CN203967131U - LED lead frame at the bottom of a kind of novel mug - Google Patents
LED lead frame at the bottom of a kind of novel mug Download PDFInfo
- Publication number
- CN203967131U CN203967131U CN201420302126.XU CN201420302126U CN203967131U CN 203967131 U CN203967131 U CN 203967131U CN 201420302126 U CN201420302126 U CN 201420302126U CN 203967131 U CN203967131 U CN 203967131U
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- Prior art keywords
- cup
- plastic cement
- encapsulation
- chamber
- lead frame
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Abstract
The utility model discloses LED lead frame at the bottom of a kind of novel mug, comprise couple of conductor terminal and plastic cement cup, plastic cement cup profile is cuboid, plastic cement cup middle part is provided with encapsulation cup chamber, the two ends of pair of conductive terminal on Width are completely covered and are surrounded by plastic cement cup by plastic cement cup, the sidewall in encapsulation cup chamber is outward-dipping and its cross section rectangular in shape from down to up, the entire length of LED lead frame is 2.1-2.3mm, integral width is 1.5-1.7mm, cup end length and the width in encapsulation cup chamber are respectively 1.51-1.61mm and 0.91-1.01mm, the cup in the encapsulation cup chamber of plastic cement cup encapsulates at the end and is fixed with wafer.The utility model advantage: thus by the cup floor space that increase encapsulates cup chamber, increased the cup silver coating area at the end, can effectively utilize light efficiency, increase luminous flux, increased considerably the bonding wire region at glass end, a glass back welding line is more prone to.
Description
Technical field
The utility model relates to LED product technical field, in particular LED lead frame at the bottom of a kind of novel mug.
Background technology
LED lead frame comprise conductor terminal and with the plastic cement cup of conductor terminal integrated injection molding, its plastic cement cup is provided with encapsulation cup chamber, for the less compact LED lead frame of overall dimension, the cup floor space design in the encapsulation cup chamber of traditional LED lead frame is less, at the bottom of its glass, the reflective surface area of silver coating is also less, through encapsulation procedure, verify, because the cup floor space in encapsulation cup chamber is less, caused cup back welding line difficulty, if a little slightly overflow, glue just can cause beating gold thread skew or beat not first-class bad phenomenon, as beat gold thread and have slightly off normal just can be easily just beat on encapsulation glass chamber sidewall, and less can only the encapsulation of cup floor space in encapsulation cup chamber fixed a wafer, power and the scope of application of product have been reduced.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, LED lead frame at the bottom of a kind of novel mug is provided, thereby the cup floor space that this lead frame encapsulates cup chamber by increase has increased the silver coating area at the cup end, can more effectively utilize light efficiency, increase luminous flux, the bonding wire region that has increased considerably the cup end, becomes a glass back welding line and is more prone to.
The utility model is achieved through the following technical solutions:
LED lead frame at the bottom of a kind of novel mug, comprise couple of conductor terminal and with the plastic cement cup of couple of conductor terminal integrated injection molding, described plastic cement cup profile is cuboid, described plastic cement cup middle part is provided with the encapsulation cup chamber for packaged LED wafer, described pair of conductive terminal comprises respectively in the longitudinal direction the connecting portion in the encapsulation cup chamber of stretching into plastic cement cup and stretches out the free portion outside plastic cement cup, the connecting portion of described pair of conductive terminal arranges and in opposite directions by separating with the integrated isolated insulation band of plastic cement cup, the terminal pins of the outer end outwardly formation in middle part outside plastic cement cup is stretched out by the free portion of described conducting terminal, the two ends of described pair of conductive terminal on Width are completely covered and are surrounded by plastic cement cup by described plastic cement cup, the sidewall in described encapsulation cup chamber is outward-dipping and its cross section rectangular in shape from down to up, the entire length of described LED lead frame is 2.1-2.3mm, integral width is 1.5-1.7mm, cup end length and the width in described encapsulation cup chamber are respectively 1.51-1.61mm and 0.91-1.01mm, the cup in the encapsulation cup chamber of described plastic cement cup encapsulates at the end and is fixed with wafer.
As the preferred implementation of technique scheme, the cup in the encapsulation cup chamber of described plastic cement cup encapsulates at the end and is fixed with a large-sized wafer or a plurality of small size wafer.
As the preferred implementation of technique scheme, described pair of conductive terminal upper surface is provided with silver coating in the position, cup bottom that is positioned at encapsulation cup chamber.
As the preferred implementation of technique scheme, outer being trapped among with the junction of described plastic cement cup of described pair of conductive terminal is provided with the fastening step being interlocked with described plastic cement cup.
As the preferred implementation of technique scheme, described plastic cement cup two lateral wall lower edges are in the longitudinal direction provided with groove, and described plastic cement cup is by the stuck point phase interlock of protruding on this groove and material strip.
Four incline places in the encapsulation cup chamber of described plastic cement cup have rounding.
The utility model has the following advantages compared to existing technology:
LED lead frame at the bottom of a kind of novel mug that the utility model provides, under the prerequisite that can not strengthen in product design size, thereby the cup floor space that encapsulates cup chamber by increase has increased reflection of light area, thereby can more effectively utilize light efficiency, increase luminous flux; The soldering tin that has increased considerably the cup end, becomes a glass back welding line and is more prone to, and has effectively avoided beating gold thread skew or has beaten not first-class bad phenomenon; Thereby and saved injection moulding plastic material used owing to increasing the cup floor space in encapsulation cup chamber, reduced cost; In addition at the bottom of its glass, can be applicable to encapsulation and fix a large-sized wafer or a plurality of small size wafer, power increases greatly, has greatly expanded the scope of application of this kind of product.
Accompanying drawing explanation
Fig. 1 is vertical view of the present utility model.
Fig. 2 is front view of the present utility model.
Fig. 3 is left view of the present utility model.
Embodiment
Below embodiment of the present utility model is elaborated; the present embodiment is implemented take technical solutions of the utility model under prerequisite; provided detailed execution mode and concrete operating process, but protection range of the present utility model is not limited to following embodiment.
Referring to Fig. 1 to Fig. 3, LED lead frame at the bottom of a kind of novel mug that the utility model provides, LED lead frame at the bottom of a kind of novel mug, comprise couple of conductor terminal 2 and with the plastic cement cup 3 of couple of conductor terminal 2 integrated injection moldings, plastic cement cup 3 profiles are cuboid, plastic cement cup 3 middle parts are provided with the encapsulation cup chamber 31 for packaged LED wafer 1, pair of conductive terminal comprises respectively in the longitudinal direction the connecting portion in the encapsulation cup chamber 31 of stretching into plastic cement cup 3 and stretches out the free portion outside plastic cement cup 3, the connecting portion of pair of conductive terminal arranges and in opposite directions by separating with the integrated isolated insulation band 32 of plastic cement cup 3, the terminal pins 21 of the outer end outwardly formation in middle part outside plastic cement cup 3 is stretched out by the free portion of conducting terminal, the two ends of pair of conductive terminal on Width are covered by plastic cement cup 3 completely and are surrounded by plastic cement cup 3.Outer being trapped among with the junction of plastic cement cup 3 of pair of conductive terminal is provided with the fastening step 22 being interlocked with plastic cement cup 3.Pair of conductive terminal upper surface is provided with silver coating in the position, cup bottom that is positioned at encapsulation cup chamber 31.On the silver coating of the cup in the encapsulation cup chamber 31 of plastic cement cup 3 at the end, encapsulation is fixed with a large-sized wafer 1 or a plurality of small size wafer 1.The sidewall in encapsulation cup chamber 31 is outward-dipping and its cross section rectangular in shape from down to up, and four incline places in the encapsulation cup chamber 31 of plastic cement cup 3 have rounding.The entire length of LED lead frame is that 2.1-2.3mm, integral width are 1.5-1.7mm, and cup end length and the width in encapsulation cup chamber 31 are respectively 1.51-1.61mm and 0.91-1.01mm, and this scope size need to be changed die cavity fuse according to using.Plastic cement cup 3 two lateral wall lower edges are in the longitudinal direction provided with groove 33, and plastic cement cup 3 is by the stuck point phase interlock of protruding on this groove 33 and material strip.
LED lead frame at the bottom of a kind of novel mug that the utility model provides, under the prerequisite that can not strengthen in product design size, thereby the cup floor space that encapsulates cup chamber 31 by increase has increased the silver coating area at the cup end, increase reflection of light area, thereby can more effectively utilize light efficiency, increase luminous flux; The soldering tin that has increased considerably the cup end, becomes a glass back welding line and is more prone to, and has effectively avoided beating gold thread skew or has beaten not first-class bad phenomenon; Thereby and saved injection moulding plastic material used owing to increasing the cup floor space in encapsulation cup chamber 31, reduced cost; In addition at the bottom of its glass, can be applicable to encapsulation and fix a large-sized wafer 1 or a plurality of small size wafer 1, greatly expand the scope of application of this kind of product.
These are only preferred embodiment of the present utility model, not in order to limit the utility model, all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (6)
1. LED lead frame at the bottom of a novel mug, comprise couple of conductor terminal and with the plastic cement cup of couple of conductor terminal integrated injection molding, described plastic cement cup profile is cuboid, it is characterized in that: described plastic cement cup middle part is provided with the encapsulation cup chamber for packaged LED wafer, described pair of conductive terminal comprises respectively in the longitudinal direction the connecting portion in the encapsulation cup chamber of stretching into plastic cement cup and stretches out the free portion outside plastic cement cup, the connecting portion of described pair of conductive terminal arranges and in opposite directions by separating with the integrated isolated insulation band of plastic cement cup, the terminal pins of the outer end outwardly formation in middle part outside plastic cement cup is stretched out by the free portion of described conducting terminal, the two ends of described pair of conductive terminal on Width are completely covered and are surrounded by plastic cement cup by described plastic cement cup, the sidewall in described encapsulation cup chamber is outward-dipping and its cross section rectangular in shape from down to up, the entire length of described LED lead frame is 2.1-2.3mm, integral width is 1.5-1.7mm, cup end length and the width in described encapsulation cup chamber are respectively 1.51-1.61mm and 0.91-1.01mm, the cup in the encapsulation cup chamber of described plastic cement cup encapsulates at the end and is fixed with wafer.
2. LED lead frame at the bottom of a kind of novel mug as claimed in claim 1, is characterized in that: the cup in the encapsulation cup chamber of described plastic cement cup encapsulates at the end and is fixed with a large-sized wafer or a plurality of small size wafer.
3. LED lead frame at the bottom of a kind of novel mug as claimed in claim 1 or 2, is characterized in that: described pair of conductive terminal upper surface is provided with silver coating in the position, cup bottom that is positioned at encapsulation cup chamber.
4. LED lead frame at the bottom of a kind of novel mug as claimed in claim 3, is characterized in that: outer being trapped among with the junction of described plastic cement cup of described pair of conductive terminal is provided with the fastening step being interlocked with described plastic cement cup.
5. LED lead frame at the bottom of a kind of novel mug as claimed in claim 4, is characterized in that: described plastic cement cup two lateral wall lower edges are in the longitudinal direction provided with groove, and described plastic cement cup is by the stuck point phase interlock of protruding on this groove and material strip.
6. LED lead frame at the bottom of a kind of novel mug as claimed in claim 5, is characterized in that: four incline places in the encapsulation cup chamber of described plastic cement cup have rounding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420302126.XU CN203967131U (en) | 2014-06-06 | 2014-06-06 | LED lead frame at the bottom of a kind of novel mug |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420302126.XU CN203967131U (en) | 2014-06-06 | 2014-06-06 | LED lead frame at the bottom of a kind of novel mug |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203967131U true CN203967131U (en) | 2014-11-26 |
Family
ID=51927679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420302126.XU Expired - Fee Related CN203967131U (en) | 2014-06-06 | 2014-06-06 | LED lead frame at the bottom of a kind of novel mug |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203967131U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9954151B2 (en) | 2015-11-30 | 2018-04-24 | Nichia Corporation | Package, package intermediate body, light emitting device, method for manufacturing same |
| US10079332B2 (en) | 2015-12-09 | 2018-09-18 | Nichia Corporation | Package manufacturing method, light emitting device manufacturing method, package, and light emitting device |
-
2014
- 2014-06-06 CN CN201420302126.XU patent/CN203967131U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9954151B2 (en) | 2015-11-30 | 2018-04-24 | Nichia Corporation | Package, package intermediate body, light emitting device, method for manufacturing same |
| US10580947B2 (en) | 2015-11-30 | 2020-03-03 | Nichia Corporation | Package and package intermediate body |
| US10079332B2 (en) | 2015-12-09 | 2018-09-18 | Nichia Corporation | Package manufacturing method, light emitting device manufacturing method, package, and light emitting device |
| US10490705B2 (en) | 2015-12-09 | 2019-11-26 | Nichia Corporation | Package and light emitting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141126 Termination date: 20170606 |