CN107486951A - A kind of in line efficient silicon wafer cutting device of push type - Google Patents
A kind of in line efficient silicon wafer cutting device of push type Download PDFInfo
- Publication number
- CN107486951A CN107486951A CN201710753888.XA CN201710753888A CN107486951A CN 107486951 A CN107486951 A CN 107486951A CN 201710753888 A CN201710753888 A CN 201710753888A CN 107486951 A CN107486951 A CN 107486951A
- Authority
- CN
- China
- Prior art keywords
- push type
- cutting device
- silicon wafer
- wafer cutting
- guide wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention relates to a kind of in line efficient silicon wafer cutting device of push type, belong to silicon chip cutting processing field, including guide wheel, diamond wire is tied with the guide wheel, the in line mode of silicon heavy stone used as an anchor is arranged on the diamond wire, and pushing ram is provided with after the silicon heavy stone used as an anchor, and the pushing ram is connected with motor, infrared inductor is provided among the pushing ram, both ends are provided with coolant nozzle above the guide wheel.Structure design of the present invention is simple, convenient, practical and can prevent silicon chip from being deformed in cutting process, effectively raises rate of cutting and efficiency, reduces silicon chip clipping time.
Description
Technical field
The invention belongs to silicon chip cutting processing field, relates generally to a kind of in line efficient silicon wafer cutting device of push type.
Background technology
Popularization and the extra normal development of semiconductor industry in recent years with world community green energy resource, silicon chip cutting processing
The backwardness of ability and the wretched insufficiency of production capacity have constituted the bottleneck of industrial chain.Silicon chip cutting is electronics industry main raw material(s) one
The upstream key technology of silicon chip (wafer) production, quality and the scale of cutting directly influence the subsequent production of whole industrial chain.
In the electronics industry, the demand of silicon chip is mainly manifested in the semiconductor industries such as solar energy power generating and integrated circuit.Its
In, silicon chip cuts the most common problem of strabismus.
Chinese invention patent (application number：201610741494.8) disclose a kind of diamond wire wire cutting machine, it is proposed that bag
Base and the workbench on base are included, the side of workbench is provided with the roller for being used for placing diamond wire, the workbench
Roller one and roller two are respectively equipped with upper and lower both sides, it is characterised in that regulation dress is provided between described roller and roller one
Put, the adjusting means includes cylinder and the roller three positioned at cylinder piston rod end, and cutting machine also includes magnetic valve, described
Cylinder and magnetic valve between connected by tracheae.This cutting machine uses solenoid valve control cylinder so that diamond wire is constantly in
Tensioned state so that the operating efficiency of cutting machine is higher.The invention solves the problems, such as that diamond wire line of cut difficulty is tightened.
Chinese invention patent (application number：201310746209.8) disclose a kind of silicon chip cutter, including silicon chip cutting
Steel wire, wherein, described silicon chip cutting steel wire includes two steel wire bodies, and two steel wire bodies are to be superimposed with each other into " 8 "
The integral structure of font, described steel wire body is interior to be provided with passage, and the cross sectional shape of the passage is regular hexagon, described logical
Hard alloy is filled with road, the steel wire body outer surface coats one layer of protective layer using potassium steel as material, the protection
Layer surface does frosted processing, and reservoir is provided with the protective layer, and the reservoir is spherical structure, the reservoir and protection
Layer outer wall is directly provided with cylindrical channel, and the glutinous ability with cutting grinding fluid of silicon chip cutting steel wire therein increases, increased
Production efficiency is added.
Chinese invention patent (application number：201310494360.7) disclose a kind of silicon chip cutting technique, silicon in this invention
To use main auxiliary material be mortar for piece cutting, by the recovery to waste mortar, adjusts the proportioning of mortar, and on this basis to cutting
The parameter cut in technique is adjusted, and greatly reduces the discharge of solid waste, so as to reduce environmental pollution and be produced into
This.
Chinese invention patent (application number：201210320569.7) disclose a kind of multi-wire cutting machine for silicon wafer Buddha's warrior attendant wire cutting
Liquid system, including be provided with cutting silicon ingot diamond wire cutting machine, to the cutting machine provide cutting liquid feedway and
Reclaim the retracting device for the cutting liquid that the cutting machine flows down.Feedway includes cutting nozzle, cooling nozzles, controlled respectively
Several supply valves of the cutting nozzle and the cooling nozzles flow, with described supply the supply pump that is connected of valve and for institute
State the supply cylinder of supply pump connection.Retracting device includes the backflow cylinder with precipitation and the extraction being connected with the supply cylinder
Pump.The side of diamond wire is provided with cooling nozzles, and cooling nozzles are individually controlled with supply valve, can big flow spray cutting liquid with
Cooling cleaning action is played, and the backflow cylinder of retracting device has the function that to precipitate the silica flour in cutting liquid in favor of again making
With so as to form a kind of silicon wafer multi-wire cutting machine diamond wire cutting liquid system of suitable Buddha's warrior attendant wire cutting.
Above-mentioned patent solves the viscosity of cutting liquid (PEG) in silicon chip cutting process, the grain type and granularity of silicon carbide micro-powder,
The viscosity of mortar, the flow of mortar, the problem of speed of steel wire causes Si wafer quality.But without solution silicon chip cutting well
During easily cut the problem of oblique.
The content of the invention
Oblique inconvenience is easily cut for silicon chip cutting in reality, present invention offer is a kind of simple in construction, convenient, practical
And can prevent silicon chip from being deformed in cutting process, improve the cutter device of rate of cutting and efficiency.
Design of the present invention is：A kind of in line efficient silicon wafer cutting device of push type, including guide wheel 1, institute
State and diamond wire 2 is tied with guide wheel 1, silicon heavy stone used as an anchor 3 is placed with the diamond wire 2, pushing ram 6, the pushing ram are provided with after the silicon heavy stone used as an anchor 3
6 are connected with motor 7, are provided with infrared inductor 5 among the pushing ram 6, the top both ends of guide wheel 1 are provided with coolant nozzle 4.
In design provided by the invention, the material of described guide wheel 1 is aluminium alloy.
In design provided by the invention, described diamond wire 2 is resin gold steel wire or the golden steel wire of plating.
In design provided by the invention, the collapsing length of described pushing ram 6 can be adjusted.
In design provided by the invention, described silicon heavy stone used as an anchor 3, which is that in line mode is single, is arranged in the golden top of steel wire 2.
In design provided by the invention, described motor 7 provides the power that pushing ram 6 promotes silicon heavy stone used as an anchor 3 to advance.
In design provided by the invention, the distance of the described infrared inductor 5 detection advance of pushing ram 6.
In design provided by the invention, described coolant nozzle 4 is continuously sprayed to silicon heavy stone used as an anchor cutting part, and reduction is cut
Cut the temperature and lubrication at position.
In design provided by the invention, the adjustable angle scope of described coolant nozzle 4 and guide wheel 1 is 0-90
Degree.
The present invention has advantages below：
The in line efficient silicon wafer cutting device of push type of one kind provided by the invention, it is simple in construction, it is convenient, practical and can be with
Prevent silicon chip from being deformed in cutting process, improve rate of cutting and efficiency, and save clipping time.
Brief description of the drawings
The tomograph of the in line pusher efficiently silicon wafer cutting devices of Fig. 1, wherein 1- guide wheels, 2- diamond wires, 3- silicon heavy stones used as an anchor,
4- coolant nozzles, 5- infrared inductors, 6- pushing rams, 7- motor.
Fig. 2 this patent silicon chip cutting mode schematic diagrames.
Fig. 3 conventional method silicon chip cutting mode schematic diagrames.
Embodiment
Below in conjunction with accompanying drawing of the present invention and specific design scheme, the design in the embodiment of the present invention is carried out clear
Chu, it is fully described by, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole implementation
Example.Based on the embodiment in patent of the present invention, those of ordinary skill in the art are obtained under the premise of creative work is not paid
The every other embodiment obtained, belong to the scope of this patent protection.
Embodiment 1
As shown in the in line pusher efficiently tomographs of silicon wafer cutting device of Fig. 1, a kind of in line efficient silicon of push type
Piece cutter device, including guide wheel 1, diamond wire 2 is tied with the guide wheel 1, silicon heavy stone used as an anchor 3, the silicon heavy stone used as an anchor 3 are placed with the diamond wire 2
Pushing ram 6 is provided with afterwards, and the pushing ram 6 is connected with motor 7, infrared inductor 5, the guide wheel 1 are provided among the pushing ram 6
Top both ends are provided with coolant nozzle 4.
The material of described guide wheel 1 is aluminium alloy.
Described diamond wire 2 is resin gold steel wire or the golden steel wire of plating.
The collapsing length of described pushing ram 6 can be adjusted.
Described silicon heavy stone used as an anchor 3, which is that in line mode is single, is arranged in the golden top of steel wire 2.
Described motor 7 provides the power that pushing ram 6 promotes silicon heavy stone used as an anchor 3 to advance.
Described infrared inductor 5 detects the distance that pushing ram 6 advances.
Described coolant nozzle 4 continuously sprays to silicon heavy stone used as an anchor cutting part, reduces the temperature and lubrication of cutting part.
The adjustable angle scope of described coolant nozzle 4 and guide wheel 1 is 0-90 degree.
In silicon chip cutting process, this patent silicon chip cutting mode was as shown in Fig. 2 first block of silicon heavy stone used as an anchor was on diamond wire before this
Cut, and second piece of silicon chip is slowly promoted forward by expansion link, treat that first piece of silicon chip is cut completely, then second piece of silicon chip is stood
The position of first piece of silicon chip is substituted to be cut, in whole silicon chip cutting process, the silicon chip cutting of this patent does not have all the time
Appearance was cut tiltedly, and rate of cutting is comparatively fast and stably, in 10~12 minutes/block.Silicon chip cutting mode such as Fig. 3 of conventional method
Shown, two pieces of silicon chips simultaneously and are listed on diamond wire and cut, because the contact area of silicon chip and diamond wire increases, diamond wire
Movement easily causes cutting line skew, and uneven so as to cut, Yi Fashengqie is oblique, and rate of cutting is slower and unstable, is
15~18 minutes/block.
Every technical staff's notice：Although the present invention describes according to above-mentioned embodiment, of the invention
Invention thought be not limited to that invention, any repacking with inventive concept, will all include this patent protection of the patent right
In the range of.
Claims (9)
1. a kind of in line efficient silicon wafer cutting device of push type, it is characterised in that including guide wheel (1), be tied with the guide wheel (1)
Diamond wire (2), silicon heavy stone used as an anchor (3) is placed with the diamond wire (2), the silicon heavy stone used as an anchor (3) is provided with pushing ram (6), the pushing ram (6) afterwards
Motor (7) is connected with, infrared inductor (5) is provided among the pushing ram (6), both ends are provided with cooling above the guide wheel (1)
Nozzle for liquid (4).
2. the in line efficient silicon wafer cutting device of push type of one kind according to claim 1, it is characterised in that described guide wheel
(1) material is aluminium alloy.
3. the in line efficient silicon wafer cutting device of push type of one kind according to claim 1, it is characterised in that described Buddha's warrior attendant
Line (2) is resin gold steel wire or the golden steel wire of plating.
4. the in line efficient silicon wafer cutting device of push type of one kind according to claim 1, it is characterised in that described propulsion
The collapsing length of bar (6) can be adjusted.
5. the in line efficient silicon wafer cutting device of push type of one kind according to claim 1, it is characterised in that described silicon heavy stone used as an anchor
(3) it is arranged in in line mode is single above golden steel wire (2).
6. the in line efficient silicon wafer cutting device of push type of one kind according to claim 1, it is characterised in that described is electronic
Machine (7) provides the power that pushing ram (6) promotes silicon heavy stone used as an anchor (3) to advance.
7. the in line efficient silicon wafer cutting device of push type of one kind according to claim 1, it is characterised in that described is infrared
The distance that inductor (5) detection pushing ram (6) advances.
8. the in line efficient silicon wafer cutting device of push type of one kind according to claim 1, it is characterised in that described cooling
Nozzle for liquid (4) continuously sprays to silicon heavy stone used as an anchor cutting part, reduces the temperature and lubrication of cutting part.
9. the in line efficient silicon wafer cutting device of push type of one kind according to claim 1, it is characterised in that described cooling
The adjustable angle scope of nozzle for liquid (4) and guide wheel (1) is 0-90 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710753888.XA CN107486951A (en) | 2017-08-29 | 2017-08-29 | A kind of in line efficient silicon wafer cutting device of push type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710753888.XA CN107486951A (en) | 2017-08-29 | 2017-08-29 | A kind of in line efficient silicon wafer cutting device of push type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107486951A true CN107486951A (en) | 2017-12-19 |
Family
ID=60646029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710753888.XA Pending CN107486951A (en) | 2017-08-29 | 2017-08-29 | A kind of in line efficient silicon wafer cutting device of push type |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107486951A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108407118A (en) * | 2018-05-04 | 2018-08-17 | 江苏聚成金刚石科技有限公司 | A kind of diamond cutting line slicing machine |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60172459A (en) * | 1984-02-18 | 1985-09-05 | Kenichi Ishikawa | Cutting in vibrating multiwire system and apparatus thereof |
| CN2285197Y (en) * | 1996-10-11 | 1998-07-01 | 荆沙市建筑材料总厂 | Cement tile shaping machine |
| TW527268B (en) * | 2000-05-31 | 2003-04-11 | Memc Electronic Materials Spa | Wire saw and process for slicing multiple semiconductor ingots |
| CN201320809Y (en) * | 2008-12-30 | 2009-10-07 | 高佳太阳能（无锡）有限公司 | Silicon rod cutting clamp |
| CN203304444U (en) * | 2013-07-03 | 2013-11-27 | 宁波市鄞州区杰赛精密机械有限公司 | Pushing part of automatic feeding equipment |
| CN203696677U (en) * | 2013-11-14 | 2014-07-09 | 安徽大地熊新材料股份有限公司 | Automatic feeding device |
| CN205167279U (en) * | 2015-12-02 | 2016-04-20 | 英利能源（中国）有限公司 | Silicon wafer cutting device |
| CN206436394U (en) * | 2016-11-24 | 2017-08-25 | 浙江昀丰新材料科技股份有限公司 | A kind of silicon crystal bar cutting equipment |
-
2017
- 2017-08-29 CN CN201710753888.XA patent/CN107486951A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60172459A (en) * | 1984-02-18 | 1985-09-05 | Kenichi Ishikawa | Cutting in vibrating multiwire system and apparatus thereof |
| CN2285197Y (en) * | 1996-10-11 | 1998-07-01 | 荆沙市建筑材料总厂 | Cement tile shaping machine |
| TW527268B (en) * | 2000-05-31 | 2003-04-11 | Memc Electronic Materials Spa | Wire saw and process for slicing multiple semiconductor ingots |
| CN201320809Y (en) * | 2008-12-30 | 2009-10-07 | 高佳太阳能（无锡）有限公司 | Silicon rod cutting clamp |
| CN203304444U (en) * | 2013-07-03 | 2013-11-27 | 宁波市鄞州区杰赛精密机械有限公司 | Pushing part of automatic feeding equipment |
| CN203696677U (en) * | 2013-11-14 | 2014-07-09 | 安徽大地熊新材料股份有限公司 | Automatic feeding device |
| CN205167279U (en) * | 2015-12-02 | 2016-04-20 | 英利能源（中国）有限公司 | Silicon wafer cutting device |
| CN206436394U (en) * | 2016-11-24 | 2017-08-25 | 浙江昀丰新材料科技股份有限公司 | A kind of silicon crystal bar cutting equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108407118A (en) * | 2018-05-04 | 2018-08-17 | 江苏聚成金刚石科技有限公司 | A kind of diamond cutting line slicing machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103240805B (en) | Cut equipment and the method for multiple section from workpiece simultaneously | |
| CN205996537U (en) | A kind of clamping device being applied to cast processing | |
| Chung et al. | Distribution of diamond grains in fixed abrasive wire sawing process | |
| CN104875287B (en) | Dry and wet dual-purpose laser welding diamond saw blade | |
| CN101870008B (en) | Saw-type sintering metal base diamond saw blade for cutting QFN (Quad Flat Non-leaded) package substrate | |
| CN103991140A (en) | Diamond wire-electrode cutting technology for silicon rod | |
| CN101774157A (en) | Method and equipment for removing scale on metal wires or metal bars by grinding material water jet | |
| CN107901256A (en) | The device and cutting method of Buddha's warrior attendant wire cutting polysilicon chip | |
| CN107486951A (en) | A kind of in line efficient silicon wafer cutting device of push type | |
| CN110116372B (en) | Combined type efficient precise dressing method for superhard abrasive grinding wheel | |
| CN206010720U (en) | Emery wheel groove cleaning device when a kind of glass substrate grinds | |
| CN209477992U (en) | A kind of device based on dry ice Jet Polishing | |
| CN202240893U (en) | Water-cooled polishing fixture for polycrystalline diamond | |
| CN207548422U (en) | A kind of plate shearing machine carbide chip production mould grinding device | |
| CN105382948B (en) | A kind of solar silicon wafers steel wire used for cutting and its production method | |
| CN203712895U (en) | Steel wire cleaning device of multi-wire sawing machine | |
| CN206426281U (en) | A kind of novel stone cutting frame saw | |
| CN103586989B (en) | A kind of saw blade cutting machine applying free abrasive | |
| CN203739035U (en) | Device for cutting semiconductor thermoelectric materials | |
| CN206997368U (en) | A kind of hot-rolling mill cooling device | |
| CN216178824U (en) | Sawing machine receiving device for drill tool production | |
| CN108374557A (en) | A kind of aluminum alloy pattern plate recoverying and utilizing method | |
| CN205888277U (en) | Double -end beveler with cooling a tool function | |
| CN207206216U (en) | From the flat surface grinding super-hard abrasive tool for setting cooling passage | |
| CN203738609U (en) | Wear-resisting cutting head for water-jet cutting machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171219 |
|
| RJ01 | Rejection of invention patent application after publication |