CN203774257U - Manual BGA ball mounter - Google Patents
Manual BGA ball mounter Download PDFInfo
- Publication number
- CN203774257U CN203774257U CN201420135110.4U CN201420135110U CN203774257U CN 203774257 U CN203774257 U CN 203774257U CN 201420135110 U CN201420135110 U CN 201420135110U CN 203774257 U CN203774257 U CN 203774257U
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- CN
- China
- Prior art keywords
- printing
- workbench
- direction motion
- ball
- scraper
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Abstract
A manual BGA ball mounter comprises a main body rack bench and a man-machine control system. The main body rack bench is provided with a platform guide rail, a working platform, a ball mounting mechanism and a printing mechanism. The working platform is erected on the platform guide rail and can carry out X-direction movement along the platform guide rail. The ball mounting mechanism and the printing mechanism are erected on the main body rack bench side by side and a lower portion is provided with a space where the working platform can pass through. The working platform can enter into the printing mechanism and the ball mounting mechanism along the platform guide rail so as to realize printing and ball mounting of a semiconductor chip. The man-machine control system is connected to the working platform and the printing mechanism in a telecommunication connection mode respectively so as to control motion of the working platform and the printing mechanism. The ball mounter adopts a mechanical positioning mode. Positioning is accurate and a success rate of the ball mounting is high. The ball mounter corresponds to many types. Corresponding to different types of chips, only fixtures need to be replaced and operation is convenient. Double scrapers are independently and automatically operated and a pressure adjusting system is arranged so that an amount of scraping gum is effectively controlled and the success rate of the ball mounting is guaranteed.
Description
Technical field
The utility model relates to a kind of semiconductor production equipment, relates in particular to a kind of manually BGA ball attachment machine.
Background technology
Compared with the conventional package forms such as BGA encapsulation and TSOP, there is less volume, better thermal diffusivity and electrical property.BGA packaged type is that pin is arranged in the mode of comprehensive lattice point shape hash, and using tin ball as pin and solder joint, this kind of packaged type can overcome the phenomenon that pin is more so that bending; But the packaged type of BGA need be with ball attachment machine by the pin of tin ball attached wafer.
At present domesticly plant ball process aspect at BGA, some employings ball chuck tool of manually planting as pointed in utility model patent CN1581441A is realized, and this shortcoming of manually planting ball mode is obvious:
1, scaling powder is by manually smearing, lost labor and be not easy to control frictioning amount.
2, scaling powder and plant ball and realize with two devices respectively, mounting or dismounting chip is time-consuming.
The defect of manually planting in a word ball chuck tool makes some clients use the full-automatic BGA of external import to plant ball equipment, and the BGA of external import plants ball equipment and also has following inevitable shortcoming:
1, this kind equipment all adopts multiple CCD respectively BGA substrate and printing mechanism and ball attachment machine structure to be carried out to contraposition in the market, causes cost higher, expensive.
2, automatic ball-embedding mechanism is very complicated, and in the time changing new product, workload is larger.
3, automatic ball-embedding equipment need to be used expensive special tool, high cost for demand is not very large product.
Utility model content
The purpose of this utility model, exactly in order to solve the problem in above-mentioned actual production, provides a kind of manually BGA ball attachment machine.
In order to achieve the above object, the utility model has adopted following technical scheme: a kind of manually BGA ball attachment machine, comprise main body pallet and man-machine control system, and on main body pallet, be provided with platform rail, workbench, ball attachment machine structure and printing mechanism; Described workbench is erected on platform rail can make X to movement along platform rail, described ball attachment machine structure and printing mechanism are erected on main body pallet side by side, its underpart is provided with the space for workbench turnover, and workbench can enter printing mechanism and ball attachment machine structure is realized the printing of semiconductor chip and plants ball along platform rail; Described man-machine control system telecom-connects with workbench and printing mechanism respectively, controls the action of workbench and printing mechanism.
Described workbench comprises that the chip placement tool, workbench Z-direction motion cylinder, the workbench X that are erected at the slide unit on platform rail and be arranged on slide unit manually locate knob and vacuum adsorption system to positioning cylinder, workbench; Chip placement tool is erected at the top of workbench Z-direction motion cylinder, and workbench X is provided with workbench X to positioning cylinder control valve to positioning cylinder, and vacuum adsorption system is provided with vacuum adsorption control valve.
Described ball attachment machine structure comprises that planting ball bracing frame and being arranged on plants and plant net plate on ball bracing frame.
Described printing mechanism comprises printing bracing frame and is arranged on scraper mechanism and the Printing screen on printing bracing frame; Scraper mechanism comprises Y-direction motion motor, Y-direction motion screw mandrel, the first printing scraper, the second printing scraper, the first printing scraper Z-direction motion cylinder and the second printing scraper Z-direction motion cylinder, Y-direction motion screw mandrel is connected with the transmission of Y-direction motion motor, the first printing scraper is connected with the transmission of Y-direction motion wire rod thread respectively with the second printing scraper, and the first printing scraper Z-direction motion cylinder is connected with the second printing scraper transmission with the first printing scraper respectively with the second printing scraper Z-direction motion cylinder; The first printing scraper and the second printing scraper can be done Y-direction motion and under the effect of corresponding Z-direction motion cylinder, do separate Z-direction motion under the drive of Y-direction motion screw mandrel; The first printing scraper Z-direction motion cylinder and the second printing scraper Z-direction motion cylinder are respectively equipped with scraper pressure control valve, can regulate the frictioning pressure of the first printing scraper, the second printing scraper.
Described main body pallet is provided with printing location hole and plants ball location hole, and described workbench X is provided with inserted link to positioning cylinder bottom, and this inserted link can insert printing location hole or plant and in ball location hole, realize the printing location of workbench or plant ball location.
Compared with prior art, the utlity model has following advantage and disadvantage:
1, manually BGA ball attachment machine adopts mechanical locate mode, and accurate positioning is planted ball success rate high.
2, corresponding multiple kind, when the chip of corresponding different cultivars, as long as change tool, easy to operate.
3, two scrapers are independent automatically moves and has pressure regulating system, effectively controls frictioning amount, ensures to plant ball success rate.
Brief description of the drawings
Fig. 1 is the perspective view of the manual BGA ball attachment machine of the utility model;
Fig. 2 is the structural representation of facing of the manual BGA ball attachment machine of the utility model;
Fig. 3 is the plan structure schematic diagram of the manual BGA ball attachment machine of the utility model;
Fig. 4 is the printing work view of the manual BGA ball attachment machine of the utility model;
Fig. 5 be the manual BGA ball attachment machine of the utility model plant ball working state schematic representation.
Embodiment
Referring to Fig. 1, Fig. 2, Fig. 3, manual BGA ball attachment machine of the present utility model, comprises main body pallet 1 and man-machine control system 2, is provided with platform rail 3, workbench 4, ball attachment machine structure 5 and printing mechanism 6 on main body pallet 1.Workbench 4 is erected on platform rail 3 can make X to movement along platform rail, ball attachment machine structure 5 and printing mechanism 6 are erected on main body pallet 1 side by side, its underpart is provided with the space for workbench turnover, and workbench can enter printing mechanism and ball attachment machine structure is realized the printing of semiconductor chip and plants ball along platform rail; Man-machine control system 2 telecom-connects with workbench 4 and printing mechanism 6 respectively, controls the action of workbench and printing mechanism.
Workbench 4 in the utility model comprises the slide unit 41 being erected on platform rail 3 and is arranged on chip on slide unit places tool 42, workbench Z-direction motion cylinder 43, workbench X to positioning cylinder 44, workbench manual positioning knob 45 and vacuum adsorption system 46; Chip placement tool 42 is erected at the top of workbench Z-direction motion cylinder 43, and workbench X is provided with workbench X to positioning cylinder control valve 47 to positioning cylinder 44, and vacuum adsorption system 46 is provided with vacuum adsorption control valve.
Ball attachment machine structure 5 in the utility model comprises that planting ball bracing frame and being arranged on plants and plant net plate 51 on ball bracing frame.
Printing mechanism 6 in the utility model comprises printing bracing frame and is arranged on scraper mechanism and the Printing screen 61 on printing bracing frame; Scraper mechanism comprises Y-direction motion motor 62, Y-direction motion screw mandrel 63, the first printing scraper 64, the second printing scraper 65, the first printing scraper Z-direction motion cylinder 66 and the second printing scraper Z-direction motion cylinder 67, Y-direction motion screw mandrel is connected with the transmission of Y-direction motion motor, the first printing scraper is connected with the transmission of Y-direction motion wire rod thread respectively with the second printing scraper, and the first printing scraper Z-direction motion cylinder is connected with the second printing scraper transmission with the first printing scraper respectively with the second printing scraper Z-direction motion cylinder; The first printing scraper and the second printing scraper can be done Y-direction motion and under the effect of corresponding Z-direction motion cylinder, do separate Z-direction motion under the drive of Y-direction motion screw mandrel; The first printing scraper Z-direction motion cylinder and the second printing scraper Z-direction motion cylinder are respectively equipped with scraper pressure control valve 68,69, can regulate the frictioning pressure of the first printing scraper, the second printing scraper.
Main body pallet 1 in the utility model is provided with printing location hole 11 and plants ball location hole 12, and workbench X is provided with inserted link to positioning cylinder bottom, and this inserted link can insert printing location hole or plant and in ball location hole, realize the printing location of workbench or plant ball location.
Operation principle of the present utility model is can accompanying drawings as follows:
1, chip is placed action: as shown in Figures 2 and 3, manually the workbench 4 of BGA ball attachment machine is placed on and evades position, then chip is placed on to chip and places in tool 42, manually pull lower vacuum adsorption control valve, vacuum holds chip.
2, printing action: after chip places, as shown in Figure 4, manually workbench is shifted onto to printing position, screw off after workbench manual positioning knob 45, pull lower workbench X to positioning cylinder control valve 47, workbench positioning cylinder 44 declines, inserted link under cylinder 44 injects printing location hole 11, and workbench location is complete, in man-machine control system, press printing start button, automatically weld the printing of glue.
3, plant ball action: after finishing printing, as shown in Figure 5, workbench is shifted onto and planted ball position, screw off after workbench manual positioning knob 45, pull lower workbench X to positioning cylinder control valve 47, workbench positioning cylinder 44 declines, and the inserted link under cylinder 44 injects plants ball location hole 12, workbench location is complete, in man-machine control system, to press and plant ball start button, workbench Z-direction motion cylinder 43 rises, workbench 4 is arrived and plant ball height, then manually plant ball operation.
Claims (5)
1. a manual BGA ball attachment machine, is characterized in that, comprises main body pallet and man-machine control system, is provided with platform rail, workbench, ball attachment machine structure and printing mechanism on main body pallet; Described workbench is erected on platform rail can make X to movement along platform rail, described ball attachment machine structure and printing mechanism are erected on main body pallet side by side, its underpart is provided with the space for workbench turnover, and workbench can enter printing mechanism and ball attachment machine structure is realized the printing of semiconductor chip and plants ball along platform rail; Described man-machine control system telecom-connects with workbench and printing mechanism respectively, controls the action of workbench and printing mechanism.
2. manual BGA ball attachment machine as claimed in claim 1, is characterized in that: described workbench comprises that the chip placement tool, workbench Z-direction motion cylinder, the workbench X that are erected at the slide unit on platform rail and be arranged on slide unit manually locate knob and vacuum adsorption system to positioning cylinder, workbench; Chip placement tool is erected at the top of workbench Z-direction motion cylinder, and workbench X is provided with workbench X to positioning cylinder control valve to positioning cylinder, and vacuum adsorption system is provided with vacuum adsorption control valve.
3. manual BGA ball attachment machine as claimed in claim 1, is characterized in that: described ball attachment machine structure comprises that planting ball bracing frame and being arranged on plants and plant net plate on ball bracing frame.
4. manual BGA ball attachment machine as claimed in claim 1, is characterized in that: described printing mechanism comprises printing bracing frame and is arranged on scraper mechanism and the Printing screen on printing bracing frame; Scraper mechanism comprises Y-direction motion motor, Y-direction motion screw mandrel, the first printing scraper, the second printing scraper, the first printing scraper Z-direction motion cylinder and the second printing scraper Z-direction motion cylinder, Y-direction motion screw mandrel is connected with the transmission of Y-direction motion motor, the first printing scraper is connected with the transmission of Y-direction motion wire rod thread respectively with the second printing scraper, and the first printing scraper Z-direction motion cylinder is connected with the second printing scraper transmission with the first printing scraper respectively with the second printing scraper Z-direction motion cylinder; The first printing scraper and the second printing scraper can be done Y-direction motion and under the effect of corresponding Z-direction motion cylinder, do separate Z-direction motion under the drive of Y-direction motion screw mandrel; The first printing scraper Z-direction motion cylinder and the second printing scraper Z-direction motion cylinder are respectively equipped with scraper pressure control valve, can regulate the frictioning pressure of the first printing scraper, the second printing scraper.
5. manual BGA ball attachment machine as claimed in claim 1, it is characterized in that: described main body pallet is provided with printing location hole and plants ball location hole, described workbench X is provided with inserted link to positioning cylinder bottom, and this inserted link can insert printing location hole or plant and in ball location hole, realize the printing location of workbench or plant ball location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420135110.4U CN203774257U (en) | 2014-03-24 | 2014-03-24 | Manual BGA ball mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420135110.4U CN203774257U (en) | 2014-03-24 | 2014-03-24 | Manual BGA ball mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203774257U true CN203774257U (en) | 2014-08-13 |
Family
ID=51291415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420135110.4U Withdrawn - After Issue CN203774257U (en) | 2014-03-24 | 2014-03-24 | Manual BGA ball mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203774257U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103871915A (en) * | 2014-03-24 | 2014-06-18 | 上海微松工业自动化有限公司 | Manual BGA ball mounting machine |
-
2014
- 2014-03-24 CN CN201420135110.4U patent/CN203774257U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103871915A (en) * | 2014-03-24 | 2014-06-18 | 上海微松工业自动化有限公司 | Manual BGA ball mounting machine |
| CN103871915B (en) * | 2014-03-24 | 2016-08-17 | 上海微松工业自动化有限公司 | Manually BGA ball attachment machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140813 Effective date of abandoning: 20160817 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |