CN108407118A - A kind of diamond cutting line slicing machine - Google Patents
A kind of diamond cutting line slicing machine Download PDFInfo
- Publication number
- CN108407118A CN108407118A CN201810419267.2A CN201810419267A CN108407118A CN 108407118 A CN108407118 A CN 108407118A CN 201810419267 A CN201810419267 A CN 201810419267A CN 108407118 A CN108407118 A CN 108407118A
- Authority
- CN
- China
- Prior art keywords
- cutting
- diamond wire
- diamond
- power supply
- external power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to a kind of efficient diamond cutting line slicing machines, including pedestal and workbench, cutting liquid spray equipment is provided on the workbench, two parallel guide wheels, I-beam wheel wind diamond wire on the guide wheel, diamond wire both ends are connected in I-beam wheel, it is characterized in that the diamond cutting line slicing machine further includes the external power supply that diamond wire can be promoted to form electrical circuit with cutting liquid, the external power supply anode is connect with Buddha's warrior attendant gauze, and cathode is connect with cutting liquid.During high-speed cutting, after external power supply is powered, electrolysis occurs for cutting liquid, precipitated oxygen is returned on the net in diamond wire, cutting adsorbing powder dust is hindered on diamond wire, effectively avoids micro mist from blocking diamond wire cutting edge, diamond wire cutting force is able to continually and steadily, cut identical material, stria ratio declines 1.05%, and broken string ratio reduces by 4.3%, and about 0.5h can be reduced per knife clipping time, hilted broadsword line consumption reduces 1km, and A product rate can promote about 5.1%.
Description
Technical field
The present invention relates to photovoltaic industry more particularly to Buddha's warrior attendant wire cutting industries.
Background technology
As a kind of reproducible clean energy resource, solar energy application is more and more extensive, and photovoltaic generation is then most important
One of field, wherein silicon chip is the important component of solar cell, and the preparation of silicon chip at present is using a kind of more mostly
Crystalline silicon rod is cut into required silicon chip by the method for wire cutting, and cutting mode usually has silicon carbide mortar cutting and diamond wire
Cutting.It is cut compared to traditional mortar, industry diamond wire singulation crystal silicon, polysilicon or sapphire have some superiority at present, cut
Cut time shortening, twice or more of the cutting of single board production capacity traditional mortar, and thinner silicon chip can be cut, in addition also have at
The advantages that this decline, environmental pollution reduces, so Buddha's warrior attendant wire cutting will be popularized increasingly.But diamond wire conventional at present is cut
There is also apparent defects for piece machine, and in Buddha's warrior attendant wire cutting, cutting liquid dispersion performance is limited, and part silica flour is in Buddha's warrior attendant wire cutting
Remain in diamond wire crack and be difficult to exclude, as clipping time extends, sedimentating dust is more on diamond wire, and " paste " lives golden steel
Line, causes diamond wire cutting power to decline, and such phenomenon is more apparent with the propulsion of graph thinning.
Invention content
Therefore, it is an object of the invention to solve the problems, such as above-mentioned cutting process dust accumulation, one kind is provided rapidly and efficiently
The diamond cutting line slicing machine of dedusting, specific technical solution are as follows.
A kind of diamond cutting line slicing machine, including pedestal and workbench, are provided with cutting liquid spray equipment on the workbench, and two
The parallel guide wheel of root, two I-beam wheels, the cutting liquid spray equipment include water tank, water pump, nozzle, and gold is wound on the guide wheel
Rigid line, diamond wire both ends are connected in I-beam wheel, it is characterised in that the slicer further include can promote diamond wire with
Cutting liquid forms the external power supply of electrical circuit, the external power supply anode connect diamond wire or its by way of any position, cathode connects
Cutting liquid spray equipment.
Further, external power supply anode be preferably connected to diamond wire by way of any one I-beam wheel, cathode
Preferably it is connected in water tank.
Further, the external power supply（4）Voltage is 10 ~ 100 volts, it is preferred that voltage is 20 ~ 40 volts.
Compared with prior art, the beneficial effects of the present invention are in cutting process, external power supply leads to diamond wire simultaneously
Electricity, the cutting liquid contacted with Buddha's warrior attendant gauze occur cell reaction and then hinder adsorbing powder dust in diamond wire surface precipitated oxygen
On diamond wire, the cleaning of diamond wire ensure that so that diamond wire cutting force is able to continual and steady performance, reduces silicon chip line
Trace and broken string ratio, reduce clipping time, cost-effective, while improving A product rates.
Description of the drawings
Attached drawing 1 is saw working bench schematic diagram.
Attached drawing 2 is cutting process circuit diagram.
Specific implementation mode
Present invention will be further explained below with reference to the attached drawings and examples, and applicant makees detailed by way of examples below
It describes in detail bright, but is not limitation to the present invention program to the description of embodiment, any design according to the present invention is made
Only formal but not substantive equivalent transformation is regarded as technical scheme of the present invention scope.
Referring to attached drawing 1, shows a kind of diamond cutting line slicing machine, including pedestal and workbench, be provided on the workbench
Cutting liquid spray equipment（1）, two parallel guide wheels（2）, two I-beam wheels（3）, the cutting liquid spray equipment（1）Including water
Case（11）, water pump（12）, nozzle（13）, the guide wheel（2）Upper winding diamond wire（5）, diamond wire（5）Both ends are connected to two
A I-beam wheel（3）On, it is characterised in that the slicer further includes that can promote diamond wire（5）Electrical circuit is formed with cutting liquid
External power supply（4）.
Further, the external power supply（4）Anode connects diamond wire or any position of its approach, and cathode connects cutting liquid spray
Shower device（1）.
Further, the external power supply（4）Positive any one I-beam wheel for being preferably connected on diamond wire approach（3）
On.
Further, the external power supply（4）Cathode is preferably connected on water tank（11）It is interior.
Referring to attached drawing 2, show in cutting machine operational process, external power supply（4）Diamond wire after energization（5）With cutting liquid shape
At an electrical circuit, guide wheel（3）On Buddha's warrior attendant gauze be equivalent to the anode in cell reaction, cutting liquid（6）With Buddha's warrior attendant gauze
After contact, cutting liquid（6）Cell reaction occurs, the precipitated oxygen on diamond wire then hinders adsorbing powder dust on diamond wire.
In conclusion technical solution provided by the invention, solves the problems, such as adsorbing powder dust on diamond wire, ensure that gold
The cleaning of rigid line so that diamond wire cutting force is able to continual and steady performance, reduces silicon chip stria and broken string ratio, reduces cutting
It is time, cost-effective, while improving A product rates.
By actual production, when the crystal bar of cutting same material, other process conditions are certain, external power supply installed, to powder
The elimination effect of dirt is apparent, specific embodiment as described below.
Embodiment 1
The diamond cutting line slicing machine equipped with MB50 model I-beam wheels is selected, in the case of no external power supply, sets diamond wire clipping time
For 120min, hilted broadsword line consumption is 3.2km, and final breakage ratio 3.5%, stria rate 1.8%, A product rates are 90.3%.
Embodiment 2
The diamond cutting line slicing machine equipped with MB50 model I-beam wheels, external 24 volts of power supplys, anode is selected to connect any one I-beam wheel
On, in cathode water receiving case, diamond wire clipping time is set as 20min, hilted broadsword line consumption is 3.2km, final breakage ratio 1.6%, stria
Rate 0.7%, A product rates are 95.1%.
Embodiment 3
The diamond cutting line slicing machine equipped with MB50 model I-beam wheels, external 40 volts of power supplys, anode is selected to connect any one I-beam wheel
On, in cathode water receiving case, diamond wire clipping time is set as 120min, hilted broadsword line consumption is 3.2km, final breakage ratio 1.8%, line
Trace rate 0.9%, A product rates are 92.8%.
Claims (5)
1. a kind of diamond cutting line slicing machine, including pedestal and workbench, cutting liquid spray equipment is provided on the workbench（1）,
Two parallel guide wheels（2）, I-beam wheel（3）, the cutting liquid spray equipment（1）Including water tank（11）, water pump（12）, nozzle
（13）, the guide wheel（2）Upper winding diamond wire（5）, diamond wire（5）Both ends are connected to I-beam wheel（3）On, it is characterised in that
The slicer further includes that can promote diamond wire（5）The external power supply of electrical circuit is formed with cutting liquid（4）.
2. a kind of diamond cutting line slicing machine according to claim 1, the external power supply（4）Anode connects diamond wire（5）, cathode
Connect cutting liquid spray equipment（1）.
3. a kind of diamond cutting line slicing machine according to claim 1 or 2, the external power supply（4）Anode is preferably connected to
Any one I-beam wheel（3）, cathode is preferably connected to water tank（11）It is interior.
4. a kind of Buddha's warrior attendant wire cutting machine according to claim 1, the external power supply（4）Voltage be 10 ~ 100 volts.
5. a kind of Buddha's warrior attendant wire cutting machine according to claim 4, the external power supply（4）Voltage be preferably 20 ~ 40 volts
It is special.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810419267.2A CN108407118A (en) | 2018-05-04 | 2018-05-04 | A kind of diamond cutting line slicing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810419267.2A CN108407118A (en) | 2018-05-04 | 2018-05-04 | A kind of diamond cutting line slicing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108407118A true CN108407118A (en) | 2018-08-17 |
Family
ID=63137613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810419267.2A Pending CN108407118A (en) | 2018-05-04 | 2018-05-04 | A kind of diamond cutting line slicing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108407118A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109571783A (en) * | 2018-12-27 | 2019-04-05 | 西安奕斯伟硅片技术有限公司 | Spray structure, work piece cut system and the spraying method of cutting line |
| CN110180915A (en) * | 2019-07-17 | 2019-08-30 | 高特(江苏)新材料有限公司 | A kind of diamond wire bus stretches drawing impurity removing device |
| CN110539413A (en) * | 2019-10-12 | 2019-12-06 | 青岛高测科技股份有限公司 | Diamond single-line electric spark composite machining method and device |
| CN110587840A (en) * | 2019-10-12 | 2019-12-20 | 青岛高测科技股份有限公司 | Diamond multi-wire electric spark discharge cutting method and wire cutting device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101797713A (en) * | 2010-04-08 | 2010-08-11 | 南京航空航天大学 | Grinding/electrolyzing composite multiline-cutting processing method for silicon wafer |
| CN103991140A (en) * | 2014-04-28 | 2014-08-20 | 阳光硅谷电子科技有限公司 | Diamond wire-electrode cutting technology for silicon rod |
| TWM545684U (en) * | 2017-03-03 | 2017-07-21 | 環球晶圓股份有限公司 | Cutting apparatus |
| CN107486951A (en) * | 2017-08-29 | 2017-12-19 | 浙江华友电子有限公司 | A kind of in line efficient silicon wafer cutting device of push type |
| CN107649756A (en) * | 2017-09-21 | 2018-02-02 | 河南理工大学 | A kind of processing unit (plant) for being used to process the anti-clip slot of superthin diamond cutting blade |
| CN208263217U (en) * | 2018-05-04 | 2018-12-21 | 江苏聚成金刚石科技有限公司 | A kind of diamond cutting line slicing machine |
-
2018
- 2018-05-04 CN CN201810419267.2A patent/CN108407118A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101797713A (en) * | 2010-04-08 | 2010-08-11 | 南京航空航天大学 | Grinding/electrolyzing composite multiline-cutting processing method for silicon wafer |
| CN103991140A (en) * | 2014-04-28 | 2014-08-20 | 阳光硅谷电子科技有限公司 | Diamond wire-electrode cutting technology for silicon rod |
| TWM545684U (en) * | 2017-03-03 | 2017-07-21 | 環球晶圓股份有限公司 | Cutting apparatus |
| CN107486951A (en) * | 2017-08-29 | 2017-12-19 | 浙江华友电子有限公司 | A kind of in line efficient silicon wafer cutting device of push type |
| CN107649756A (en) * | 2017-09-21 | 2018-02-02 | 河南理工大学 | A kind of processing unit (plant) for being used to process the anti-clip slot of superthin diamond cutting blade |
| CN208263217U (en) * | 2018-05-04 | 2018-12-21 | 江苏聚成金刚石科技有限公司 | A kind of diamond cutting line slicing machine |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109571783A (en) * | 2018-12-27 | 2019-04-05 | 西安奕斯伟硅片技术有限公司 | Spray structure, work piece cut system and the spraying method of cutting line |
| CN110180915A (en) * | 2019-07-17 | 2019-08-30 | 高特(江苏)新材料有限公司 | A kind of diamond wire bus stretches drawing impurity removing device |
| CN110180915B (en) * | 2019-07-17 | 2023-12-08 | 高特(江苏)新材料有限公司 | Diamond wire bus stretching impurity removing device |
| CN110539413A (en) * | 2019-10-12 | 2019-12-06 | 青岛高测科技股份有限公司 | Diamond single-line electric spark composite machining method and device |
| CN110587840A (en) * | 2019-10-12 | 2019-12-20 | 青岛高测科技股份有限公司 | Diamond multi-wire electric spark discharge cutting method and wire cutting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 223800 No.18, Qixiashan Road, Susu Industrial Park, Suqian City, Jiangsu Province Applicant after: Jiangsu Jucheng Diamond Technology Co.,Ltd. Address before: 223800 No.18, Qixiashan Road, Susu Industrial Park, Sucheng District, Suqian City, Jiangsu Province Applicant before: JIANGSU JUCHENG DIAMOND TECHNOLOGY Co.,Ltd. |
|
| CB02 | Change of applicant information |