CN101956904A - LED lamp and manufacturing method - Google Patents
LED lamp and manufacturing method Download PDFInfo
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- CN101956904A CN101956904A CN200910151669XA CN200910151669A CN101956904A CN 101956904 A CN101956904 A CN 101956904A CN 200910151669X A CN200910151669X A CN 200910151669XA CN 200910151669 A CN200910151669 A CN 200910151669A CN 101956904 A CN101956904 A CN 101956904A
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Abstract
The invention relates to an LED lamp which is characterized by comprising a lamp wick, a lamp holder, a resistor and a heat conducting and electrical insulating material, wherein the lamp wick comprises at least one 0.3-5 W AC LED device; the lamp holder is provided with a first electrode, a second electrode and a chamber, and the first electrode has a spiral, columnar or needle-like shape; the resistance of the resistor is between 50 ohms and 50000 ohms, and the resistor is connected between the first electrode and the second electrode in series; and the heat conducting and electrical insulating material with the heat conductivity coefficient between 0.25 W/mK and 30 W/mK is filled in the chamber and is in mechanical contact with the lamp wick and the first electrode and provides a heat channel to help the lamp wick to dissipate heat to the first electrode. The LED lamp has the advantages of good heat dissipation capability ad high power application.
Description
Technical field
The present invention relates to a kind of electric light, specifically, is a kind of light emitting diode (LED) electric light that can directly replace traditional tungsten filament, halogen or Electricity-saving lamp bulb.
Background technology
Use the LED lamp of direct current LED matrix, must use power supply changeover device to convert alternating current to direct current and supply described direct current LED matrix, therefore can increase the cost of LED lamp as wick.In addition, power supply changeover device is difficult to hide fully be placed in the standard lamp head of conventional bulb, therefore needs mold developing making separately to be different from mechanism's part of conventional bulb, not only more increases cost, also increases the volume of LED lamp.The direct current LED matrix can produce heat energy when energising, so must handle these heat energy by the additional designs cooling mechanism.If can't efficiently radiates heat, high temperature can cause the luminous efficiency of LED to reduce, the life-span reduces and unfavorable effect such as wavelength shift.Power supply changeover device also can produce heat energy alternating current being converted in the galvanic process, particularly inductance wherein and integrated circuit, and high temperature also can damage this class component, causes product to operate.Particularly in high-power application, the light fixture of lighting use for example, the heat energy that the direct current LED matrix produces is higher, and therefore heat radiation is not enough and situation that cause is more serious.Some product adopts many lower powered bullet cuts (lamp type) LED, and uses simple bridge rectifier, so that adapt to traditional lamp holder of small size.But lower powered LED brightness is generally low excessively, and the market acceptance is limited, and this series products is often because poor heat radiation, and the light decay phenomenon is serious.
In recent years, the technology of the LED matrix of use alternating current is day by day ripe, and brightness also promotes day by day, has had commercial exploitation and has been worth.The alternating current LED matrix is produced on a plurality of LED of series and parallel on the same epi-wafer, the resistor that this epi-wafer encapsulation back series connection has certain resistance value, can directly bear civil power uses as high voltages such as 110 volts or 220 volts, therefore economize required power supply changeover device of removing DC LED matrix or rectification circuit, effectively reduce cost and reduce the quality problems that circuit causes.Though the alternating current LED matrix conveniently is applied in the space of small size, still have the problem of heat radiation to handle.Especially in high-power application, the light fixture of lighting use for example, the heat energy of its generation is higher, if set up radiator, can strengthen the volume and the cost of LED lamp, if do not help the heat radiation of alternating current LED matrix, can cause luminous efficiency reduction, the life-span of LED to reduce and wavelength shift, even burn the LED epi-wafer again.
Summary of the invention
Purpose of the present invention is to propose a kind of LED lamp of strengthening the heat radiation of alternating current LED matrix.
Another object of the present invention is to propose a kind of LED lamp that can directly replace traditional tungsten filament, halogen or Electricity-saving lamp bulb.
Another purpose of the present invention is to propose a kind of manufacture method of LED lamp.
For achieving the above object, technical solution of the present invention is:
A kind of LED lamp is characterized in that comprising:
One wick contains at least one power between 0.3 to 5W alternating current LED matrix;
One has the lamp holder of first electrode and second electrode, is provided with a chamber, and described first electrode has spiral lamination, column or needle-like profile;
One resistance value is between 50 to 50000 ohm resistor, and described wick is connected between described first electrode and described second electrode;
One thermal conductivity factor is filled in the described chamber between 0.25 to 30W/mK heat-conducting insulation material, mechanically contacts described wick and described first electrode, provides the passage of heat to help described wick heat radiation to described first electrode.
LED lamp of the present invention can also be further achieved by the following technical measures.
Aforesaid LED lamp, wherein said wick comprises:
One has the circuit board of perforation, welds described first electrode;
One heat-conducting piece has first end and weld described alternating current LED matrix, and second end is imbedded in the described heat-conducting insulation material by described perforation.
Aforesaid LED lamp, wherein said heat-conducting piece have flank between described alternating current LED matrix and described circuit board.
Aforesaid LED lamp, wherein said circuit board has the tempered glass fibre base plate.
Aforesaid LED lamp, wherein said alternating current LED matrix has the plastic leaded chip carrier encapsulating structure.
Aforesaid LED lamp, wherein said resistor is welded on the described circuit board.
Aforesaid LED lamp, wherein said wick comprise that a circuit board welds described alternating current LED matrix and described first electrode.
Aforesaid LED lamp, wherein said circuit board comprises:
One aluminum metal layer mechanically contacts described heat-conducting insulation material;
One copper metal layer welds described alternating current LED matrix;
One heat-conducting medium layer is between described aluminum metal layer and copper metal layer.
Aforesaid LED lamp, wherein said alternating current LED matrix comprise a direct chip support plate encapsulating structure.
Aforesaid LED lamp, wherein said resistor is welded on the described circuit board.
Aforesaid LED lamp, wherein said heat-conducting insulation material comprises epoxy resin, or the heat conduction powder, or the mixture of the two.
Aforesaid LED lamp, wherein said resistor is embedded in the described heat-conducting insulation material.
Aforesaid LED lamp comprises more that wherein a lampshade seals described wick.
Aforesaid LED lamp, wherein said lampshade comprise glass cover, vinyl cover, epoxy resin and silica gel one of them.
Aforesaid LED lamp, wherein said lamp holder are the standard lamp head of traditional osram lamp.
Aforesaid LED lamp, wherein said lamp holder are the standard lamp head of traditional based on halogen bulb.
A kind of manufacture method of LED lamp is characterized in that comprising following manufacturing step:
First step: prepare to have the lamp holder of first electrode, second electrode and chamber, described first electrode has spiral lamination, column or needle-like profile;
Second step: the circuit board of preparing to have perforation;
Third step: prepare at least one power between 0.3 to 5W alternating current LED matrix;
The 4th step: prepare resistance value between 50 to 50000 ohm resistor;
The 5th step: prepare thermal conductivity factor between 0.25 to 30W/mK heat-conducting insulation material;
The 6th step: prepare heat-conducting piece;
The 7th step: described resistor is welded described second electrode and described circuit board;
The 8th step: described circuit board is welded described first electrode;
The 9th step: described heat-conducting insulation material is inserted the described chamber from described perforation;
The tenth step: first end of described heat-conducting piece is passed described perforation imbed in the described heat-conducting insulation material;
The 11 step: second end that described alternating current LED matrix is welded described heat-conducting piece;
The 12 step: described alternating current LED matrix is welded described circuit board.
The manufacture method of LED lamp of the present invention can also be further achieved by the following technical measures.
Aforesaid manufacture method wherein more comprises the described heat-conducting insulation material that is heating and curing.
A kind of manufacture method of LED lamp is characterized in that comprising following manufacturing step:
First step: prepare to have the lamp holder of first electrode, second electrode and chamber, described first electrode has spiral lamination, column or needle-like profile;
Second step: prepare circuit board;
Third step: prepare at least one power between 0.3 to 5W alternating current LED matrix;
The 4th step: prepare resistance value between 50 to 50000 ohm resistor;
The 5th step: prepare thermal conductivity factor between 0.25 to 30W/mK heat-conducting insulation material;
The 6th step: described resistor is welded described second electrode;
The 7th step: described heat-conducting insulation material is inserted in the described chamber;
The 8th step: make described circuit board mechanically contact described heat-conducting insulation material;
The 9th step: described resistor is welded described circuit board;
The tenth step: described circuit board is welded described first electrode;
The 11 step: described alternating current LED matrix is welded described circuit board.
Aforesaid manufacture method wherein more comprises the described heat-conducting insulation material that is heating and curing.
After adopting technique scheme, LED lamp of the present invention has the following advantages:
1. has good heat-sinking capability.
2. can make high power applications.
Description of drawings
Fig. 1 is the schematic diagram of the first embodiment of the present invention;
Fig. 2 is the schematic diagram of equivalent circuit of the LED lamp of Fig. 1;
Fig. 3 is the schematic diagram of several alternating current LED epi-wafers;
Fig. 4 is the schematic diagram of the second embodiment of the present invention;
Fig. 5 is the schematic diagram of the third embodiment of the present invention;
Fig. 6 is the schematic diagram of many epi-wafers wick;
Fig. 7 is the schematic diagram of the fourth embodiment of the present invention;
Fig. 8 is the schematic diagram of the fifth embodiment of the present invention;
Fig. 9 is the schematic diagram of the sixth embodiment of the present invention;
Figure 10 is the schematic diagram of the seventh embodiment of the present invention.
The element numbers explanation
10, lamp holder 12, first electrode 14, second electrode 16, spiral lamination profile 18, chamber 20, wick 22, alternating current LED epi-wafer 24, support 26, sealing 28, circuit board 30, resistor 32, lead 34, lead 36, heat-conducting insulation material 38, resistor 40, lampshade 50, heat-conducting piece 52, weld pad 54, weld pad 56, axial sheet 58, flank 60, perforation 62, perforation 64, perforation 66, pin 68, scolding tin 70, scolding tin 72, aluminum metal layer 74, heat-conducting medium layer 76, copper metal layer.
The specific embodiment
Below in conjunction with embodiment and accompanying drawing thereof the present invention is illustrated further.
Now see also Fig. 1, Fig. 1 is the schematic diagram of the first embodiment of the present invention.As shown in the figure, in order to highlight characteristics of the present invention, the standard lamp head 10 that described first embodiment uses miniature bulb to use, its have electrode 12 with 14 for being connected AC power.As those skilled in the familiar, the metal-back that first electrode 12 has spiral lamination profile 16 has chamber 18 in it.This embodiment uses an alternating current LED matrix 20 as wick, and it is fixed on alternating current LED epi-wafer 22 on the support 24, and covers sealing 26 thereon.LED is encapsulated as known technology, for simplicity of illustration, does not draw the detailed packaging structure of alternating current LED matrix 20 herein.One end of resistor 30 is soldered to second electrode 14, and other end mat lead 32 is soldered to LED matrix 20, and the two ends of lead 34 are respectively welded to first electrode 12 and alternating current LED matrix 20.The equivalent circuit of this LED lamp as shown in Figure 2, alternating current LED epi-wafer 22 and resistor 30 are connected between electrode 12 and 14.Be familiar with as people, so-called alternating current LED epi-wafer, the LED that contains two opposite direction configurations is connected in parallel between two branch connecting pins, has at least one LED on each described direction, and the LED of described two opposite direction configurations is lighted in the positive and negative half period of AC power respectively.The size of the resistance value R of resistor 30 is to select according to the current value of design requirement.Resistor 30 also has the function of protection alternating current LED epi-wafer 22, and when being connected to the AC power generation surging of electrode 12 and 14, resistor 30 can absorb most surge voltage.One of characteristics of the present invention are to fill heat-conducting insulation material 36 in chamber 18, and it mechanically contacts the support 24 and first electrode 12, provides the passage of heat that alternating current LED epi-wafer 22 is dispelled the heat because of thermal energy conduction to the first electrode 12 that electrified light emitting produces.Described support 24 contains the sheet metal of helpful alternating current LED epi-wafer 22 heat radiations usually, and therefore, support 24 is attached on the heat-conducting insulation material 36, has good thermal conductance effect.Except helping 22 heat radiations of alternating current LED epi-wafer, heat-conducting insulation material 36 also helps resistor 30 heat radiations, because resistor 30 is embedded in the heat-conducting insulation material 36.
Heat-conducting insulation material 36 can be selected epoxy resin for use, perhaps heat conduction powder, for example aluminium oxide, aluminium nitride, boron nitride or other Heat Conduction Material, the perhaps mixture of the two.Table 1 is to use three kinds of different Heat Conduction Materials in the LED of Fig. 1 lamp, the actual result who records.
Table 1
From the test result of table 1 as can be known, adopt the heat-conducting insulation material 36 of epoxy resin, because of thermal conductivity factor relatively poor, so afterwards bulk temperature is higher in energising; With the heat-conducting insulation material 36 of epoxy resin and heat conduction powder, preferable because of heat-conducting effect, light no abnormal situation generation in the test; Directly use the heat-conducting insulation material 36 of heat conduction powder pressing filling, also can obtain the good heat conductive effect.Generally speaking, the LED lamp can obtain good light output brightness, lights no abnormal generation in 1000 hours continuously.Also can select for use other material as heat-conducting insulation material 36, the preferably, its thermal conductivity factor is between 0.25 to 30W/mK.
What conventional bulb was used is standard lamp head, and for example E12, E14, E17, E26 and E27 are the lamp holders of traditional osram lamp, and MR16 and GU10 are the lamp holders of traditional based on halogen bulb.Table 2 is to use standard lamp head E12 and E27 in the LED of Fig. 1 lamp, the actual result who records.
Table 2
Shown in the content of table 2, no matter the LED lamp of Fig. 1 is to use less E12 lamp holder of common volume or the bigger E27 lamp holder of volume, all can obtain good light output brightness, and light no abnormal generation in 1000 hours continuously, the heat energy that expression alternating current LED epi-wafer 22 produces conducts to first electrode 12 effectively and dispels the heat.As shown in Figure 1, the size of this LED lamp is approximately identical with lamp holder 10, has good heat-sinking capability again, can reach the high power applications that known technology is not accomplished.In the lamp holder of traditional based on halogen bulb, an electrode is the cylindrical metal shell, is insulated thing and another electrode separation is opened.Some standard lamp head then is to use two needle electrodes insulated from each other.No matter be lamp holder or other standard lamp head of traditional osram lamp, traditional based on halogen bulb, all there is chamber can fill heat-conducting insulation material, therefore have at least an electrode to dispel the heat with the wick of helping the LED lamp.Because the electrode of lamp holder outwards exposes to the open air, so good radiating effect can be provided.
The LED lamp of Fig. 1 can use various processing procedures to make.In one embodiment, earlier with after all circuit unit welding, recharge heat-conducting insulation material 36 in chamber 18, the consumption of heat-conducting insulation material 36 is filled to till the bottom of its contact support 24, can increase to plane slightly above support 24 bottoms, if the mixture of selecting epoxy resin or epoxy resin and heat conduction powder for use as heat-conducting insulation material 36, is then solidified in its injecting chamber's 18 back heating.If select for use the heat conduction powder, then after it inserts chamber 18, exert pressure and make its consolidation as heat-conducting insulation material 36.Also heat conduction powder silica gel can be become colloid, injecting chamber's 18 back heating are solidified.In another embodiment, elder generation's welding lead 34 and resistor 30 are to electrode 12 and 14, fill heat-conducting insulation material 36 then in chamber 18, lead 32 and 34 tail end expose outside the heat-conducting insulation material 36, LED matrix 20 is attached to the upper surface of heat-conducting insulation material 36, last welding lead 32 and 34 is to LED matrix 20 again.Solidify heat-conducting insulation material 36 if desired, can attach before the LED matrix 20 or heating execution later on.
The brightness that can select for use the alternating current LED epi-wafer 22 that includes more LED quantity to improve the LED lamp.Fig. 3 is the schematic diagram of several alternating current LED epi-wafers 22, and first kind is the opposite LED of two string directions in parallel between two branch connecting pins, and each string comprises plural LED; Second kind is right at the LED of series connection more than two couples between two branch connecting pins, and every pair of LEDs is connected in parallel to containing the opposite LED of both direction; The third is that LED more than five is configured to bridge architecture.These have all had commercial product to select for use.
Fig. 4 is the schematic diagram of the second embodiment of the present invention.The wick of this embodiment comprise circuit board 28 and on alternating current LED matrix 20, alternating current LED matrix 20 contains at least one alternating current LED epi-wafer 22.Resistors in series 38 changes into and being installed on the circuit board 28, and mat lead 34 and 32 is connected circuit board 28 between electrode 12 and 14.Circuit board 28 can be selected the assembly of tempered glass fiber (FR4) or metal substrate (IMS) for use; Alternating current LED matrix 20 and resistors in series 38 can be selected surface installing type assembly (SMD) for use, use surperficial adhesion technology (SMT) to be installed on the circuit board 28.Because resistor 38 is to be welded on the circuit board 28, therefore can use variable resistance to increase the elasticity of using, for example convenient current value of adjusting by alternating current LED matrix 20.When making this LED lamp, earlier alternating current LED matrix 20 and resistors in series 38 are welded on the circuit board 28, engage with lamp holder 10 again.In one embodiment, elder generation's welding lead 34 and 32 is to electrode 12 and 14 and circuit board 28, recharge heat-conducting insulation material 36 in chamber 18, the amount of heat-conducting insulation material 36 is filled to till the bottom of its contact circuit plate 28, can increase to plane slightly above circuit board 28 bottoms, need, again heat-conducting insulation material 36 is heating and curing.In another embodiment, elder generation's welding lead 34 and 32 is to electrode 12 and 14, fill heat-conducting insulation material 36 then in chamber 18, lead 32 and 34 tail end expose outside the heat-conducting insulation material 36, again circuit board 28 is attached to the upper surface of heat-conducting insulation material 36, last welding lead 32 and 34 needs to circuit board 28, and heat-conducting insulation material 36 can or be heating and curing later on before attaching circuit board 28.Selecting for use of heat-conducting insulation material 36 is identical with the embodiment of Fig. 1 with making.As everyone knows, the bottom of circuit board 28 contains the metal level of helpful heat radiation usually, and therefore, circuit board 28 is attached on the heat-conducting insulation material 36, has good thermal conductance effect.
Engage after wick and the lamp holder 10, add lampshade 40.Lampshade 40 can be selected glass cover, vinyl cover, epoxy resin or silica gel for use.If select glass cover or vinyl cover for use, can use mechanical systems such as gummed, trip or thread that it is bonded on the end of lamp holder 10.If select epoxy resin or silica gel for use, then it is coated on the wick, its consumption enough encase fully circuit board 28 and on all component, need, be heating and curing.Lampshade 40 prevents that as over cap aqueous vapor, dust or external force are applied on the intraware of LED lamp.Lampshade 40 also has the function of optical module, can produce various required optical effects by modes such as atomizing, geometry design.The vaporific structure of lampshade 40 can be utilized sandblast, etching, static powder body coating, coating silica gel, spray paint or the injection molding method making.Table 3 is the lampshade 40 actual results that record of several unlike materials.
Table 3
The content of table 3 shows, no matter lampshade 40 adopts glass cover, vinyl cover, epoxy resin or silica gel, all can obtain good light output, light also no abnormal generation in the test, the heat energy that expression energising back alternating current LED epi-wafer 22 produces effectively sees through the heat-conducting insulation material 36 and first electrode 12 and conducts to the outside, the not obviously influence heat radiation because sealing up lampshade 40.
Fig. 5 is the schematic diagram of the third embodiment of the present invention.The wick of this LED lamp comprises alternating current LED matrix 20, circuit board 28 and heat-conducting piece 50.Alternating current LED matrix 20, resistor 38 and circuit board 28 are identical with the embodiment of Fig. 4, and an end of heat-conducting piece 50 has on the lower surface that card is attached to circuit board 28, and the other end is imbedded in the heat-conducting insulation material 36.The axial length of heat-conducting piece 50 is between 0.1 to 10 centimeter, and the preferably is 0.5 to 3.0 centimeter, utilizes its depth of imbedding heat-conducting insulation material 36 to adjust the height of alternating current LED matrix 20.Heat-conducting piece 50 is to be made by the material of high thermal conductivity, for example copper or other metal, and it is shaped as column, sheet or other shape.Lampshade 40 is selected glass cover or vinyl cover for use.The processing procedure of this LED lamp, earlier lead 34 and 32 is welded to electrode 12 and 14, then with in heat-conducting insulation material 36 injecting chamber 18, lead 34 and 32 tail end expose outside the heat-conducting insulation material 36, one end of heat-conducting piece 50 is inserted in the heat-conducting insulation material 36, the words that need, heat-conducting insulation material 36 is heating and curing, the circuit board 28 that alternating current LED matrix 20 and resistor 38 will be installed again is welded on the card of heat-conducting piece 50, welding lead 34 and 32 joins lampshade 40 on the end of lamp holder 10 at last to circuit board 28.
If improve the brightness of LED lamp, can use more alternating current LED matrix 20 series, parallel or connection in series-parallel.Many epi-wafers wick for example shown in Figure 6 is three row's alternating current LED matrixs 20 in parallel between the weld pad 52 and 54 of circuit board 28, and each row is contained three alternating current LED matrixs 20.If the power of each alternating current LED matrix 20 is 1 watt, then this wick can reach 9 watts.
The wick of Fig. 4, Fig. 5 and Fig. 6 is that alternating current LED matrix 20 is attached on the circuit board 28, also can change encapsulation alternating current epi-wafer 22 on circuit board 28 into, and its naked crystalline substance with alternating current epi-wafer 22 directly is attached on the circuit board 28, covers sealing 26 behind the routing again.
Fig. 7 is the schematic diagram of the fourth embodiment of the present invention, except resistor 30, increases a resistor 38 that is installed on the circuit board 28 and is connected serially to resistor 30 and alternating current LED matrix 20.Circuit board 28, resistor 38 and alternating current LED matrix 20 can make a module, and the resistance value size of resistor 38 is to cooperate 20 designs of alternating current LED matrix, and resistor 30 and lamp holder 10 are another modules.The combination of disparate modules can obtain the LED lamp of different size.For example use identical resistor 30 and lamp holder 10 modules,, just can make the LED lamp of different brightness or current value as long as arrange in pairs or groups different wick and resistor 38 modules.Resistor 38 also can adopt variable resistance, adjusts its resistance value according to demand.
Fig. 8 is the schematic diagram of the fifth embodiment of the present invention, alternating current LED matrix 20 is welded on the card of heat-conducting piece 50, the other end of heat-conducting piece 50 is imbedded in the heat-conducting insulation material 36, utilizes it to imbed the height that the depth in the heat-conducting insulation material 36 is adjusted alternating current LED matrix 20.Table 4 is effects that comparison heat-conducting piece 50 uses copper post and copper sheet.
Table 4
From the test result of table 4 as can be known, increase the quicker outside that conducts to of heat energy that the design of copper post or copper sheet can allow 20 energisings of alternating current LED matrix produce, obtains good light and export brightness, light no abnormal generation in 1000 hours continuously.Make in the method for this LED lamp one, earlier lead 34 and resistor 30 are welded to electrode 12 and 14, then with in heat-conducting insulation material 36 injecting chamber 18, lead 34 and 32 tail end expose outside the heat-conducting insulation material 36, one end of heat-conducting piece 50 is inserted in the heat-conducting insulation material 36, the words that need, heat-conducting insulation material 36 is heating and curing, again alternating current LED matrix 20 is welded on the card of heat-conducting piece 50, welding lead 34 and 32 pins to alternating current LED matrix 20 join lampshade 40 on the end of lamp holder 10 at last then.In different embodiment, also can before inserting heat-conducting insulation material 36, heat-conducting piece 50 earlier alternating current LED matrix 20 be welded on the card of heat-conducting piece 50.
Fig. 9 is the schematic diagram of the sixth embodiment of the present invention, use has the circuit board 28 of perforation 60, first end of heat-conducting piece 50 is above circuit board 28, and second end is imbedded in the heat-conducting insulation material 36 through perforation 60, and alternating current LED matrix 20 is welded on second end of heat-conducting piece 50.Heat-conducting piece 50 has laminated structure 56 and flank 58, and the axial length of laminated structure 56 is between 0.1 to 10 centimeter, and the preferably is between 0.5 to 3.0 centimeter, and flank 58 is between alternating current LED matrix 20 and circuit board 28.The pin 66 mat scolding tin 68 of alternating current LED matrix 20 are soldered to the perforation 62 of circuit board 28, and scolding tin 70 is soldered to first electrode 12 with the perforation 64 of circuit board 28.Perforation 62 and 64 can be used blind hole or other structure instead, and these are known technologies of circuit board.Resistor 30 is welded between second electrode 14 and the circuit board 28, so resistor 30 and alternating current LED matrix 20 are connected between electrode 12 and 14.Circuit board 28 can be selected the assembly of tempered glass fiber or metal substrate for use.The preferably, circuit board 28 is thermal contact conductance insulating materials 36 mechanically also.In different embodiment, also can change resistor 30 into be welded on the circuit board 28 resistor, or the resistor that is increased on the circuit board 28 connects with resistor 30, embodiment is the same as the aforementioned.Need, can install lampshade additional, these are the same with aforesaid embodiment.When making this LED lamp, earlier resistor 30 is soldered to second electrode 14 and circuit board 28, again circuit board 28 is soldered to first electrode 12,60 heat-conducting insulation material 36 inserted the chamber 18 from boring a hole then, first end of heat-conducting piece is passed perforation 60 imbed in the heat-conducting insulation material 36, and second end welding alternating current LED matrix 20.Need, heat-conducting insulation material 36 is heating and curing.
Figure 10 is the schematic diagram of the seventh embodiment of the present invention, uses the circuit board 28 with metal substrate to be attached on the heat-conducting insulation material 36.Sort circuit plate 28 has aluminum metal layer 72, copper metal layer 76 and heat-conducting medium layer 74 between aluminum metal layer 72 and copper metal layer 76, and heat-sinking capability is higher than the tempered glass fibre base plate.Alternating current LED matrix 20 is welded on the circuit board 28 with the COB encapsulating structure, scolding tin is soldered to first electrode 12 with circuit board 28, resistor 30 is welded between second electrode 14 and the circuit board 28, so resistor 30 and alternating current LED matrix 20 are connected between electrode 12 and 14.In different embodiment, also can change resistor 30 into be welded on the circuit board 28 resistor, or the resistor that is increased on the circuit board 28 connects with resistor 30, embodiment is the same as the aforementioned.Need, can install lampshade additional, these are the same with aforesaid embodiment.The manufacture method system of this LED lamp is with resistor 30 welding second electrode 14, heat-conducting insulation material 36 is inserted in the chamber 18, circuit board 28 is attached on the heat-conducting insulation material 36, with resistor 30 soldered circuit boards 28, with circuit board 28 welding first electrode 12, and on circuit board 28, encapsulate alternating current LED matrix 20.Need, heat-conducting insulation material 36 is heating and curing.When encapsulation alternating current LED matrix 20, earlier alternating current LED epi-wafer 22 is welded on the circuit board 28, stamp closing line then, be coated with sealing 26 again.If install lampshade additional, also can exempt applying sealing 26.
In the various embodiments described above, according to the application of reality, the alternating current LED matrix 20 of employing, its power are between 0.3 to 5W, and the preferably is 1 to 3W, selects 50 to 50000 ohm resistor 30 or 38.The working voltage of alternating current LED matrix 20 is between 12 to 240 volts, if use single alternating current LED matrix 20, then its working voltage is chosen as 110 volts or 220 volts according to AC power; A plurality of alternating current LED matrixs 20 if connect, then the voltage of its use can select for use lower, for example 12 volts.
Though the alternating current LED matrix 20 of the various embodiments described above is illustration bullet cut assembly and plastic leaded chip carrier encapsulating structure (PLCC), surface adhesion encapsulating structure (SMD), and direct chip support plate encapsulating structure (COB) only, also applicable the present invention of alternating current LED matrix of other various different kenels or encapsulation.
Above embodiment is only for the usefulness that the present invention is described, but not limitation of the present invention, person skilled in the relevant technique under the situation that does not break away from the spirit and scope of the present invention, can also be made various conversion or variation.Therefore, all technical schemes that are equal to also should belong to category of the present invention, should be limited by each claim.
Claims (20)
1. LED lamp is characterized in that comprising:
One wick contains at least one power between 0.3 to 5W alternating current LED matrix;
One has the lamp holder of first electrode and second electrode, is provided with a chamber, and described first electrode has spiral lamination, column or needle-like profile;
One resistance value is between 50 to 50000 ohm resistor, and described wick is connected between described first electrode and described second electrode;
One thermal conductivity factor is filled in the described chamber between 0.25 to 30W/mK heat-conducting insulation material, mechanically contacts described wick and described first electrode, provides the passage of heat to help described wick heat radiation to described first electrode.
2. LED lamp as claimed in claim 1 is characterized in that, described wick comprises:
One has the circuit board of perforation, welds described first electrode;
One heat-conducting piece has first end and weld described alternating current LED matrix, and second end is imbedded in the described heat-conducting insulation material by described perforation.
3. LED lamp as claimed in claim 2 is characterized in that, described heat-conducting piece has flank between described alternating current LED matrix and described circuit board.
4. LED lamp as claimed in claim 2 is characterized in that described circuit board has the tempered glass fibre base plate.
5. LED lamp as claimed in claim 2 is characterized in that, described alternating current LED matrix has the plastic leaded chip carrier encapsulating structure.
6. LED lamp as claimed in claim 2 is characterized in that described resistor is welded on the described circuit board.
7. LED lamp as claimed in claim 1 is characterized in that, described wick comprises that a circuit board welds described alternating current LED matrix and described first electrode.
8. LED lamp as claimed in claim 7 is characterized in that, described circuit board comprises:
One aluminum metal layer mechanically contacts described heat-conducting insulation material;
One copper metal layer welds described alternating current LED matrix;
One heat-conducting medium layer is between described aluminum metal layer and copper metal layer.
9. LED lamp as claimed in claim 7 is characterized in that, described alternating current LED matrix comprises a direct chip support plate encapsulating structure.
10. LED lamp as claimed in claim 7 is characterized in that described resistor is welded on the described circuit board.
11. LED lamp as claimed in claim 1 is characterized in that described heat-conducting insulation material comprises epoxy resin, or the heat conduction powder, or the mixture of the two.
12. LED lamp as claimed in claim 1 is characterized in that described resistor is embedded in the described heat-conducting insulation material.
13. LED lamp as claimed in claim 1 is characterized in that, comprises that more a lampshade seals described wick.
14. LED lamp as claimed in claim 13 is characterized in that, described lampshade comprise glass cover, vinyl cover, epoxy resin and silica gel one of them.
15. LED lamp as claimed in claim 1 is characterized in that, described lamp holder is the standard lamp head of traditional osram lamp.
16. LED lamp as claimed in claim 1 is characterized in that, described lamp holder is the standard lamp head of traditional based on halogen bulb.
17. the manufacture method of a LED lamp is characterized in that comprising following manufacturing step:
First step: prepare to have the lamp holder of first electrode, second electrode and chamber, described first electrode has spiral lamination, column or needle-like profile;
Second step: the circuit board of preparing to have perforation;
Third step: prepare at least one power between 0.3 to 5W alternating current LED matrix;
The 4th step: prepare resistance value between 50 to 50000 ohm resistor;
The 5th step: prepare thermal conductivity factor between 0.25 to 30W/mK heat-conducting insulation material;
The 6th step: prepare heat-conducting piece;
The 7th step: described resistor is welded described second electrode and described circuit board;
The 8th step: described circuit board is welded described first electrode;
The 9th step: described heat-conducting insulation material is inserted the described chamber from described perforation;
The tenth step: first end of described heat-conducting piece is passed described perforation imbed in the described heat-conducting insulation material;
The 11 step: second end that described alternating current LED matrix is welded described heat-conducting piece;
The 12 step: described alternating current LED matrix is welded described circuit board.
18. the manufacture method of LED lamp as claimed in claim 17 is characterized in that, more comprises the described heat-conducting insulation material that is heating and curing.
19. the manufacture method of a LED lamp is characterized in that comprising following manufacturing step:
First step: prepare to have the lamp holder of first electrode, second electrode and chamber, described first electrode has spiral lamination, column or needle-like profile;
Second step: prepare circuit board;
Third step: prepare at least one power between 0.3 to 5W alternating current LED matrix;
The 4th step: prepare resistance value between 50 to 50000 ohm resistor;
The 5th step: prepare thermal conductivity factor between 0.25 to 30W/mK heat-conducting insulation material;
The 6th step: described resistor is welded described second electrode;
The 7th step: described heat-conducting insulation material is inserted in the described chamber;
The 8th step: make described circuit board mechanically contact described heat-conducting insulation material;
The 9th step: described resistor is welded described circuit board;
The tenth step: described circuit board is welded described first electrode;
The 11 step: described alternating current LED matrix is welded described circuit board.
20. the manufacture method of LED lamp as claimed in claim 19 is characterized in that, more comprises the described heat-conducting insulation material that is heating and curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910151669XA CN101956904A (en) | 2009-07-15 | 2009-07-15 | LED lamp and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910151669XA CN101956904A (en) | 2009-07-15 | 2009-07-15 | LED lamp and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101956904A true CN101956904A (en) | 2011-01-26 |
Family
ID=43484411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910151669XA Pending CN101956904A (en) | 2009-07-15 | 2009-07-15 | LED lamp and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101956904A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111113786A (en) * | 2020-01-02 | 2020-05-08 | 重庆辉照光电科技有限公司 | Automatic molding process of lamp core column |
| CN111486351A (en) * | 2014-08-07 | 2020-08-04 | 晶元光电股份有限公司 | Lighting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2125767U (en) * | 1992-05-14 | 1992-12-23 | 陶然 | Ac electronic signal lamp |
| CN2839817Y (en) * | 2005-11-07 | 2006-11-22 | 程继金 | Flight vehicle LED indicating lamp |
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2009
- 2009-07-15 CN CN200910151669XA patent/CN101956904A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2125767U (en) * | 1992-05-14 | 1992-12-23 | 陶然 | Ac electronic signal lamp |
| CN2839817Y (en) * | 2005-11-07 | 2006-11-22 | 程继金 | Flight vehicle LED indicating lamp |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111486351A (en) * | 2014-08-07 | 2020-08-04 | 晶元光电股份有限公司 | Lighting device |
| CN111113786A (en) * | 2020-01-02 | 2020-05-08 | 重庆辉照光电科技有限公司 | Automatic molding process of lamp core column |
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Application publication date: 20110126 |