CN205291299U - A resin cushion board for diamond wire cutting - Google Patents
A resin cushion board for diamond wire cutting Download PDFInfo
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- CN205291299U CN205291299U CN201520912296.4U CN201520912296U CN205291299U CN 205291299 U CN205291299 U CN 205291299U CN 201520912296 U CN201520912296 U CN 201520912296U CN 205291299 U CN205291299 U CN 205291299U
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- diamond wire
- backing plate
- utility
- model
- cushion board
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Abstract
The utility model discloses a resin cushion board for diamond wire cutting, its characterized in that: resin cushion board 1 surface open along its long limit direction and have a plurality of perpendicular grooves 11. The branch number in perpendicular groove 11 be 3~5. The utility model discloses a bad phenomenons such as crystalline substance that the resin cushion board can reduce silicon chip produced among the diamond wire cutting process splits, bright border, breach improve the cutting quality.
Description
Technical field
This utility model relates to a kind of resin backing plate, particularly relates to a kind of resin backing plate for diamond wire saw.
Background technology
Along with the development of photovoltaic industry, industry begins with diamond wire saw technology gradually, is monocrystalline silicon piece by silicon single crystal rod multi-wire saw. When using this technology, it is fixed on the diamond on steel wire by the scraping of its point blade portion, silicon rod is cut into silicon chip. Owing to diamond wire saw has high efficiency, low cost, low stain, can cut the advantages such as thinner silicon chip, therefore replace traditional mortar just gradually and add the cutting mode of steel wire.
Before using diamond wire saw technology to cut, it is necessary to first silicon single crystal rod is bonded on resin plate by viscose glue, to keep the fixing of silicon rod position. Resin plate conventional at present is slab construction. In high-speed cutting process, produced heat can make viscose glue, resin plate and silicon rod expand, but due to the coefficient of expansion of this three and differ, add the internal stress that monocrystal rod during high-speed cutting produces, it is easy to cause the crystalline substance of a part of silicon chip to split, the bad phenomenon such as bright border, breach.
Utility model content
The purpose of this utility model is in that to provide a kind of resin backing plate for diamond wire saw, the bad phenomenon such as its crystalline substance that can reduce in diamond wire saw process produced silicon chip splits, bright border, breach, improves cut quality.
For achieving the above object, this utility model is by the following technical solutions:
A kind of resin backing plate for diamond wire saw, it is characterised in that: described resin backing plate has some vertical slots along long side direction.
Preferably, the bar number of described vertical slot is 3 ~ 5.
Preferably, the wide 0.1 ~ 2mm of described vertical slot, deep 0.1 ~ 2mm.
It is highly preferred that described vertical slot width 2mm, deep 2mm.
Open the vertical slot on resin backing plate and can disperse and discharge the internal stress that during diamond wire high-speed cutting, crystal bar produces, thus the bad phenomenon such as the crystalline substance of silicon chip produced by reducing in diamond wire saw process splits, bright border, breach.
This utility model has the advantages that
1. the bad phenomenon such as the crystalline substance of silicon chip produced by effective minimizing diamond wire saw process splits, bright border, breach, improve cut quality, reduce percent defective;
2. simple in construction, it is easy to make.
Accompanying drawing explanation
Fig. 1 is front view of the present utility model;
Fig. 2 is use schematic diagram of the present utility model.
Accompanying drawing labelling: 1-resin backing plate; 2-crystal bar; 3-single crystal support; 11-vertical slot.
Detailed description of the invention
Below in conjunction with flotation device figure, this utility model is described further.
As shown in Figure 1 and 2, of the present utility model one preferred embodiment in, the surface of this resin backing plate 1 being used for diamond wire saw has 3 vertical slots 11 along its long side direction. Vertical slot 11 wide 2mm, deep 2mm.
In use, the bottom surface of resin backing plate 1 is bonded on single crystal support 3. The glue stirred tiling is coated on the end face of resin backing plate 1, then crystal bar 2 is placed on its top face along the long side direction of resin backing plate 1. Placed a period of time, after crystal bar 2 is firmly sticked on resin backing plate 1, it is possible to cut.
This utility model is not limited to above-mentioned detailed description of the invention, according to foregoing, ordinary technical knowledge and customary means according to this area, without departing under the above-mentioned basic fundamental thought premise of this utility model, it is also possible to this utility model to be made the equivalent modifications of other various ways, replacement or change. These amendments, replacement or change all fall among protection domain of the present utility model.
Claims (4)
1. the resin backing plate for diamond wire saw, it is characterised in that: described resin backing plate (1) surface has some vertical slots (11) along its long side direction.
2. the resin backing plate for diamond wire saw according to claim 1, it is characterised in that: the bar number of described vertical slot (11) is 3��5.
3. the resin backing plate for diamond wire saw according to claim 2, it is characterised in that: described vertical slot (11) wide 0.1��2mm, deep 0.1��2mm.
4. the resin backing plate for diamond wire saw according to claim 3, it is characterised in that: described vertical slot (11) wide 2mm, deep 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520912296.4U CN205291299U (en) | 2015-11-17 | 2015-11-17 | A resin cushion board for diamond wire cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520912296.4U CN205291299U (en) | 2015-11-17 | 2015-11-17 | A resin cushion board for diamond wire cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205291299U true CN205291299U (en) | 2016-06-08 |
Family
ID=56438453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520912296.4U Active CN205291299U (en) | 2015-11-17 | 2015-11-17 | A resin cushion board for diamond wire cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205291299U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112026024A (en) * | 2020-08-24 | 2020-12-04 | 山西烁科晶体有限公司 | Method for cutting ingot through guide frame in multi-wire mode |
-
2015
- 2015-11-17 CN CN201520912296.4U patent/CN205291299U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112026024A (en) * | 2020-08-24 | 2020-12-04 | 山西烁科晶体有限公司 | Method for cutting ingot through guide frame in multi-wire mode |
| CN112026024B (en) * | 2020-08-24 | 2021-10-01 | 山西烁科晶体有限公司 | Method for cutting ingot through guide frame in multi-wire mode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |