CN203892912U - LED (light-emitting diode) lamp - Google Patents

Abstract

The utility model discloses an LED (light-emitting diode) lamp capable of directly replacing a conventional tungsten, halogen or power-saving lamp. The LED lamp comprises a lamp wick with at least one LED device and a heat-conducting insulating material filling a chamber of a lamp holder and mechanically contacting with the lamp wick and an electrode of the lamp base. When the LED device is energized, a thermal channel for conducting heat energy from the lamp wick to the electrode for heat radiation is provided by the heat-conducting insulating material. The LED lamp can be directly inserted into a lamp socket of an ordinary lamp, and the replacement of a conventional lamp system or the additional arrangement of an adapter are avoided.

Description

LED lamp

Technical field

The utility model is about a kind of electric light, particularly about a kind of light emitting diode (LED) electric light that can directly replace traditional tungsten filament, halogen or Electricity-saving lamp bulb.

Background technology

Use direct current LED matrix as the LED lamp of wick, must use power supply changeover device will convert direct current confession to should direct current LED matrix, so can increase the cost of LED lamp.In addition, power supply changeover device is difficult to completely hide and be placed in the standard lamp head of conventional bulb, therefore needs mold developing separately to make the mechanism's part that is different from conventional bulb, not only more increases cost, also increases the volume of LED lamp.Direct current LED matrix can produce heat energy when energising, therefore must process these heat energy by additional designs cooling mechanism.If cannot efficiently radiates heat, high temperature can cause the luminous efficiency of LED to reduce, the life-span reduces and the unfavorable effect such as wavelength shift.Power supply changeover device, alternating current being converted in galvanic process, also can produce heat energy, inductance and integrated circuit wherein particularly, and high temperature also can damage this class component, causes product to operate.Particularly in high-power application, the light fixture of lighting use for example, the heat energy that direct current LED matrix produces is higher, and therefore heat radiation situation not enough and that cause is more serious.Some product adopts many lower powered bullet cuts (lamp type) LED, and uses simple bridge rectifier, to adapt to traditional lamp holder of small size.But lower powered LED brightness is generally too low, and market acceptance is limited, and this series products is often because poor heat radiation, and light decay phenomenon is serious.

In recent years, the technology of the LED matrix of use alternating current is day by day ripe, and brightness also promotes day by day, has had commercial exploitation and has been worth.Alternating current LED matrix is produced on a plurality of LED of series and parallel on same wafer of heap of stone, after this wafer package of heap of stone, series connection has the resistor of certain resistance value, can directly bear civil power uses as high voltages such as 110 volts or 220 volts, therefore economize the required power supply changeover device of removing DC LED matrix or rectification circuit, effectively reduce costs and reduce the quality problems that circuit causes.Although alternating current LED matrix is conveniently applied in the space of small size, still have the problem of heat radiation to process.Especially in high-power application, the light fixture of lighting use for example, the heat energy of its generation is higher, if set up radiator, can strengthen volume and the cost of LED lamp, if do not help the heat radiation of alternating current LED matrix, can cause again luminous efficiency reduction, the life-span of LED to reduce and wavelength shift, even burn LED wafer of heap of stone.

In view of this, just have and need to propose a kind of scheme, to address the above problem.

Utility model content

One of the purpose of this utility model, is to propose a kind of LED lamp of strengthening LED matrix heat radiation.

One of the purpose of this utility model, is to propose a kind of LED lamp that can directly replace traditional tungsten filament, halogen or Electricity-saving lamp bulb.

According to the utility model, the utility model provides a kind of LED lamp, comprising: wick, contains the LED matrix of at least one power between 0.3 to 5W; The lamp holder with first and second electrode, it has chamber, and this first electrode has spiral lamination, column or needle-like profile; Resistance value is connected between this first and second electrode between the resistor between 50 to 50000 nurses difficult to understand and this wick; And the heat-conducting insulation material that thermal conductivity factor is greater than 30W/mK is filled in this chamber, mechanically contact this wick and this first electrode, provide the passage of heat to help this wick heat radiation to this first electrode.

Preferably, this at least one LED matrix mechanically contacts this heat-conducting insulation material.

Preferably, this wick comprises this at least one LED matrix of circuit board bearing, and mechanically contacts this heat-conducting insulation material.

Preferably, this wick comprises: this at least one LED matrix of circuit board bearing; And heat-conducting piece welds this circuit board, and one end is imbedded in this heat-conducting insulation material.

Preferably, this wick comprises that heat-conducting piece welds this at least one LED matrix, and one end is imbedded in this heat-conducting insulation material.

Preferably, this wick comprises: have the circuit board of perforation, carry this at least one LED matrix; And heat-conducting piece, thering is first end and weld this LED matrix, the second end is imbedded in this heat-conducting insulation material by this perforation.

Preferably, this circuit board mechanically contacts this heat-conducting insulation material.

Preferably, this heat-conducting insulation material comprises epoxy resin or heat conduction powder.

Preferably, this resistor is embedded in this heat-conducting insulation material.

Preferably, this heat-conducting insulation material is liquid state, semisolid or solid-state material.

According to the utility model, a kind of LED lamp comprises the wick that contains at least one LED matrix, has the lamp holder of chamber, and heat-conducting insulation material is filled in this chamber, mechanically contacts an electrode of this wick and this lamp holder.When this LED matrix energising, this heat-conducting insulation material provides the passage of heat that heat energy is conducted to this electrode heat radiation from this wick.

This lamp holder can be used the lamp holder of conventional bulb, so this LED lamp can directly insert the light bulb holder of general light fixture, does not need to change original lamp system or installs adapter additional.

In order to allow the above-mentioned and other objects, features and advantages of the present utility model can be more obvious, below will coordinate appended diagram, be described in detail as follows.In addition,, in explanation of the present utility model, identical member represents with same-sign, in this, first states clearly.

Accompanying drawing explanation

Fig. 1 is the schematic diagram of the first embodiment of the present utility model;

Fig. 2 is the schematic diagram of equivalent circuit of the LED lamp of Fig. 1;

Fig. 3 a-Fig. 3 c is the schematic diagram of several LED wafer of heap of stone;

Fig. 4 is the schematic diagram of the second embodiment of the present utility model;

Fig. 5 is the schematic diagram of the 3rd embodiment of the present utility model;

Fig. 6 is the schematic diagram of many wafer wicks of heap of stone;

Fig. 7 is the schematic diagram of the 4th embodiment of the present utility model;

Fig. 8 is the schematic diagram of the 5th embodiment of the present utility model;

Fig. 9 is the schematic diagram of the 6th embodiment of the present utility model; And

Figure 10 is the schematic diagram of the 7th embodiment of the present utility model.

Description of reference numerals

10 lamp holder 12 electrodes

14 electrode 16 spiral lamination profiles

18 chamber 20 wicks

22 LED build wafer 24 supports

26 sealing 30 resistors

32 wire 34 wires

36 heat-conducting insulation material 38 resistors

40 lampshade 50 heat-conducting pieces

52 weld pad 54 weld pads

56 axial sheet 58 flanks

60 perforation 62 perforations

64 perforation 66 pins

68 scolding tin 70 scolding tin

The specific embodiment

Fig. 1 is the schematic diagram of the first embodiment of the present utility model.In order to highlight the feature of this creation, the standard lamp head 10 that this embodiment is used miniature bulb to use, it has electrode 12 and supplies to be connected AC power with 14.As having of the art, conventionally know the knowledgeable and be familiar with, electrode 12 cordings have the metal-back of spiral lamination profile 16, have chamber 18 in it.This embodiment is used a LEDs device 20 as wick, and it is that LED wafer 22 of heap of stone is fixed on support 24, and covers thereon sealing 26.The encapsulation of LED is known techniques, for simplicity of illustration, does not draw the detailed packaging structure of LED matrix 20 herein.One end of resistor 30 is soldered to electrode 14, and other end mat wire 32 is soldered to LED matrix 20, and the two ends of wire 34 are respectively welded to electrode 12 and LED matrix 20.As shown in Figure 2, LED wafer 22 of heap of stone and resistor 30 are connected between electrode 12 and 14 equivalent circuit of this LED lamp.As having of the art conventionally known the knowledgeable and is familiar with, so-called alternating current LED wafer of heap of stone, the LED that contains two contrary direction configurations is connected in parallel between two branch connecting pins, each the party upwards has at least one LED, and the LED of these two contrary direction configurations is lit in the positive and negative half period of AC power respectively.The size of the resistance value R of resistor 30 is to select according to the current value of design requirement.Resistor 30 also has the function of protection alternating current LED wafer 22 of heap of stone, and when being connected to the AC power generation surging of electrode 12 and 14, resistor 30 can absorb most surge voltage.Get back to Fig. 1, one of feature of the present utility model, is in chamber 18, to fill heat-conducting insulation material 36, and it mechanically contacts support 24 and electrode 12, and thermal energy conduction to the electrode 12 that provides hot channel that LED wafer 22 of heap of stone is produced because of electrified light emitting dispels the heat.As having of the art, conventionally know the knowledgeable and be familiar with, support 24 is conventionally containing the sheet metal of helpful LED wafer 22 heat radiations of heap of stone, and therefore, support 24 is attached on heat-conducting insulation material 36, has good thermal conductance effect.Except helping LED wafer 22 heat radiations of heap of stone, heat-conducting insulation material 36 also helps resistor 30 heat radiations, because resistor 30 is embedded in heat-conducting insulation material 36.

Heat-conducting insulation material 36 can be selected epoxy resin, or heat conduction powder, for example aluminium oxide, aluminium nitride, boron nitride or other Heat Conduction Material, or the mixture of the two.Table 1 is to use three kinds of different Heat Conduction Materials in the LED of Fig. 1 lamp, the actual result recording.

Table 1

From the test result of table 1, adopt the heat-conducting insulation material 36 of epoxy resin, poor because of thermal conductivity factor, therefore switch on, bulk temperature is higher afterwards; The heat-conducting insulation material 36 that epoxy resin is mixed with heat conduction powder, better because of heat-conducting effect, light in test and occur without unusual condition; Directly use the heat-conducting insulation material 36 of heat conduction powder pressing filling, also can obtain good heat conductive effect.Generally speaking, LED lamp can obtain good light output brightness, lights continuously and without abnormal, occurs for 1000 hours.Also can select other material as heat-conducting insulation material 36, preferably, its thermal conductivity factor is greater than 30W/mK.

What conventional bulb was used is standard lamp head, and for example E12, E14, E17, E26 and E27 are the lamp holders of traditional osram lamp, and MR16 and GU10 are the lamp holders of traditional halogen bulb.Table 2 is used standard lamp head E12 and E27 in the LED of Fig. 1 lamp, the actual result recording.

Table 2

As shown in the content of table 2, no matter the LED lamp of Fig. 1 is E12 lamp holder or the larger E27 lamp holder of volume that uses common small volume, all can obtain good light output brightness, and light continuously 1000 hours without abnormal generation, the heat energy that expression LED wafer 22 of heap of stone produces effectively conducts to electrode 12 and dispels the heat.As shown in Figure 1, the size of this LED lamp is approximately identical with lamp holder 10, has again good heat-sinking capability, can reach the high power applications that known techniques is not accomplished.In the lamp holder of traditional halogen bulb, an electrode is cylindrical metal shell, is insulated thing and another electrode separation is opened.Some standard lamp head is to use two needle electrodes insulated from each other.No matter be lamp holder or other standard lamp head of traditional osram lamp, traditional halogen bulb, there is chamber can fill heat-conducting insulation material, therefore have at least an electrode to dispel the heat with the wick of helping LED lamp.Because the electrode of lamp holder outwards exposes to the open air, so good radiating effect can be provided.

The LED lamp of Fig. 1 can be manufactured with various processing procedures.In one embodiment, first by after all circuit unit welding, recharge heat-conducting insulation material 36 in chamber 18, till the consumption of heat-conducting insulation material 36 is filled to the bottom of its contact support 24, can slightly be increased to the plane over support 24 bottoms, if select the mixture of epoxy resin or epoxy resin and heat conduction powder as heat-conducting insulation material 36, the rear heating of Ze Qi injecting chamber 18 is solidified.If select heat conduction powder as heat-conducting insulation material 36, after it inserts chamber 18, exert pressure and make its consolidation.Also heat conduction powder mixing silica gel can be become to colloid, the rear heating of injecting chamber 18 is solidified.In another embodiment, first welding lead 34 and resistor 30 are to electrode 12 and 14, then fill heat-conducting insulation material 36 in chamber 18, wire 32 and 34 tail end expose outside heat-conducting insulation material 36, LED matrix 20 is attached to the upper surface of heat-conducting insulation material 36, last welding lead 32 and 34 is to LED matrix 20 again.If need to solidify heat-conducting insulation material 36, can attach before LED matrix 20 or after heating execution.

Can select the LED that includes more LED quantity to build the brightness that wafer 22 improves LED lamp.Fig. 3 a-Fig. 3 b is the schematic diagram of several LED wafer 22 of heap of stone, and Fig. 3 a is the LED of two string opposite directions in parallel between two branch connecting pins, every a string plural LED that comprises; Fig. 3 b is the LED couple connecting more than two couples between two branch connecting pins, and every pair of LEDs is connected in parallel to containing the LED that both direction is contrary; Fig. 3 c is that five above LED are configured to bridge architecture.These have all had commercial product to select.

Fig. 4 is the schematic diagram of the second embodiment of the present utility model.The wick of this embodiment comprise circuit board 28 and on LED matrix 20, LED matrix 20 contains at least one LED wafer 22 of heap of stone.Resistors in series 38 changes into and being arranged on circuit board 28, and mat wire 34 and 32 is connected to circuit board 28 between electrode 12 and 14.Circuit board 28 can be selected the assembly of tempered glass fiber (FR4) or metal substrate (IMS); LED matrix 20 and resistors in series 38 can be selected surface installing type assembly (SMD), use surface mount technology (SMT) to be arranged on circuit board 28.Because resistor 38 is to be welded on circuit board 28, therefore can use variable resistance to increase the elasticity of application, for example convenient adjustment is by the current value of LED matrix 20.When manufacturing this LED lamp, first LED matrix 20 and resistors in series 38 are welded on circuit board 28, then engage with lamp holder 10.In one embodiment, first welding lead 34 and 32 is to electrode 12 and 14 and circuit board 28, recharge heat-conducting insulation material 36 in chamber 18, till the amount of heat-conducting insulation material 36 is filled to the bottom of its contact circuit plate 28, can slightly be increased to the plane over circuit board 28 bottoms, be heating and curing if required, then by heat-conducting insulation material 36.In another embodiment, first welding lead 34 and 32 is to electrode 12 and 14, then fill heat-conducting insulation material 36 in chamber 18, wire 32 and 34 tail end expose outside heat-conducting insulation material 36, again circuit board 28 is attached to the upper surface of heat-conducting insulation material 36, last welding lead 32 and 34 is to circuit board 28, and if required, heat-conducting insulation material 36 can or be heating and curing before attaching circuit board 28 later.Selecting of heat-conducting insulation material 36 is identical with the embodiment of Fig. 1 with making.As having of the art, conventionally know the knowledgeable and be familiar with, the bottom of circuit board 28 is conventionally containing the metal level of helpful heat radiation, and therefore, circuit board 28 is attached on heat-conducting insulation material 36, has good thermal conductance effect.

After engaging wick and lamp holder 10, add lampshade 40.Lampshade 40 can be selected glass cover, vinyl cover, epoxy resin or silica gel.If select glass cover or vinyl cover, can use the mechanical systems such as gummed, trip or thread to be bonded on the end of lamp holder 10.If select epoxy resin or silica gel, be coated on wick, its consumption enough encase completely circuit board 28 and on all component, if required, be heating and curing.Lampshade 40, as over cap, prevents that aqueous vapor, dust or external force are applied on the intraware of LED lamp.Lampshade 40 also has the function of optical module, and the modes such as atomization, geometry design that can see through produce various required optical effects.The vaporific structure of lampshade 40 can be utilized sandblast, etching, static powder body coating, coating silica gel, spray paint or injection molding method making.Table 3 is the actual results that record of the lampshade 40 of several unlike materials.

Table 3

The content of table 3 shows, no matter lampshade 40 adopts glass cover, vinyl cover, epoxy resin or silica gel, all can obtain good light output, light in test and also without abnormal, occur, the heat energy that after expression energising, LED wafer 22 of heap of stone produces effectively conducts to outside through heat-conducting insulation material 36 and electrode 12, the obviously impact heat radiation because sealing up lampshade 40.

Fig. 5 is the schematic diagram of the 3rd embodiment of the present utility model.The wick of this LED lamp comprises LED matrix 20, circuit board 28 and heat-conducting piece 50.LED matrix 20, resistor 38 and circuit board 28 are identical with the embodiment of Fig. 4, and one end of heat-conducting piece 50 has in the lower surface that card is attached to circuit board 28, and the other end is imbedded in heat-conducting insulation material 36.The axial length of heat-conducting piece 50 is between 0.1 to 10 centimeter, and preferably is 0.5 to 3.0 centimeter, utilizes its depth of imbedding heat-conducting insulation material 36 to adjust the height of LED matrix 20.Heat-conducting piece 50 is to be made by the material of high thermal conductivity, for example copper or other metal, and it is shaped as column, sheet or other shape.Lampshade 40 is selected glass cover or vinyl cover.The processing procedure of this LED lamp, system is first welded to electrode 12 and 14 by wire 34 and 32, then by heat-conducting insulation material 36 injecting chamber 18, wire 34 and 32 tail end expose outside heat-conducting insulation material 36, one end of heat-conducting piece 50 is inserted in heat-conducting insulation material 36, if required, heat-conducting insulation material 36 is heating and curing, again the circuit board 28 that LED matrix 20 and resistor 38 are installed is welded in the card of heat-conducting piece 50, welding lead 34 and 32, to circuit board 28, finally joins lampshade 40 on the end of lamp holder 10 to.

If improve the brightness of LED lamp, can use more LED matrix 20 series, parallel or connection in series-parallel.Wafer wick how of heap of stone as shown in Figure 6 of example, ties up to three row's LED matrixs 20 in parallel between the weld pad 52 and 54 of circuit board 28, and each row is contained three LED matrixs 20.If the power of each LED matrix 20 is 1 watt, this wick can reach 9 watts.

The wick system of Fig. 4, Fig. 5 and Fig. 6 is attached to LED matrix 20 on circuit board 28, also can change encapsulation wafer 22 of heap of stone on circuit board 28 into, and it is that the naked crystalline substance of wafer 22 of heap of stone is directly attached on circuit board 28, covers sealing 26 after routing again.

Fig. 7 is the schematic diagram of the 4th embodiment of the present utility model, except resistor 30, increases a resistor 38 being arranged on circuit board 28 and is connected serially to resistor 30 and LED matrix 20.Circuit board 28, resistor 38 and LED matrix 20 can make a module, and the resistance value size of resistor 38 is 20 designs of cooperated with LED device, and resistor 30 and lamp holder 10 are another modules.The combination of disparate modules can obtain the LED lamp of different size.For example use identical resistor 30 and lamp holder 10 modules, as long as arrange in pairs or groups different wick and resistor 38 modules, just can manufacture the LED lamp of different brightness or current value.Resistor 38 also can adopt variable resistance, adjusts according to demand its resistance value.

Fig. 8 is the schematic diagram of the 5th embodiment of the present utility model, LED matrix 20 is welded in the card of heat-conducting piece 50, the other end of heat-conducting piece 50 is imbedded in heat-conducting insulation material 36, utilizes it to imbed the height that the depth in heat-conducting insulation material 36 is adjusted LED matrix 20.Table 4 is effects that comparison heat-conducting piece 50 is used copper post and copper sheet.

Table 4

From the test result of table 4, the design that increases copper post or copper sheet can allow the heat energy of LED matrix 20 energising generations conduct to more fast outside, obtains good light output brightness, lights continuously and without abnormal, occurs for 1000 hours.In the method for this LED lamp of a manufacture, first wire 34 and resistor 30 are welded to electrode 12 and 14, then by heat-conducting insulation material 36 injecting chamber 18, wire 34 and 32 tail end expose outside heat-conducting insulation material 36, one end of heat-conducting piece 50 is inserted in heat-conducting insulation material 36, if required, heat-conducting insulation material 36 is heating and curing, again LED matrix 20 is welded in the card of heat-conducting piece 50, then welding lead 34 and 32 pins to LED matrix 20, finally join lampshade 40 on the end of lamp holder 10 to.In different embodiment, also can before inserting heat-conducting insulation material 36, heat-conducting piece 50 first LED matrix 20 be welded in the card of heat-conducting piece 50.

Fig. 9 is the schematic diagram of the 6th embodiment of the present utility model, use has the circuit board 28 of perforation 60, one end of heat-conducting piece 50 is above circuit board 28, and the other end 60 is imbedded in heat-conducting insulation material 36 through perforation, and LED matrix 20 is welded on one end that heat-conducting piece 50 exposes.Heat-conducting piece 50 has laminated structure 56 and flank 58, and the axial length of laminated structure 56 is between 0.1 to 10 centimeter, and preferably is between 0.5 to 3.0 centimeter, and flank 58 is between LED matrix 20 and circuit board 28.The pin 66 mat scolding tin 68 of LED matrix 20 are soldered to the perforation 62 of circuit board 28, and scolding tin 70 is soldered to electrode 12 by the perforation of circuit board 28 64.Perforation 62 and 64 can be used blind hole or other structure instead, and these are known techniques of circuit board.Resistor 30 is welded between electrode 14 and circuit board 28, so resistor 30 and LED matrix 20 are connected between electrode 12 and 14.Circuit board 28 can be selected the assembly of tempered glass fiber or metal substrate.Preferably, circuit board 28 is thermal contact conductance insulating materials 36 mechanically also.In different embodiment, also can change resistor 30 into be welded on circuit board 28 resistor, or the resistor being increased on circuit board 28 connects with resistor 30, embodiment is the same as the aforementioned.If required, can install lampshade additional, these are the same with aforesaid embodiment.When manufacturing this LED lamp, first resistor 30 is soldered to electrode 14 and circuit board 28, again circuit board 28 is soldered to electrode 12, then from boring a hole, 60 heat-conducting insulation material 36 is inserted chamber 18, one end of heat-conducting piece is imbedded in heat-conducting insulation material 36 through perforation 60, finally welded LED matrix 20.If required, the heat-conducting insulation material 36 that is heating and curing.

Figure 10 is the schematic diagram of the 7th embodiment of the present utility model, uses the circuit board 28 with metal substrate to be attached on heat-conducting insulation material 36.Sort circuit plate 28 has aluminium lamination 72, copper layer 76 and heat-conducting layer 74 between between the two, and heat-sinking capability is higher than tempered glass fibre base plate.LED matrix 20 is welded on circuit board 28 with COB encapsulating structure, and scolding tin is soldered to electrode 12 by circuit board 28, and resistor 30 is welded between electrode 14 and circuit board 28, so resistor 30 and LED matrix 20 are connected between electrode 12 and 14.In different embodiment, also can change resistor 30 into be welded on circuit board 28 resistor, or the resistor being increased on circuit board 28 connects with resistor 30, embodiment is the same as the aforementioned.If required, can install lampshade additional, these are the same with aforesaid embodiment.The first welding resistor 30 of manufacturer's genealogy of law of this LED lamp is to electrode 14, then heat-conducting insulation material 36 is inserted in chamber 18, then resistor 30 is soldered to circuit board 28, and soldered circuit board 28 is to electrode 12, finally packaged LED device 20 on circuit board 28.If required, the heat-conducting insulation material 36 that is heating and curing.When packaged LED device 20, first LED wafer 22 of heap of stone is welded on circuit board 28, then stamp closing line, then be coated with sealing 26.If install lampshade additional, also can exempt and apply sealing 26.

In the various embodiments described above, according to actual application, the LED matrix 20 of employing, its power is between 0.3 to 5W, and preferably is 1 to 3W, selects the resistor 30 or 38 of 50 to 50000 nurses difficult to understand.The use voltage of LED matrix 20 is between 12 to 240 volts, if use single LED matrix 20, it uses voltage to be chosen as 110 volts or 220 volts of persons according to AC power; A plurality of LED matrixs 20 if connected, the voltage of its use can be selected junior, for example 12 volts.In addition, heat-conducting insulation material 36 is to can be liquid state, semisolid (colloidal state) or solid-state material.

Although the LED matrix 20 of the various embodiments described above is illustration bullet cut assembly and plastic lead wire chip carrier encapsulating structure (PLCC), surface mount encapsulating structure (SMD) and direct wafer carrier encapsulating structure (COB) only, the LED matrix of other various different kenels or encapsulation is applicable the utility model also.

Although the utility model discloses with previous examples, so it,, not in order to limit the utility model, has and conventionally knows the knowledgeable in technical field under any the utility model, within not departing from spirit and scope of the present utility model, when doing various changes and modification.Therefore protection domain of the present utility model is when being as the criterion depending on the accompanying claim person of defining.

Claims (10)

1. a LED lamp, is characterised in that, comprising:

Wick, contains the LED matrix of at least one power between 0.3 to 5W;

The lamp holder with first and second electrode, it has chamber, and this first electrode has spiral lamination, column or needle-like profile;

Resistance value is connected between this first and second electrode between the resistor between 50 to 50000 nurses difficult to understand and this wick; And

The heat-conducting insulation material that thermal conductivity factor is greater than 30W/mK is filled in this chamber, mechanically contacts this wick and this first electrode, provides the passage of heat to help this wick heat radiation to this first electrode.

2. LED lamp as claimed in claim 1, is characterized in that, this at least one LED matrix mechanically contacts this heat-conducting insulation material.

3. LED lamp as claimed in claim 1, is characterized in that, this wick comprises this at least one LED matrix of circuit board bearing, and mechanically contacts this heat-conducting insulation material.

4. LED lamp as claimed in claim 1, is characterized in that, this wick comprises:

This at least one LED matrix of circuit board bearing; And

Heat-conducting piece welds this circuit board, and one end is imbedded in this heat-conducting insulation material.

5. LED lamp as claimed in claim 1, is characterized in that, this wick comprises that heat-conducting piece welds this at least one LED matrix, and one end is imbedded in this heat-conducting insulation material.

6. LED lamp as claimed in claim 1, is characterized in that, this wick comprises:

The circuit board with perforation, carries this at least one LED matrix; And

Heat-conducting piece, has first end and welds this LED matrix, and the second end is imbedded in this heat-conducting insulation material by this perforation.

7. LED lamp as claimed in claim 6, is characterized in that, this circuit board mechanically contacts this heat-conducting insulation material.

8. LED lamp as claimed in claim 1, is characterized in that, this heat-conducting insulation material comprises epoxy resin or heat conduction powder.

9. the LED lamp as described in any one in claim 2-6, is characterized in that, this resistor is embedded in this heat-conducting insulation material.

10. LED lamp as claimed in claim 1, is characterized in that, this heat-conducting insulation material is liquid state, semisolid or solid-state material.