CN204045574U - A kind of lead frame for low-power device - Google Patents
A kind of lead frame for low-power device Download PDFInfo
- Publication number
- CN204045574U CN204045574U CN201420504769.2U CN201420504769U CN204045574U CN 204045574 U CN204045574 U CN 204045574U CN 201420504769 U CN201420504769 U CN 201420504769U CN 204045574 U CN204045574 U CN 204045574U
- Authority
- CN
- China
- Prior art keywords
- terminal pin
- lead frame
- frame unit
- low
- power device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a kind of lead frame for low-power device, be made up of multiple lead frame unit, be interconnected by dowel between each lead frame unit, lead frame unit is provided with terminal pin, terminal pin is provided with three, wherein a left side, residence and terminal pin end placed in the middle are provided with pressure-sizing district, occupy right terminal pin end and be provided with slide holder, terminal pin is divided into terminal pin and lower terminal pin, horizontal bar is provided with between upper terminal pin and lower terminal pin, lead frame unit is provided with location hole, this lead frame structure is simple, be adapted at using in small-power electronic device, good heat dissipation effect, security performance is high.
Description
Technical field
The utility model relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection realizing chip internal circuits exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it serves the function served as bridge be connected with outer lead, all needing in the semiconductor integrated block of the overwhelming majority to use lead frame, is basic material important in electronics and information industry.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of lead frame for low-power device.
In order to solve the problems of the technologies described above, the utility model provides a kind of lead frame for low-power device, be made up of multiple lead frame unit, be interconnected by dowel between each lead frame unit, described lead frame unit comprises fin and terminal pin, described terminal pin is provided with three, and wherein a left side, residence and terminal pin end placed in the middle are provided with pressure-sizing district, occupies right terminal pin end and is provided with slide holder.
As further improvement of the utility model, described terminal pin is divided into terminal pin and lower terminal pin, is provided with horizontal bar between upper terminal pin and lower terminal pin.
As further improvement of the utility model, described lead frame unit is provided with location hole.
Adopt said structure, its beneficial effect is: this lead frame structure is simple, and be adapted at using in small-power electronic device, good heat dissipation effect, security performance is high.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1-lead frame unit, 2-terminal pin, the upper terminal pin of 2-1-, terminal pin under 2-2-, 3-pressure-sizing district, 4-slide holder, 5-horizontal bar, 6-location hole.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Fig. 1, a kind of lead frame for low-power device, be made up of multiple lead frame unit 1, be interconnected by dowel between each lead frame unit 1, described lead frame unit 1 is provided with terminal pin 2, described terminal pin 2 is provided with three, wherein a left side, residence and terminal pin 2 end placed in the middle are provided with pressure-sizing district 3, occupy right terminal pin 2 end and be provided with slide holder 4, described terminal pin 2 is divided into terminal pin 2-1 and lower terminal pin 2-2, be provided with horizontal bar 5 between upper terminal pin 2-1 and lower terminal pin 2-2, described lead frame unit 1 is provided with location hole 6.
This lead frame structure is simple, and be adapted at using in small-power electronic device, good heat dissipation effect, security performance is high.
Any employing and the similar lead frame designed by technical characteristic of the utility model will fall within protection range of the present utility model.
Claims (3)
1. the lead frame for low-power device, be made up of multiple lead frame unit (1), be interconnected by dowel between each lead frame unit (1), described lead frame unit (1) is provided with terminal pin (2), it is characterized in that: described terminal pin (2) is provided with three, wherein a left side, residence and terminal pin (2) end placed in the middle are provided with pressure-sizing district (3), occupy right terminal pin (2) end and are provided with slide holder (4).
2. a kind of lead frame for low-power device according to claim 1, it is characterized in that: described terminal pin (2) is divided into terminal pin (2-1) and lower terminal pin (2-2), is provided with horizontal bar (5) between upper terminal pin (2-1) and lower terminal pin (2-2).
3. a kind of lead frame for low-power device according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420504769.2U CN204045574U (en) | 2014-09-03 | 2014-09-03 | A kind of lead frame for low-power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420504769.2U CN204045574U (en) | 2014-09-03 | 2014-09-03 | A kind of lead frame for low-power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204045574U true CN204045574U (en) | 2014-12-24 |
Family
ID=52246211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420504769.2U Expired - Fee Related CN204045574U (en) | 2014-09-03 | 2014-09-03 | A kind of lead frame for low-power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204045574U (en) |
-
2014
- 2014-09-03 CN CN201420504769.2U patent/CN204045574U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205920964U (en) | Lead frame with two kinds of chips | |
| CN203850280U (en) | Double-chip plastic-sealed lead frame | |
| CN203850288U (en) | Plastic-sealed lead frame with separated heat radiating fins | |
| CN204045574U (en) | A kind of lead frame for low-power device | |
| CN103617983A (en) | Low-power plastic packaged lead frame | |
| CN204045577U (en) | A kind of lead frame for integrated circuit | |
| CN203617290U (en) | Lead frame with pits | |
| CN204045576U (en) | A kind of lead frame | |
| CN103633055A (en) | Plastic package lead frame provided with U-shaped grooves | |
| CN204045575U (en) | A kind of lead frame for relatively high power electrical equipment | |
| CN203617282U (en) | Lead frame applied to low-power electrical appliance | |
| CN204130522U (en) | A kind of lead frame of local silver-plating | |
| CN203536411U (en) | Semiconductor packaging structure | |
| CN203850290U (en) | Plastic-sealed lead frame suitable for high-temperature electrical appliances | |
| CN204045572U (en) | A kind of lead frame with chiasma type slide holder | |
| CN203617285U (en) | Lead frame capable of radiating heat quickly | |
| CN203617283U (en) | Low-power lead frame | |
| CN203850286U (en) | Plastic-sealed lead frame suitable for high-temperature environment | |
| CN203850279U (en) | Plastic-sealed lead frame suitable for high-power electrical appliances | |
| CN203589012U (en) | Thickened lead frame | |
| CN203850285U (en) | Thickened plastic-sealed lead frame | |
| CN203850289U (en) | Plastic-sealed lead frame for low-power electrical appliances | |
| CN203850283U (en) | Plastic-sealed lead frame with pressing marks | |
| CN203850278U (en) | Packaging-facilitated plastic-coated lead frame | |
| CN203850274U (en) | A thin plastic packaging lead wire framework |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141224 Termination date: 20150903 |
|
| EXPY | Termination of patent right or utility model |