CN204257697U - A kind of TO-220 encapsulates diode - Google Patents
A kind of TO-220 encapsulates diode Download PDFInfo
- Publication number
- CN204257697U CN204257697U CN201420756850.XU CN201420756850U CN204257697U CN 204257697 U CN204257697 U CN 204257697U CN 201420756850 U CN201420756850 U CN 201420756850U CN 204257697 U CN204257697 U CN 204257697U
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- China
- Prior art keywords
- backlight unit
- diode chip
- pins
- diode
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of TO-220 and encapsulate diode, comprise two diode chip for backlight unit, three pins, framework, plastic-sealed body and two braces, described framework comprises fixed head and substrate, described two diode chip for backlight unit are fixed on substrate, described three pins and substrate in the same plane, wherein a pin is connected with the input of two diode chip for backlight unit, other two pins are respectively connected by the output of a brace respectively with two diode chip for backlight unit, described plastic-sealed body is by two diode chip for backlight unit, three pins, framework and two braces are packaged together.The utility model structure is simple, and plastic-sealed body small volume, radiating effect is better.
Description
Technical field
The utility model relates to diode field, particularly relates to a kind of TO-220 and encapsulates diode.
Background technology
TO-220 packaging appearance is a kind of direct insertion packing forms that a kind of high power transistor, middle small scale integrated circuit etc. often adopt.Wherein, TO English is the abbreviation of Transistor Outline.Usually, TO-220 is single straight cutting, generally can draw 3,5 or 7 pin.
As depicted in figs. 1 and 2, existing TO-220 encapsulates the pin of diode and fixed head does not go out at grade, and plastic-sealed body must higher than pin certain altitude, to such an extent as to diode package is thicker, and radiating effect is poor.
Utility model content
Technical problem to be solved in the utility model is the defect for background technology, provides that a kind of plastic-sealed body is thinner, the good TO-220 that dispels the heat encapsulates diode.
The utility model is for solving the problems of the technologies described above by the following technical solutions:
A kind of TO-220 encapsulates diode, comprise two diode chip for backlight unit, three pins, framework, plastic-sealed body and two braces, described framework comprises fixed head and substrate, described two diode chip for backlight unit are fixed on substrate, described three pins and substrate in the same plane, wherein a pin is connected with the input of two diode chip for backlight unit, other two pins are respectively connected by the output of a brace respectively with two diode chip for backlight unit, and the root of two diode chip for backlight unit, three pins, framework and two braces are packaged together by described plastic-sealed body.
The utility model adopts above technical scheme compared with prior art, has following technique effect:
1. structure is simple, and plastic-sealed body is thinner, and cumulative volume comparatively original structure reduces by 40%;
2. cost reduces;
3. radiating effect is better.
Accompanying drawing explanation
Fig. 1 is the structural representation that existing TO-220 encapsulates diode.
Fig. 2 is the end view of Fig. 1.
Fig. 3 is structural representation of the present utility model.
The end view of Fig. 4 Fig. 3.
In figure, 1-framework, 2-plastic-sealed body, 3-pin, 4-chip, 5-brace.
Embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further detail:
As shown in Figure 3 and Figure 4, the utility model discloses a kind of TO-220 and encapsulate diode, comprise two diode chip for backlight unit, 4, three pins 3, framework 1, plastic-sealed body 2 and two braces 5.Described framework 1 comprises fixed head and substrate, described two diode chip for backlight unit 4 are fixed on substrate, described three pins 3 are in the same plane with substrate, wherein a pin 3 is connected with the input of two diode chip for backlight unit 4, other two pins 3 are respectively connected by the output of a brace 5 respectively with two diode chip for backlight unit 4, and the root of two diode chip for backlight unit, 4, three pins 3, framework 1 and two braces 5 are packaged together by described plastic-sealed body 2.
Adopt in this way, make plastic-sealed body 2 thinner, cumulative volume comparatively original structure reduces by 40%, is significantly reduced to this, and radiating effect is better simultaneously.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; be understood that; the foregoing is only embodiment of the present utility model; be not limited to the utility model; all within spirit of the present utility model and principle, any amendment made, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (1)
1. a TO-220 encapsulates diode, it is characterized in that, comprise two diode chip for backlight unit, three pins, framework, plastic-sealed body and two braces, described framework comprises fixed head and substrate, described two diode chip for backlight unit are fixed on substrate, described three pins and substrate in the same plane, wherein a pin is connected with the input of two diode chip for backlight unit, other two pins are respectively connected by the output of a brace respectively with two diode chip for backlight unit, described plastic-sealed body is by two diode chip for backlight unit, the root of three pins, framework and two braces are packaged together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420756850.XU CN204257697U (en) | 2014-12-06 | 2014-12-06 | A kind of TO-220 encapsulates diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420756850.XU CN204257697U (en) | 2014-12-06 | 2014-12-06 | A kind of TO-220 encapsulates diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204257697U true CN204257697U (en) | 2015-04-08 |
Family
ID=52961970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420756850.XU Active CN204257697U (en) | 2014-12-06 | 2014-12-06 | A kind of TO-220 encapsulates diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204257697U (en) |
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2014
- 2014-12-06 CN CN201420756850.XU patent/CN204257697U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |