose board thickness is too small, and then the defective work piece plate.The cut part of viscose board can guarantee that viscose glue avoids because being cut fracture, and then has avoided falling the generation of sheet, fragment problems.
The present embodiment adopts the resin viscose board, because the resin viscose board on the one hand can be little with glass viscose board difference on hardness, meets in the scroll saw cutting requirement to viscose board hardness; Than the graphite viscose board, unlubricated effect, little to the scroll saw loss, the cutting that namely consumes is few with diamond wire; Simultaneously, greatly be better than the glass viscose board on toughness, in normal cutting operation process, generally can not occur to cause falling the problems such as sheet, fragment because viscose board is broken.So described resin viscose board can substitute the graphite viscose board on the one hand, carry out the diamond fretsaw cutting, avoided the generation to Chang Wenti such as the reduction of scroll saw cutting force and the increases of silicon chip edge sheet ratio when returning sword cutting of graphite viscose board; On the other hand, also can replace the glass viscose board to carry out the free abrasive multi-wire saw, avoid because of the broken generation that causes falling sheet, fragment problems of viscose board.
S12: with binding silicon rods on described viscose board.
Concrete, adopt epoxy glue with binding silicon rods to be cut on described viscose board.
Complete silicon rod viscose by step S11 and step S12, because the present embodiment adopts the resin viscose board, therefore, can select diamond fretsaw cutting or any scroll saw cutting mode of free abrasive multi-wire saw that silicon rod is cut into slices, avoid the restriction of viscose board material to cutting mode.
By above-mentioned discussion to the resin viscose board as can be known, no matter adopt which kind of scroll saw cutting mode, the hardness that suitable scroll saw cutting is arranged due to the resin viscose board, when carrying out silicon rod slicing, when scroll saw is cut to the resin viscose board, described resin viscose board is little to the loss of scroll saw, has reduced the consumption of scroll saw diamond wire, and then has reduced production cost; And described resin viscose board has toughness preferably, and not easy fracture, fragmentation can be given full play to the maximum cutting force of scroll saw during cutting, and cutting efficiency is high; And change effect without profit, avoided having reduced silicon chip edge sheet ratio due to the impact on the viscose board cutting force of the lubrication of viscose board.
S13: after the silicon chip cutting is completed, adopt the mode of water soaking to separate described work plate and viscose board.
Described work plate separates by hot-water soak with the viscose board separate type, and operating procedure is identical with step S3 in embodiment one.Therefore, simple to operate with beneficial effect described in embodiment, energy consumption is low, and safe, pollution-free.
Below, illustrate that by two groups of contrast experiments the resin viscose board replaces graphite viscose board and the cutting effect of glass viscose board in the silicon rod cutting.
First group of contrast experiment:
Experimental example one: use graphite as viscose board, use diameter on the slicer of NTC-442DW model, two long 8 cun silicon rods as 300mm to be carried out the diamond fretsaw cutting technique as the diamond wire of 0.15mm, its depth of cut reaches 170mm, the diamond wire use amount is 16km, and silicon chip edge sheet proportion is 6%.Wherein, the described degree of depth is to weigh the parameter of scroll saw cutting force and cutting effect, and described 170mm depth of cut refers to 8 cun distances that silicon rod is advanced of scroll saw cutting 300mm on cut direction, and its numerical value is larger, and expression scroll saw cutting force is less, and cutting effect is poorer.
Contrast experiment's example one: the resin viscose board that graphite viscose board in experimental example one is changed into same size, carry out identical cutting operation, its depth of cut is only 164mm, the diamond wire consumption is 14km, cutting silicon wafer edge piece ratio is only 3%, and clipping time than experimental example one time used reduces greatly.
This group test data shows, adopts the resin viscose board to replace the graphite viscose board to carry out the diamond fretsaw cutting technique, and the heart yearn consumption is few, has reduced production cost; And the silicon chip edge sheet is few, has improved product quality; Clipping time is short, has improved production efficiency.
Second group of contrast experiment:
Experimental example two: use glass as viscose board, use diameter to use two long 8 cun silicon rods as 300mm of free abrasive cutting as the common steel wire of 0.12mm on the NTC-442 slicer, glass fragmentation faced causes falling the sheet ratio in 1% left and right.
Contrast experiment's example two: change the glass viscose board in experimental example two into the resin viscose board, carry out cutting operation identical in experimental example two, do not fall sheet in cutting, the steel wire consumption is more or less the same, but the time used is short than the glass viscose board.
This group contrast experiment explanation when carrying out the cutting of silicon rod scroll saw, adopts the resin viscose board to replace the glass viscose board to carry out cutting technique, there is no fragment, has improved yield rate, and clipping time is short, has improved production efficiency.
By above-mentioned discussion as can be known, the present embodiment replaces traditional graphite viscose board and glass viscose board by the resin viscose board, when carrying out silicon rod slicing, meets the scroll saw split requirement due to the resin viscose board on hardness and toughness, and is little to the scroll saw loss.
On the one hand, than the glass viscose board, its toughness is better, can not occur to cause falling the problems such as sheet, fragment because viscose board is broken in normal cutting process, has improved yield rate.
On the other hand, than the graphite viscose board, the reduction to scroll saw heart yearn cutting force when returning sword cutting of graphite viscose board has been avoided in unlubricated effect, has reduced the consumption of diamond wire, has improved production efficiency; Simultaneously, reduced the edge piece ratio;
And, due to resin viscose board moderate strength, good toughness, easy fracture not can be given full play to the most suitable cutting force of scroll saw heart yearn, and cutting efficiency is high.
Simultaneously, adopt the described resin viscose board of bubble glue bond and work plate, carrying out viscose board when coming unstuck, only need by hot-water soak, can realize separating of resin viscose board and work plate and work plate, separation method is simple, easy to operate, and energy consumption is low, and is pollution-free.
Embodiment three
With reference to figure 3, Fig. 4, on the basis of embodiment one and embodiment two, above-mentioned two embodiment are described more specifically by explanation.
With reference to figure 3, a kind of modular construction schematic diagram that adopts institute of the present invention technical scheme to be bonded together that Fig. 3 provides for the embodiment of the present invention.Specific implementation is: pass through fixedly viscose board 3 of bubble glue-line 2 bondings on work plate 1; Viscose board 3 tops are by the adhesive layer 4 fixing silicon rods 5 to be cut of bonding, and described binding agent is preferably epoxy glue.
Wherein, described viscose board 3 is preferably the resin viscose board, at first, resin viscose board price is cheap than glass viscose board and graphite viscose board, purchase cost is low, and simultaneously as described in embodiment one and embodiment two, the resin viscose board is than traditional graphite viscose board and glass viscose board, when carrying out silicon rod scroll saw sheet, cutting efficiency, yield rate are high.
Concrete, when carrying out silicon rod slicing, will hang cutting by the assembly that the silicon rod that is bonded together, viscose board and work plate consist of.With reference to figure 4, soon in Fig. 3, assembly carries out 180 ° of vertically rotations, cuts after suspension.Scroll saw 6 is from the silicon rod below, and along cut direction shown in arrow, from the bottom to top, cut position shown in dotted line in Fig. 4.In order to make cutting fully, after each cutting was completed, scroll saw 6 will be in the score of the interior formation of viscose board 3 10mm left and right, as shown in curve in Fig. 46.
Need to prove, when online sawing is cut, because friction will produce high temperature, if do not take measures, will cause at silicon chip surface and stain and scroll saw broken string equivalent risk.So, no matter be to adopt the diamond fretsaw cutting, still adopt the free abrasive cutting, need to cut cooling measure.
Therefore, preferably, technical solution of the present invention is hanging cutting, with the silicon rod 5 of the assembly after hanging and part viscose board 3 is immersed in the water or the liquid environment such as free abrasive in cut, avoid the silicon chip surface burn, also avoid cutting simultaneously the dust pollution of generation.As use diamond fretsaw cutting, described cutting cooling measure can also for: be continuously scroll saw and carry out the trickle operation.
After completing silicon rod slicing, the subsequent technique operation is identical with the described operating procedure of embodiment two with embodiment one.
By above-mentioned description to embodiment of the present invention technical scheme and specific works process operation principle as can be known, identical with embodiment two with embodiment one, the described method for cutting silicon chips of the present embodiment, when carrying out the cutting of silicon rod scroll saw, reduced the consumption (being mainly the consumption of line bow and diamond wire) of scroll saw, and then reduced production costs; Simultaneously, resin viscose board moderate strength, cutting efficiency is high; Good toughness is difficult for occuring silicon chip and falls the sheet problem, and yield rate is high.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and General Principle as defined herein can be in the situation that do not break away from the spirit or scope of the present invention, realization in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a method for cutting silicon chips, is characterized in that, comprises step:
Adopt bubble glue that viscose board is bonded on work plate;
Silicon rod is bonded on described viscose board;
After the silicon chip cutting is completed, adopt the mode of water soaking to separate described work plate and viscose board.
2. method according to claim 1, is characterized in that, described viscose board is the resin viscose board.
3. method according to claim 2, is characterized in that, the thickness of described resin viscose board is 12mm-20mm.
4. method according to claim 1, is characterized in that, the silicon chip cutting mode comprises:
Adopt diamond fretsaw to carry out the silicon rod cutting;
Or adopt free abrasive multi-wire saw mode to carry out the silicon rod cutting.
5. method according to claim 1, is characterized in that, the mode of described employing water soaking separates described work plate and viscose board is: described resin viscose board and work plate are soaked 20min-30min in temperature in greater than the water of 90 ℃.
6. method according to claim 1, is characterized in that, described silicon rod bonds on described viscose board by epoxy glue.
7. method according to claim 1, is characterized in that, also comprises step after silicon chip cutting is completed with in the middle of separating described work plate and viscose board step: silicon chip is separated with described viscose board.
8. method according to claim 7, is characterized in that, the described concrete mode that silicon chip is separated with described viscose board is: it is 50 ℃ of-60 ℃ of water that silicon chip and viscose board coupling part are placed in temperature, soaks 10min-15min.
9. method according to claim 7, is characterized in that, also comprises step after described viscose board comes unstuck: the silicon chip after described separation is cleaned, remove the impurity of silicon chip surface.
10. method according to claim 9, is characterized in that, described method also comprises: the silicon chip after cleaning is carried out quality inspection.
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| CN103522428A (en) * | 2013-10-16 | 2014-01-22 | 内蒙古中环光伏材料有限公司 | Solar silicon wafer processing method and device |
| CN103756616A (en) * | 2014-01-23 | 2014-04-30 | 高佳太阳能股份有限公司 | Application of thermosensitive epoxy resin adhesive in multiline cutting |
| CN103786272A (en) * | 2013-12-23 | 2014-05-14 | 镇江环太硅科技有限公司 | Solar polycrystalline silicon ingot cutting method |
| CN107473331A (en) * | 2017-08-17 | 2017-12-15 | 隆基绿能科技股份有限公司 | Concentrated water treatment method and silicon wafer stripping method |
| CN109435079A (en) * | 2018-09-17 | 2019-03-08 | 无锡斯贝尔磁性材料有限公司 | A kind of diamond wire saw method |
| CN111805781A (en) * | 2020-07-24 | 2020-10-23 | 四川永祥硅材料有限公司 | Silicon material cutting process |
| CN114770781A (en) * | 2022-06-22 | 2022-07-22 | 成都泰美克晶体技术有限公司 | SC wafer chord-changing positioning device and using method thereof |
| CN114853325A (en) * | 2022-06-06 | 2022-08-05 | 安徽光智科技有限公司 | Isolation bonding method for chalcogenide glass |
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