CN203823519U - High-power LED lamp with good thermal dissipation effect - Google Patents
High-power LED lamp with good thermal dissipation effect Download PDFInfo
- Publication number
- CN203823519U CN203823519U CN201420202425.6U CN201420202425U CN203823519U CN 203823519 U CN203823519 U CN 203823519U CN 201420202425 U CN201420202425 U CN 201420202425U CN 203823519 U CN203823519 U CN 203823519U
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- heat
- conducting plate
- power led
- led chip
- radiator
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Abstract
The utility model relates to an LED lamp and provides a high-power LED lamp with good thermal dissipation effect. The high-power LED lamp comprises a high-power LED chip and a cooling device used for packaging cooling the high-power LED chip; the cooling device comprises a heat transfer plate, fluid and a first cooler; the high-power LED chip is packaged in the upper surface of the heat transfer plate; the first cooler is arranged on the lower surface of the heat transfer plate; a plurality of pipelines which are communicated with one another are distributed in the heat transfer plate; the fluid which can enhance the heat-conducting property is arranged in the pipelines.
Description
Technical field
The utility model relates to LED light fixture, particularly a kind of high-power high heat radiation LED lamp.
Background technology
At present, adopt of LED radiating mode is packaged in LED lamp on substrate more, again by baseplate-laminating on temperature-uniforming plate, again temperature-uniforming plate is fitted in above radiator, also there is the directly way on radiator by baseplate-laminating, although but the heat-conducting effect of temperature-uniforming plate is fine, but through causing thermal resistance to increase after laminating repeatedly to such an extent as to significantly reduce the thermal source conduction of LED lamp, and process on product line increases, more exist the service life of laminating material (being generally heat-conducting cream) short, thereby have a strong impact on the service life of LED lamp.As, in Chinese patent application publication number CN1277665A document, a kind of LED lamp heat sink conception is disclosed, in this scheme, its heat radiation is the heat that absorbs the pedestal that connects LED by the joint pin in lamp body, then throw away in lamp body and dispel the heat, due to repeatedly heat radiation indirectly, and dispel the heat in sealing lamp body, shortened the service life of LED, radiating effect is not good.And for example in Chinese patent Granted publication CN1594962A document, a kind of LED lamp heat sink conception is disclosed, in this scheme, its heat radiation is that the heat of LED sees through light source board and reaches heat conductive insulating film and heat conductive insulating adhesive plaster reaches heat-dissipating casing again, also be indirect heat radiation, cannot improve thermal source conduction, effect is also not good.
Utility model content
Therefore the high-power high heat radiation LED lamp that,, for above-mentioned problem, the utility model proposes a kind of better heat-radiation effect, simple in structure, thermal source conductivity is high, extends LED service life.
For solving this technical problem, the utility model is taked following scheme: high-power high heat radiation LED lamp, the heat abstractor that comprises high-power LED chip and also dispel the heat for high-power LED chip for packaged high-power LED chip, described heat abstractor comprises heat-conducting plate, fluid and the first radiator, described high-power LED chip package is in heat-conducting plate upper surface, described the first radiator is located at heat-conducting plate lower surface, in described heat-conducting plate, be laid with many pipelines that are interconnected, in the pipeline in described heat-conducting plate, be filled with the fluid of increased thermal conductivity energy.
Further, also comprise an above heat-conducting copper pipe, each heat-conducting copper pipe is all connected with the pipeline in heat-conducting plate, is all filled with fluid in each heat-conducting copper pipe.
Further, described fluid is mixed and is formed by copper powder, pure water and alcohol.
Further, the purity of described copper powder is 99.3-99.7%, and the monomer particle diameter of described copper powder is 75～150 microns.
Further, also comprise the second radiator, each described heat-conducting copper pipe is all arranged on the second radiator.
Further, between described the first radiator and heat-conducting plate, be provided with tin paste layer.
Further, described heat-conducting plate is metallic plate or ceramic wafer.
By adopting aforementioned techniques scheme, the beneficial effects of the utility model are: by high-power LED chip is directly packaged on heat-conducting plate, exempt original basic with the thermal resistance problem between temperature-uniforming plate, radiator is directly set simultaneously under heat-conducting plate, fully to the thermal source of high-power LED chip directly through heat-conducting plate heat conduction again by radiator quick heat radiating, efficiently solve the problem that high-power LED chip internal heat resource is assembled, thereby increase substantially the service life of high-power LED chip, improve the power of LED light fixture, by fill the fluid of quick conductive in heat-conducting plate, further improve the cooling heat source effect of high-power LED chip, by further improvement, increase heat-conducting copper pipe, and heat-conducting copper pipe is arranged on radiator, can faster the heat on heat-conducting plate be derived to heat radiation, further improve the heat radiation of high-power LED chip internal heat resource, extend the service life of high-power LED chip.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model embodiment.
Detailed description of the invention
Now with detailed description of the invention, the utility model is further illustrated by reference to the accompanying drawings.
With reference to figure 1, high-power high heat radiation LED lamp of the present utility model, the heat abstractor that comprises high-power LED chip 1 and also dispel the heat for high-power LED chip 1 for packaged high-power LED chip 1, described heat abstractor comprises heat-conducting plate 2, fluid, the first radiator, 12 heat-conducting copper pipes 3 and the second radiator 4, described high-power LED chip 1 is packaged in heat-conducting plate 2 upper surfaces, described the first radiator is located at heat-conducting plate 2 lower surfaces, in described heat-conducting plate 2, be laid with many pipelines that are interconnected, in pipeline in described heat-conducting plate 2, be filled with the fluid of increased thermal conductivity energy, each heat-conducting copper pipe 3 is all connected with the pipeline in heat-conducting plate 2, the interior fluid that is all filled with of each heat-conducting copper pipe 3, described fluid is by copper powder, pure water and alcohol mix formation, the purity of described copper powder is 99.5%, the monomer particle diameter of described copper powder is 100 microns, each described heat-conducting copper pipe 3 is all arranged on the second radiator 4, between described the first radiator and heat-conducting plate, be provided with tin paste layer, described heat-conducting plate is metallic plate.
In the utility model, in fluid, the purity of contained copper powder is taking 99.3-99.7% as good, and the monomer particle diameter of copper powder is taking 75～150 microns as good, and heat-conducting plate can also be ceramic wafer.
The utility model is by being directly packaged in high-power LED chip on heat-conducting plate, exempt original basic with the thermal resistance problem between temperature-uniforming plate, radiator is directly set simultaneously under heat-conducting plate, fully to the thermal source of high-power LED chip directly through heat-conducting plate heat conduction again by radiator quick heat radiating, efficiently solve the problem that high-power LED chip internal heat resource is assembled, thereby increase substantially the service life of high-power LED chip, improve the power of LED light fixture, by fill the fluid of quick conductive in heat-conducting plate, further improve the cooling heat source effect of high-power LED chip, by further improvement, increase heat-conducting copper pipe, and heat-conducting copper pipe is arranged on radiator, can faster the heat on heat-conducting plate be derived to heat radiation, further improve the heat radiation of high-power LED chip internal heat resource, extend the service life of high-power LED chip.
Although specifically show and introduced the utility model in conjunction with preferred embodiment; but those skilled in the art should be understood that; not departing from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection domain of the present utility model.
Claims (5)
1. high-power high-heat-dispersion LED light fixture, comprise great power LED chip and for packaged high-power LED chip and be the heat abstractor of great power LED chip cooling, it is characterized in that: described heat abstractor comprises heat-conducting plate, fluid and the first radiator, described great power LED chip package is in heat-conducting plate upper surface, described the first radiator is located at heat-conducting plate lower surface, in described heat-conducting plate, be laid with many pipelines that are interconnected, in the pipeline in described heat-conducting plate, be filled with the fluid of increased thermal conductivity energy.
2. according to the high-power high-heat-dispersion LED light fixture described in claim 1, it is characterized in that: also comprise an above heat-conducting copper pipe, each heat-conducting copper pipe is all connected with the pipeline in heat-conducting plate, is all filled with fluid in each heat-conducting copper pipe.
3. according to the high-power high-heat-dispersion LED light fixture described in claim 1, it is characterized in that: also comprise the second radiator, each described heat-conducting copper pipe is all arranged on the second radiator.
4. according to the high-power high-heat-dispersion LED light fixture described in claim 1, it is characterized in that: between described the first radiator and heat-conducting plate, be provided with tin paste layer.
5. according to the high-power high-heat-dispersion LED light fixture described in claim 1 or 2 or 4, it is characterized in that: described heat-conducting plate is metallic plate or ceramic wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420202425.6U CN203823519U (en) | 2014-04-24 | 2014-04-24 | High-power LED lamp with good thermal dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420202425.6U CN203823519U (en) | 2014-04-24 | 2014-04-24 | High-power LED lamp with good thermal dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203823519U true CN203823519U (en) | 2014-09-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420202425.6U Expired - Fee Related CN203823519U (en) | 2014-04-24 | 2014-04-24 | High-power LED lamp with good thermal dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203823519U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013119A (en) * | 2021-03-03 | 2021-06-22 | 同辉电子科技股份有限公司 | LED chip with array structure |
-
2014
- 2014-04-24 CN CN201420202425.6U patent/CN203823519U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013119A (en) * | 2021-03-03 | 2021-06-22 | 同辉电子科技股份有限公司 | LED chip with array structure |
| CN113013119B (en) * | 2021-03-03 | 2022-07-12 | 同辉电子科技股份有限公司 | LED chip with array structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140910 Termination date: 20150424 |
|
| EXPY | Termination of patent right or utility model |