CN210807773U - Heat-resistant high-frequency plate - Google Patents
Heat-resistant high-frequency plate Download PDFInfo
- Publication number
- CN210807773U CN210807773U CN201920896370.6U CN201920896370U CN210807773U CN 210807773 U CN210807773 U CN 210807773U CN 201920896370 U CN201920896370 U CN 201920896370U CN 210807773 U CN210807773 U CN 210807773U
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- China
- Prior art keywords
- polyimide
- heat
- copper
- plate
- board
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- Expired - Fee Related
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Abstract
The utility model discloses a heat-resistant type high frequency board, including the mainframe box, the lower extreme outside fixed mounting of mainframe box has the supporting legs, and the front end surface fixed mounting of mainframe box has control panel, the upper end outside fixed mounting of mainframe box has cotton pad, and one side surface of mainframe box is close to its upper end position department fixed mounting of department has the supporting seat, the upper end outside movable mounting of supporting seat has the drive brush-holder stud, and the inside internal surface of drive brush-holder stud is close to its lower extreme position department and is equipped with the pivot, the top position department that the inside internal surface of drive brush-holder stud is close to the pivot is equipped with folding axle. A heat-resistant type high frequency board, can carry out surface cleaning to turning over the piece object after turning over the piece to can reduce vibrations and to the harm of turning over the piece thing, can conveniently process turning over the piece thing after turning over the piece, be applicable to different working conditions.
Description
Technical Field
The utility model relates to a high frequency board field, in particular to heat-resistant type high frequency board.
Background
The high-frequency board is a special circuit board with higher electromagnetic frequency, generally speaking, the high frequency can be defined as the frequency above 1GHz, and is commonly used in the fields of radio systems, locator systems and the like; but current high frequency board radiating effect is relatively poor, and it is installed inside the back at equipment, with equipment direct contact, basically only can rely on and dispel the heat with the heat-conduction between the equipment, and secondly do not possess heat-resisting effect poor, stability is relatively poor in addition, and the banding structure is not enough has only adopted simple adhesive bonding to connect, and is firm inadequately.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a heat-resisting type high frequency board, can effectively solve the radiating effect among the background art poor, heat-resisting effect poor and the banding structure firm problem inadequately.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a heat-resistant type high frequency board, includes the high frequency board main part, the mounting hole has all been seted up to the upper surface four corners position of high frequency board main part, the lower part fixed mounting of high frequency board main part has heat radiation fins, the high frequency board main part is including first polyimide board, first copper, second polyimide board, second copper and banding polyimide board, first copper, second polyimide board and second copper stack are arranged, the banding polyimide board is located the side of first polyimide board, first copper, second polyimide board and second copper.
Preferably, one side of banding polyimide board is equipped with the connecting block, connecting block and banding polyimide board body coupling.
Preferably, the connecting block is in a convex shape, and a connecting groove matched with the connecting block is formed between the first polyimide plate and the first copper plate.
Preferably, be equipped with first aluminium base glue film between first polyimide board and the first copper, be equipped with the aluminium base glue film of second between first copper and the second polyimide board, be equipped with the aluminium base glue film of third between second polyimide board and the second copper.
Preferably, the number of connecting blocks and connecting grooves is six, every all be equipped with an aluminium base glue film between connecting block and the connecting groove.
Compared with the prior art, the utility model discloses following beneficial effect has: the utility model discloses in, through the heat radiation fin who sets up, heat radiation fin is the recess form of a continuity, the area of contact of high frequency board main part and air has been increased, thereby the radiating effect has been increased, first aluminium base glue film through setting up, aluminium base glue film is a metal base composite adhesive, high temperature resistance has, the performance of high strength, it has heat resistance more to compare the adhesive that uses in the traditional high frequency board, through the connecting block that sets up, the connecting block is the type of protruding, also be equipped with between first polyimide board and the first copper and connect the connecting groove with connecting block assorted, the connecting groove has formed the snap-on with connecting the block and has been connected, glue film filling between adding, can the banding of whole high frequency board main part more firm, stability is higher.
Drawings
Fig. 1 is a schematic view of an overall structure of a heat-resistant high-frequency plate according to the present invention;
fig. 2 is an enlarged view of a in fig. 1 of a heat-resistant high-frequency board according to the present invention;
fig. 3 is a cross-sectional view of a heat-resistant high-frequency board according to the present invention.
In the figure: 1. a high-frequency plate main body; 2. mounting holes; 3. heat dissipation fins; 4. a first polyimide sheet; 5. a first copper plate; 6. a second polyimide sheet; 7. a second copper plate; 8. a first aluminum-based glue layer; 9. a second aluminum-based glue layer; 10. a third aluminum-based glue layer; 11. sealing the edge of the polyimide plate; 12. and (4) connecting the blocks.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-3, a heat-resistant high-frequency board includes a high-frequency board main body 1, mounting holes 2 are formed at four corners of an upper surface of the high-frequency board main body 1, heat dissipation fins 3 are fixedly mounted at a lower portion of the high-frequency board main body 1, the heat dissipation fins 3 are continuous groove-shaped, and a contact area between the high-frequency board main body 1 and air is increased, so that a heat dissipation effect is increased, the high-frequency board main body 1 includes a first polyimide plate 4, a first copper plate 5, a second polyimide plate 6, a second copper plate 7, and an edge-sealed polyimide plate 11, the first polyimide plate 4, the first copper plate 5, the second polyimide plate 6, and the second copper plate 7 are stacked and arranged, and the edge-sealed polyimide plate 11 is located at a side of the first polyimide plate 4, the first copper plate 5, the second polyimide plate 6, and the second copper plate 7;
one side of the edge-sealed polyimide plate 11 is provided with a connecting block 12, and the connecting block 12 is integrally connected with the edge-sealed polyimide plate 11; the connecting block 12 is in a convex shape, a connecting groove matched with the connecting block 12 is formed between the first polyimide plate 4 and the first copper plate 5, the connecting groove and the connecting block 12 are connected in a clamping mode, and the glue layer filled between the connecting groove and the connecting block is added, so that the edge sealing of the whole high-frequency plate main body 1 is firmer, and the stability is higher; a first aluminum-based adhesive layer 8 is arranged between the first polyimide plate 4 and the first copper plate 5, a second aluminum-based adhesive layer 9 is arranged between the first copper plate 5 and the second polyimide plate 6, a third aluminum-based adhesive layer 10 is arranged between the second polyimide plate 6 and the second copper plate 7, and the aluminum-based adhesive layer is a metal-based composite adhesive and has high temperature resistance and high strength, and has higher heat resistance than an adhesive used in a traditional high-frequency plate; the quantity of connecting block 12 and spread groove is six, every all be equipped with first aluminium base glue film 8 between connecting block 12 and the spread groove.
It should be noted that, the utility model relates to a heat-resistant high frequency board, when using, the high frequency board main body 1 is fixed on the external device by the external screw through the mounting hole 2, after fixing, the heat dissipation fins 3 directly contact with the external device, because the heat dissipation fins 3 are in the shape of continuous concave, the contact area between the heat dissipation fins and the air can be increased, thereby the heat dissipation effect of the high frequency board main body 1 is increased, secondly the aluminum-based glue layer is a metal-based composite adhesive, which has high temperature resistance and high strength, compared with the adhesive used in the traditional high frequency board, the heat resistance is better, therefore, through the first aluminum-based glue layer 8, the second aluminum-based glue layer 9 and the third aluminum-based glue layer 10, the heat resistance of the high frequency board main body 1 can be greatly increased, in addition, the connecting block 12 is in the shape of convex, a connecting groove matched with the connecting block 12 is also arranged between the first polyimide board 4 and the first copper plate, the spread groove has formed the snap-on with connecting block 12 and has been connected, and the glue film of filling between in addition, the banding that can whole high frequency board main part 1 is more firm, and stability is higher.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. A heat-resistant high-frequency board characterized in that: including high frequency plate main part (1), mounting hole (2) have all been seted up to the upper surface four corners position of high frequency plate main part (1), the lower part fixed mounting of high frequency plate main part (1) has heat radiation fins (3), high frequency plate main part (1) is including first polyimide plate (4), first copper (5), second polyimide plate (6), second copper (7) and banding polyimide plate (11), first polyimide plate (4), first copper (5), second polyimide plate (6) and second copper (7) stack are arranged, banding polyimide plate (11) are located the side of first polyimide plate (4), first copper (5), second polyimide plate (6) and second copper (7).
2. A heat-resistant high-frequency board according to claim 1, characterized in that: one side of banding polyimide board (11) is equipped with connecting block (12), connecting block (12) and banding polyimide board (11) body coupling.
3. A heat-resistant high-frequency board according to claim 2, characterized in that: the shape of connecting block (12) is the type of calligraphy of protruding, be equipped with between first polyimide board (4) and first copper (5) with connecting block (12) assorted spread groove.
4. A heat-resistant high-frequency board according to claim 1, characterized in that: be equipped with first aluminium base glue film (8) between first polyimide board (4) and first copper (5), be equipped with aluminium base glue film (9) of second between first copper (5) and second polyimide board (6), be equipped with aluminium base glue film (10) of third between second polyimide board (6) and second copper (7).
5. A heat-resistant high-frequency board according to claim 2, characterized in that: the quantity of connecting block (12) and spread groove is six, every all be equipped with first aluminium base glue film (8) between connecting block (12) and the spread groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920896370.6U CN210807773U (en) | 2019-06-14 | 2019-06-14 | Heat-resistant high-frequency plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920896370.6U CN210807773U (en) | 2019-06-14 | 2019-06-14 | Heat-resistant high-frequency plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210807773U true CN210807773U (en) | 2020-06-19 |
Family
ID=71227144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920896370.6U Expired - Fee Related CN210807773U (en) | 2019-06-14 | 2019-06-14 | Heat-resistant high-frequency plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210807773U (en) |
-
2019
- 2019-06-14 CN CN201920896370.6U patent/CN210807773U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200619 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |