CN203983256U - A kind of integrated circuit package structure - Google Patents
A kind of integrated circuit package structure Download PDFInfo
- Publication number
- CN203983256U CN203983256U CN201420366680.4U CN201420366680U CN203983256U CN 203983256 U CN203983256 U CN 203983256U CN 201420366680 U CN201420366680 U CN 201420366680U CN 203983256 U CN203983256 U CN 203983256U
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- China
- Prior art keywords
- ventilation
- integrated circuit
- main structure
- structure body
- heat abstractor
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- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of integrated circuit package structure, relate to integrated device electronics field, comprise main structure body, the bottom surface of described main structure body is to have cancellated radiating surface, bottom at described main structure body is provided with ventilation heat abstractor, and ventilation heat abstractor is connected by engage thread with main structure body, and described ventilation heat abstractor is provided with ventilation hole, be provided with heat radiation machine on ventilation heat abstractor top, heat radiation machine is connected and communicates with ventilation hole.The utility model is provided with ventilation heat abstractor in main structure body bottom, ventilation heat abstractor is provided with ventilation hole and heat radiation machine, and the bottom surface of main structure body is network structure, guarantee that the ventilation of integrated circuit, heat radiation are good, ensure the reliability of integrated circuit work.
Description
Technical field
the utility model relates to integrated device electronics field, more particularly relates to a kind of integrated circuit package structure.
Background technology
?integrated antenna package not only plays bonding point and the outside effect being electrically connected in integrated circuit (IC) chip; also for integrated circuit (IC) chip provides a reliable and stable operational environment; integrated circuit (IC) chip is played to the effect of machinery or environmental protection; thereby the function that integrated circuit (IC) chip can be brought into normal play, and ensure that it has high stability and reliability.In a word, the quality of integrated antenna package quality is very large to the good and bad relation of the overall performance of integrated circuit.Therefore, encapsulation should have stronger mechanical performance, good electric property, heat dispersion and chemical stability.Although the physical structure of IC, application, I/O quantity variance are very large, but difference is little for the effect of IC encapsulation and function, and the object of encapsulation is also suitable consistent.As " chip
Protector ", several effects have been played in encapsulation, are summed up and mainly contain two basic functions: (1) protection chip, makes it avoid physical damnification; (2) redistribution I/O, obtains the pin pitch that is easier to process in assembling.Encapsulation also has some other less important effect, such as providing one to be easier to standardized structure, for chip provides thermal dissipating path, makes chip avoid producing the soft error that α particle causes, and a kind of structure that is more convenient for test and ageing test is provided.Encapsulation can also be used for the interconnection of multiple IC.Can directly interconnect by the interconnection technique of the standards such as Wire Bonding Technology.Or the interconnection vias that also can provide with encapsulation, as the interconnection vias using in hybrid package technology, multi-chip module, system in package and system bulk miniaturization widely and the interconnection additive method that concept comprised, interconnects indirectly.
Existing integrated circuit package structure is all enclosed, has ventilation, the bad shortcoming of dispelling the heat, if the functional reliability of ventilation, the bad integrated circuit that dispels the heat will be affected.
Utility model content
The technical problem that the utility model solves is to provide a kind of ventilation, good integrated circuit package structure dispels the heat.
For solving the problems of the technologies described above, the technical scheme adopting is: a kind of integrated circuit package structure, comprise main structure body, the bottom surface of described main structure body is to have cancellated radiating surface, bottom at described main structure body is provided with ventilation heat abstractor, and ventilation heat abstractor is connected by engage thread with main structure body, and described ventilation heat abstractor is provided with ventilation hole, be provided with heat radiation machine on ventilation heat abstractor top, heat radiation machine is connected and communicates with ventilation hole.
Further, be also included in described main structure body top and be provided with groove, in groove, be provided with electronic chip, encapsulated layer is housed above electronic chip.
Further, the positive and negative electrode of described electronic chip passes from ventilation hole and bottom surface, and the electronic chip of integrated circuit interconnects.
Further, material selection silica gel or the flexible glue of described encapsulated layer.
The beneficial effects of the utility model are: the utility model is provided with ventilation heat abstractor in main structure body bottom, ventilation heat abstractor is provided with ventilation hole and heat radiation machine, and the bottom surface of main structure body is network structure, ventilation, the heat radiation of having guaranteed integrated circuit are good, have ensured the reliability of integrated circuit work.
Brief description of the drawings
Fig. 1 is cutaway view of the present utility model.
Fig. 2 is the vertical view of Fig. 1.
Embodiment
Below in conjunction with embodiment, the utility model is described in detail:
As shown in Figure 1 and Figure 2, a kind of integrated circuit package structure, comprises main structure body 1, and the bottom surface 5 of main structure body 1 is to have cancellated radiating surface, and network structure is cellular.Be provided with ventilation heat abstractor 4 in the bottom of main structure body 1, ventilation heat abstractor 4 is connected by engage thread with main structure body 1, ventilation heat abstractor 4 is provided with ventilation hole 41, the diameter of ventilation hole 41 is 2.0-3.2 millimeter, be provided with heat radiation machine 42 on ventilation heat abstractor 4 tops, heat radiation machine 42 is connected and communicates with ventilation hole 41, and heat radiation machine 42 directly sheds from ventilation hole 41 after the heat in integrated circuit is sucked.Also be included in main structure body 1 top and be provided with groove 2, be provided with electronic chip 21 in groove 2, electronic chip 21 is equipped with encapsulated layer 3 above, and the positive and negative electrode of electronic chip 21 passes from ventilation hole 41 and bottom surface 5, and the electronic chip of integrated circuit interconnects.Encapsulated layer 3 is fluorescent powder packaging layer, on the surface of encapsulated layer 3, scribbles layer of fluorescent powder, and the thickness proportion of fluorescent material and encapsulated layer 3 is 0.4:1, material selection silica gel or the flexible glue of encapsulated layer 3.
The material that main structure body of the present utility model is selected is aluminum or aluminum alloy, and recessing on main structure body is provided with electronic chip in groove, and the circuit design on main structure body links together electronic chip; On encapsulated layer, scribble fluorescent material and can prepare powerful product, can select as requested the quantity of groove to meet the design requirement of different circuit.In addition, be provided with ventilation heat abstractor in main structure body bottom, ventilation heat abstractor is provided with ventilation hole and heat radiation machine, and the bottom surface of main structure body is network structure, has guaranteed that the ventilation of integrated circuit, heat radiation are good, has ensured the reliability of integrated circuit work.
The foregoing is only preferred implementation of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (4)
1. an integrated circuit package structure, it is characterized in that: comprise main structure body (1), the bottom surface (5) of described main structure body (1) is to have cancellated radiating surface, be provided with ventilation heat abstractor (4) in the bottom of described main structure body (1), ventilation heat abstractor (4) is connected by engage thread with main structure body (1), described ventilation heat abstractor (4) is provided with ventilation hole (41), be provided with heat radiation machine (42) on ventilation heat abstractor (4) top, heat radiation machine (42) is connected and communicates with ventilation hole (41).
2. a kind of integrated circuit package structure according to claim 1, it is characterized in that: be also included in described main structure body (1) top and be provided with groove (2), in groove (2), be provided with electronic chip (21), electronic chip (21) is equipped with encapsulated layer (3) above.
3. a kind of integrated circuit package structure according to claim 2, it is characterized in that: the positive and negative electrode of described electronic chip (21) passes from ventilation hole (41) and bottom surface (5), and the electronic chip of integrated circuit interconnects.
4. a kind of integrated circuit package structure according to claim 2, is characterized in that: material selection silica gel or the flexible glue of described encapsulated layer (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420366680.4U CN203983256U (en) | 2014-07-04 | 2014-07-04 | A kind of integrated circuit package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420366680.4U CN203983256U (en) | 2014-07-04 | 2014-07-04 | A kind of integrated circuit package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203983256U true CN203983256U (en) | 2014-12-03 |
Family
ID=51980679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420366680.4U Expired - Fee Related CN203983256U (en) | 2014-07-04 | 2014-07-04 | A kind of integrated circuit package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203983256U (en) |
-
2014
- 2014-07-04 CN CN201420366680.4U patent/CN203983256U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141203 Termination date: 20150704 |
|
| EXPY | Termination of patent right or utility model |