CN204090317U - A kind of can the chip mounter of sub-material, feeding fast - Google Patents
A kind of can the chip mounter of sub-material, feeding fast Download PDFInfo
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- CN204090317U CN204090317U CN201420366558.7U CN201420366558U CN204090317U CN 204090317 U CN204090317 U CN 204090317U CN 201420366558 U CN201420366558 U CN 201420366558U CN 204090317 U CN204090317 U CN 204090317U
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- positioning module
- feeding
- chip mounter
- axis
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Abstract
The utility model relate to a kind of can the chip mounter of sub-material, feeding fast, comprise frame and be installed on feed mechanism in frame, Ban Liao mechanism and feeding distribution mechanism; Feeding distribution mechanism comprises sub-material positioning module and the first driving mechanism, and the length direction of sub-material positioning module is X-axis, and the length direction perpendicular to sub-material positioning module is Y-axis, and sub-material positioning module is provided with multiple location notch, and multiple location notch is spaced apart along X-direction; Ban Liao mechanism comprises the 3rd driving mechanism and removes material manipulator.Above-mentioned chip mounter has sub-material positioning module, first driving mechanism can drive sub-material positioning module to move along X-axis, 3rd driving mechanism can drive removes material manipulator along Y-axis reciprocating motion, is carried to multiple location notchs of sub-material positioning module, like this by material from feed mechanism, after sub-material, when feeding, the sucker of multiple chip machinery hand can be spaced along X-axis, works simultaneously, material is taken away together from multiple location notch, thus the time of feeding can be reduced.
Description
Technical field
The utility model belongs to chip mounter field, particularly relate to a kind of can the chip mounter of sub-material, feeding fast.
Background technology
Chip mounter generally comprises frame and is installed on the feed mechanism in frame, and material first by feed mechanism material loading, then passes through chip machinery hand feeding.Existing chip mounter is when feeding, and chip machinery hand need from same station difference feeding successively, and the feeding time is each sucker feeding time sum, and this feeding mode adds the feeding time, reduces machine operation efficiency.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of and reduces the feeding time, improve machine operation efficiency can the chip mounter of sub-material, feeding fast.
The utility model be achieved in that provide a kind of can the chip mounter of sub-material, feeding fast, comprise frame and be installed on the feed mechanism in described frame, described chip mounter also comprises and is installed on Ban Liao mechanism in described frame and feeding distribution mechanism; Described feeding distribution mechanism comprises sub-material positioning module and the first driving mechanism, the length direction of described sub-material positioning module is X-axis, length direction perpendicular to described sub-material positioning module is Y-axis, described sub-material positioning module is provided with the multiple location notchs for positioning material, and described multiple location notch is spaced apart along described X-direction; Described Ban Liao mechanism comprises the 3rd driving mechanism and removes material manipulator for what remove material; Described first driving mechanism can drive described sub-material positioning module to move along described X-axis, removes material manipulator along described Y-axis reciprocating motion, be carried to described multiple location notch by material from described feed mechanism described in described 3rd driving mechanism can drive.
Further, described feed mechanism involving vibrations charging tray.
Further, described feed mechanism also comprises guiding mechanism, described guiding mechanism comprises base plate and multiple locating piece, described multiple locating piece is fixedly arranged on described base plate, one end of described multiple locating piece is enclosed to form the guiding groove for correcting, material is delivered in described guiding groove by described vibrating tray, described in remove material manipulator material is carried to described location notch from described guiding groove.
Further, described in remove material manipulator comprise first, second manipulator, first, second manipulator described is arranged along described Y direction interval.
Further, described location notch is provided with vacuum intake hole.
Further, described first driving mechanism comprises the first slide block and the first motor, described first slide block can be installed in described frame along described X-axis slidably, and described sub-material positioning module is fixedly arranged on described first slide block, and described first motor can drive described first skid.
Further, described chip mounter is also provided with the CCD camera for detecting the position of expecting in described location notch.
Further, described feeding distribution mechanism also comprises the second driving mechanism, described second driving mechanism comprises the second slide block and the second motor, and described second slide block can be installed in described frame along described Y-axis slidably, and described second motor can drive described second skid; Described first driving mechanism comprises the first slide block and the first motor, and described first slide block can be installed on described second slide block along described X-axis slidably, and described first motor can drive described first skid.
Compared with prior art, chip mounter of the present utility model has sub-material positioning module, first driving mechanism can drive sub-material positioning module to move along X-axis, 3rd driving mechanism can drive removes material manipulator along Y-axis reciprocating motion, material is carried to multiple location notchs of sub-material positioning module from feed mechanism, like this, after sub-material, when feeding, the sucker of multiple chip machinery hand can be spaced along X-axis, works simultaneously, is taken away together by material from multiple location notch, thus the time of feeding can be reduced, increase work efficiency.
Accompanying drawing explanation
Fig. 1 is that the utility model can the schematic perspective view of chip mounter one preferred embodiment of sub-material, feeding fast;
Fig. 2 is close-up schematic view embodiment illustrated in fig. 1.
Embodiment
In order to make technical problem to be solved in the utility model, technical scheme and beneficial effect clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
As depicted in figs. 1 and 2, be a preferred embodiment of the present utility model, this chip mounter of sub-material, feeding fast can comprise frame 100 and is installed on feed mechanism in frame 100, Ban Liao mechanism and feeding distribution mechanism.
Feed mechanism involving vibrations charging tray 200, expects by vibrating tray 200 vibration feeding.Preferably, feed mechanism also comprises guiding mechanism 300.Guiding mechanism 300 comprises base plate 310 and multiple locating piece 320, and multiple locating piece 320 is fixedly arranged on base plate 310, and one end of multiple locating piece 320 is enclosed to form the guiding groove 301 for correcting, and material is delivered in guiding groove 301 and carried out correcting by vibrating tray 200.
Feeding distribution mechanism comprises sub-material positioning module 200, first driving mechanism 400 and the second driving mechanism 500.The length direction of sub-material positioning module 200 is X-axis, and the length direction perpendicular to sub-material positioning module 200 is Y-axis.Sub-material positioning module 200 is provided with the multiple location notchs 201 for positioning material, and multiple location notch 201 is spaced apart along X-direction.First driving mechanism 400 comprises the first slide block 410 and the first motor 420, second driving mechanism 500 comprises the second slide block 510 and the second motor 520.Second slide block 510 can be installed in frame 100 along Y-axis slidably, and the second motor 520 can drive the second slide block 510 to slide.First slide block 410 can be installed on the second slide block 510 along X-axis slidably, and the first motor 420 can drive the first slide block 410 to slide.Like this, by the driving of the first driving mechanism 400 and the second driving mechanism 500, sub-material positioning module 200 can be moved respectively along X-axis and Y-axis.
Ban Liao mechanism comprises the 3rd driving mechanism 600 and expects manipulator 700 for removing removing of material.3rd driving mechanism 600 can drive removes material manipulator 700 along Y-axis reciprocating motion.
3rd driving mechanism 600 comprises motor 610, first cam 620, second cam 630, connecting rod 640 and slide block 650.Manipulator 700 is fixedly connected with slide block 650, motor 610 can drive the first cam 620 and the second cam 630 to move, contacted with slide block 650 by the second cam 630, driving device hand 700 is along Y-axis reciprocating motion, contacted with slide block 650 with connecting rod 640 by the first cam 620, driving device hand 700 carries out the action of feeding/blowing along Z axis.3rd driving mechanism 600 is prior art, does not repeat them here.
During work, first expecting by vibrating tray 200 vibration feeding, arrive in guiding groove 301; 3rd driving mechanism 600 can drive removes material manipulator 700 along Y-axis reciprocating motion, and the first driving mechanism 400 can drive sub-material positioning module 200 to move along X-axis, thus makes to remove material manipulator 700 and material can be carried to multiple location notch 201 from guiding groove 301.Removing before material is positioned over location notch 201 by material manipulator 700, second driving mechanism 500 can drive sub-material positioning module 200 to move along Y-axis, location notch 201 can be aimed at and remove the material of expecting that manipulator 700 is carried, in the present embodiment, second driving mechanism 500 drives location notch 201, make material be positioned over the position at the edge, the same side of multiple location notch 201, like this, achieve and locate comparatively accurately.
As other execution mode, feeding distribution mechanism also can not arrange the second driving mechanism 500, and can be installed in frame 100 slidably along X-axis by the first slide block 410, sub-material positioning module 200 is fixedly arranged on the first slide block 410.First motor 420 drives the first slide block 410 to slide, thus drives sub-material positioning module 200 to move in the X-axis direction.Like this, the object of sub-material can also be arrived.Preferably, chip mounter can also arrange CCD (Charge-coupled Device, charge coupled cell) camera, like this, the position of material can be detected in each location notch 201, and without the need to accurately locating when sub-material.
After above-mentioned feeding distribution mechanism carries out sub-material, when feeding, the sucker (not shown) of multiple chip machinery hand can be spaced along X-axis, work simultaneously, material is taken away together from multiple location notch 201, thus reduces the time of feeding, increase work efficiency.
For increasing the stability of expecting when X, Y-axis motion, can vacuum intake hole (not shown) be set on location notch 201, remove after expecting that manipulator 700 is put into location notch 201 material, vacuum intake hole vacuum is opened, thus material is stably adsorbed on location notch 201 li.
Preferably, remove material manipulator 700 and comprise the first manipulator 710 and the second manipulator 720, first, second manipulator 710,720 is arranged along Y direction interval, second manipulator 720 is near sub-material positioning module 200, such first manipulator 710 and the second manipulator 720 can feeding and blowings simultaneously, improve speed.
These are only preferred embodiment of the present utility model, not in order to limit the utility model, all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (8)
1. can the chip mounter of sub-material, feeding fast, comprise frame and be installed on the feed mechanism in described frame, it is characterized in that, described chip mounter also comprises and is installed on Ban Liao mechanism in described frame and feeding distribution mechanism; Described feeding distribution mechanism comprises sub-material positioning module and the first driving mechanism, the length direction of described sub-material positioning module is X-axis, length direction perpendicular to described sub-material positioning module is Y-axis, described sub-material positioning module is provided with the multiple location notchs for positioning material, and described multiple location notch is spaced apart along described X-direction; Described Ban Liao mechanism comprises the 3rd driving mechanism and removes material manipulator for what remove material; Described first driving mechanism can drive described sub-material positioning module to move along described X-axis, removes material manipulator along described Y-axis reciprocating motion, be carried to described multiple location notch by material from described feed mechanism described in described 3rd driving mechanism can drive.
2. as claimed in claim 1 can the chip mounter of sub-material, feeding fast, it is characterized in that, described feed mechanism involving vibrations charging tray.
3. as claimed in claim 2 can the chip mounter of sub-material, feeding fast, it is characterized in that, described feed mechanism also comprises guiding mechanism, described guiding mechanism comprises base plate and multiple locating piece, described multiple locating piece is fixedly arranged on described base plate, one end of described multiple locating piece is enclosed to form the guiding groove for correcting, and material is delivered in described guiding groove by described vibrating tray, described in remove material manipulator material is carried to described location notch from described guiding groove.
4. as claimed in claim 1 can the chip mounter of sub-material, feeding fast, it is characterized in that, described in remove material manipulator and comprise first, second manipulator, first, second manipulator described is arranged along described Y direction interval.
5. as claimed in claim 1 can the chip mounter of sub-material, feeding fast, it is characterized in that, described location notch is provided with vacuum intake hole.
6. as in claim 1 to 5 as described in any one can the chip mounter of sub-material, feeding fast, it is characterized in that, described first driving mechanism comprises the first slide block and the first motor, described first slide block can be installed in described frame along described X-axis slidably, described sub-material positioning module is fixedly arranged on described first slide block, and described first motor can drive described first skid.
7. as claimed in claim 6 can the chip mounter of sub-material, feeding fast, it is characterized in that, described chip mounter is also provided with the CCD camera for detecting the position of expecting in described location notch.
8. as claimed in any of claims 1 to 7 in one of claims can the chip mounter of sub-material, feeding fast, it is characterized in that, described feeding distribution mechanism also comprises the second driving mechanism, described second driving mechanism comprises the second slide block and the second motor, described second slide block can be installed in described frame along described Y-axis slidably, and described second motor can drive described second skid; Described first driving mechanism comprises the first slide block and the first motor, and described first slide block can be installed on described second slide block along described X-axis slidably, and described first motor can drive described first skid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420366558.7U CN204090317U (en) | 2014-07-03 | 2014-07-03 | A kind of can the chip mounter of sub-material, feeding fast |
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CN201420366558.7U CN204090317U (en) | 2014-07-03 | 2014-07-03 | A kind of can the chip mounter of sub-material, feeding fast |
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CN204090317U true CN204090317U (en) | 2015-01-07 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106064742A (en) * | 2016-08-24 | 2016-11-02 | 深圳市策维科技有限公司 | Automatic feed mechanism and the laminating apparatus of fingerprint recognition module |
CN109264374A (en) * | 2018-10-25 | 2019-01-25 | 珠海格力智能装备有限公司 | Automatic elbow material distributing device |
-
2014
- 2014-07-03 CN CN201420366558.7U patent/CN204090317U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106064742A (en) * | 2016-08-24 | 2016-11-02 | 深圳市策维科技有限公司 | Automatic feed mechanism and the laminating apparatus of fingerprint recognition module |
CN106064742B (en) * | 2016-08-24 | 2018-03-13 | 深圳市策维科技有限公司 | The laminating apparatus of automatic feed mechanism and fingerprint recognition module |
CN109264374A (en) * | 2018-10-25 | 2019-01-25 | 珠海格力智能装备有限公司 | Automatic elbow material distributing device |
CN109264374B (en) * | 2018-10-25 | 2024-04-02 | 珠海格力智能装备有限公司 | Elbow automatic distributing device |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150107 Termination date: 20170703 |
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CF01 | Termination of patent right due to non-payment of annual fee |