CN203839367U - Semiconductor device with unlock-lock combined groove lead frame - Google Patents
Semiconductor device with unlock-lock combined groove lead frame Download PDFInfo
- Publication number
- CN203839367U CN203839367U CN201320886208.9U CN201320886208U CN203839367U CN 203839367 U CN203839367 U CN 203839367U CN 201320886208 U CN201320886208 U CN 201320886208U CN 203839367 U CN203839367 U CN 203839367U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- semiconductor device
- chip
- longitudinal groove
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 239000000206 moulding compound Substances 0.000 claims description 23
- 230000005855 radiation Effects 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000012778 molding material Substances 0.000 abstract 4
- 230000006355 external stress Effects 0.000 abstract 1
- 229940125782 compound 2 Drugs 0.000 description 8
- 230000007812 deficiency Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model relates to a semiconductor device with an unlock-lock combined groove lead frame. The semiconductor device comprises a lead frame, a chip arranged on the lead frame, and a molding material for wrapping the chip and the lead frame. A vertical through groove is formed in the lead frame. A lower opening of the vertical through groove is composed of a straight through port and a reaming port. The molding material is buckled with the lead frame through the vertical through groove and the lower opening of the vertical through groove. The semiconductor device with the unlock-lock combined groove lead frame enhances fastening force between the molding material and the lead frame through the vertical through groove and the lower reamed opening, so that the molding material on the semiconductor device is prevented from separating from the lead frame. In addition, external stress is effectively prevented from being applied on the chip, qualified rate of semiconductor devices is improved, production cost of an enterprise is effectively reduced, and reliability of semiconductor devices is improved.
Description
Technical field
The utility model relates to a kind of with departing from and the semiconductor device that locks combination slot lead frame.
Background technology
In semiconductor packages field, the moulding compound of semiconductor device is normally coated on the lead frame with longitudinal groove, due to the lead frame of this structure and the fastening force of moulding compound deficiency, cause many semiconductor device products to occur the problem that moulding compound comes off from lead frame, this has affected the quality of semiconductor device product greatly, reduce the qualification rate of semiconductor device product simultaneously, increased the production cost of enterprise.In order to address the above problem, need to strengthen the lead frame of semiconductor device and the fastening force of moulding compound, prevent from departing from moulding compound and lead frame, also to have and can effectively prevent that outer lateral stress is delivered to the structural measure of chip simultaneously.
Utility model content
In order to overcome deficiency of the prior art, it is a kind of with departing from and the semiconductor device that locks combination slot lead frame that the purpose of this utility model has been to provide, solved the quality problems that depart from the moulding compound of the medium-term and long-term existence of semiconductor device semiconductor device product and lead frame, also can effectively prevent that outer lateral stress is delivered to chip simultaneously.
To achieve these goals, the technical solution of the utility model is: a kind of with departing from and the semiconductor device that locks combination slot lead frame, comprise lead frame, be arranged at chip on lead frame and the moulding compound of coating chip and lead frame, on described lead frame, offer a longitudinal groove, described longitudinal groove lower ending opening is comprised of straight-through port and reaming port, and described moulding compound interlocks by longitudinal groove and lower ending opening thereof and lead frame.
Further, described lead frame has heat radiation fixed part, chip section and the pin portion being connected, and described chip is arranged at the centre of lead frame chip section, and described longitudinal groove is opened in lead frame chip section near a side of heat radiation fixed part.
Further, described lead frame chip section offers away from the opposite side lower end of heat radiation fixed part the breach interlocking with moulding compound.
Further, described lead frame is made by fin.
Compared with prior art, the utlity model has following beneficial effect: should be with departing from opening reinforcement moulding compound after by longitudinal groove and lower end reaming thereof of semiconductor device with locking combination slot lead frame and the fastening force of lead frame, prevent from departing from the moulding compound of semiconductor device and lead frame; Meanwhile, also can effectively prevent that outer lateral stress is delivered on chip, improve the qualification rate of semiconductor device product, effectively reduce the production cost of enterprise, promote the reliability of semiconductor device product.
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Accompanying drawing explanation
Fig. 1 is the profile of the utility model embodiment.
In figure: 1-lead frame, the 1-1-fixed part that dispels the heat, 1-2-chip section, 1-3-pin portion, 2-moulding compound, 3-straight-through port, the longitudinal groove of 4-, 5-reaming port, 6-chip, 7-breach.
Embodiment
As shown in Figure 1, a kind of with departing from and the semiconductor device that locks combination slot lead frame, comprise lead frame 1, be arranged at chip 6 on lead frame 1 and the moulding compound 2 of coating chip 6 and lead frame 1, on described lead frame 1, offer a longitudinal groove 4, described longitudinal groove 4 lower ending openings are comprised of the reaming port 5 of straight-through port 3 and side, and described moulding compound 2 interlocks by longitudinal groove 4 and lower ending opening thereof and lead frame 1.
In the present embodiment, described lead frame 1 is made by fin, described lead frame 1 has heat radiation fixed part 1-1, chip section 1-2 and the 1-3 of pin portion being connected, described chip 6 is arranged at the middle of lead frame 1 chip section 1-2 above, described longitudinal groove 4 is opened in lead frame 1 chip section 1-2 near a side of heat radiation fixed part 1-1, and described lead frame 1 chip section 1-2 also offers away from the opposite side lower end of heat radiation fixed part 1-1 the breach 7 interlocking with moulding compound 2.
In the present embodiment, the aperture of described longitudinal groove 4 lower ending openings is greater than the upper end open of longitudinal groove 4; While making longitudinal groove 4, can first on lead frame 1, offer a longitudinal hole, then longitudinal hole lower end is expanded to a notch to this side of chip section 1-2, described longitudinal hole and notch have formed the combination slot with disengaging and lock function.During encapsulation, described moulding compound 2 is filled with longitudinal groove 4 of lead frame 1 and the straight-through port 3 of lower end and reaming port 5, and coated lead frame 1 chip section 1-2 and chip 6.
The opening of the utility model after by longitudinal groove 4 and lower end reaming thereof increased the contact area of moulding compound 2 with lead frame 1, strengthened the fastening force of moulding compound 2 with lead frame 1, can effectively prevent that moulding compound 2 separation from lead frame 1 from coming off, the quality problems of throwing off on the moulding compound 2 that has solved the medium-term and long-term existence of semiconductor device product and lead frame 1; Meanwhile, longitudinally this side of groove 4 straight-through ports 3 can be separated from plastics when having extraneous stress, effectively prevents that outer lateral stress is delivered to chip 6 and has solved this type of stress failures problem producing when semiconductor device product is used.
The foregoing is only preferred embodiment of the present utility model, all equalizations of doing according to the utility model claim change and modify, and all should belong to covering scope of the present utility model.
Claims (2)
1. one kind with the semiconductor device departing from locking combination slot lead frame, it is characterized in that: comprise lead frame, be arranged at chip on lead frame and the moulding compound of coating chip and lead frame, described lead frame has the heat radiation fixed part being connected, chip section and pin portion, described chip is arranged at the centre of lead frame chip section, described lead frame chip section offers a longitudinal groove near a side of heat radiation fixed part, the aperture of described longitudinal groove lower ending opening is greater than longitudinal groove upper end open, described longitudinal groove lower ending opening is comprised of the reaming port of straight-through port and a side, described reaming port is positioned at this side of lead frame chip section, described lead frame chip section offers away from the opposite side lower end of heat radiation fixed part the breach interlocking with moulding compound, described moulding compound interlocks by longitudinal groove and lower ending opening thereof and lead frame.
2. according to claim 1 with departing from and the semiconductor device that locks combination slot lead frame, it is characterized in that: described lead frame is made by fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320886208.9U CN203839367U (en) | 2013-12-31 | 2013-12-31 | Semiconductor device with unlock-lock combined groove lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320886208.9U CN203839367U (en) | 2013-12-31 | 2013-12-31 | Semiconductor device with unlock-lock combined groove lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203839367U true CN203839367U (en) | 2014-09-17 |
Family
ID=51517173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320886208.9U Expired - Lifetime CN203839367U (en) | 2013-12-31 | 2013-12-31 | Semiconductor device with unlock-lock combined groove lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203839367U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981466A (en) * | 2017-05-10 | 2017-07-25 | 捷捷半导体有限公司 | Silicon controlled module and its assemble method with sieve-mesh low stress copper lead electrode |
| CN109075151A (en) * | 2016-04-26 | 2018-12-21 | 凌力尔特科技有限责任公司 | The lead frame that mechanical engagement and electrically and thermally for component package circuit conduct |
| US11749576B2 (en) | 2018-03-27 | 2023-09-05 | Analog Devices International Unlimited Company | Stacked circuit package with molded base having laser drilled openings for upper package |
| US11844178B2 (en) | 2020-06-02 | 2023-12-12 | Analog Devices International Unlimited Company | Electronic component |
-
2013
- 2013-12-31 CN CN201320886208.9U patent/CN203839367U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109075151A (en) * | 2016-04-26 | 2018-12-21 | 凌力尔特科技有限责任公司 | The lead frame that mechanical engagement and electrically and thermally for component package circuit conduct |
| CN106981466A (en) * | 2017-05-10 | 2017-07-25 | 捷捷半导体有限公司 | Silicon controlled module and its assemble method with sieve-mesh low stress copper lead electrode |
| CN106981466B (en) * | 2017-05-10 | 2023-09-19 | 捷捷半导体有限公司 | Silicon controlled rectifier module with sieve mesh-shaped low-stress copper lead electrode and assembling method thereof |
| US11749576B2 (en) | 2018-03-27 | 2023-09-05 | Analog Devices International Unlimited Company | Stacked circuit package with molded base having laser drilled openings for upper package |
| US11844178B2 (en) | 2020-06-02 | 2023-12-12 | Analog Devices International Unlimited Company | Electronic component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140917 |
|
| CX01 | Expiry of patent term |