CN204538076U - Led倒装cob结构 - Google Patents
Led倒装cob结构 Download PDFInfo
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- CN204538076U CN204538076U CN201520088525.5U CN201520088525U CN204538076U CN 204538076 U CN204538076 U CN 204538076U CN 201520088525 U CN201520088525 U CN 201520088525U CN 204538076 U CN204538076 U CN 204538076U
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- chip
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- 239000000758 substrate Substances 0.000 claims abstract description 41
- 229910052709 silver Inorganic materials 0.000 claims abstract description 26
- 239000004332 silver Substances 0.000 claims abstract description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000843 powder Substances 0.000 claims abstract description 22
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000000926 separation method Methods 0.000 claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 5
- 238000009747 press moulding Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 5
- 230000018109 developmental process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Abstract
Description
Claims (5)
Priority Applications (1)
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CN201520088525.5U CN204538076U (zh) | 2015-02-09 | 2015-02-09 | Led倒装cob结构 |
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CN201520088525.5U CN204538076U (zh) | 2015-02-09 | 2015-02-09 | Led倒装cob结构 |
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CN204538076U true CN204538076U (zh) | 2015-08-05 |
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CN201520088525.5U Active CN204538076U (zh) | 2015-02-09 | 2015-02-09 | Led倒装cob结构 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110444647A (zh) * | 2019-07-26 | 2019-11-12 | 深圳市华尔威光电科技有限公司 | 一种基于cob技术的led封装方法 |
CN111106100A (zh) * | 2019-12-25 | 2020-05-05 | 广东华辉煌光电科技有限公司 | Cob光源结构 |
-
2015
- 2015-02-09 CN CN201520088525.5U patent/CN204538076U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110444647A (zh) * | 2019-07-26 | 2019-11-12 | 深圳市华尔威光电科技有限公司 | 一种基于cob技术的led封装方法 |
CN111106100A (zh) * | 2019-12-25 | 2020-05-05 | 广东华辉煌光电科技有限公司 | Cob光源结构 |
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Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240322 Address after: 241000 No.11, Weier Road, East District, Wuhu Economic and Technological Development Zone, Anhui Province Patentee after: Anhui ruituo Electronics Co.,Ltd. Country or region after: China Address before: No. 157 Huaihe East Road, Dalian Economic and Technological Development Zone, Liaoning Province, 116600 Patentee before: ELEC-TECH PHOTOELECTRIC TECHNOLOGY (DALIAN) Co.,Ltd. Country or region before: China |
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TR01 | Transfer of patent right |