CN203743935U - Light-emitting module and lighting device - Google Patents
Light-emitting module and lighting device Download PDFInfo
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- CN203743935U CN203743935U CN201420122090.7U CN201420122090U CN203743935U CN 203743935 U CN203743935 U CN 203743935U CN 201420122090 U CN201420122090 U CN 201420122090U CN 203743935 U CN203743935 U CN 203743935U
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Abstract
The utility model provides a light-emitting module and a lighting device. According to the light-emitting module and the lighting device, the problem that the color of light emitted by a light-emitting module is nonuniform can be solved. The light-emitting module (54) is provided with a substrate (21), an LED (45) arranged on the substrate (21), and a fluorescent body layer (31) provided with a fluorescent body, wherein the LED (45) is provided with a base material (44) and a light-emitting layer (43), the base material (44) is arranged on the substrate (21), the light-emitting layer (43) is arranged on the base material (44) and can emit light, and the fluorescent body layer (31) is located in the thickness direction of the substrate (21) and form a dome shape on the side where the light-emitting layer (43) is located, so that the difference between the length of the portion, where light emitted from the center of the light-emitting surface of the light-emitting layer (43) passes through, of a light path and the length of the portion, where light emitted from one end of the light-emitting surface of the light-emitting layer (43) passes through, of the light path becomes smaller.
Description
Technical field
Embodiment of the present utility model relates to light emitting module and lighting device.
Background technology
In recent years, with LED(Light Emitting Diode, light emitting diode) be that the lighting device of light source is universal.As the light emitting module of the lighting device for such, known have a following structure: transparent resin covers base material and be provided with the LED of the semiconductor layer (luminescent layer) that comprises GaN etc. and the luminescent coating that utilizes the resin that comprises fluorophor to form in the light-emitting area of luminescent layer.
In such light emitting module, what comprise fluorophor is aqueous resin-coated in light-emitting area and form luminescent coating, so due to the impact of wettability, the surface tension of resin etc. of light-emitting area, form the dome-shaped of protuberance near the central authorities of the light-emitting area of luminescent coating.If luminescent coating forms such shape, the thickness of luminescent coating is different because of the position in light-emitting area, and the optical path length that passes through luminescent coating from the light of light-emitting area radiation is because of the position difference light-emitting area.
If by the optical path length difference of luminescent coating, the density difference of the fluorophor on the radiation direction of the light radiating from luminescent layer.So the color of the light sometimes radiating to the outside of light emitting module is different because of the position in light-emitting area, can not radiate the light of even color.
No. 4424354th, patent documentation 1:JP special permission
Summary of the invention
Problem to be solved in the utility model is to suppress the irregular colour of the light of light emitting module radiation.
Light emitting module in embodiment possesses: substrate, be located at semiconductor light-emitting elements on substrate, have the luminescent coating of fluorophor.Described semiconductor light-emitting elements has: be located at the base material on described substrate and be located on described base material and luminous luminescent layer.Described luminescent coating is on the thickness direction of described substrate and form dome-shapedly in described luminescent layer side, and is formed as making the light sending from the central authorities of described luminescent layer to reduce by the difference of the optical path length of this luminescent coating by the optical path length of this luminescent coating and the light sending from the end of described luminescent layer.
According to the utility model, can expect the irregular colour of the light that suppresses light emitting module radiation.
Brief description of the drawings
Fig. 1 is the stereogram that represents an example of the related lighting device of the 1st embodiment.
Fig. 2 is the profile that represents an example of the related lighting device of the 1st embodiment.
Fig. 3 is the concept map that represents an example of the electrical connection of the related lighting device of the 1st embodiment.
Fig. 4 is the figure that represents an example of the structure of the related luminescence unit of the 1st embodiment.
Fig. 5 is the top view that represents an example of the related light emitting module of the 1st embodiment.
Fig. 6 is the A-A profile of the light emitting module in presentation graphs 5.
Fig. 7 is near the enlarged drawing LED in presentation graphs 6.
Fig. 8 is near the figure of the example LED representing in comparative example.
Fig. 9 is the figure that represents near the example of the related LED of the 2nd embodiment.
Figure 10 is the figure that represents near the example of the related LED of the 3rd embodiment.
Figure 11 is the figure that represents near the example of the related LED of the 4th embodiment.
Figure 12 is the concept map of the relation for the resin that contains fluorophor and transparent resin are described.
In figure: 21-substrate; 27-the 2nd distribution pad; 30-sticker; 31-luminescent coating; 43-luminescent layer; 44-base material; 45-LED; 53-containment member; 54-light emitting module.
Detailed description of the invention
Below the related light emitting module of embodiment of explanation possesses: substrate, the semiconductor light-emitting elements of being located on substrate are LED and the luminescent coating with fluorophor.LED has base material and is located on base material and luminous luminescent layer.Luminescent coating is on the thickness direction of substrate and form dome-shapedly in luminescent layer side, and the light that is formed as making the light sending from the central authorities of the light-emitting area of luminescent layer to send by the optical path length of this luminescent coating and the end of the light-emitting area from luminescent layer diminishes by the difference of the optical path length of this luminescent coating.Utilize such structure, can expect the irregular colour of the light that suppresses light emitting module radiation.
In addition,, in the related light emitting module of the embodiment of following explanation, preferably, on the thickness direction of substrate, the area of the light-emitting area of the Area Ratio luminescent layer of the lower surface of luminescent coating is large.Thus, thickness poor of the luminescent coating of the each position in light-emitting area can be reduced, the irregular colour of the light that suppresses light emitting module radiation can be expected.
In addition, in the related light emitting module of the embodiment of following explanation, can be also on the thickness direction of substrate, the area of the Area Ratio base material of luminescent layer is little, and luminescent coating is formed on base material in the mode that covers luminescent layer.Thus, thickness poor of the luminescent coating of the each position in light-emitting area can be reduced, the irregular colour of the light that suppresses light emitting module radiation can be expected.
In addition,, in the related light emitting module of the embodiment of following explanation, also can in the light-emitting area of luminescent layer, further possess and be formed as dome-type transparent component.In this case, can be also luminescent coating to cover the mode of transparent component, in the light-emitting area of luminescent layer, be formed as dome-shapedly, on the thickness direction of substrate, the area of the Area Ratio luminescent coating of transparent component is little.Thus, thickness poor of the luminescent coating of the each position in light-emitting area can be reduced, the irregular colour of the light that suppresses light emitting module radiation can be expected.
In addition, in the related light emitting module of the embodiment of following explanation, also can be on the thickness direction of substrate, the distance of the periphery of the face that the end of the light-emitting area from luminescent layer is joined to transparent component and this light-emitting area is made as a, the thickness of the luminescent coating in the periphery of the face that transparent component and light-emitting area are joined is made as b, the thickness of the luminescent coating of the centre of light-emitting area is made as in the situation of c, can meets the relation of a < b≤c.Thus, thickness poor of the luminescent coating of the each position in light-emitting area can be reduced, the irregular colour of the light that suppresses light emitting module radiation can be expected.
In addition,, in the related light emitting module of the embodiment of following explanation, base material can contain silicon.In addition the lighting device in the embodiment below illustrating, also can possess above-mentioned light emitting module and supply with the ignition device of electric power to this light emitting module.
Below, with reference to accompanying drawing, light emitting module and lighting device in embodiment are described.In addition, to having the identical symbol of structure tag of identical function in embodiment, the repetitive description thereof will be omitted.In addition, the light emitting module that following embodiment is illustrated and lighting device have only represented an example, and are not used in restriction the utility model.In addition, following embodiment can combination aptly in not conflicting scope.
(the 1st embodiment)
The Straight lamp and the lighting device that possesses Straight lamp, for example ligthing paraphernalia of the 1st embodiment are described with reference to Fig. 1～Fig. 6 below.
［ structure of lighting device 1 ］
Fig. 1 is the stereogram that an example of the related lighting device of the 1st embodiment is shown.In addition, Fig. 2 is the profile of the ligthing paraphernalia shown in Fig. 1.In Fig. 1 and Fig. 2, Reference numeral 1 is exemplified with the lighting device of direct mount type.
Lighting device 1 possesses: apparatus main body (appliance body) 2, ignition device 3, paired the first lamp socket 4a and an example of the second lamp socket 4b, reflecting member 5 and light supply apparatus are straight pipe type lamp 11 etc.
Main body 2 shown in Fig. 2 is made by the metallic plate of for example elongated shape.Main body 2 is extended in direction in the table of paper of drawing Fig. 2.Main body 2 is for example fixed on ceiling within doors with not shown multiple screws.
Ignition device 3 is fixed on the pars intermedia of the length direction of main body 2.Ignition device 3 receives commercial ac power source and generates direct current output, and direct current output is supplied to straight pipe type lamp 11 described later.
In addition, not shown power supply terminal platform, multiple member supports metalwork and a pair of lamp socket supporting member etc. have been installed respectively in main body 2.Power supply terminal platform is connected with the power line of the commercial ac power source of introducing from ceiling.And then power supply terminal platform is electrically connected with ignition device 3 via distribution in not shown utensil.
Lamp socket 4a and 4b and lamp socket supporting member link and are disposed in respectively the length direction both ends of main body 2.Lamp socket 4a and 4b are that rotation is mounted.Lamp socket 4a and 4b are provided with the straight pipe type lamp 11 being described later, for example, be the lamp socket adapting to respectively with lamp holder 13a and the 13b of G13 type.
Fig. 3 is the concept map that an example of the electrical connection of the related lighting device of the 1st embodiment is shown.As shown in Figure 3, lamp socket 4a and 4b have the pair of terminal metalwork 8 or the terminal metal piece 9 that are connected with lamp base 16a described later and 16b respectively.For to straight pipe type lamp 11 supply powers described later, the terminal metal piece 8 of the 1st lamp socket 4a is connected with ignition device 3 by distribution in utensil.
As shown in Figure 2, reflecting member 5 for example has metal base plate 5a, side plate 5b and end plate 5c, is formed as the groove shape of upper surface open.Base plate 5a is flat.Side plate 5b bends obliquely from the width two ends of base plate 5a.The end face opening that end plate 5c sealing is made up of the end of the length direction of base plate 5a and side plate 5b.
The color steel sheet that the metallic plate of formation base plate 5a and side plate 5b presents white color system color by surface forms.So the surface of base plate 5a and side plate 5b becomes reflecting surface.The length direction two ends of base plate 5a have not shown lamp socket through hole.
Reflecting member 5 has covered main body 2 and has been installed on each parts of main body 2.This state by removable decoration screw 6(with reference to Fig. 1) keep.Decorate screw 6 and base plate 5a is upwards connected and is screwed into member supports metalwork.Decorate screw 6 and can twist operation by hand without instrument.Lamp socket 4a and 4b be lower side-prominent to base plate 5a by lamp socket through hole.
In Fig. 1, lighting device 1 supports the straight pipe type lamp 11 of a following explanation, but as other mode, for example, also can be configured to and possess two pairs of lamp sockets, supports two straight pipe type lamps 11.
Referring to Fig. 2 and Fig. 3, the straight pipe type lamp 11 removably being supported by lamp socket 4a and 4b is described.Straight pipe type lamp 11 has the size same with the fluorescent lamp of both depositing and external diameter.This straight pipe type lamp 11 possesses: pipe 12, be installed on the first lamp holder 13a and the second lamp holder 13b, beam 14 and the luminescence unit 15 at the two ends of this pipe 12.
Pipe 12 is formed as for example strip with the resin material of light transmission.In the resin material of formation pipe 12, preferably use the polycarbonate resin of the diffusion material that is mixed with light.The diffuse reflectance of this pipe 12 is preferably 90%～95%.As shown in Figure 2, pipe 12, under its use state, has a pair of protuberance 12a at the inner face at the position that becomes top.
The first lamp holder 13a is installed on an end of the length direction of pipe 12, and the second lamp holder 13b is installed on the other end of the length direction of pipe 12.Above-mentioned the first lamp holder 13a and the second lamp holder 13b are removably connected with lamp socket 4a and 4b respectively.By this connection, the straight pipe type lamp 11 that is supported on lamp socket 4a and 4b be disposed at reflecting member 5 base plate 5a under.A part for light from from straight pipe type lamp 11 to outside outgoing is reflected at the side plate 5b of reflecting member 5.
As shown in Figure 3, the first lamp holder 13a has to its outside two outstanding lamp base 16a.These two mutual electric insulations of lamp base 16a.For example, and the leading section of two lamp base 16a curves L word shape, almost bends to right angle in mode separated from each other.
As shown in Figure 3, the second lamp holder 13b has to its outside outstanding lamp base 16b.This lamp base 16b has: columned axial region and be located at the leading section of columned axial region and leading section that front shape (not shown) is elliptical shape or oblong shape, side is formed as T word shape.
The lamp base 16a of the first lamp holder 13a is connected with the terminal metal piece 8 of lamp socket 4a, and the lamp base 16b of the second lamp holder 13b and the terminal metal piece 9 of lamp socket 4b be connected, and thus, straight pipe type lamp 11 is mechanically supported in lamp socket 4a and 4b.Under this holding state, by the lamp base 16a of the terminal metal piece 8 in lamp socket 4a and the first lamp holder 13a of joining with it, carry out to the power supply of straight pipe type lamp 11.
As shown in Figure 2, beam 14 is accommodated in pipe 12.Beam 14 is liner materials of mechanicalness good strength, for example, for lightweight with formation such as aluminium alloys.The two ends of the length direction of beam 14 and the first lamp holder 13a and the second lamp holder 13b electric insulation ground link.14a(Fig. 2 of base plate supports portion that beam 14 for example has multiple formation arch rib shapes illustrates one).
Fig. 4 illustrates the figure of an example of the structure of the related luminescence unit of the 1st embodiment.As shown in Figure 4, with regard to luminescence unit 15, be formed as on elongated roughly OBL substrate 21 and on the length direction of this substrate 21, disposing side by side multiple light emitting modules 54.On substrate 21, dispose the various electric components 57～59 such as capacitor, connector.The surface of substrate 21 is provided with the resist layer taking the high synthetic resin of electrical insulating property as principal component.This resist layer is for example white, also as the high reflecting layer of reflection of light rate and practical function.
The total length of the length of substrate 21 and beam 14 is roughly equal.Substrate 21 is fixed by the not shown screw that is screwed into beam 14.In the present embodiment, luminescence unit 15 has a substrate 21, but as other embodiment, luminescence unit 15 also can be made up of multiple substrates.
Luminescence unit 15 is accommodated in pipe 12 together with beam 14.Under this holding state, the both ends of the width of luminescence unit 15 load the protuberance 12a in pipe 12.Thus, the upside of the Breadth Maximum portion of luminescence unit 15 in pipe 12 essentially horizontally arranges.
［ structure of light emitting module 54 ］
Fig. 5 is the top view that an example of the related light emitting module of the 1st embodiment is shown.Fig. 6 is the A-A profile of the light emitting module of Fig. 5.Fig. 7 is near the enlarged drawing of LED of Fig. 6.
Light emitting module 54 has LED45 and containment member 53.LED45 has: the base material 44 being formed by silicon or the material that contains silicon and be formed at the semiconductor layer (luminescent layer) 43 that contains gallium nitride (GaN) etc. on base material 44.At the thickness direction of luminescent layer 43, the upper surface of base material 44 is formed as larger than the profile of luminescent layer 43.Luminescent layer 43 is located at the substantial middle of the upper surface of base material 44.
Luminescent coating 31, as shown in Figure 5, is located on base material 44 to cover the mode of luminescent layer 43, and the bottom surface of luminescent coating 31 is connected in the upper surface of luminescent layer 43 and base material 44.On the thickness direction of luminescent coating 31, the area of the upper surface (light-emitting area) of the Area Ratio luminescent layer 43 of the bottom surface of luminescent coating 31 is large.
Base material 44 is bonded on the 2nd distribution pad 27 by sticker 30.In the present embodiment, sticker 30 for example, is made up of high (reflectivity the is more than 60%) material of the reflectivity of for example white or silver color.
Luminescent layer 43 is formed with anode and negative electrode.The anode of luminescent layer 43 by gold etc. metal lead wire 51 wire-bonded in the 1st distribution pad 26.In addition, the negative electrode of luminescent layer 43 by gold etc. metal lead wire 52 wire-bonded in the 2nd distribution pad 27.Electroplating processes is carried out with the material that for example silver-colored isoreflectance is high in the surface of the 1st distribution pad 26 and the 2nd distribution pad 27.
Containment member 53 is the high transparent resins with thermoplasticity of diffusivity such as such as epoxy resin, urea resin, silicones.Luminescent coating 31 is the layers that added fluorophor to transparent resin.Transparent resin in luminescent coating 31 can use the material identical with containment member 53.The fluorophor adding to luminescent coating 31 is subject to the light that the luminescent layer 43 of LED45 sends and excites, and the light of the different color of the color of the light that sends from luminescent layer 43 of radiation.
In the present embodiment, fluorophor uses yellow fluorophor, the blue optical excitation that this yellow fluorophor is sent by luminescent layer 43 and radiate the light of with the blue light yellow in complementary color relation system.Thus, light emitting module 54 can penetrate white light as output light.
In the present embodiment, base material 44 is formed by silicon, so the surface of base material 44 is black, absorbs light.So the light that the face from the luminescent layer 43 that joins with base material 44 light radiating from luminescent layer 43 radiates is absorbed at base material 44, does not radiate to outside.Therefore, the main top radiating light to base material 44 of luminescent layer 43.
Fig. 8 is near the figure of the example LED illustrating in comparative example.In the present embodiment, luminescent coating 31 is used to thermoplastic resin, with regard to luminescent coating 31, for example, under the soft state of high temperature, coat in the light-emitting area of luminescent layer 43, and harden by cooling.Here, comparative example as shown in Figure 8, if only form luminescent coating 31 at the upper surface of luminescent layer 43, luminescent coating 31 is due to the impact of the surface tension of the contained resin of wettability, the luminescent coating 31 of the light-emitting area of luminescent layer 43 etc., and is formed as near the dome-shaped of the protuberance central authorities of light-emitting area.In this case, the thickness of luminescent coating 31 is thick near than the end of luminescent layer 43 near the central authorities of the light-emitting area of luminescent layer 43.
So, as shown in Figure 8, short by the optical path length L1 of luminescent coating 31 than near the light radiating the central authorities of the light-emitting area from luminescent layer 43 by the optical path length L2 of luminescent coating 31 near the light radiating the end of luminescent layer 43.So, near the central authorities of luminescent layer 43 and near end, the density difference of the fluorophor in the radiation direction of the light that luminescent layer 43 radiates.So the color of the light radiating to the outside of light emitting module 54, cannot the uniform light of emission colours because of the position difference in light-emitting area.
In comparative example as shown in Figure 8, near the central authorities of luminescent layer 43, yellow light by the fluorophor radiation in luminescent coating 31 is more, so seem to turn white from outside, near the end of luminescent layer 43, yellow light by the fluorophor radiation in luminescent coating 31 is less, so see and turn blue from outside.
On the other hand, in the light emitting module 54 of present embodiment, for example, as shown in Figure 7, the bottom surface of luminescent coating 31 forms greatlyr than the light-emitting area of luminescent layer 43.So near near the difference of the thickness of the luminescent coating 31 thickness of luminescent coating 31 and the end of luminescent layer 43 central authorities of the light-emitting area of luminescent layer 43 is less than the situation of the comparative example shown in Fig. 8.
So, as shown in Figure 7, from near radiate the end of luminescent layer 43 light by the optical path length L2 in luminescent coating 31 and near radiate the central authorities of the light-emitting area of luminescent layer 43 light poor by the optical path length L1 in luminescent coating 31, less than the situation of the comparative example shown in Fig. 8.So, near the central authorities of luminescent layer 43 with end near, the difference of the density of the fluorophor in the radiation direction of light is also little than the situation of the comparative example shown in Fig. 8.
Therefore, the color of the light radiating for the outside to light emitting module 54, also has the difference of the each position in light-emitting area in the case of than little the comparative example shown in Fig. 8, therefore can expect the outside radiation of the more uniform light of color to light emitting module 54.
In addition, in the present embodiment, be black for the base material 44 of LED45, and absorb light.In addition, the side of base material 44 is covered by the high sticker 30 of reflectivity.Thus, sticker 30 prevents from being absorbed by base material 44 to the light of the direction incident of base material 44, and the external reflection to light emitting module 54 by the light of the direction incident to base material 44.Thus, can expect to improve the luminous efficiency of light emitting module 54.
In addition, in the present embodiment, sticker 30 is made up of the high material of thermal conductivity.Thus, the heat that luminescent layer 43 produces is transmitted to sticker 30 from bottom surface and the side of base material 44 effectively through base material 44, and emits to the 2nd distribution pad 27 and substrate 21.Thus, can expect to suppress the temperature rise of light emitting module 54.
Above, the 1st embodiment has been described.
Known according to the above description, utilize the light emitting module 54 of present embodiment, can expect to suppress the irregular colour of the light that light emitting module 54 radiates.
(the 2nd embodiment)
Next,, with reference to accompanying drawing, the 2nd embodiment is described.The structure of lighting device 1, straight pipe type lamp 11 and luminescence unit 15 in present embodiment is identical with the structure of lighting device 1, straight pipe type lamp 11 and luminescence unit 15 in the 1st embodiment, so omit detailed explanation.
［ structure of light emitting module 54 ］
Fig. 9 is near the figure of the example LED illustrating in the 2nd embodiment.In addition, except the point of following explanation, in Fig. 9, the structure of the symbol that mark is identical with Fig. 7 have with Fig. 7 in the identical or same function of structure, so description thereof is omitted.
The upper surface of the base material 44 in present embodiment, on the thickness direction of luminescent layer 43, is formed as the roughly the same size of face of surrounding with the profile of luminescent layer 43.In substrate 21, on the thickness direction of substrate 21, be provided with the recess 32 with the roughly the same shape of base material 44 and the depression slightly larger than the profile of base material 44.LED45 makes luminescent layer 43 embed upward recess 32, and the bottom surface of base material 44 and side engage with sticker 30 with the end and the inwall of recess 32.In the present embodiment, also preferably sticker 30 is made up of reflectivity and the high material of thermal conductivity.
In the present embodiment, example as shown in Figure 9, so that the degree of depth L3 of the recess 32 on the thickness direction of substrate 21 is equivalent to the mode of the length that the thickness of the thickness L4 of base material 44 and the joint bottom surface of base material 44 and the sticker 30 at the end of recess 32 is added, on substrate 21, form recess 32.Luminescent coating 31 is located on the substrate 21 of surrounding of recess 32 in the mode that covers luminescent layer 43.The bottom surface of luminescent coating 31 is connected in the substrate 21 of the upper surface of luminescent layer 43 and the surrounding of recess 32.So, in the present embodiment, also having on the thickness direction of luminescent coating 31, the area of the bottom surface of luminescent coating 31 is greater than the area of the upper surface (light-emitting area) of luminescent layer 43.
Thus, even in the light emitting module 54 of present embodiment, as shown in Figure 9, near the thickness of the luminescent coating 31 near the thickness of luminescent coating 31 central authorities of the light-emitting area of luminescent layer 43 and the end of luminescent layer 43 poor is less than the situation of the comparative example shown in Fig. 8.So, as shown in Figure 9, from near radiate the end of luminescent layer 43 light by the optical path length L2 in luminescent coating 31 and near radiate the central authorities of the light-emitting area of luminescent layer 43 light poor by the optical path length L1 in luminescent coating 31, less than the situation of the comparative example shown in Fig. 8.
So, even in the light emitting module 54 of present embodiment, about the color of the light to outside radiation, the each locational difference in light-emitting area is also little than the situation of the comparative example shown in Fig. 8, therefore can expect the outside radiation of the more uniform light of color to light emitting module 54.
In addition, so that degree of depth L3 is equivalent to, the thickness of the thickness L4 of base material 44 and the joint bottom surface of base material 44 and the sticker 30 at the end of recess 32 is added to the mode of the length obtaining, recess 32 is formed on substrate 21.So, can expect: under the state in LED45 embeds recess 32, the side of base material 44 is covered by the inwall of recess 32, and recess 32 prevents that base material 44 from absorbing to the light of the direction incident of base material 44.
In addition, in the present embodiment, be provided with the resist layer of high reflectance on the surface of substrate 21.So, be positioned at surface external reflection to light emitting module 54 by the light of the direction incident to base material 44 of the substrate 21 of the periphery of recess 32.Thus, can expect the raising of the luminous efficiency of light emitting module 54.In addition, sticker 30 is made up of the high material of reflectivity.So sticker 30 is at the part place joining with luminescent coating 31, prevent from being absorbed by base material 44 to the light of the direction incident of base material 44, and the external reflection to light emitting module 54 by the light of the direction incident to base material 44.
In addition, in the present embodiment, the inwall of recess 32 surrounds all sidewalls of base material 44.Base material 44 and recess 32 are engaged by the high sticker 30 of thermal conductivity, so the heat that produces and be transmitted to base material 44 by luminescent layer 43 is not only transmitted from the bottom surface of base material 44, are also transmitted to respectively the inwall transmission of recess 32 by sticker 30 from the side of base material 44.Thus, can expect that the heat being produced by luminescent layer 43 emits to substrate 21 effectively.
Above, the 2nd embodiment has been described.
According to the above description can be clear and definite, in the light emitting module 54 of present embodiment, also can expect to suppress the irregular colour of the light that light emitting module 54 radiates.
(the 3rd embodiment)
Next,, with reference to accompanying drawing, the 3rd embodiment is described.The structure of lighting device 1, straight pipe type lamp 11 and luminescence unit 15 in present embodiment is identical with the structure of lighting device 1, straight pipe type lamp 11 and luminescence unit 15 in the 1st embodiment, so omit detailed explanation.
［ structure of light emitting module 54 ］
Figure 10 is the figure that near the example of the related LED of the 3rd embodiment is shown.In addition, except the point of following explanation, in Figure 10, the structure of the symbol that mark is identical with Fig. 7 have with Fig. 7 in the consistent or identical function of structure, so description thereof is omitted.
The upper surface of the base material 44 in present embodiment, on the thickness direction of luminescent layer 43, is formed as the roughly the same size of face of surrounding with the profile of luminescent layer 43.Substrate 21 is provided with to be had the thickness roughly the same with base material 44 and has the structure 33 that bores the through hole of opening the shape roughly the same with base material 44 on thickness direction.In the present embodiment, structure 33 is preferably formed by the high material of thermal conductivity.
LED45 makes luminescent layer 43 through hole of telescope structure thing 33 upward, and the bottom surface of base material 44 and side engage with the inwall of substrate 21 and through hole with sticker 30.In the present embodiment, also preferably sticker 30 is made up of reflectivity and the high material of thermal conductivity.
In the present embodiment, the thickness L5 of structure 33, for example, as shown in figure 10, is formed as the thickness with base material 44 same degree.Luminescent coating 31 is located on structure 33 in the mode that covers luminescent layer 43.The upper surface of the upper surface of the bottom surface of luminescent coating 31 and luminescent layer 43 and structure 33 joins.So, be also in the present embodiment on the thickness direction of luminescent coating 31, the area of the bottom surface of luminescent coating 31 is greater than the area of the upper surface (light-emitting area) of luminescent layer 43.
Thus, as shown in figure 10, in the light emitting module 54 of present embodiment, near the thickness of the luminescent coating 31 near the thickness of luminescent coating 31 central authorities of the light-emitting area of luminescent layer 43 and the end of luminescent layer 43 poor, also than little in the situation of the comparative example shown in Fig. 8.So, example as shown in figure 10, from near radiate the end of luminescent layer 43 light by the optical path length L2 in luminescent coating 31 and near radiate the central authorities of the light-emitting area of luminescent layer 43 light poor by the optical path length L1 in luminescent coating 31, little compared with the situation of the comparative example shown in Fig. 8.
Therefore, in light emitting module 54 in the present embodiment, for the color of the light to outside radiation, also can expect compared with the situation of each locational difference in light-emitting area and the comparative example shown in Fig. 8 littlely, the more uniform light of color is to the outside radiation of light emitting module 54.
In addition, to be formed as the thickness of thickness L5 and base material 44 be same degree to structure 33.So, can expect: under the state of the through hole of LED45 telescope structure thing 33, the side of base material 44 is constructed thing 33 walls and covers, and structure 33 prevents that base material 44 from absorbing to the light of the direction incident of base material 44.
In addition, in the present embodiment, be provided with the resist layer of high reflectance on the surface of structure 33.So structure 33 is the external reflection to light emitting module 54 by the light of the direction incident at base material 44.Thus, can expect to improve the luminous efficiency of light emitting module 54.In addition, sticker 30 is made up of the high material of reflectivity.So sticker 30, in the part of joining with luminescent coating 31, prevents from being absorbed by base material 44 to the light of the direction incident of base material 44, and the external reflection to light emitting module 54 by the light of the direction incident at base material 44.
In addition, in the present embodiment, structure 33 surrounds all sidewalls of base material 44.Base material 44 engages with the high sticker 30 of thermal conductivity with structure 33, so produced and the heat of conducting to base material 44 is transmitted to structure 33 through sticker 30 respectively from the side of base material 44 by luminescent layer 43.Thus, can expect that structure 33 emits the heat being produced by luminescent layer 43 effectively to the 2nd distribution pad 27 and substrate 21.
Above, the 3rd embodiment has been described.
According to as described above can be clear and definite, in the light emitting module 54 of present embodiment, also can expect to suppress the irregular colour of the light that light emitting module 54 radiates.
(the 4th embodiment)
Next,, with reference to accompanying drawing, the 4th embodiment is described.The structure of lighting device 1, straight pipe type lamp 11 and luminescence unit 15 in present embodiment is identical with the structure of lighting device 1, straight pipe type lamp 11 and luminescence unit 15 in the 1st embodiment, so omit detailed explanation.
［ structure of light emitting module 54 ］
Figure 11 is near the figure of the example LED illustrating in the 4th embodiment.In addition, except the point of following explanation, in Figure 11, the structure in structure and Fig. 7 of the symbol that mark is identical with Fig. 7 has identical or the same function, so description thereof is omitted.
The upper surface of the base material 44 in present embodiment, on the thickness direction of luminescent layer 43, is formed as the roughly the same size of face surrounding with the profile of luminescent layer 43.Luminescent layer 43 is provided with and is formed as dome-type transparent resin 34.Transparent resin 34 can use for example identical with containment member 53 material.Luminescent coating 31 is formed as dome-shaped in the mode that covers transparent resin 34 at the upper surface of luminescent layer 43.
In the present embodiment, the bottom surface of transparent resin 34, on thickness direction, in the little mode of area than the upper surface of the bottom surface of luminescent coating 31 and luminescent layer 43, is formed as dome-shaped in the substantial middle of the upper surface of luminescent layer 43.Due to such structure, example as shown in figure 11, from near radiate the end of luminescent layer 43 light by the optical path length L2 in luminescent coating 31 and near radiate the central authorities of the light-emitting area of luminescent layer 43 light poor by the optical path length L1 in luminescent coating 31, little compared with the situation of the comparative example shown in Fig. 8.
Thus, near the central authorities of luminescent layer 43 and near end, the density of the fluorophor in the radiation direction of light poor, also little than the situation of the comparative example shown in Fig. 8.Therefore, the color of the light radiating for the outside to light emitting module 54, the each locational difference in light-emitting area is also little than the situation of the comparative example shown in Fig. 8, can expect the more uniform light of outside emission colours to light emitting module 54.
Figure 12 is the concept map of the relation for the resin that comprises fluorophor and transparent resin are described.Here, in the light emitting module 54 of present embodiment, on the thickness direction of luminescent layer 43, the distance of the periphery of the face that the end of the light-emitting area from luminescent layer 43 is joined to transparent resin 34 and this light-emitting area is made as a, the thickness of the luminescent coating 31 in the periphery of the face that transparent resin 34 and light-emitting area are joined is made as b, the thickness of the luminescent coating 31 of the centre of light-emitting area is made as in the situation of c, preferably meets the relation of a < b≤c.Thus, transparent resin 34 can reduce thickness poor of the luminescent coating 31 of the each position in light-emitting area, can expect to suppress the irregular colour of the light that light emitting module 54 radiates.
Above, the 4th embodiment has been described.
According to as described above can be clear and definite, in the light emitting module 54 of present embodiment, also can expect to suppress the irregular colour of the light that light emitting module 54 radiates.
In addition, the utility model is not limited to above-mentioned each embodiment, and comprises various variation.For example, above-mentioned each embodiment, illustrates the utility model and has been described in detail, the utility model is not necessarily limited to possess illustrated all structural elements for understandable.In addition, also a part for the structure of embodiment can be replaced into the structure of other embodiment, also can add to the structure of certain embodiment the structure of other embodiment.In addition,, about a part for the structure of each embodiment, can be made as other the appending, delete, replace of structure.
Claims (6)
1. a light emitting module, is characterized in that, possesses:
Substrate;
Be located at the semiconductor light-emitting elements on substrate, have: base material, be located on described base material and luminous luminescent layer; And
There is the luminescent coating of fluorophor,
Described luminescent coating is on the thickness direction of described substrate and be formed as dome-shapedly in described luminescent layer side, and is formed as making the light sending from the central authorities of described luminescent layer to diminish by the difference of the optical path length of this luminescent coating by the optical path length of this luminescent coating and the light sending from the end of described luminescent layer.
2. the light emitting module of recording according to claim 1, is characterized in that,
On the thickness direction of described substrate, the area of the light-emitting area of luminescent layer is large described in the Area Ratio of the lower surface of described luminescent coating.
3. the light emitting module of recording according to claim 1 or 2, is characterized in that,
On the thickness direction of described substrate, the area of base material is little described in the Area Ratio of described luminescent layer,
Described luminescent coating is formed on described base material to cover the mode of described luminescent layer.
4. the light emitting module of recording according to claim 1, is characterized in that,
Also possess and in the light-emitting area of described luminescent layer, be formed as dome-type transparent component;
Described luminescent coating is formed as dome-shaped in the mode that covers described transparent component in the light-emitting area of described luminescent layer;
On the thickness direction of described substrate, the area of luminescent coating is little described in the Area Ratio of described transparent component.
5. the light emitting module of recording according to claim 4, is characterized in that,
On the thickness direction of described substrate, distance in the periphery of the face that the end of the light-emitting area from described luminescent layer is joined to described transparent component and this light-emitting area is made as a, the thickness of the described luminescent coating in the periphery of the face that described transparent component and described light-emitting area are joined is made as b, the thickness of the described luminescent coating of the centre of described light-emitting area is made as in the situation of c, meets the relation of a < b≤c.
6. a lighting device, is characterized in that, possesses:
The light emitting module that in claim 1 to 5, any one is recorded; With
Supply with the ignition device of electric power to described light emitting module.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013196151A JP2015061066A (en) | 2013-09-20 | 2013-09-20 | Light-emitting module and lighting device |
| JP2013-196151 | 2013-09-20 |
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| Publication Number | Publication Date |
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| CN203743935U true CN203743935U (en) | 2014-07-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420122090.7U Expired - Fee Related CN203743935U (en) | 2013-09-20 | 2014-03-18 | Light-emitting module and lighting device |
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| JP (1) | JP2015061066A (en) |
| CN (1) | CN203743935U (en) |
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| JP7386714B2 (en) | 2019-01-11 | 2023-11-27 | シチズン時計株式会社 | LED light emitting device and its manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2907286B1 (en) * | 1998-06-26 | 1999-06-21 | サンケン電気株式会社 | Resin-sealed semiconductor light emitting device having fluorescent cover |
| JP2007035802A (en) * | 2005-07-25 | 2007-02-08 | Matsushita Electric Works Ltd | Light-emitting device |
| JP2012044034A (en) * | 2010-08-20 | 2012-03-01 | Stanley Electric Co Ltd | Semiconductor light-emitting device and semiconductor light-emitting device manufacturing method |
| JP5472635B2 (en) * | 2010-10-08 | 2014-04-16 | 東芝ライテック株式会社 | Straight tube lamp and luminaire |
| JP2013084535A (en) * | 2011-09-29 | 2013-05-09 | Panasonic Corp | Led unit |
| JP6038443B2 (en) * | 2011-11-21 | 2016-12-07 | スタンレー電気株式会社 | Semiconductor light emitting device and method for manufacturing semiconductor light emitting device |
| JP5751154B2 (en) * | 2011-12-14 | 2015-07-22 | 豊田合成株式会社 | Light emitting device and manufacturing method thereof |
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