CN204497223U - A kind of DFN0603 84 arranges Single cone detonating fuse framework - Google Patents
A kind of DFN0603 84 arranges Single cone detonating fuse framework Download PDFInfo
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- CN204497223U CN204497223U CN201520249662.2U CN201520249662U CN204497223U CN 204497223 U CN204497223 U CN 204497223U CN 201520249662 U CN201520249662 U CN 201520249662U CN 204497223 U CN204497223 U CN 204497223U
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Abstract
The utility model relates to a kind of lead frame, be specifically related to a kind of DFN0603 84 and arrange Single cone detonating fuse framework, comprise the framework taken up, described lengths of frame is 250 ± 0.1mm, width is 70 ± 0.05mm, described framework is spaced the welding region of 84 row's transistors from top to bottom, described 84 row's welding regions often arrange the single package unit that 544 are placed transistor, a chip groove is provided with in described single package unit, 544 single package unit on described often row are positioned on same level line, the described length direction of single package unit and the Width of framework are arranged in parallel, framework is divided into four A by the length direction along framework, B, C, D region, interval 10mm between each region, submarginal A district and D offset are from frame edge 10mm, Width along framework on the framework back side between described four regions is provided with spacing convave trough.The more traditional lead frame structure of this lead frame increases the density of product, improves production efficiency, reduces cost, be beneficial to welding.
Description
Technical field
The utility model relates to a kind of lead frame, and particularly a kind of DFN0603 84 arranges Single cone detonating fuse framework.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection realizing chip internal circuits exit and outer lead by means of bonding gold wire, form the key structure part of electric loop, it serves the function served as bridge be connected with outer lead, all needing in the semiconductor integrated block of the overwhelming majority to use lead frame, is basic material important in electronics and information industry.The chip packaging unit model of chip package form to be DFN0603(DFN be miniature electric components and parts, the chip groove that one is placed transistor is provided with in its one single chip encapsulation unit of Single cone detonating fuse frame representation, 0603 represents that one single chip unit is of a size of long 0.6mm, wide 0.3mm) time, more chip to be arranged at identical size lead frame, just need to carry out appropriate design to arrangement form.
As current lead frame product, as the lead frame of the 48*220mm size on market, every sheet approximately can arrange 10560 products, this lead frame length is 220mm, width is 48mm, and the density of the transistor of this product is low, causes production efficiency low and production cost is high, the glue tail band that this framework back side uses, is unfavorable for the welding of chip and copper cash.In addition, the product of current poor efficiency, its wasting of resources consumed is large.Along with the growth of market consumption, current equipment and the design productivity of product can not meet market demand, need to improve the effective rate of utilization of product, along with the raising of production cost and labour costs, it may be necessary technique improvement and reduce production cost.
Utility model content
The purpose of this utility model is: for prior art Problems existing, provides that a kind of density is large, cost is low, and the DFN0603 84 being more conducive to welding arranges Single cone detonating fuse framework.
To achieve these goals, the technical solution adopted in the utility model is:
A kind of DFN0603 84 arranges Single cone detonating fuse framework, comprise the framework taken up, described lengths of frame is 250 ± 0.1mm, width is 70 ± 0.05mm, described framework is spaced the welding region of 84 row's transistors from top to bottom, described 84 row's welding regions often arrange the single package unit that 544 are placed transistor, a chip groove is provided with in described single package unit, 544 single package unit on described often row are positioned on the same level line of framework, the described length direction of single package unit and the Width of framework are arranged in parallel, framework is divided into four A by the length direction along framework, B, C, D region, interval 10mm between each region, submarginal A district and D offset are from frame edge 10mm, Width along framework on the framework back side between described four regions is provided with spacing convave trough.
Size due to the single package unit of DFN0603 model is fixing 0.6*0.3mm, therefore when frame size is fixing, reasonably contribute to improving framework utilance to frame welding regional compartmentalization, this lead frame is divided into four identical regions along lengths of frame direction, and the length direction of single package unit and the Width of framework are arranged in parallel, often row has 544 single package unit placing transistor, arranges 136 single package unit in so each region; The length of this framework is 250mm, the size of space between removing A, B, C, D region and the reserved size at edge, each region is for arranging that single package unit is of a size of 50mm, and 0.3*136 is 40.8mm, to meet on framework often arrangement and puts the demand that 544 are placed the encapsulation unit of transistors; And the wide of framework is 70mm, the length of single package unit is 0.6mm, 0.6*84 is 50.4mm, and meet user demand completely, such setting adds framework density, improves device efficiency, reduces costs.
The spacing convave trough that the framework back side between described four regions is arranged along frame width direction increases the surface area at the framework back side, makes it be the increase in the contact area of plastic-sealed body and framework at plastic packaging, improves sealing and stability; In addition, because this lead frame subregion is reasonable, regional all leaves the size of space, is conducive to welding and the installation of encapsulation unit.
As preferred version of the present utility model, the quantity of described spacing convave trough is 6, and the groove width of spacing convave trough is 6mm, length is 10mm.The quantity of spacing convave trough is set to 6, and length is 10mm, and just the Appropriate application width dimensions of framework, makes the surface area increment at the framework back side maximum, is conducive to plastic packaging effect when improving plastic packaging.
In sum, owing to have employed technique scheme, the beneficial effects of the utility model are: DFN0603 84 arranges Single cone detonating fuse framework
1, framework is reasonably divided into four identical regions by this lead frame, distribution of sizes is reasonable, meet the demand of the single package unit of DFN0603 model being arranged under fixing frame size 84 row's/45696 encapsulation units and transistor completely, add framework density, improve device efficiency, reduce costs; And due to this lead frame subregion reasonable, regional all leaves the size of space, is conducive to welding and the installation of encapsulation unit;
2, the spacing convave trough that the framework back side between described four regions is arranged along frame width direction increases the surface area at the framework back side, makes it be the increase in the contact area of plastic-sealed body and framework at plastic packaging, improves sealing and stability;
3, enhance productivity, the device efficiency .Molding of leading portion raising 40% improves the efficiency of 4.3 times;
4, improve resource utilization, framework utilance improves 40%, Compound consumption and reduces by 50%;
5, replace glue tail band by stainless steel tail band, increase the weld strength of framework and the thickness of stability and reduction product.
Accompanying drawing explanation
Fig. 1 is the structural representation that the utility model DFN0603 84 arranges Single cone detonating fuse framework.
Fig. 2 is the E portion enlarged drawing in Fig. 1 in a-quadrant.
Mark in figure: 1-framework, 2-single package unit, 3-spacing convave trough, 4-framework fixing hole.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail.
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
embodiment
1
As depicted in figs. 1 and 2, Fig. 1 is the structural representation that the utility model DFN0603 84 arranges Single cone detonating fuse framework, region A, B, C, D that 4 identical is had in figure, Fig. 2 is the E portion enlarged drawing in Fig. 1 in a-quadrant, is as can be seen from Figure 2 provided with the chip groove that is placed transistor in single package unit.The DFN0603 84 of the present embodiment arranges Single cone detonating fuse framework (DFN0603 is the encapsulation model of miniature electric components and parts), comprise the framework 1 taken up, described framework 1 length is 250 ± 0.1mm, width is 70 ± 0.05mm, described framework 1 is spaced the welding region of 84 row's transistors from top to bottom, described 84 row's welding regions often arrange the single package unit 2 that 544 are placed transistor, a chip groove is provided with in described single package unit 2, 544 single package unit 2 on described often row are positioned on the same level line of framework 1, the length direction of described single package unit 2 and the Width of framework 1 are arranged in parallel, framework 1 is divided into four A by the length direction along framework 1, B, C, D region, interval 10mm between each region, submarginal A district and D offset are from frame edge 10mm, Width along framework 1 on the framework back side between described four regions is provided with spacing convave trough 3.
Size due to the single package unit of DFN0603 model is fixing 0.6*0.3mm, therefore when frame size is fixing, reasonably contribute to improving framework utilance to frame welding regional compartmentalization, this lead frame is divided into four identical regions along lengths of frame direction, and the length direction of single package unit and the Width of framework are arranged in parallel, often row has 544 single package unit placing transistor, arranges 136 single package unit in so each region; The length of this framework is 250mm, the size of space between removing A, B, C, D region and the reserved size at edge, each region is for arranging that single package unit is of a size of 50mm, and 0.3*136 is 40.8mm, to meet on framework often arrangement and puts the demand that 544 are placed the encapsulation unit of transistors; And the wide of framework is 70mm, the length of single package unit is 0.6mm, 0.6*84 is 50.4mm, and meet user demand completely, such setting adds framework density, improves device efficiency, reduces costs.
The spacing convave trough that the framework back side between described four regions is arranged along frame width direction increases the surface area at the framework back side, makes it be the increase in the contact area of plastic-sealed body and framework at plastic packaging, improves sealing and stability; In addition, because this lead frame subregion is reasonable, regional all leaves the size of space, is conducive to welding and the installation of encapsulation unit.
In the present embodiment, the quantity of described spacing convave trough 3 is 6, and the groove width of spacing convave trough 3 is 6mm, length is 10mm.The quantity of spacing convave trough is set to 6, and length is 10mm, and just the Appropriate application width dimensions of framework, makes the surface area increment at the framework back side maximum, is conducive to plastic packaging effect when improving plastic packaging.
As shown in fig. 1, the frame edge of framework 1 is provided with multiple fixing hole 4, the plastic packaging being convenient to this lead frame is fixed and framework assembling; And the widthwise edges of framework 1 has been arranged to cancavo-convex uneven limit, and such being provided with is beneficial to the connection of lead frame and other accessories, be also conducive to the fixing when superposition of multiple lead frame is deposited, conserve space.
While the utility model takes up transistor density raising, leading portion needs prevent framework to be oxidized and ensure soldering reliability, and removes unnecessary waste material on request in rear operation.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (2)
1. a DFN0603 84 arranges Single cone detonating fuse framework, comprise the framework taken up, it is characterized in that, described lengths of frame is 250 ± 0.1mm, width is 70 ± 0.05mm, described framework is spaced the welding region of 84 row's transistors from top to bottom, described 84 row's welding regions often arrange the single package unit that 544 are placed transistor, a chip groove is provided with in described single package unit, 544 single package unit on described often row are positioned on the same level line of framework, the described length direction of single package unit and the Width of framework are arranged in parallel, framework is divided into four A by the length direction along framework, B, C, D region, interval 10mm between each region, submarginal A district and D offset are from frame edge 10mm, Width along framework on the framework back side between described four regions is provided with spacing convave trough.
2. DFN0603 84 according to claim 1 arranges Single cone detonating fuse framework, it is characterized in that, the quantity of described spacing convave trough is 6, and the groove width of spacing convave trough is 6mm, length is 10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520249662.2U CN204497223U (en) | 2015-04-23 | 2015-04-23 | A kind of DFN0603 84 arranges Single cone detonating fuse framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520249662.2U CN204497223U (en) | 2015-04-23 | 2015-04-23 | A kind of DFN0603 84 arranges Single cone detonating fuse framework |
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| Publication Number | Publication Date |
|---|---|
| CN204497223U true CN204497223U (en) | 2015-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520249662.2U Expired - Fee Related CN204497223U (en) | 2015-04-23 | 2015-04-23 | A kind of DFN0603 84 arranges Single cone detonating fuse framework |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204497223U (en) |
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2015
- 2015-04-23 CN CN201520249662.2U patent/CN204497223U/en not_active Expired - Fee Related
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150722 Termination date: 20180423 |
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| CF01 | Termination of patent right due to non-payment of annual fee |