CN203968564U - Cooling electronic component structure - Google Patents
Cooling electronic component structure Download PDFInfo
- Publication number
- CN203968564U CN203968564U CN201420370270.7U CN201420370270U CN203968564U CN 203968564 U CN203968564 U CN 203968564U CN 201420370270 U CN201420370270 U CN 201420370270U CN 203968564 U CN203968564 U CN 203968564U
- Authority
- CN
- China
- Prior art keywords
- heat radiation
- electronic component
- bar portion
- depression bar
- radiation ceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 33
- 239000000919 ceramic Substances 0.000 claims abstract description 65
- 230000005855 radiation Effects 0.000 claims abstract description 57
- 230000035515 penetration Effects 0.000 claims description 11
- 239000006260 foam Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a kind of cooling electronic component structure, described electronic devices and components are fixed on printed circuit board (PCB), described radiator structure comprises that lower surface attaches to the heat radiation ceramics of electronic devices and components upper surface and the fixture for fixing described heat radiation ceramics, wherein: the upper surface of described heat radiation ceramics has the holddown groove of crossing over this heat radiation ceramics; Described fixture comprises depression bar portion and is positioned at the syndeton at depression bar portion two ends, and holddown groove, described syndeton that described depression bar portion embeds heat radiation ceramics are fixed on printed circuit board (PCB).The utility model is selected ceramics to dispel the heat and is fixed by fixture, and not only mounting structure is simple, and can significantly reduce costs under the prerequisite that does not affect radiating effect.
Description
Technical field
The utility model relates to printed-board technology field, especially relates to a kind of cooling electronic component structure.
Background technology
For the radiator structure complexity of components and parts, stable not in prior art, and fin mostly is metal, and expensive, cost is higher.
Utility model content
The purpose of this utility model is to provide a kind of cooling electronic component structure, solved complex structure in prior art, the problem that unstable and cost is high.
The technical scheme that the utility model technical solution problem adopts is: a kind of cooling electronic component structure, described electronic devices and components are fixed on printed circuit board (PCB), described radiator structure comprises that lower surface attaches to the heat radiation ceramics of electronic devices and components upper surface and the fixture for fixing described heat radiation ceramics, wherein: the upper surface of described heat radiation ceramics has the holddown groove of crossing over this heat radiation ceramics; Described fixture comprises depression bar portion and is positioned at the syndeton at depression bar portion two ends, and holddown groove, described syndeton that described depression bar portion embeds heat radiation ceramics are fixed on printed circuit board (PCB).
In cooling electronic component structure described in the utility model, between the lower surface of described heat radiation ceramics and the upper surface of electronic devices and components, there is heat-conducting glue.
In cooling electronic component structure described in the utility model, mate with the shape and size of depression bar portion the bottom of the holddown groove of described heat radiation ceramics upper surface.
In cooling electronic component structure described in the utility model, described syndeton comprises two the first through holes and two fasteners at the two ends that are positioned at depression bar portion, has two the second through holes and this two the second through holes are corresponding with the position of the first through hole on described printed circuit board (PCB); Described fastener comprises body and is connected to the deduction cap at described body two ends and for the penetration portions through described depression bar portion and printed circuit board (PCB), described penetration portions has the clamping part moving along described body radial expansion; Described penetration portions is offered vertically for making described clamping part carry out along described body the clearance space that radial expansion moves; The penetration portions of each fastener is stuck in the lower surface of printed circuit board (PCB) successively through first through hole and second through hole and clamping part.
In cooling electronic component structure described in the utility model, between the deduction cap of described fastener and depression bar portion, there is foam cushion, the difference of the distance between the length of described fastener body and the first through hole and the second through hole is less than the thickness of described foam cushion.
In cooling electronic component structure described in the utility model, described heat radiation ceramics is square or rectangle, and the holddown groove of this heat radiation ceramics upper surface is diagonal angle distribution.
In cooling electronic component structure described in the utility model, described syndeton comprises the connecting rod that is connected to depression bar portion two ends and the hook that is positioned at connecting rod end, and described two connecting rods is towards the opposite; On described printed circuit board (PCB), there is the button corresponding with described hook.
In cooling electronic component structure described in the utility model, the connecting rod at described depression bar portion and two ends, hook one.
In cooling electronic component structure described in the utility model, described heat radiation ceramics is square or rectangle, and described holddown groove is parallel to one group of limit of the ceramics that dispels the heat.
In cooling electronic component structure described in the utility model, the upper surface of described heat radiation ceramics is that waveform and described holddown groove are positioned at one of them trough.
Implement cooling electronic component structure of the present utility model, there is following beneficial effect: select ceramics to dispel the heat and be fixed by fixture, not only mounting structure is simple, and can significantly reduce costs under the prerequisite that does not affect radiating effect.
Brief description of the drawings
Fig. 1 is the schematic diagram of the first embodiment of cooling electronic component structure of the present utility model.
Fig. 2 is the side schematic view of cooling electronic component structure in Fig. 1.
Fig. 3 is the schematic diagram of the second embodiment of cooling electronic component structure of the present utility model.
Fig. 4 is the side schematic view of cooling electronic component structure in Fig. 3.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Cooling electronic component structure of the present utility model comprises that lower surface attaches to the heat radiation ceramics of electronic devices and components upper surface and for fixing the fixture of this heat radiation ceramics, wherein: the upper surface of heat radiation ceramics has the holddown groove of crossing over this heat radiation ceramics; Fixture comprises depression bar portion and is positioned at the syndeton at depression bar portion two ends.Above-mentioned heat radiation ceramics is embedded the holddown groove of heat radiation ceramics and syndeton is fixed on printed circuit board (PCB) by depression bar portion, thereby heat radiation ceramics is fixed on the electronic devices and components on printed circuit board (PCB).
Above-mentioned electronic devices and components are specifically as follows various types of heater members, such as small-power chip etc.Heat radiation ceramics adopts the pottery taking carborundum (SiC) as main component, it is not only cheap, and due to micro-Cavitated structure of carborundum itself and outstanding heat loss through radiation characteristic, the far super metal material that can only passive heat radiation of its active heat removal usefulness, reduces the cost of radiator structure greatly.And fix by holddown groove crimping, the fixed structure of heat radiation ceramics is simple, stable.Below by different embodiment, radiator structure of the present utility model is described.
Embodiment 1:
As shown in Figure 1-2, in the first embodiment of cooling electronic component structure of the present utility model, electronic devices and components are welded to printed circuit board (PCB) by modes such as pasters, corresponding radiator structure comprises heat radiation ceramics 11 and fixture, the lower surface of ceramics 11 of wherein dispelling the heat attaches to electronic devices and components upper surface, and the upper surface of this heat radiation ceramics 11 is waveform, and one of them trough forms holddown groove; Fixture is for fixing above-mentioned heat radiation ceramics 11, and comprise depression bar portion 121, be positioned at the connecting rod 122 at depression bar portion 121 two ends and be positioned at the hook 123 of connecting rod 122 ends, and two connecting rods 122 is towards the opposite, on printed circuit board (PCB), there is the button corresponding with hook 123.Above-mentioned heat radiation ceramics 11 is embedded the holddown groove of heat radiation ceramics 11 and hook 123 is fixed on to the button on printed circuit board (PCB) by depression bar portion 121, realizes the fixing of heat radiation ceramics 11.
Especially, the connecting rod 122 at above-mentioned depression bar portion 121 and two ends, hook 123 one.Certainly, in actual applications, above-mentioned depression bar portion 121, connecting rod 122, hook 123 also can connect by welding manner.
Embodiment 2:
As shown in Figure 3-4, in the second embodiment of cooling electronic component structure of the present utility model, electronic devices and components are welded to printed circuit board (PCB) by modes such as pasters, corresponding radiator structure comprises heat radiation ceramics 31 and fixture, the lower surface of ceramics 31 of wherein dispelling the heat attaches to electronic devices and components upper surface, and the upper surface of this heat radiation ceramics 31 has the holddown groove of crossing over this heat radiation ceramics 31; Fixture is for fixing above-mentioned heat radiation ceramics 31, and comprises depression bar portion 321, is positioned at the syndeton at depression bar portion 321 two ends.Above-mentioned heat radiation ceramics 31 is embedded the holddown groove of heat radiation ceramics 31 and syndeton is fixed on printed circuit board (PCB) by depression bar portion 321, thereby realizes the fixing of heat radiation ceramics.
For improving radiating effect, can between the heat radiation lower surface of ceramics 31 and the upper surface of electronic devices and components, heat-conducting glue 33 be set.Due to the pliability of heat-conducting glue, the contact-making surface of ceramics 31 and/or electronic devices and components of can avoiding like this dispelling the heat is uneven and the effectively transmission of heat by contact that causes dispelling the heat between ceramics 31 and electronic devices and components makes to dispel the heat and can seamless contact conduct heat and then improve radiating efficiency between ceramics 31 and electronic devices and components.
In the present embodiment, mate with the shape and size of depression bar portion 321 bottom of the holddown groove of heat radiation ceramics 31 upper surfaces.
Above-mentioned syndeton comprises two the first through holes and two fasteners 322 at the two ends that are positioned at depression bar portion 321, and on printed circuit board (PCB), has two the second through holes and this two the second through holes are corresponding with the position of the first through hole.Fastener 32 comprises body (being bar portion) and is connected to the deduction cap at body two ends and for the penetration portions through depression bar portion (i.e. the first through hole) and printed circuit board (PCB) (i.e. the second through hole), and this penetration portions tapered and have the clamping part moving along body radial expansion and offer vertically for making clamping part carry out along body the clearance space that radial expansion moves.When fixing, the penetration portions of each fastener 322 is stuck in the lower surface of printed circuit board (PCB) successively through first through hole and second through hole and clamping part.
In addition, between the deduction cap of above-mentioned fastener 322 and depression bar portion 321, there is foam cushion 323, and the difference of distance between the length of the body of fastener 322 and the first through hole and the second through hole is less than the thickness of foam cushion 323.Because foam cushion 323 has elasticity, therefore said structure can limit fastener 322 movement vertically, ensures the stability of the snapping of fastener 322.
Especially, above-mentioned heat radiation ceramics 31 is square or rectangle, and the holddown groove of these heat radiation ceramics 31 upper surfaces is diagonal angle and distributes, and holddown groove is positioned on the diagonal of heat radiation ceramics 31, can further strengthen like this heat radiation ceramics 31 fixing stability.Certainly, in actual applications, holddown groove also can adopt other modes, for example, be parallel to the limit of the ceramics 31 that dispels the heat etc.
All these improvement or conversion should be understood that, for those of ordinary skills, can be improved as described above or convert, within all should belong to the protection range of the utility model claims.
Claims (10)
1. a cooling electronic component structure, described electronic devices and components are fixed on printed circuit board (PCB), it is characterized in that, described radiator structure comprises that lower surface attaches to the heat radiation ceramics of electronic devices and components upper surface and the fixture for fixing described heat radiation ceramics, wherein: the upper surface of described heat radiation ceramics has the holddown groove of crossing over this heat radiation ceramics; Described fixture comprises depression bar portion and is positioned at the syndeton at depression bar portion two ends, and holddown groove, described syndeton that described depression bar portion embeds heat radiation ceramics are fixed on printed circuit board (PCB).
2. cooling electronic component structure according to claim 1, is characterized in that, between the lower surface of described heat radiation ceramics and the upper surface of electronic devices and components, has heat-conducting glue.
3. cooling electronic component structure according to claim 1 and 2, is characterized in that, mate with the shape and size of depression bar portion the bottom of the holddown groove of described heat radiation ceramics upper surface.
4. cooling electronic component structure according to claim 3, it is characterized in that, described syndeton comprises two the first through holes and two fasteners at the two ends that are positioned at depression bar portion, has two the second through holes and this two the second through holes are corresponding with the position of the first through hole on described printed circuit board (PCB); Described fastener comprises body and is connected to the deduction cap at described body two ends and for the penetration portions through described depression bar portion and printed circuit board (PCB), described penetration portions has the clamping part moving along described body radial expansion; Described penetration portions is offered vertically for making described clamping part carry out along described body the clearance space that radial expansion moves; The penetration portions of each fastener is stuck in the lower surface of printed circuit board (PCB) successively through first through hole and second through hole and clamping part.
5. cooling electronic component structure according to claim 4, it is characterized in that, between the deduction cap of described fastener and depression bar portion, have foam cushion, the difference of the distance between the length of described fastener body and the first through hole and the second through hole is less than the thickness of described foam cushion.
6. cooling electronic component structure according to claim 4, is characterized in that, described heat radiation ceramics is square or rectangle, and the holddown groove of this heat radiation ceramics upper surface is diagonal angle distribution.
7. cooling electronic component structure according to claim 3, is characterized in that, described syndeton comprises the connecting rod that is connected to depression bar portion two ends and the hook that is positioned at connecting rod end, and described two connecting rods is towards the opposite; On described printed circuit board (PCB), there is the button corresponding with described hook.
8. cooling electronic component structure according to claim 7, is characterized in that, the connecting rod at described depression bar portion and two ends, hook one.
9. cooling electronic component structure according to claim 7, is characterized in that, described heat radiation ceramics is square or rectangle, and described holddown groove is parallel to one group of limit of the ceramics that dispels the heat.
10. cooling electronic component structure according to claim 9, is characterized in that, the upper surface of described heat radiation ceramics is that waveform and described holddown groove are positioned at one of them trough.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420370270.7U CN203968564U (en) | 2014-07-04 | 2014-07-04 | Cooling electronic component structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420370270.7U CN203968564U (en) | 2014-07-04 | 2014-07-04 | Cooling electronic component structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203968564U true CN203968564U (en) | 2014-11-26 |
Family
ID=51929097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420370270.7U Expired - Fee Related CN203968564U (en) | 2014-07-04 | 2014-07-04 | Cooling electronic component structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203968564U (en) |
-
2014
- 2014-07-04 CN CN201420370270.7U patent/CN203968564U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170120 Address after: 523000 Guangdong province Huizhou City Zhongkai high tech area Huihuan Zhongxing Street Yang Village 1 third storey building Patentee after: Huizhou silver packing material Co., Ltd. Address before: 516000 Guangdong City, Huiyang province autumn Town, Autumn Lake Road, old Wai village, No. 1 Patentee before: Li Dongzhen |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141126 Termination date: 20180704 |