CN205159011U - Paster precision resistor - Google Patents
Paster precision resistor Download PDFInfo
- Publication number
- CN205159011U CN205159011U CN201520991693.5U CN201520991693U CN205159011U CN 205159011 U CN205159011 U CN 205159011U CN 201520991693 U CN201520991693 U CN 201520991693U CN 205159011 U CN205159011 U CN 205159011U
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- China
- Prior art keywords
- electrode
- ceramic substrate
- resistive element
- protective layer
- fin
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- Expired - Fee Related
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Abstract
The utility model discloses a paster precision resistor, including body and the electrically conductive frame of two heat dissipations, this body is including a ceramic substrate, a resistive element, the two electrically conductive utmost points, a protective layer and a fin, the bottom surface of this ceramic substrate is provided with a plurality of heat dissipation groove, this resistive element set up in the ceramic substrate on the surface, this two electrically conductive utmost point sets up respectively in the both ends of ceramic substrate, this protective layer covers in the surface of resistive element, this fin covers in the protective layer on the surface, the electrically conductive frame of this two heat dissipation sets up respectively in the both ends of body, and the electrically conductive frame of each heat dissipation is all including the portion of registrating, supporting part and the fixed part of integrated into one piece connection. During the use, will dispel the heat through the screw and electrically conduct frame lock solid electric connection on the circuit board, the body hangs on the circuit board to the cooperation sets up heat dissipation groove and fin, can form fine result of ventilating heat dissipation, has improved the precision of product greatly, need not to adopt welded fastening simultaneously, can not the polluted environment, and repeatedly usable, easy dismounting.
Description
Technical field
The utility model relates to resistive domain technology, refers in particular to a kind of paster precision resistance.
Background technology
Patch resistor, also Chip-R is claimed, because of have volume little, lightweight, adapt to Reflow Soldering and wave-soldering, electric performance stablity, reliability is high, assembly cost is low and with automatically fill advantages such as being sticked for mating, the high and high frequency characteristics of mechanical strength is superior, and be widely used in the fields such as computer, mobile phone, e-dictionary, medical electronics product, video camera, electronic electric meter and VCD machine.
But current Chip-R is due to easy heating, and radiating effect is poor, cause resistance precision lower, and current Chip-R all adopts welding manner to fix, easily to environment, and cannot dismantle after fixing, cause using inconvenience.
Summary of the invention
In view of this, the utility model is for the disappearance of prior art existence, and its main purpose is to provide a kind of paster precision resistance, and it effectively can solve the bad and awkward problem of existing patch capacitor radiating effect.
For achieving the above object, the utility model adopts following technical scheme: a kind of paster precision resistance, includes body and two radiation conductive framves; This body includes a ceramic substrate, a resistive element, two conductive electrode, a protective layer and a fin; The bottom surface of this ceramic substrate is provided with multiple heat radiation groove, this resistive element is arranged on the surface of ceramic substrate, this two conductive electrode is arranged at the two ends of ceramic substrate respectively, two conductive electrode are connected with the two ends of resistive element respectively, this protective layer is covered in the outer surface of resistive element, and this fin is covered on the surface of protective layer; This two radiation conductives frame is arranged at the two ends of body respectively, each radiation conductive frame includes the fit portion of one-body molded connection, support portion and fixed part, fit portion is sheathed on outside corresponding conductive electrode, and this fixed part is provided with fixing hole, and between fixed part and fit portion, height of formation is poor.
Preferably, described ceramic substrate is aluminium nitride ceramics material.
Preferably, described radiation conductive frame is metallic copper material.
Preferably, described conductive electrode includes face electrode, back electrode, termination electrode, target and outer electrode, two end surfaces of this ceramic substrate are all coated with face electrode, the bottom surface of ceramic substrate is coated with back electrode, termination electrode is arranged at the end of ceramic substrate, each termination electrode covers the surface of the surface of corresponding surface electrode, the end face of ceramic substrate and corresponding back electrode respectively, target wraps corresponding termination electrode completely, outer electrode wraps corresponding target completely, and this resistive element is connected between double-sided electrode.
Preferably; described protective layer includes the first vitreum and secondary vitreous; this the first vitreum is covered in the surface of resistive element; this secondary vitreous is covered in the first Vitrea outer surface; the periphery of secondary vitreous is pressed against the surface periphery of face electrode, and this fin is covered on the surface of secondary vitreous.
The utility model compared with prior art has obvious advantage and beneficial effect, specifically, as shown from the above technical solution: during use, by screw radiation conductive frame is locked on circuit board and is electrically connected, body is suspended from circuit board, and be equipped with heat radiation groove and fin, good result of ventilating heat dissipation can be formed, substantially increase the precision of product, be welded and fixed without the need to adopting simultaneously, do not pollute the environment, reusable, easy accessibility.
For more clearly setting forth architectural feature of the present utility model and effect, below in conjunction with accompanying drawing and specific embodiment, the utility model is described in detail.
Accompanying drawing explanation
Fig. 1 is the schematic cross-section of the preferred embodiment of the utility model.
Accompanying drawing identifier declaration:
10, body 11, ceramic substrate
12, resistive element 13, conductive electrode
131, face electrode 132, back electrode
133, termination electrode 134, target
135, outer electrode 14, protective layer
141, the first vitreum 142, secondary vitreous
15, fin 101, heat radiation groove
20, radiation conductive frame 21, fit portion
22, support portion 23, fixed part
201, fixing hole
Embodiment
Please refer to shown in Fig. 1, that show the concrete structure of the preferred embodiment of the utility model, include body 10 and two radiation conductive framves 20.
This body 10 includes ceramic substrate 11, resistive element 12, two conductive electrode 13, protective layer 14 and a fin 15; The bottom surface of this ceramic substrate 11 is provided with multiple heat radiation groove 101; this resistive element 12 is arranged on the surface of ceramic substrate 11; this two conductive electrode 13 is arranged at the two ends of ceramic substrate 11 respectively; two conductive electrode 13 are connected with the two ends of resistive element 12 respectively; this protective layer 14 is covered in the outer surface of resistive element 12, and this fin 15 is covered on the surface of protective layer 14.Specifically, in the present embodiment, described ceramic substrate 11 is aluminium nitride ceramics material, has high thermal conductivity coefficient, good heat dissipation effect, described conductive electrode 13 includes face electrode 131, back electrode 132, termination electrode 133, target 134 and outer electrode 135, two end surfaces of this ceramic substrate 11 are all coated with face electrode 131, the bottom surface of ceramic substrate 11 is coated with back electrode 132, termination electrode 133 is arranged at the end of ceramic substrate 11, each termination electrode 133 covers the surface of corresponding surface electrode 131 respectively, the end face of ceramic substrate 11 and the surface of corresponding back electrode 132, target 134 wraps corresponding termination electrode 133 completely, outer electrode 135 wraps corresponding target 134 completely, this resistive element 12 is connected between double-sided electrode 131, described protective layer 14 includes the first vitreum 141 and secondary vitreous 142, this the first vitreum 141 is covered in the surface of resistive element 12, this secondary vitreous 142 is covered in the outer surface of the first vitreum 141, the periphery of secondary vitreous 142 is pressed against the surface periphery of face electrode 131, this fin 15 is covered on the surface of secondary vitreous 142, and, the cross section of described resistive element 12 is inverted trapezoidal, the end face of face electrode 131 and the suitable laminating in side of resistive element 12, the cross section of described first vitreum 141 is isosceles trapezoid, the cross section outline of this secondary vitreous 142 is also isosceles trapezoid, the end face of this termination electrode 133, the end face of target 134 and all suitable with the lateral surface of secondary vitreous 142 laminating of the end face of outer electrode 135.
This two radiation conductives frame 20 is arranged at the two ends of body 10 respectively, each radiation conductive frame 20 includes the fit portion 21 of one-body molded connection, support portion 22 and fixed part 23, fit portion 21 is sheathed on outside corresponding conductive electrode 13, this fixed part 23 is provided with fixing hole 201, and between fixed part 23 and fit portion 21, height of formation is poor.In the present embodiment, described radiation conductive frame 20 is metallic copper material.
Design focal point of the present utility model is: during use, by screw radiation conductive frame is locked on circuit board and is electrically connected, body is suspended from circuit board, and be equipped with heat radiation groove and fin, good result of ventilating heat dissipation can be formed, substantially increase the precision of product, be welded and fixed without the need to adopting simultaneously, do not pollute the environment, reusable, easy accessibility.
Below know-why of the present utility model is described in conjunction with specific embodiments.These describe just in order to explain principle of the present utility model, and can not be interpreted as the restriction to the utility model protection range by any way.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present utility model, and these modes all will fall within protection range of the present utility model.
Claims (5)
1. a paster precision resistance, is characterized in that: include body and two radiation conductive framves; This body includes a ceramic substrate, a resistive element, two conductive electrode, a protective layer and a fin; The bottom surface of this ceramic substrate is provided with multiple heat radiation groove, this resistive element is arranged on the surface of ceramic substrate, this two conductive electrode is arranged at the two ends of ceramic substrate respectively, two conductive electrode are connected with the two ends of resistive element respectively, this protective layer is covered in the outer surface of resistive element, and this fin is covered on the surface of protective layer; This two radiation conductives frame is arranged at the two ends of body respectively, each radiation conductive frame includes the fit portion of one-body molded connection, support portion and fixed part, fit portion is sheathed on outside corresponding conductive electrode, and this fixed part is provided with fixing hole, and between fixed part and fit portion, height of formation is poor.
2. paster precision resistance as claimed in claim 1, is characterized in that: described ceramic substrate is aluminium nitride ceramics material.
3. paster precision resistance as claimed in claim 1, is characterized in that: described radiation conductive frame is metallic copper material.
4. paster precision resistance as claimed in claim 1, it is characterized in that: described conductive electrode includes face electrode, back electrode, termination electrode, target and outer electrode, two end surfaces of this ceramic substrate are all coated with face electrode, the bottom surface of ceramic substrate is coated with back electrode, termination electrode is arranged at the end of ceramic substrate, each termination electrode covers the surface of corresponding surface electrode respectively, the end face of ceramic substrate and the surface of corresponding back electrode, target wraps corresponding termination electrode completely, outer electrode wraps corresponding target completely, this resistive element is connected between double-sided electrode.
5. paster precision resistance as claimed in claim 4; it is characterized in that: described protective layer includes the first vitreum and secondary vitreous; this the first vitreum is covered in the surface of resistive element; this secondary vitreous is covered in the first Vitrea outer surface; the periphery of secondary vitreous is pressed against the surface periphery of face electrode, and this fin is covered on the surface of secondary vitreous.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520991693.5U CN205159011U (en) | 2015-12-04 | 2015-12-04 | Paster precision resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520991693.5U CN205159011U (en) | 2015-12-04 | 2015-12-04 | Paster precision resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205159011U true CN205159011U (en) | 2016-04-13 |
Family
ID=55694678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520991693.5U Expired - Fee Related CN205159011U (en) | 2015-12-04 | 2015-12-04 | Paster precision resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205159011U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108711477A (en) * | 2018-05-24 | 2018-10-26 | 苏州惠琪特电子科技有限公司 | A kind of structure of high power precise chip resistor |
| CN108806906A (en) * | 2018-06-12 | 2018-11-13 | 深圳市业展电子有限公司 | The method and its Chip-R of alloy Chip-R are made for rectangular metal composite material strip for a kind of section |
| CN112397265A (en) * | 2020-11-09 | 2021-02-23 | 扬州永星电子有限公司 | High-power precise chip resistor |
| CN113517102A (en) * | 2021-04-15 | 2021-10-19 | 蚌埠市双环电子集团股份有限公司 | Integrated water-cooling module resistor |
-
2015
- 2015-12-04 CN CN201520991693.5U patent/CN205159011U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108711477A (en) * | 2018-05-24 | 2018-10-26 | 苏州惠琪特电子科技有限公司 | A kind of structure of high power precise chip resistor |
| CN108806906A (en) * | 2018-06-12 | 2018-11-13 | 深圳市业展电子有限公司 | The method and its Chip-R of alloy Chip-R are made for rectangular metal composite material strip for a kind of section |
| CN112397265A (en) * | 2020-11-09 | 2021-02-23 | 扬州永星电子有限公司 | High-power precise chip resistor |
| CN113517102A (en) * | 2021-04-15 | 2021-10-19 | 蚌埠市双环电子集团股份有限公司 | Integrated water-cooling module resistor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160413 Termination date: 20181204 |