CN204257618U - A kind of waterproof stamp-mounting-paper diode - Google Patents
A kind of waterproof stamp-mounting-paper diode Download PDFInfo
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- CN204257618U CN204257618U CN201420756854.8U CN201420756854U CN204257618U CN 204257618 U CN204257618 U CN 204257618U CN 201420756854 U CN201420756854 U CN 201420756854U CN 204257618 U CN204257618 U CN 204257618U
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Abstract
The utility model discloses a kind of waterproof stamp-mounting-paper diode, comprise framework, plastic-sealed body, chip and brace, described chip is attached on framework, described framework comprises two pins, the input of chip and output are connected on two pins of framework by described brace respectively, framework, chip and brace are correspondingly packaged together by described plastic-sealed body, and the surrounding that described framework is posting chip is provided with groove.When the utility model makes outside moisture be difficult to be spread to chip place by pin, ensure that the stability of diode.
Description
Technical field
The utility model relates to diode field, particularly relates to a kind of waterproof stamp-mounting-paper diode.
Background technology
Electron trade is increasingly competitive, also more and more higher to Electronic Packaging component reliability requirement in the industry.In order to obtain the accreditation of client and occupy the sufficient market share, enterprise also more and more payes attention to the encapsulation of pasting diode.
Existing stamp-mounting-paper diode generally all adopts copper framework, and chip is attached on copper framework, the input of chip and output is connected on the pin of notice framework, then carries out plastic packaging to copper framework by brace.
Combine easily tight between the plastic-sealed body of this structure and frame pin, cause steam to enter plastic-sealed body, affect the electrical and reliability of chip.
Utility model content
Technical problem to be solved in the utility model is the defect for background technology, provides a kind of waterproof stamp-mounting-paper diode.
The utility model is for solving the problems of the technologies described above by the following technical solutions:
A kind of waterproof stamp-mounting-paper diode, comprise framework, plastic-sealed body, chip and brace, described chip is attached on framework, described framework comprises two pins, the input of chip and output are connected on two pins of framework by described brace respectively, framework, chip and brace are correspondingly packaged together by described plastic-sealed body, and the surrounding that described framework is posting chip is provided with groove.
As the further prioritization scheme of a kind of waterproof stamp-mounting-paper diode of the utility model, described groove is U-type groove.
As the further prioritization scheme of a kind of waterproof stamp-mounting-paper diode of the utility model, described framework is copper framework.
The utility model adopts above technical scheme compared with prior art, has following technique effect:
After diode plastic packaging, U-type groove part is filled by plastic packaging material, plastic-sealed body forms projection herein, when outside moisture is spread to chip place by pin, need to be allowed for access after plastic-sealed body projection is turned round chip region, considerably increase the difficulty that moisture infiltrates, ensure that the normal work of chip, also ensure that the stability of diode.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is that the A-A in Fig. 1 analyses and observe structure for amplifying schematic diagram.
In figure, 1-plastic-sealed body, 2-chip, 3-brace, the pin of 4-framework, 5-groove, 6-framework.
Embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further detail:
As depicted in figs. 1 and 2, the utility model discloses a kind of waterproof stamp-mounting-paper diode, comprise framework 6, plastic-sealed body 1, chip 2 and brace 3.Described chip 2 is attached on framework 6, described framework 6 comprises two pins 4, the input of chip 2 and output are connected on two pins 4 of framework 6 by described brace 3 respectively, framework 6, chip 2 and brace 3 are correspondingly packaged together by described plastic-sealed body 1, and described framework 6 is provided with groove 5 in the surrounding posting chip 2.
Described groove 5 prioritizing selection is U-type groove, and described framework 6 is copper framework.
After arranging like this, U-type groove part is filled by plastic packaging material, plastic-sealed body 1 forms projection herein, when outside moisture is spread to chip 2 place by pin 4, need to be allowed for access after plastic-sealed body 1 projection is turned round chip 2 region, considerably increase the difficulty that moisture infiltrates, ensure that the normal work of chip 2, also ensure that the stability of diode.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; be understood that; the foregoing is only embodiment of the present utility model; be not limited to the utility model; all within spirit of the present utility model and principle, any amendment made, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (3)
1. a waterproof stamp-mounting-paper diode, comprise framework, plastic-sealed body, chip and brace, described chip is attached on framework, described framework comprises two pins, the input of chip and output are connected on two pins of framework by described brace respectively, framework, chip and brace are correspondingly packaged together by described plastic-sealed body, it is characterized in that, the surrounding that described framework is posting chip is provided with groove.
2. waterproof stamp-mounting-paper diode according to claim 1, is characterized in that, described groove is U-type groove.
3. waterproof stamp-mounting-paper diode according to claim 1, is characterized in that, described framework is copper framework.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420756854.8U CN204257618U (en) | 2014-12-06 | 2014-12-06 | A kind of waterproof stamp-mounting-paper diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420756854.8U CN204257618U (en) | 2014-12-06 | 2014-12-06 | A kind of waterproof stamp-mounting-paper diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204257618U true CN204257618U (en) | 2015-04-08 |
Family
ID=52961895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420756854.8U Active CN204257618U (en) | 2014-12-06 | 2014-12-06 | A kind of waterproof stamp-mounting-paper diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204257618U (en) |
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2014
- 2014-12-06 CN CN201420756854.8U patent/CN204257618U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |